Solid Polymer Derived From Phenolic Reactant Patents (Class 525/534)
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Patent number: 8507602Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.Type: GrantFiled: October 22, 2007Date of Patent: August 13, 2013Assignee: Whitford Worldwide CompanyInventors: Thomas J. Bate, Arthur Wachowski, Jan Wilhelm Ernst Moos
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Patent number: 8501874Abstract: The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E).Type: GrantFiled: August 8, 2008Date of Patent: August 6, 2013Assignee: Kaneka CorporationInventors: Shigeru Tanaka, Kanji Shimoohsako, Takashi Itoh, Koji Okada, Mutsuaki Murakami
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Patent number: 8487050Abstract: A composition comprises a fluorine-containing aromatic polymer, an epoxy compound and an initiator. Its use as film, laminate with polyimide or copper foils, copper-clad laminated board and adhesive film. The fluorine-containing aromatic polymer is preferably a fluorine-containing aryl ether polymer. The initiator is preferably a cationic initiator.Type: GrantFiled: April 27, 2006Date of Patent: July 16, 2013Assignee: Nippon Shokubai Co., Ltd.Inventors: Kazushi Omote, Ai Nishichi, Shimpei Sato
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Patent number: 8486609Abstract: The invention relates to an antireflective coating composition comprising a crosslinker and a crosslinkable polymer capable of being crosslinked by the crosslinker, where the crosslinkable polymer comprises a unit represented by structure (1): A-Bn??(1) where A is a fused aromatic ring and B has a structure (2), where R1 is C1-C4alkyl and R2 is C1-C4alkyl. The invention further relates to a process for forming an image using the composition.Type: GrantFiled: December 23, 2009Date of Patent: July 16, 2013Assignee: AZ Electronic Materials USA Corp.Inventors: M. Dalil Rahman, Douglas McKenzie, Huirong Yao, JoonYeon Cho, Yi Yl, Guanyang Lin
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Publication number: 20130177807Abstract: A binder for an electrode of a lithium battery, and a lithium battery containing the binder. The binder includes: a carbon nanotube; and a polymer chemically bonded to the carbon nanotube, and thus may form a conducting path by improving dispersion of the carbon nanotube. Accordingly, the binder may have high capacity and improve the lifetime of the lithium battery.Type: ApplicationFiled: August 29, 2012Publication date: July 11, 2013Applicant: Samsung SDI Co., Ltd.Inventors: Beom-Wook LEE, Hye-Sun JEONG, Hye-Ran LEE
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Publication number: 20130172433Abstract: A method for the manufacture of a polymer is provided, the method comprising: Providing a first monomer, the first monomer comprising a bicyclic diamine moiety, a first nucleophilic group provided on a carbon atom of an aromatic moiety, and a second nucleophilic group provided on a carbon atom of an aromatic moiety; Providing a bridging compound comprising at least two sites vulnerable to nucleophilic attack; and Contacting the first monomer with the bridging compound. Polymers made by said method and uses of such polymers are also disclosed.Type: ApplicationFiled: September 15, 2011Publication date: July 4, 2013Applicant: UNIVERSITY COLLEGE CARDIFF CONSULTANTS LIMITEDInventors: Neil Bruce McKeown, Mariolino Carta
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Publication number: 20130143363Abstract: An adhesive film for a semiconductor may include about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film, a phenolic curing agent, and an amine curing agent, and the adhesive film may have a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes.Type: ApplicationFiled: December 5, 2012Publication date: June 6, 2013Inventors: Sang Jin KIM, Kyoung Tae WI, Jae Won CHOI, Sang Kyun KIM, Cheol Su KIM
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Publication number: 20130137626Abstract: The invention relates to microcapsules, the capsule walls of which comprise a resin that can be obtained by reacting a) at least one compound selected from the group consisting of a1) amines and a2) aromatic or heteroaromatic compounds which are unsubstituted or substituted with one or more substituents from the group consisting of C1-C20-alkyl, OH, OR, COOH, SH, SR, NHCOR, OCOR, halogen, or an aromatic compound, where R is a C1-C10-alkyl group, with b) at least one aldehydic component that contains at least two carbons atoms per molecule, in the presence of c) at least one copolymer which contains units of 2-acrylamido-2-methylpropane sulphonic acid or salts (AMPS) thereof and/or 2-acrylamido-2-methylpropane phosphonic acid or salts (AMPP) thereof and units of one or more (meth)acrylates.Type: ApplicationFiled: March 14, 2011Publication date: May 30, 2013Applicant: FOLLMANN & CO. GESELLSCHAFT FÜR CHEMIE-WERKSTOFFE UND VERFAHRENSTECHNIK MBH & CO. KGInventors: Klaus Last, Daniel Mues
