Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.

Abstract: A curable composition, and a material obtained by curing the composition, in which the curable composition includes a vinylester polymerisable compound, jointly with a sulphonated polyaromatic thermoplastic polymer, and an N-vinyl lactam, and which is characterised in that it further includes, a first non-vinylester polymerisable compound which includes at least one isocyanurate group bearing at least two (meth)acrylate groups; and a second non-vinylester polymerisable compound which includes at least one carbopolycyclic or heteropolycyclic group bearing at least two (meth)acrylate groups.

Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Abstract: A composition having a crosslinking compound that has the following structure (I) wherein R is OH, NH2, halide, ester, amine, ether, or amide, and x is 2-6 and A is an arene moiety having a molecular weight of less than about 10,000. A mixture including the composition and a polymer, a method for forming the mixture and a crosslinked polymer are also disclosed.

Abstract: Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations are curable at relatively low temperatures, as compared to those polymer formulations not comprising contemplated crosslinkers. Transparent films formed from these contemplated formulations are also disclosed. Organic transparent film compositions are also disclosed that comprise: at least one at least one phenol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming organic transparent films with improved transmittance by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of less than about 200° C.

Abstract: A resist underlayer film-forming composition includes a polymer including a repeating unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and a solvent. Each of R3 to R8 individually represent a group shown by the following formula (2) or the like. R1 represents a single bond or the like. R2 represents a hydrogen atom or the like.

Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

Abstract: A novel hydroxyl-functional polyether derived from the reaction of (a) a divinylarene dioxide, particularly a divinylarene dioxide derived from divinylbenzene such as divinylbenzene dioxide (DVBDO); and (b) a diphenol; wherein the reaction product is thermally stable and exhibits an absence of self-polymerization (crosslinking or gelling) upon heating at elevated temperatures. The novel hydroxyl-functional polyether offers improved properties compared to known hydroxyl-functional polyethers such as solid epoxy resins, phenolic epoxy resins (hardeners), and poly(hydroxyl ethers).

Abstract: The invention provides methods for stably binding and immobilizing deoxyribonucleic acid onto objects and substrates. The method includes exposing the deoxyribonucleic acid to alkaline conditions, and contacting the deoxyribonucleic acid to the object or substrate. The alkaline conditions are produced by mixing the deoxyribonucleic acid with an alkaline solution having a pH of about 9.0 or higher, and contacting the deoxyribonucleic acid to the substrate. The immobilized DNA can be used as a taggant and can be used in combination with other detectable taggants, such as optical reporters. Methods for authentication of a DNA marked object are also provided.

Abstract: The present invention relates to process for crosslinking an arylene oxide polymer comprising a 3-pyridyl and/or a 4-pyridyl group, wherein the polymer is reacted with a compound according to Formula (1) or a compound according to Formula (2), wherein R1, R2, R3 and R4 are independently selected from the group consisting of hydrogen, halogen, hydroxy and cyano. The crosslinked arylene oxide polymer can be used as a membrane, in particular a proton conducting membrane.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A synthetic bead for use in mineral separation is described. The synthetic bead has a surface made of a synthetic material such as polymer and the synthetic material is functionalized with molecules having a functional group for attracting mineral particles to the surface in a separation process. The synthetic beads can be placed in flotation cell containing a mixture of water, valuable material and unwanted material or in a pipeline where the mixture is transported from one location to another. The enriched synthetic beads carrying the mineral particles are separated from the unwanted materials in the mixture. The mineral particles are then released from the synthetic beads by means of low pH treatment, ultrasonic agitation, thermal or electromagnetic treatment.

Abstract: A process for producing a solution blend of a polybenzimidazole (PBI) and a polyetherketoneketone (PEKK). The PBI is mixed with sulfuric acid at a temperature between 40° C. and 80° C. for 30 minutes to 2 hours to produce a PBI solution then cooled to room temperature to form a cooled PBI solution. Then PEKK is added to the cooled PBI solution to form a mixture and that mixture is stirred from 30 minutes to 2 hours at room temperature to form a stirred mixture. The stirred mixture is poured into an excess of water being stirred swiftly to form an aqueous mixture. The aqueous mixture is filtered to produce a blend. The blend is washed with water and dried. The resulting blend can yield a blend in all proportion from 1/99 PBI/PEKK to 99/1 PBI/PEKK.

Abstract: An adsorptive carrier includes one or more high-molecular-weight compounds each of which includes two or more aromatic ring-containing repeating units, the aromatic rings being covalently bound to each other via a structure represented by Formula (I): wherein R1 represents hydrogen or an organic group, and R2 represents an organic group.

