Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an organic silicon compound having at least one phenolic hydroxyl group per molecule, and(E) a filler.

Abstract: A process for preparing a water soluble phenol-formaldehyde resole resin having improved storage stability employs a calcium compound to catalyze the condensation reaction which occurs under basic conditions. Sulfamic acid is used to neutralize the resole solution, yielding a soluble calcium salt which will not settle out of the solution or clog transfer lines or spray nozzles as may a calcium salt precipitated during the neutralization. Glass fiber insulation produced using a binder prepared with the aqueous resole solution shows enhanced thickness recovery and lower odor potential.

Abstract: An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

Abstract: Uncured compositions are prepared from dialkanolamines and polyglycidyl ethers of tris(hydroxyphenyl)alkanes. These compositions are water soluble or water miscible.

Abstract: Novel epoxidised phenol ethers of formula I ##STR1## are described wherein R.sup.1 denotes C.sub.1 -C.sub.20 alkyl, C.sub.5 -C.sub.9 cycloalkyl or C.sub.7 -C.sub.14 aralkyl, R.sup.2 has one of the meanings of R.sup.1 or is, in addition hydrogen or a radical or formula II ##STR2## R.sup.3 denotes C.sub.1 -C.sub.6 alkyl or halogen, R.sup.4 and R.sup.5 denotes hydrogen or C.sub.1 -C.sub.6 alkyl, R.sup.6 denotes hydrogen or methyl, m is 0, 1 or 2 and n is an integer from 0 to 30, with the proviso that at least two radicals, R.sup.2, must be epoxide groups of formula II. The compounds are especially suitable for encasing electronic components.

Abstract: A resin composition for a molding material is provided which comprises a resol-type phenolic resin, an epoxy resin and an amine compound having hydrogen atoms directly bonded to the nitrogen atom. The amine compound is contained in such a proportion that the amount of its hydrogen atoms directly bonded to the nitrogen atom is 0.5 to 2.0 equivalents per equivalent of the epoxy groups of the epoxy resin.

Abstract: Latent catalysts for epoxy reactions are prepared by reacting a tetrasubstituted onium compound such as tetrabutylphosphonium acetate.acetic acid complex or an amine compound with an acid having a weak-nucleophilic anion such as fluoboric acid. These catalysts provide stable latent catalysts for epoxy resins for advancement or curing reactions.

Abstract: Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a phenol-aldehyde resin.Typical nitrogen bases used in (c) include benzyldimethylamine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde.

Abstract: Cyclic amidines which are modified by the incorporation of additional polar groups, may be used as catalysts for hardening heat-curable resin compositions comprising polyepoxides and optionally carboxyl group-containing polymers. Such amidine catalysts yield a high reactivity, an excellent storage stability and result in elastic coatings which show a high gloss and a good resistance to solvents.

Abstract: A coating composition contains an organic polyol, a polyepoxide, a blocked polyisocyanate crosslinking agent, and a phenolic resin. The coating composition also can be formulated as a two package coating composition with a free polyisocyanate crosslinking agent. The composition is flexible, having an elongation of at least 10 percent when cured. This coating composition is particularly suitable as a primer in preparing substrates with a multilayer coating having good flexibility.

Abstract: A heat curable epoxy adhesive composition has been developed which is substantially insoluble in cold hydraulic fluid before it is cured and resistant to degradation in hot hydraulic fluid after it is heat cured. The adhesive comprises a diglycidyl ether of bisphenol-A, a lesser amount of an epoxy novolac resin and a catalytic amount of 2-ethyl-4-methyl imidazole curing agent. The adhesive is particularly adapted to automatically and permanently calibrate the relief pressure of check valves in hydraulic systems.