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Patent number: 8450399Abstract: The invention relates to a polymer composition which is characterized in that it comprises a mixture (A) consisting of formula (A1) and/or formula (A2), phenolic resin (B) and a stabilizer (C) in the form of a HALS compound.Type: GrantFiled: April 2, 2009Date of Patent: May 28, 2013Assignee: Evonik Degussa GmbHInventors: Marianne Omeis, Kathrin Salwiczek, Elke Fiebig-Bauer
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Patent number: 8445566Abstract: The invention relates to a continuous process for producing a reactive polymer based on compounds according to the structures (A1) and/or (A2) and phenolic resin in an extruder and to the reactive polymer produced according to said process and the use thereof for producing composite materials.Type: GrantFiled: April 2, 2009Date of Patent: May 21, 2013Assignee: Evonik Degussa GmbHInventors: Marianne Omeis, Thomas Weihrauch, Silvia Herda, Elke Fiebig-Bauer
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Publication number: 20130119369Abstract: The present invention provides: a layered structure having a substrate and a hole injection and/or hole transport layer comprising an aromatic compound having, on a side chain, at least one type of group having a cationic center; an electronic device having the layered structure; an aromatic compound having, on a hydrocarbon side chain, at least one type of group having a cationic center; an aromatic compound having a leaving group on a hydrocarbon side chain; and a method for manufacturing the aromatic compound having, on a hydrocarbon side chain, at least one type of group having a cationic center, the method comprising reacting the aromatic compound having a leaving group on a hydrocarbon side chain with a specific nitrogen compound, phosphorus compound, sulfur compound, or a combination of two or more of these compounds, thereby converting the aromatic compound into an onium salt thereof.Type: ApplicationFiled: July 29, 2011Publication date: May 16, 2013Applicant: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Arihiro Yashiro, Hideyuki Higashimura, Rui Ishikawa, Masanobu Tanaka
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Patent number: 8440313Abstract: Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties. Therefore, the composition can be used as a material for next-generation boards that are becoming lighter in weight and smaller in size and thickness. Also disclosed herein is a printed circuit board using the composition.Type: GrantFiled: December 11, 2008Date of Patent: May 14, 2013Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics Co., Ltd., Samsung Fine Chemicals Co., Ltd., Sungkyunkwan University Foundation For Corporate CollaborationInventors: Chung Kun Cho, Myung Sup Jung, Mahn Jong Kim, Jin Young Bae, Chung Won Park
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Patent number: 8436106Abstract: Cross-linkers and polymers produced using them are provided. The cross-linked polymers are suitable for use in applications where a broad temperature range may be encountered. In some examples, at least a first and a second polyetheretherketone chain may be cross-linked to each other through two or more Schiff base linkages. Articles using the cross-linked polymers are also described.Type: GrantFiled: July 24, 2008Date of Patent: May 7, 2013Assignee: Schlumberger Technology CorporationInventors: Huilin Tu, Agathe Robisson
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Publication number: 20130102740Abstract: Provided are a sulfonated poly(arylene ether) copolymer including a crosslinking structure and a polyelectrolyte membrane including the same. Particularly, a sulfonated poly(arylene ether) copolymer including a crosslinking structure in a polymer chain or at the terminal portion of the polymer chain, and a polyelectrolyte membrane including the same are provided. The polyelectrolyte membrane using the sulfonated poly(arylene ether) copolymer including the crosslinking structure, may have the same or better degree of a thermal stability, a mechanical stability, a chemical stability, a membrane forming capability, etc. than a commonly used polyelectrolyte membrane. In addition, the proton conductivity and the cell performance of the polyelectrolyte membrane may be remarkably improved than those of the commonly used polymer electrolyte. Further, the properties of the electrolyte membrane may be rarely changed, and a high measuring stability may be obtainable.Type: ApplicationFiled: July 13, 2011Publication date: April 25, 2013Applicant: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Jae-Suk Lee, Young Jea Kim, Hyo Kyeong Son, Da Young Kim, Un Ko
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Patent number: 8420768Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.Type: GrantFiled: December 20, 2010Date of Patent: April 16, 2013Assignee: Chevron U.S.A. Inc.Inventors: Jeremy E. Dahl, Robert M. Carlson, Shenggao Liu
