Abstract: A resin composition comprising(a) a glycidyl ether of phenol novolak and/or cresol novolak,(b) a phenol novolak and/or cresol novolak,(c) an organic solvent, and(d) a silane coupling agent having an aromatic ring and an amino group having active hydrogen in the same molecule;a process for forming a transparent thin film by using a glycidyl ether of phenol novolak and/or cresol novolak and a phenol novolak and/or cresol novolak, which comprises dissolving said materials in an organic solvent, forming a coat and heat curing it to obtain a transparent thin film, wherein the improvement comprises the use of a silane coupling agent having an aromatic ring and an amino group having active hydrogen in the same molecule as additive; andtransparent thin films formed from the above process.

Abstract: The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.

Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: A two-step process for the preparation of a silicone resin-modified phenolic resin is disclosed wherein an alkoxysilane-modified phenolic resin is first prepared by reacting an alkoxysilane with a phenolic resin. In a subsequent step, the alkoxysilane-modified phenolic resin is hydrolyzed and condensed by heating and stirring it with water. The resulting silicone resin-modified phenolic resin, which is free of diorganopolysiloxane units, has excellent heat resistance and excellent electrical insulating properties.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises a flexibilizer obtained by pre-reaction of an epoxy resin and at least one modified silicone oil having the formula: ##STR1## where R.sub.1, R.sub.3, and R.sub.4 are divalent organic groups; R.sub.21, R.sub.22, R.sub.23, R.sub.24, R.sub.25, R.sub.26, and R.sub.27 are respectively selected from the group consisting of an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, a phenyl group, and a fluorine-substituted alkyl group having from 1 to 5 carbon atoms; a is an integer from 10 to 300; and b is an integer from 2 to 10, in which 0.ltoreq.b/(a+b).ltoreq.0.32, and wherein the equivalent ratio of phenolic hydroxyl groups in said modified silicone oil to epoxy groups of the epoxy resin of the flexibilizer is from 0.001 to 0.4:1; an epoxy resin other than the flexibilizer; and a curing agent.

Abstract: Disclosed herein are amido-amine silane resins prepared by reacting an aminosilane with a hydroxy alkyl functional amine and a polyisocyanate or a polyacid or its lower alkyl ester.

Abstract: A silicone-epoxy resin composition comprising(A) 100 parts by weight of a curable epoxy resin,(B) 1-100 parts by weight of an epoxy resin-modified silicone resin obtained by a condensation reaction of 1-99 mole % of an epoxy resin having at least one hydroxyl group and at least one epoxy group and 1-99 mole % of an organosiloxane or organosilane compound represented by the general formula ##EQU1## wherein R.sup.1 represents a monvalent hydrocarbon group or a halogenated monovalent hydrocarbon group, R.sup.2 represents a hydrogen atom or a monovalent aliphatic hydrocarbon group, is a number ranging from 1 to 1,500; n is a number ranging from 0.9 to 3; and m is a number ranging from 0.05 to 3.1 with a proviso that the sum of m+n is not greater than 4, and(c) 1-100 parts by weight of an epoxy-modified polysiloxane having an epoxy equivalent ranging from 1,000 to 20,000, represented by the general formula ##STR1## wherein R.sup.3, R.sup.4, R.sup.5, R.sup.6, and R.sup.

Abstract: Polymer dispersing agent comprising a graft polymer prepared by graft-polymerizing an organopolysiloxane having a mercapto group on the side chain with at least one acrylic or methacrylic monomer, and epoxy resin composition comprising epoxy resin, silicone resin and the above polymer dispersing agent. The polymer dispersing agent has an excellent effect for dispersing the silicone resin into the epoxy resin, and thereby the epoxy resin composition thus prepared has high dispersion stability and exhibits improved impact resistance and relaxation of residual internal stress and is useful as a sealing agent for IC, a coating agent, a paint composition, an adhesive, and a prepreg.

Abstract: A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.

Abstract: Phenolic molding compositions, particularly useful as sheet molding compositions comprise: 1) a resole phenole resin, 2) a thickening agent selected from the group consisting of alkaline earth metal oxides or hydroxides and silanes, 3) a filler selected from the group consisting of clay, talc, and mixtures thereof, and 4) an epoxy resin.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: A composition comprising a multifunctional glycidyl ether having at least three epoxy groups per molecule with a hardening amount of a mixture of a rigid aromatic diamine and an aromatic diaminopolysiloxane can be thermally cured to a compatible composition. Glycidylamines cannot be used in this composition. Optionally, a diglycidyl ether can be included.The cured compositions have higher glass transition temperatures than previously observed with epoxy/silicone systems. They also have improved resistance to atomic oxygen over that shown by epoxy formulations lacking a polysiloxane species therein.

Abstract: An epoxy resin based powder coating composition which comprises: (A) 100 parts by weight of a mixed epoxy resin having a softening point of 60.degree.-80.degree. C. which consists of 50 to 70 wt. % of a bisphenol A expoxy resin having a number-average molecular weight of 800 to 1,800 and 30 to 50 wt. % of a cresol novolak epoxy resin; (B) 5 to 80 parts by weight of a novolak resin; (C) 0.5 to 5 parts by weight of triphenylphosphine; (D) 60 to 200 parts by weight of an inorganic powder having an average particle size of 0.5 to 75 um; and (E) 0.01 to 2 parts by weight of a microfine silica powder having an average particle size of 1 to 100 nm.The epoxy resin based powder coating composition can be coated on electrical and electronic components at 90.degree.-100.degree. C. with retaining the high moisture resistance, storage stability and free-flowing properties.