Abstract: An epoxy resin composition having excellent handling properties, solvent resistance and heat resistance and particularly excellent low-temperature curability is provided which comprises (A) a polyfunctional epoxy resin having an epoxy equivalent of 160 to 2,000 obtained by reacting an epoxy resin having an epoxy equivalent of 100 to 800 with a molecular weight increasing agent containing 2.1 to 10 functional groups (phenolic hydroxyl groups) on an average per molecule and (B) a curing agent for the epoxy resin) as essential ingredients.

Abstract: Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.

Abstract: Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.

Abstract: Storage stable, heat curable mixtures obtained from epoxy resins as a binder system containing latent hardening agents as well as fillers and additive materials which have outstanding mechanical and electrical properties and which are obtained as epoxy resin components of an adduct of a high molecular solid epoxy resin and 4,4'-diaminodiarylalkane in a molecular ratio of 1:0.01 to 0.05. The preferred economical curing agent is a phenol formaldehyde condensation product.

Abstract: A method has been developed to use a structural epoxy adhesive to bond together surfaces of phosphated steel electrodeposited with an organic primer. The specially formulated epoxy adhesive contains a cross-linkable epoxy novolac resin, an epoxy reactive diluent, and an imidazole curing agent substituted in at least one position with an alkyl or a hydroxyalkyl group. The amount of the curing agent used in the formulation is much lower than that in a conventional two-part epoxy adhesive such that the adhesive will not attack or degrade the primer layer to weaken the bond strength. The reactive diluent used reduces the viscosity of the mixed adhesive system to facilitate dispersion and wetting of the adhesive on the coated steel surface. Bond strength achieved by this method is adequate for automotive structural applications and is capable of withstanding extended exposure to humidity, salt spray, and other hostile automotive environments without appreciable loss.

Abstract: Cyclic amidines which are modified by the incorporation of additional polar groups, may be used as catalysts for hardening heat-curable resin compositions comprising polyepoxides and optionally carboxyl group-containing polymers. Such amidine catalysts yield a high reactivity, an excellent storage stability and result in elastic coatings which show a high gloss and a good resistance to solvents.

Abstract: A catalyst and accelerator for an epoxy system which consists of a halogeisphenate of a catalytically active tertiary amine and which is obtained in a solid form practically water insoluble and odor free but which nevertheless possess the catalytic activity of the tertiary amine. The application describes the proportion of the catalyst by reacting an aqueous suspension of the halogenobisphenol with the tertiary amine, the proportion of epoxy resin systems containing the catalyst and the epoxy resin systems thus formed.

Abstract: Binders based on co-condensates of epoxy resins and resols with amines, the epoxy resin being partially defunctionalized and still containing on average 0.5-1.3 epoxide groups per molecular unit, the resol component being composed of methylol compounds of oligomethylene compounds, which are additionally substituted by hydrocarbon or hydroxyalkyl or hydroxyaralkyl radicals, and the amine containing at least one primary or secondary amino group and at most 2 hydroxyl groups.The invention further relates to a process for the preparation of a binder and for the electrophoretic deposition of a cationic resin from an aqueous dispersion onto an article connected as the cathode and to an aqueous electrophoresis bath for carrying out this process.

Abstract: Solid epoxy resin systems comprising the reaction products of a polyepoxide compound with a functionality greater than two, a diglycidyl ether of a polyhydric phenol and a polyhydric phenol; said systems being applicable for use in a variety of applications and particularly in combination with phenolic novolac hardeners for molding applications.

Abstract: Thermosetting resin coatings are provided which cure rapidly and exothermically at ambient temperatures. Accelerated crosslinking is accomplished by the reaction of oxalic acid esters with amine-containing polymeric compositions.