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Patent number: 8420719Abstract: A flame-retardant resin composition comprises a base resin (A), such as a polyester or polycarbonate resin, and an aromatic organophosphorus compound, in particular, aromatic organophosphorus oligomers or polymers.Type: GrantFiled: March 14, 2012Date of Patent: April 16, 2013Assignee: Chemtura CorporationInventors: Larry D. Timberlake, Mark V. Hanson, Narayan Subramaniam, William R. Fielding
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Publication number: 20130059127Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R-W-R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.Type: ApplicationFiled: September 1, 2011Publication date: March 7, 2013Inventor: Edward N. Peters
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Publication number: 20130052462Abstract: The invention provides networked polymeric nanofibers having a structure in which amorphous polymeric fibers are branched at multiple sites and having a diameter of from 1 nanometer to 100 nanometers. A solution of a polymer such as polystyrene in a good solvent thereof is rapidly frozen to form a nanoscale phase-separation structure of the polymer and the frozen solvent. The networked polymeric nanofibers can then be obtained upon removing the frozen solvent.Type: ApplicationFiled: February 14, 2011Publication date: February 28, 2013Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCEInventors: Izumi Ichinose, Xinsheng Peng, Sadaki Samitsu, Rui Zhang
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Publication number: 20130035457Abstract: The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.Type: ApplicationFiled: August 3, 2012Publication date: February 7, 2013Applicant: BASF SEInventors: Martin Weber, Thomas Weiß, Christian Maletzko, Bastiaan Bram Pieter Staal, Claudia Spang
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Publication number: 20130012635Abstract: A thermoplastic material comprises the cure product of a thermoplastic polymer having a thermal decomposition temperature greater than or equal to about 200° C., the thermoplastic polymer being cured at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. An article is formed from the thermoplastic material.Type: ApplicationFiled: July 8, 2011Publication date: January 10, 2013Applicant: BAKER HUGHES INCORPORATEDInventors: Jiaxiang Ren, David Peter Gerrard, James Edward Goodson, Lillian Guo, Ping Duan
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Publication number: 20120329939Abstract: A poly(arylene ether)-poly(hydroxy ether) block copolymer includes at least one poly(hydroxy ether) block and at least one poly(arylene ether) block, and the mole ratio of poly(hydroxy ether) blocks to poly(arylene ether) blocks is 0.95:1 to about 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be prepared by reacting a telechelic poly(arylene ether) having terminal hydroxyl groups with a telechelic poly(hydroxy ether) epoxy resin having terminal epoxy groups, wherein the mole ratio of the telechelic poly(hydroxy ether) to the telechelic poly(arylene ether) is 0.95:1 to 1.00:1. The poly(arylene ether)-poly(hydroxy ether) block copolymer can be shaped into an article by extrusion, thermoforming, or molding, and is a compatibilizing agent for non-polar and polar polymers.Type: ApplicationFiled: June 27, 2011Publication date: December 27, 2012Inventor: Edward Norman Peters
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Publication number: 20120329903Abstract: The present invention relates to an acid modified urethane phenoxy acrylate resin and a method for preparing the same. More particularly, the present invention relates to an acid modified urethane phenoxy acrylate resin in which a urethane modified acrylic group is introduced at the side chain by reacting a phenol-novolac resin with (metha)acryloyloxyalkyl isocyanate or Bis(metha)acryloyloxyalkyl isocyanate and then reacting with an acid anhydride. According to the invention, it is provided a photosensitive resin having an excellent balance by maintaining heat resistance, adhesion, chemical resistance, electric resistance and the like which are shown from a resin used in a conventional photosensitive composition and improving flexibility, toughness, extensibility and the like.Type: ApplicationFiled: February 22, 2011Publication date: December 27, 2012Inventor: Dae Yeun Kim
