Abstract: Curable compositions, cured compositions formed from the curable compositions, and articles containing the cured compositions are provided. The curable compositions include (a) a curable component that includes (1) an epoxy resin, (2) a polyamide composition, (3) a multifunctional amine compound, and (4) a multifunctional (meth)acrylate compound and (b) an optional inorganic filler. The curable composition can result in the formation of cured compositions with properties such as good tensile strength, good elongation at break, good overlap shear strength, good adhesion to substrates such as metal substrates, or a combination thereof.

Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.

Abstract: A method of preparing polyurethane prepolymer does not require using a toxic isocyanate monomer (manufactured by harmful phosgene) as a raw material. Epoxy resin and carbon dioxide are used as major raw materials to form cyclic carbonates to be reacted with a functional group oligomer, and then amino groups in a hydrophilic (ether group) or hydrophobic (siloxane group) diamine polymer are used for performing a ring-opening polymerization, and the microwave irradiation is used in the ring-opening polymerization to efficiently synthesize the amino-terminated PU prepolymer, and then an acrylic group at an end is added to manufacture an UV cross-linking PU (UV-PU) oligomer which can be coated onto a fabric surface, and the fabric is dried by UV radiation for a surface treatment to form a washing-resisted long lasting hydrophilic or hydrophobic PU fabric.

Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.

Abstract: Process for the continuous preparation of prepolymers based on phenolic resin, an oxazoline component and an epoxide in the presence of a catalyst, including supplying the phenolic resin and the oxazoline component to an extruder in a stream A; a Lewis adduct of boron trifluoride or of aluminum trichloride, or arylsulphonic acids or alkylsulphonic acids, or latent arylsulphonic acids or latent alkylsulphonic acids, in a stream B, and the epoxide in a stream C, the infeed of stream A being situated, as seen in extrusion direction, before the infeed of stream C, these reactants are mixed at a reaction temperature of 120 to 200° C. with a residence time in the extruder of 3 seconds to 15 minutes, and then the product discharge of the extruder is cooled to a temperature of less than 45° C. within from 30 to 60 seconds.

Abstract: A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.

Abstract: The present invention provides hydrolytically resistant monomers prepared by the reaction of an epoxy compound and a reactive ester and methods for producing the monomers. Also provided are adhesive compositions containing the hydrolytically resistant monomers and methods for use thereof.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: Adamantane derivatives are provided including a phenolic hydroxyl group-containing adamantane derivative, a glycidyloxy group-containing adamantane derivative, and an adamantyl group-containing epoxy modified acrylate, which exhibit excellent transparency, light resistance, and heat resistance properties. Also provided are resin compositions containing the adamantane derivatives. Further provided are corresponding methods for producing the adamantane derivatives, as well as the resin compositions containing the same.

Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Aqueous, storage-stable emulsions of ?-silyl terminated polymers are useful as adhesives, sealing compounds and coating materials. The ?-silyl terminated polymers correspond to the general formula (I): in which R1 is a linear or branched alkyl or alkoxy group containing 1 to 4 carbon atoms, R2 and R3 independently of one another are linear or branched alkyl groups containing 1 to 4 carbon atoms, R4 and R6 independently of one another are divalent organic connecting groups, R5 is a hydrophobic divalent polymer group; and R7 is a CH2SiR1(OR2)(OR3) group, in which R1, R2 and R3 have the above meaning or R7 stands for a group that lends the polymer of the general formula (I) the property of self-emulsification in water by forming an oil in water emulsion.

Abstract: An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.

Abstract: An adhesive film comprising a cycloalkanediol modified copolymerized polyester resin film and a thermosetting vinyl ester resin composition layer which is hardened at room temperature on said polyester resin film.

Abstract: The present invention relates to adhesion-improved, curable compositions comprising a cyclic ether, a cyclic thiocarbonate, an amine and a carboxylic acid. A method of making such compositions and their use in adhesives, sealants and coatings are also provided.

Abstract: An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).

Abstract: An actinic energy ray-curable resin is obtained by reacting an unsaturated monocarboxylic acid (c) with a terminal epoxy group of an epoxy resin having an unsaturated group and a hydroxyl group in its side chains and an epoxy group in its terminal and further reacting a polybasic acid anhydride (d) with the hydroxyl group of the above-mentioned epoxy resin, wherein the above-mentioned epoxy resin is a product of the polyaddition reaction of a reaction product (I) of a polybasic acid anhydride (a) and a compound (b) having at least one unsaturated double bond and one alcoholic hydroxyl group in its molecule, a compound (II) having at least two carboxyl groups in its molecule, and a bifunctional epoxy compound (III), wherein at least either one of the carboxyl group-containing compound (II) and the bifunctional epoxy compound (III) is a compound containing no aromatic ring.