Abstract: A synthetic resin is in the form of a metal complex compound. The resin is the reaction product of:(a) Mannich bases which are free from epoxide groups; with(b) epoxide resins;wherein aliphatic hydroxyl groups originating from (a), (b), or a mixture thereof, are at least partially converted into urethane groups by reaction with partially blocked isocyanate, said Mannich bases (a) formed from components selected from:(a.sub.1) condensed phenols which are free from ether groups and contain at least two aromatic rings and at least two phenolic hydroxyl groups;(a.sub.2) condensed phenols which contain ether groups and contain at least two aromatic rings and at least two phenolic hydroxyl groups;(a.sub.5) formaldehyde or compounds which split off formaldehyde;(a.sub.3) secondary amines having at least one hydroxyalkyl group; and(a.sub.4) dialkylamines or dialkoxyalkylamines which do not contain free hydroxyl groups; or from the components:(a.sub.1) and (a.sub.2) with (a.sub.5) and (a.sub.3);(a.sub.1) with (a.sub.

Abstract: Water-compatible compositions are described which consist essentially of at least one resinous compound whose backbone is linear or substantially linear and consists essentially of at least one oxyaryleneoxyalkylene or oxyaryleneoxy(1,3-(2-hydroxy)alkylene) unit and which bears at least two functional organic moieties through which cross-linking can occur (preferably groups having active hydrogen, more preferably aliphatic hydroxyl groups) and at least one terminal carbamoylpyridinium group covalently bonded through the ring nitrogen atom combined with an acid curable cross-linking agent. The compositions are useful coating compositions which find particular utility in cathodic electrodeposition. The compounds are prepared, for example, by reacting a linear or substantially linear epoxy resin with a carbamoylpyridine in the presence of sufficient amount of a Bronsted acid and water to stabilize the carbamoylpyridinium salt thus formed.

Abstract: This invention relates to a heat curable composition comprising(a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(b) an epoxy resin containing at least two ##STR2## groups, and (c) a thermal initiator member of the group consisting of(1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator,(2) a BF.sub.3 adduct,(3) a BF.sub.3 adduct in combination with a free radical initiator, and(4) dicyandiamide in combination with a free radical initiator.The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.

Abstract: A composition comprising an epoxy resin having at least two epoxy groups in the molecule and a hardener selected from the group consisting of (1) a resorcinol novolak having an unreacted resorcinol content of 10% by weight or less, (2) a mixed novolak of a resorcinol novolak and a monohydric phenol novolak having a total unreacted resorcinol and monohydric phenol content of 8% by weight or less, and (3) a resorcinol/monohydric phenol polycondensation novolak having a polycondensed resorcinol content of 30 mole % or more and a total unreacted resorcinol and monohydric phenol content of 8% by weight or less.The composition is useful for moldings, laminates, paints, and adhesives with excellent thermal resistance, durability and electrical characteristics.

Abstract: Disclosed is an improved method for coating a substrate with a film of a coating composition rapidly curable at room temperature in the presence of a vaporous tertiary-amine catalyst. The pot life of the coating composition is substantially increased without deleterious loss of properties of the ultimately cured film wherein the coating composition comprises three components. The first component is a phenol-functional condensation product of (a) a phenol-aldehyde reaction product bearing a plurality of methylol and phenol groups, and (b) a polyol, polycarboxylic acid, or polyepoxide, wherein the condensation product is reacted with a selective transmethylolating agent for substantially transforming residual methylol groups into non-active hydrogen groups. The second component is a multi-isocyanate cross-linking agent and the third component is an organic solvent. The coating composition is applied to a substrate and cured by exposure of the coated substrate to a vaporous tertiary amine catalyst.

Abstract: Cationic solution addition copolymers of monoethylenically unsaturated copolymerizable monomers are described having Mannich base side chains with the structure: ##STR1## where R and R' are selected from C.sub.1 -C.sub.8 alkyl and C.sub.1 -C.sub.8 alkanol, or are together constituted by a C.sub.2 -C.sub.8 alkylene group. This copolymer is preferably reacted with a diepoxide in a stoichiometric deficiency with respect to the amine groups in the side chains. At least a portion of the tertiary amine groups are then reacted with a solubilizing acid to form a salt which enables the copolymer to be dissolved in water.

Abstract: A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.