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Publication number: 20120309857Abstract: Disclosed herein is a polyarylene-based polymer, a preparation method for the same, and a polymer electrolyte membrane for fuel cell using the polymer. The polyarylene-based polymer, which is designed to have long side chains of a hydrophilic moiety and dense sulfonic acid groups, may improve the formation of ion channels when fabricating a polymer membrane and also ensures good chemical stability of the hydrophilic moiety and good dimensional stability against water. Further, the preparation method of the present invention simplifies production of the polymer, and polymer electrolyte membranes using the polymer exhibits improved properties as a polymer electrolyte membrane for a fuel cell, such as high proton conductivity, even under an atmosphere of low water uptake, and good dimensional stability against a long-term exposure to water.Type: ApplicationFiled: December 9, 2011Publication date: December 6, 2012Applicant: HYUNDAI MOTOR COMPANYInventors: Inchul Hwang, Nak Hyun Kwon, Young Taek Kim, Dong Il Kim, Ju Ho Lee, Jang-Bae Son
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Publication number: 20120299286Abstract: Method for increasing at least one of the solubility and dispersibility of a quaterrylene and/or terrylene dye in a liquid medium, including binding the quaterrylene or terrylene dye to a polymer which is soluble in the liquid medium. Various aspects relate without limitation to polymer-bonded quaterrylene or terrylene dyes, processes, markings, security features, articles and dye-doped polymers.Type: ApplicationFiled: May 24, 2012Publication date: November 29, 2012Applicant: SICPA HOLDING SAInventors: Thomas TILLER, Cécile PASQUIER, Aurélien Georges Jean COMMEUREUC
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Patent number: 8309662Abstract: A process for producing a solution blend of a polybenzimidazole (PBI) and a polyetherketoneketone (PEKK). The PBI is mixed with sulfuric acid at a temperature between 40° C. and 80° C. for 30 minutes to 2 hours to produce a PBI solution then cooled to room temperature to form a cooled PBI solution. Then PEKK is added to the cooled PBI solution to form a mixture and that mixture is stirred from 30 minutes to 2 hours at room temperature to form a stirred mixture. The stirred mixture is poured into an excess of water being stirred swiftly to form an aqueous mixture. The aqueous mixture is filtered to produce a blend. The blend is washed with water and dried. The resulting blend can yield a blend in all proportion from 1/99 PBI/PEKK to 99/1 PBI/PEKK.Type: GrantFiled: July 22, 2010Date of Patent: November 13, 2012Assignee: PBI Performance Products, Inc.Inventors: Bobby G. Dawkins, Michael Gruender, Gregory S. Copeland, Tim Hsu
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Publication number: 20120269990Abstract: Provided are a phenoxy resin composition for transparent plastic substrate and a transparent plastic substrate using the phenoxy resin composition, capable of effectively substituting for a conventional glass substrate since having excellent thermal and chemical resistance, high adhesiveness, low water infiltration, and a small coefficient of linear thermal expansion. In one general aspect, there is provided a phenoxy resin composition for transparent plastic substrate, including: phenoxy resin having a chemical structure expressed as follows: wherein the n value is 35 to 400.Type: ApplicationFiled: December 5, 2011Publication date: October 25, 2012Applicant: Toray Advanced Materials Korea Inc.Inventors: Chang-Hoon SIM, Yeun-Soo KIM, Ki-Jeong MOON
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Patent number: 8288003Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).Type: GrantFiled: August 5, 2009Date of Patent: October 16, 2012Assignee: DIC CorporationInventors: Koji Hayashi, Yoshiyuki Takahashi, Ichirou Ogura
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Publication number: 20120252217Abstract: A resist underlayer film-forming composition includes (A) a polymer that includes a repeating unit shown by a formula (1), and has a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and (B) a solvent, wherein R3 to R8 individually represent a group shown by the following formula (2) or the like, —O—R1?R2 ??(2) wherein R1 represents a single bond or the like, and R2 represents a hydrogen atom or the like.Type: ApplicationFiled: August 30, 2011Publication date: October 4, 2012Applicant: JSR CorporationInventors: Shin-ya MINEGISHI, Yushi MATSUMURA, Shinya NAKAFUJI, Kazuhiko KOMURA, Takanori NAKANO, Satoru MURAKAMI, Kyoyu YASUDA, Makoto SUGIURA
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Publication number: 20120252986Abstract: The devices and method are provided for detecting labeled and label-free analytes, such as nucleic acids and proteins, employing conjugated cationic, anionic and neutral polymers. The analytes can be immobilized on a solid support material. The solid support material can be disposed in the pre-fabricated patterns on a substrate. The chemical structures of the polymers employed by the various embodiments of the present invention are described herein.Type: ApplicationFiled: June 25, 2010Publication date: October 4, 2012Inventors: Bin Liu, Chun Wang, Ruoyu Zhan, Glenn P. Bartholomew, Janice W. Hong, Jean M. Wheeler, Brent S. Gaylord