Abstract: A polymer comprising a first repeating unit represented by Formula 1: wherein R1 to R13 and Ar1 in Formula 1 are defined in the specification.

Abstract: A phosphorous copolymer, a method for preparing the same, and a flame retardant thermoplastic resin composition including the same is disclosed. The phosphorous copolymer includes a repeat unit represented by Formula 1: wherein each A is independently a single bond, C1 to C5 alkylene, C1 to C5 alkylidene, C5 to C6 cycloalkylidene, —S—, or —SO2—; R1 and R2 are each independently substituted or unsubstituted C1 to C6 alkyl or substituted or unsubstituted C6 to C20 aryl; R3 and R4 are each independently substituted or unsubstituted C1 to C6 alkyl, substituted or unsubstituted C3 to C6 cycloalkyl, substituted or unsubstituted C6 to C12 aryl, or halogen; a and b are each independently an integer from 0 to 4; and m and n are each independently an integer from 1 to 500.

Abstract: The present invention relates to a process for the production of polyarylene ether block copolymers comprising, in a first stage, the reaction of at least one aromatic dihydroxy compound comprising 4,4?-dihydroxybiphenyl in a molar excess and of at least one aromatic dihalogen compound, to form a polybiphenyl sulfone polymer, and then, in a second stage, the reaction of the polybiphenyl sulfone polymer with at least one aromatic dihydroxy compound and of at least one aromatic dihalogen compound. The invention further relates to the resultant polyarylene sulfone block copolymers and to the use of the polyarylene sulfone block copolymers for the production of moldings, fibers, films, or foams.

Abstract: Blend (B) comprising: at least one polyarylene (P1) in a form other than fibers, at least one poly(aryl ether ketone) (P2), and at least one fibrous filler (F). Article or part of an article comprising the blend (B).

Abstract: Medical tubing (T), such as a guidewire, a stent, a catheter or a hollow needle, made of a kinked rigid-rod polyarylene exhibiting a outstanding characteristics including high torqueability, high pushability and high flexibility and which can be easily thin-wall extruded under especially harsh conditions.

Abstract: The present invention provides Mannich base derivatives of N,N?-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

Abstract: A prepolymer prepared by condensation reaction between a first compound represented by Formula (1) below: Ar—H??(1), where Ar is composed of a crosslinkable moiety at one end, a moiety selected from the group —O—, —S—, —COO—, —CO—, —COS—, —SO2—, and —NH—, and one or two repeating units selected from the group: where A is carbon or nitrogen, and X is hydrogen or halogen; and a second compound that is an aromatic moiety.

Abstract: An fluorinated polyester compound is disclosed. The fluorinated polyester compound can be made by combining ingredients comprising a hydroxyl terminated polyphenyl ether; a carboxylic acid terminated perfluoropolyether; an acid catalyst; and a solvent. A coating solution comprising the fluorinated polyester compound and a method of coating a substrate therewith are also disclosed.

Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.

Abstract: Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170° C. or higher can be produced.

Abstract: Methods for performing a condensation reaction are disclosed. Specifically, various methods for the production of highly-pure bisphenol-A are disclosed in which an attached promoter ion exchange resin catalyst system is combined with a solvent crystallization step.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating composition comprising a substantially non-zinc containing primer and a topcoat. The primer includes an epoxy resin having an epoxy equivalent weight of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a hydroxyl equivalent weight of about 200 to about 500, and a filler material. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 520 to about 930, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a carboxyl functional polyester with an acid number of about 45 to about 75 mg KOH/g, a foaming agent and a reinforcing fiber.

Abstract: This disclosure relates generally to polysulfone compositions whose residual phenolic monomers or phenolic degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed polysulfones and articles of manufacture comprising the disclosed polysulfones.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: Disclosed are immiscible polymer blends, plastic articles containing the blends, and methods for making the plastic articles. One type of article is plastic lumber, which can be in the form of a railroad tie or a marine piling.

Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.

Abstract: A diaphragm for electro-acoustic transducers, especially a diaphragm for speakers, and a film for the diaphragm excellent in the formability and the durability in high-output operation are obtained. A diaphragm for electro-acoustic transducers formed of a film that contains a polybiphenyl ether sulfone resin (A) having a specific repetitive unit or contains it and a crystalline resin (B) such as polyaryl ketone resin; and a film for use for the diaphragm.