Abstract: A composition containing a polymeric material obtained by interreacting an epoxy-novolak polymer with an organosilicon compound, a radiation sensitive onium salt, and a near U.V. sensitizer.

Abstract: Anhydride-functional organo(poly)siloxanes having average units of the general formula ##EQU1## in which the R(s) are the same or different and represent a monovalent hydrocarbon radical or a monovalent halogenated hydrocarbon radical having from 1 to 18 carbon atom(s) per radical, A represents a radical of the formula ##STR1## in which R.sup.1 represents a hydrogen atom or a monovalent hydrocarbon radical or a monovalent halogenated hydrocarbon radical having from 1 to 12 carbon atom(s) per radical and R.sup.2 represents a hydrogen atom or a monovalent hydrocarbon radical having from 1 to 12 carbon atom(s) per radical, or the two radicals R and R.sup.2 together represent a divalent hyrocarbon radical having from 3 to 5 carbon atoms per radical, R.sup.3 represents a hydrogen atom or a monovalent hydrocarbon radical having from 1 to 4 carbon atom(s) per radical, with the proviso that R.sup.3 is a hydrogen atom if the two radicals R.sup.1 and R.sup.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: A one part heat curable organopolysiloxane composition is provided having an olefinically unsaturated organopolysiloxane, and an organohydrogenpolysiloxane, and a platinum catalyst encapsulated in an organic polymer such as a thermoplastic organic polymer, or a thermosetting organic polymer.

Abstract: A silylated polymeric binder, which is soluble or swellable in alkali, bears a plurality of at least one of aliphatic and aromatic hydroxyl groups, at least a portion of which are derivatized by units of the formula I and II:[(A-B.sub.n).sub.m C]--[(D.sub.o E.sub.p)BC].sub.u (I)and[(D.sub.o E.sub.p)BC].sub.v (II)which are side chains of the polymeric binder, whereinA denotes a silanyl group containing at least 2 silicon atoms in total linked to each other, but not more than 3 silicon atoms linked to each other in an unbranched chain or silicon atoms;B denotes a bridging group;C denotes a functional group which has formed a covalent bond with an aromatic, aliphatic, or cycloaliphatic hydroxyl group of the binder, the group D, or the group E;D denotes a grafted monohydric or polyhydric aliphatic alcohol;E denotes a grafted monohydric or polyhydric aromatic alcohol;n denotes 0 or 1;m denotes 1 or 2; and o, p, u and v each denote 0 or 1.

Abstract: A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: Thermally stable, crosslinked epoxy resins are obtained by crosslinking an epoxy resin with a silicon compound containing a basic nitrogen which is bonded to silicon via carbon and to which at least 1 hydrogen atom is bonded directly to the nitrogen atom, and thereafter conditioning the crosslinked epoxy resin.

Abstract: A plastic encapsulant for a semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, three methoxy groups. The hardener is a resol type phenol resin hardener. The organic solvent is a mixture of ketones, alcohols, and aromatic hydrocarbons.

Abstract: An epoxy resin composition consisting essentially of(A) an epoxy resin,(B) a curing agent,(C) a curing promoter,(D) an organic silicon compound having at least one phenolic hydroxyl group per molecule, and(E) a filler.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

Abstract: An antistatic thermoplastic composition is provided which comprises about 80% or more by weight of a thermoplastic resin component which includes an ABS graft copolymer; and about 20% or less by weight of an epihalohydrin copolymer of an epihalohydrin and an oxirane-containing comonomer, wherein the ratio by weight of said epihalohydrin to said comonomer is less than 13:7.

Abstract: A hot melt, non-aqueous glass size composition consists of an ethylene-ethylacrylate copolymer, a micro-crystalline wax, a phenolic-modified terpene resin and a silane.

Abstract: Curable epoxy resin compositions are provided resulting from the use of a silylnorbornane functional anhydride or imidoamine. The cured products show improved thermal and physical properties as compared to conventional curing agents.

Abstract: A primer composition which has excellent durability when immersed in water is made from a silicone-modified epoxy resin, an aminoxy silicon compound, and an organotitanate. The primer composition is particularly useful for bonding room temperature vulcanizable silicone rubber or room temperature vulcanizable silicone-modified organic rubber to building substrate materials.

Abstract: A flowable polymeric extrusion powder consisting essentially of acrylonitrile polymer particles is provided at low temperature treated with a non-sticking amount of solvent. Sufficient solvent can be added to dissolve the polymer at elevated temperature, for instance, more than 120 parts by weight of dimethyl sulfoxide solvent can be added per hundred parts of dry polymer below ambient temperature.

Abstract: A sand for making cores and moulds which comprises 100 parts by weight of a refractory filler, between 1.0 and 3.0 parts by weight of a binder, and between 0.4 and 2.0 parts by weight of an acid catalyst of crystal hydrate benzene-sulphonic acid in the form of an 80- to 92-percent solution in methyl alcohol.The present invention makes it possible to prepare a sand for making cores and moulds which displays a cold setting rate and strength higher than ever before. The cold setting rate in terms of the time after mixing at which the pattern or corebox can be removed satisfactorily is not over 1 min. and the compression strength of the sand is at least 60 N/cm.sup.2 at the time of removing the pattern or corebox.