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Publication number: 20120245265Abstract: The invention relates to: a polycarbonate resin composition which is a polycarbonate resin composition (X) including a polycarbonate resin (A) that contains structural units (a) derived from a dihydroxy compound having the portion represented by the following general formula (1) as part of the structure thereof and an aromatic polycarbonate resin (B), and in which the content of the aromatic polycarbonate resin (B) is 30% by weight or higher based on the polycarbonate resin composition (X); and a molded article obtained from the composition. [Chem. 1] ?CH2—O???(1) (The case where the portion represented by the general formula (1) is part of —CH2—O—H is excluded.Type: ApplicationFiled: June 5, 2012Publication date: September 27, 2012Applicant: MITSUBISHI CHEMICAL CORPORATIONInventor: Haruo SASAKI
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Publication number: 20120238669Abstract: Inventive composite materials are provided. The composite is preferably a nano-composite, and comprises an asphaltene, or a mixture of asphaltenes, blended with a polymer. The polymer can be any polymer in need of altered properties, including those selected from the group consisting of epoxies, acrylics, urethanes, silicones, cyanoacrylates, vulcanized rubber, phenol-formaldehyde, melamine-formaldehyde, urea-formaldehyde, imides, esters, cyanate esters, allyl resins.Type: ApplicationFiled: March 16, 2012Publication date: September 20, 2012Applicant: Honeywell Federal Manufacturing & Technologies, LLCInventor: Daniel E. Bowen, III
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Publication number: 20120223010Abstract: A membrane comprising a blend of a sulfonated poly(aryl ether) and a phenyl amine compound along with methods for making and using the same. Many additional embodiments are described including applications for such membranes.Type: ApplicationFiled: March 1, 2011Publication date: September 6, 2012Inventors: William E. Mickols, Mou Paul, Abhishek Roy
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Publication number: 20120217038Abstract: The present description discloses a polymeric composition which is a melt-processed alloy comprised of (a) a polyarylene sulfide resin, (b) a polyaryl-ether-ketone resin, and a reactive compound which results in (c) a graft copolymer of the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin in addition to the starting resins. Exemplary melt-processed polymeric compositions can be made by reacting an alkoxy silane with the polyarylene sulfide resin and/or the polyaryl-ether-ketone resin to produce a graft copolymer of a portion of one or both of the resins, sufficient to render the composition uniform and homogeneous. It is normally preferred for the exemplary organosilane compound, to be an amino silane. The subject invention further reveals an insulated wire comprising (1) an electrical conductor and (2) a layer of the melt-processed alloy composition; and fiber reinforced composites comprising fibers substantially fully impregnated with the alloy polymeric composition.Type: ApplicationFiled: April 27, 2012Publication date: August 30, 2012Applicant: TICONA, LLCInventors: Manoj Ajbani, Andrew Auerbach, Ke Feng
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Publication number: 20120208944Abstract: A method for reducing the concentration of poly(aryl ether ketone) in an original polymer composition that is exposed to an aggressive chemical environment that is more aggressive against poly(biphenyl ether sulfone) than it is against the poly(aryl ether ketone) while maintaining or exceeding at least one of the original polymer composition's tensile strength, tensile modulus, flexural strength and flexural modulus retention ratio after exposure to the aggressive chemical environment.Type: ApplicationFiled: February 3, 2012Publication date: August 16, 2012Applicant: SOLVAY ADVANCED POLYMERS L.L.C.Inventors: Mohammad Jamal EL-HIBRI, Shari Weinberg
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Publication number: 20120178852Abstract: A process for converting epoxy resin to episulfide resin through reactive melt extrusion of a solid epoxy resin with a sulfur donating compound. The resulting resin provides for an application that utilizes the resulting extruded episulfide resin as a low application temperature resin for powder coatings applications.Type: ApplicationFiled: September 21, 2010Publication date: July 12, 2012Inventors: Fabio Aguirre Vargas, Raymond J. Thibault, John Beckerdite
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Publication number: 20120172501Abstract: A flame-retardant resin composition comprises a base resin (A), such as a polyester or polycarbonate resin, and an aromatic organophosphorus compound, in particular, aromatic organophosphorus oligomers or polymers.Type: ApplicationFiled: March 14, 2012Publication date: July 5, 2012Inventors: Larry D. Timberlake, Mark V. Hanson, Narayan Subramaniam, William R. Fielding