Abstract: A topcoat composition to be applied on a resist film is provided, the topcoat composition including: (A) an alkali-soluble resin; (B) a compound containing at least one of an Si atom and an F atom, and increasing a contact angle on a surface of the topcoat film; and (C) a solvent.

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract: A hot melt adhesive composition employing a thermoplastic polyurethane, which has a high adhesive strength even under bonding conditions of low temperature and short time or even to nylon cloth, and which has a favorable adhesive strength in a wide temperature range of from room temperature to low temperature. A hot melt adhesive composition comprising a thermoplastic polyurethane (A) having a flow initiation temperature of from 80 to 150° C. and a phenolic hydroxy group-containing compound (B) having phenolic hydroxy groups and having a molecular weight of at least 1,000.

Abstract: A composition for forming an underlayer film for lithography for imparting excellent optical characteristics and etching resistance to an underlayer film for lithography, an underlayer film being formed of the composition and having a high refractive index (n) and a low extinction coefficient (k), being transparent, having high etching resistance, containing a significantly small amount of a sublimable component, and a method for forming a pattern using the underlayer film are provided. The composition for forming an underlayer film contains a naphthalene formaldehyde polymer having a specific unit obtained by reacting naphthalene and/or alkylnaphthalene with formaldehyde, and an organic solvent.

Abstract: A prosthetic device made of a first specific type of polyarylene, taken alone or in combination with a second specific type of polyarylene, featuring some unexpected advantages such as a very high strength and stiffness, good elongation properties, high chemical resistance, good biocompatibility as well as an outstanding impact resistance.

Abstract: Disclosed herein are monofunctional benzoxazine compounds having at least one electron-withdrawing group. The monofunctional benzoxazine compounds may be combined with one or more multifunctional benzoxazine compounds to form a unique benzoxazine blend. This benzoxazine blend may be combined with additional components such as catalysts and toughening agents to form a curable resin composition suitable for forming resinous films or composite materials. The presence of monofunctional benzoxazine improves the processability of the benzoxazine-based resin composition by reducing the viscosity of the resin composition, and results in improved tack and drape in the films and composite materials formed from the composition without the loss of modulus in the cured resin.

Abstract: [Problem to be Solved] The present invention has an object to provide an automotive lamp extension molding comprising a resin composition having a low specific gravity, being excellent in the balance of heat resistance and fluidity, and being excellent in gloss and brightness feeling of the surface of the molded article. [Solution] The automotive lamp extension molding according to the present invention comprises a resin composition comprising 50 to 95 mass % of a polyphenylene ether (A), and having a specific gravity in the range of 1.00 to 1.12. The reduced viscosity (measured at 30° C. using a chloroform solvent) of the (A) component is preferably 0.25 to 0.45 dl/g, and more preferably 0.25 to 0.38 dl/g.

Abstract: Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The composition includes a phenol resin (A), an epoxy resin (B), and an inorganic filler (C).

Abstract: A poly(phenylene ether)-poly(hydroxy ether) block copolymer is used to compatibilize blends of polar polymers and non-polar polymers. The resulting compatibilized blends exhibit physical property improvements relative to blends without a compatibilizer and blends with a poly(hydroxy ether).

Abstract: The invention relates to the use of a thermoplastic molding composition which comprises at least one polybiphenyl ether sulfone polymer, to produce moldings for conveying gas.

Abstract: A composition comprising (a) an epoxy resin; and (b) a hydroperoxide composition comprising a t-butyl hydroperoxide solution that contains no more than 7 weight percent water, and use of the compositions to prepare foundry shapes, the foundry shapes prepared by the process, the use of the foundry shapes to prepare cast metal articles, and the cast metal articles prepared by the process.

Abstract: A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

Abstract: A flame retardant resin composition in which an acrylonitrile-styrene based polymer, into which sulfonic acid groups and/or sulfonate groups have been introduced by sulfonating processing with a sulfonating agent containing less than 3 wt % of moisture, is contained in a resin to be made flame retardant, so that flame retardant properties will be conferred on the resin flame resistant.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.

Abstract: Embodiments include vinylbenzyl ethers of polycyclopentadiene polyphenol that can be obtained by reacting a polycyclopentadiene polyphenol with a vinylbenzyl halide. Embodiments also include thermosettable compositions including the vinylbenzyl ethers of a polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions. Formula (I).

Abstract: The present invention relates to polycarbonates comprising imide-containing aryl mono- or dihydroxy compounds as chain terminators and, respectively, monomer units, and also to compositions comprising the said polycarbonates, to their use for the production of mouldings, and to mouldings obtainable therefrom.