Abstract: A water soluble polymer comprising a copolyhydroxyaminoether having side-chains of polyalkylene oxides, an aqueous solution of said polymer and process for preparing the copolyhydroxyaminoether.

Abstract: Coatings comprising the reaction product of a terpene, an acrylic monomer and a phenolic compound containing at least one unsubstituted carbon atom ortho or para to a phenolic group and/or the reaction product of a phenolic compound containing at least one unsubstituted carbon atom ortho or para to a phenolic group and a compound containing a phenolic reactive group and an epoxy group are disclosed.

Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

Abstract: An aromatic ring-containing polymer is provided having excellent flexibility and surface water-repellency. The polymer containing an aromatic ring has a fluoroalkyl group having two or more carbon atoms as a side chain, which is optionally interrupted by divalent group, wherein the fluoroalkyl group satisfies the following formula (a): A/(A+B)?0.4??(a) wherein in the formula, A represents the number of fluorine atoms in the fluoroalkyl group and B represents the number of hydrogen atoms in the fluoroalkyl group.

Abstract: Aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC. Resins ABC are an adduct mixture of: adducts formed by the reaction of polyethylene glycol-modified epoxy resins A with olefinically unsaturated acids C, and adducts formed by the reaction of epoxy resins B, that are free from polyethylene glycol derived groups, with olefinically unsaturated acids C. A process for preparing aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC, and a process of coating a substrate with aqueous radiation curable binders comprising non-ionically stabilized epoxy resins ABC.

Abstract: Process for the anodic electro-dipcoating of conducting surfaces by dipping in an aqueous anodic electro-dipcoating bath and connecting up as the anode, in which an aqueous anodic electro-dipcoating bath is used that contains 1 to 15 wt. %, referred to the binder solids of the electro-dipcoating bath, of one or more phosphoric acid epoxy esters and/or phosphonic acid epoxy esters that have been produced in the presence of alcohols.

Abstract: A resin composition for composite material parts includes a main agent composed of an epoxy resin and a reactive diluent, and a curing agent. The reactive diluent, which is monomer or oligomer of acrylate or methacrylate having one or more vinyl (unsaturated double bond) functional groups and has low viscosity at room temperature, is used in an amount of 5 to 30 parts by weight based on 100 parts by weight of the main agent such that the main agent has a viscosity of 700 to 3000 cps at 25° C. The resin composition of the present invention is very suitable for being used to manufacture composite material parts used in wind blade, boat, automobile and aircraft by the manufacturing process such as vacuum infusion and hand lay-up vacuum assisted resin infusion process.

Abstract: The invention relates to a process for the production of post-crosslinkable thermoplastic resins by bulk-polymerizing a polymerizable composition (A) comprising (I) a monomer fluid containing a cyclic olefin (?) having two or more metathetical ring-opening reaction sites in the molecule in an amount 10 wt % or above based on the total amount of the monomers or a monomer fluid containing a norbornene monomer and a crosslinking agent, (II) a metathetical polymerization catalyst, and (III) a chain transfer agent; thermoplastic resins obtained by this process; and a process for producing crosslinked resins or crosslinked resin composite materials which comprises laminating such a thermoplastic resin with a substrate at need and then crosslinking the thermoplastic resin. According to the invention, thermoplastic resins which are free from odor due to residual monomers and excellent in storage stability can be efficiently obtained by a simple process of bulk-polymerizing the composition (A).

Abstract: Curable compositions are provided which contain a curable component and particular m-hydroxybenzene derivatives, wherein such derivatives function as aging inhibitors. Such curable compositions are useful as coating agents and adhesives having improved aging resistance.

Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

Abstract: An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxy resins. The polyols can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated aliphatic radical having 1 to 4 carbon atoms; R3 and R4 are identical or different and are each a hydrogen atom or alkyl having 1 to 3 carbon atoms, and the bridge member (R3+R4) is in each case positioned ortho or meta in relation to the phenolic oxygen atom; Z represents a group —CH2—CH2—, —CH2—CH(CH3)—, —CH(CH3)—CH2— or a combination thereof; s is number from 1 to 200; B represents hydrogen, —CO—CH?CH—COOM, —COCH(SO3M)CH2COOM, —CO—CH2—CH(SO3M)—COOM, —SO3M, —SO2M and/or —PO3MM, whereby M is preferably a cation selected from the group Li+, Na+, K+, NH4+, HO—CH2—CH2—NH3+, (HO—CH2—CH2—)2NH2+ or (HO—CH2—CH2—)3NH+; and Y is a radical of an amine. The inventive addition compounds are used as dispersing agents of solids, for example, pigments, particularly in aqueous media.