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Publication number: 20120172467Abstract: The invention relates to a flame retardant comprising a) at least one sulfur compound of the formula (I) b) at least one halogen-free organophosphorus compound with phosphorus content in the range from 0.5 to 40% by weight, based on the phosphorus compound.Type: ApplicationFiled: December 23, 2011Publication date: July 5, 2012Applicant: BASF SEInventors: Ingo Bellin, Patrick Spies, Sabine Fuchs, Christoph Fleckenstein, Peter Deglmann, Maximilian Hofmann, Rainer Ostermann, Klaus Hahn, Hartmut Denecke, Klemens Massonne, Geert Janssens, Manfred Döring, Ciesielski Michael, Jochen Wagner
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Publication number: 20120172547Abstract: A cross-linked polyphosphonate and a thermoplastic resin composition including the cross-linked polyphosphonate are disclosed. The composition may have excellent flame retardancy and mechanical strength and superior appearance and heat resistance.Type: ApplicationFiled: December 14, 2011Publication date: July 5, 2012Applicant: CHEIL INDUSTRIES INC.Inventors: Seon Ae LEE, Chang Hong KO, Sang Hyun HONG, Min Soo LEE
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Publication number: 20120172506Abstract: A polyphosphonate having an acid value of about 5.5 mg KOH/g or less and represented by Formula 1: wherein: A is a single bond, C1 to C5 alkylene, C1 to C5 alkylidene, C5 to C6 cycloalkylidene, —S— or —SO2-, R is substituted or unsubstituted C6 to C20 aryl or substituted or unsubstituted C6 to C20 aryloxy, R1 and R2 are the same or different and are each independently substituted or unsubstituted C1 to C6 alkyl, substituted or unsubstituted C3 to C6 cycloalkyl, substituted or unsubstituted C6 to C 12 aryl or halogen, a and b are the same or different and are each independently an integer from about 0 to about 4, and n is an integer from about 1 to about 500.Type: ApplicationFiled: December 20, 2011Publication date: July 5, 2012Applicant: CHEIL INDUSTRIES INC.Inventors: Min Soo LEE, Chang Hong KO, Seon Ae LEE, Sang Hyun HONG
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Patent number: 8211588Abstract: A sulfonated poly(arylene sulfone) contains an unsaturated bond. A cross-linked material may be formed from the sulfonated poly(arylene sulfone), and a clay nanocomposite may include the sulfonated poly(arylene sulfone) or the cross-linked material. A fuel cell includes the clay nanocomposite.Type: GrantFiled: January 4, 2010Date of Patent: July 3, 2012Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Yeong-suk Choi, Sang-ouk Kim, Sun-hwa Lee, Won-jun Lee
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Patent number: 8211576Abstract: A block copolymer comprising at least one segment having an acid group which is represented by the following formula (1) and at least one segment substantially free from acid groups which comprises repeating units represented by the following formula (2) is provided: (wherein, m represents an integer of 10 or more, Ar1, Ar2 and Ar3 represent each independently a divalent aromatic group which is optionally substituted by an alkyl group having 1 to 10 carbon atoms, alkoxy group having 1 to 10 carbon atoms, aryl group having 6 to 10 carbon atoms or aryloxy group having 6 to 10 carbon atoms, at least one of Ar1 and Ar2 having an acid group, and Ar3 may have an acid group or may be free from acid groups. Y represents —CO— or —SO2—, and Y's may be different from each other.Type: GrantFiled: September 24, 2004Date of Patent: July 3, 2012Assignee: Sumitomo Chemical Company, LimitedInventors: Toru Onodera, Shigeru Sasaki, Daizaburo Yashiki
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Publication number: 20120164464Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent thermal resistance, low water absorption, and good elastic modulus, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent thermal resistance, mechanical property and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.Type: ApplicationFiled: December 22, 2011Publication date: June 28, 2012Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTDInventors: JUNQI TANG, XIANPING ZENG
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Publication number: 20120164463Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.Type: ApplicationFiled: December 22, 2011Publication date: June 28, 2012Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTDInventors: Junqi Tang, Xianping Zeng
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Publication number: 20120149796Abstract: The present invention relates to a process for the production of low-halogen-content polybiphenyl sulfone polymers, to the resultant polybiphenyl sulfone polymers, to polybiphenyl sulfone polymers having less than 400 ppm content of polymer-bonded halogen, to thermoplastic molding compositions comprising these polybiphenyl sulfone polymers, and to their use for the production of moldings, of fibers, of films, of membranes, or of foams.Type: ApplicationFiled: August 17, 2010Publication date: June 14, 2012Applicant: BASF SEInventors: Martin Weber, Christian Maletzko, Gerhard Lange, Jörg Erbes, Matthias Dietrich, Nicolas Inchaurrondo, Christoph Sigwart
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Publication number: 20120149853Abstract: Method for producing polyphenylene ether, comprising preparing a polymerization solution of 10-25 parts by mass of a phenolic compound (M) and 75-90 parts by mass of an aromatic solvent (A) with the total of the compound and the solvent being 100 parts by mass, and 0.1-10 parts by mass of a catalyst (C) containing a metal salt; performing oxidative polymerization of the phenolic compound (M) by passing oxygen-containing gas through polymerization solution; stopping polymerization by mixing aqueous chelating agent solution into polymerization solution; subjecting a diphenoquinone compound produced as a by-product to quinone binding process or removal by reduction; and obtaining polyphenylene ether by separating aqueous phase through liquid-liquid separation. In the method for producing a polyphenylene ether, 0.001-0.004 part by weight of an ion catalyst (D) is added into the polymerization solution before the liquid-liquid separation.Type: ApplicationFiled: February 15, 2012Publication date: June 14, 2012Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Mutsumi MAEDA, Hiroaki FURUKAWA
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Publication number: 20120138345Abstract: An adhesive composition comprises 10 to 100 parts by weight of a first maleimide compound having a plurality of maleimide groups in a structure and having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and/or a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds based on 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in a structure. A heat resistant adhesive film formed by coating the adhesive composition on a substrate film, and a wiring film having a conductor wiring layer put between heat resistant adhesive films are also disclosed.Type: ApplicationFiled: December 1, 2011Publication date: June 7, 2012Inventors: Satoru AMOU, Kosuke Kuwabara, Tomiya Abe, Hiroaki Komatsu, Kenichi Murakami
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Publication number: 20120142828Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.Type: ApplicationFiled: February 15, 2012Publication date: June 7, 2012Applicant: Dow Global Technologies LLCInventor: Joesph Gan
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Patent number: 8163847Abstract: A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.Type: GrantFiled: December 10, 2009Date of Patent: April 24, 2012Assignee: Sabic Innovative Plastics IP B.V.Inventors: Kenneth Paul Zarnoch, John Robert Campbell, Amy Rene Freshour, Hua Guo, John Austin Rude, Prameela Susarla, Michael Alan Vallance, Gary William Yeager
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Publication number: 20120091443Abstract: A composition for use in an organic device, useful in producing an organic device, such as an organic electroluminescent element, having high operation stability, is a composition for use in an organic device that contains at least two cross-linking compounds, at least two of the cross-linking compounds having different numbers of cross-linking groups. A polymer film produced by forming a film of the composition for use in an organic device and then polymerizing the cross-linking compounds. An organic electroluminescent element that includes an anode and a cathode on a substrate and at least one organic layer disposed between the anode and the cathode, wherein at least one of the at least one organic layer is a layer that is produced by forming a film of the composition for use in an organic device and then polymerizing the cross-linking compounds.Type: ApplicationFiled: December 16, 2011Publication date: April 19, 2012Applicant: MITSUBISHI CHEMICAL CORPORATIONInventors: Kazuki OKABE, Tomoyuki OGATA, Koichiro IIDA
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Publication number: 20120091883Abstract: The present invention provides a color conversion film which can maintain sufficient conversion light intensity without increasing the thickness thereof, and a multicolor light-emitting organic EL device which uses such a film. The color conversion film of the invention includes a polymeric dye material composed of a first dye unit and a second dye unit. The first dye unit absorbs light incident on the color conversion film and transfers the energy of the absorbed incident light to the second dye unit. The second dye unit receives the energy from the first dye unit and emits light.Type: ApplicationFiled: July 27, 2009Publication date: April 19, 2012Applicant: Fuji Electric Holdings Co., Ltd.Inventors: Masaru Nagai, Chong Li