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.

Abstract: The object of the present invention is to provide an organic polymer excellent in heat resistance and chemical resistance and having a low dielectric constant. This object can be achieved by a polyether resin having a repeating unit of following formula (1): wherein R1 to R3 independently represent hydrogen atom, a halogen atom, or a substituent, or two of R1 to R3 may be mutually bonded to form a ring; R4 denotes hydrogen atom, an alkyl group with 1 to 10 carbons which may be substituted, a cycloalkyl group with 6 to 10 carbons which may be substituted, an aromatic ring with 6 to 14 carbons which may be substituted, a trialkylsilyl group which may be substituted, or a hydroxyalkyl; and Ar represents a divalent aromatic ring.

Abstract: A dental resin composition is disclosed, comprising a polycarbonate-modified diphenoxy diacrylate having a monomer structure (I): wherein R is CH3 or H; b is one or zero; A is (CH2)nO; n is an integer from 1 to 10, preferably from 1 to 5; X is an alkoxy or cycloalkoxy group having from one to six carbon atoms, for example, 2,2-propylene or —CH2—, or —S— or —O—; i is 1 or 0; and wherein M is —(C1-10 alkyl)O—, —(CH2)pO—, or —CH(CH3)CH2O—, m is an integer from 1 to 10, and p is an integer from 1 to 4. Preferably, R is methyl. The composition and described filler material are suitable for use in dental restorations, and provide improved wear resistance and other properties.

Abstract: An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the epoxy resin (B) to the phenol resin (C) is within a range from 1:0.6 to 1:1 in terms of a functional group equivalent ratio, and an adhesive sheet for a semiconductor device using the same are provided. The composition and the sheet are superior in reflow resistance and short-time and low-temperature bonding without lowering characteristics such as heat resistance, low hygroscopicity, high adhesion and electrical insulating properties of an epoxy resin cured article.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: A dental restorative composition comprises about 35 to about 43 wt %, based on the total dental restorative composition, of a polymerizable, ethylenically unsaturated resin composition, wherein the resin composition comprises, based on the resin composition alone, about 25 to about 35 wt % PCDMA, about 40 to about 50 wt % EBP-DMA, about 18 to about 28 wt % Bis-GMA, and about 55 to about 70 wt %, based on the total dental restorative composition, of a filler system, wherein the filler system comprises a silanized barium glass containing about 20 to about 60 wt % barium oxide based on the weight of silanized barium glass. Such dental restorative compositions display an ability to flow under ambient conditions and this increases their utility where improved flexural strength and ease of application is desired.

Abstract: Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.

Abstract: There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.

Abstract: A polycarbonate resin molding material for optical use which is pellets formed from a polycarbonate resin and having a bulk density of 0.72 kg/l or more and an optical disk substrate formed therefrom.

Abstract: A dental restorative composition comprises about 35 to about 43 wt %, based on the total dental restorative composition, of a polymerizable, ethylenically unsaturated resin composition, wherein the resin composition comprises, based on the resin composition alone, about 25 to about 35 wt % PCDMA, about 40 to about 50 wt % EBP-DMA, about 18 to about 28 wt % Bis-GMA, and about 55 to about 70 wt %, based on the total dental restorative composition, of a filler system, wherein the filler system comprises a silanized barium glass containing about 20 to about 60 wt % barium oxide based on the weight of silanized barium glass. Such dental restorative compositions display an ability to flow under ambient conditions and this increases their utility where improved flexural strength and ease of application is desired.

Abstract: There is provided a polymer electrolyte which shows excellent characteristics as proton conductive membrane of fuel cells and the like. This polymer electrolyte contains an aromatic polymer which is characterized by having a super strong acid group in a side chain.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: A low viscosity (and therefore low VOC) resin can be produced by limiting the molar ratio of the reactants, especially the dicarboxylic acid compound, used in the reaction. Specifically, reacting a reaction mixture comprising (i) one mole of a diepoxide having at least two glycidyl ether type epoxy groups; (ii) 0.5 to 2.0 moles of an unsaturated monocarboxylic acid; (iii) 0.1 to 0.5, preferably 0.1 to 0.3, moles of maleic anhydride; and, (iv) water, until substantially all of the epoxy groups disappear leads to the formation of a resin with a high shear (at least 500 s−1) viscosity of less than 1200 cP when measured in a 70% NVM (non-volatile matter) styrene solution. The resin may be used in barrier coatings, gel coatings, skin coatings and as a laminate resin.

Abstract: It is an object of the present invention to provide a compound having a (meth)acryloyl group that is suitably used in various applications, a process for producing such compound simply and under mild conditions, and an useful photo-curable composition and aqueous photo-curable composition comprising such compound.