Nitrogen Reactant Having At Least One Amino-nitrogen Atom Contains Three Or More Nitrogen Atoms Patents (Class 528/123)
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Patent number: 11958955Abstract: Hybrid spray foams utilize a urethane reactant, a crosslinker, and an (optional) epoxy and/or acrylic resin along with a blowing agent and rheology modifier to produce a quick-setting foam that remains in place until the foam forms and cures. The urethane reactant may be formed as an adduct with or without the use of isocyanate chemistry. In some embodiments, the polyurethane oligomer is made by reacting cyclocarbonates and di- or polyamines, while in other embodiments the polyurethane backbone employs the use of commercially available capped or blocked urethane oligomers made by any method. The oligomers contain reactive groups, typically at the oligomer ends, that crosslink with crosslinkers or with acrylic or epoxy resins to form hybrid polyurethane foams. Foams may also contain a plasticizer, and/or a surfactant as well as other optional additives. Methods of making such foams are also provided.Type: GrantFiled: September 16, 2022Date of Patent: April 16, 2024Assignee: Owens Corning Intellectual Capital, LLCInventor: Fatemeh Nassreen Olang
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Patent number: 8981033Abstract: A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.Type: GrantFiled: January 6, 2011Date of Patent: March 17, 2015Assignee: Hexcel Composites LimitedInventor: John Cawse
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Patent number: 8921497Abstract: An adhesive for anchoring materials in or to concrete or masonry exhibits a shorter cure time than previous adhesives and comprises an epoxy compound and a curing agent of at least one aliphatic amine and at least one tertiary amine, optionally with a reactive dilent, which possesses sufficent strength to pass ICBO Heat Creep Test at 110 degrees F. and the ICBO Damp Hole Test at 75 degrees F.Type: GrantFiled: December 27, 2002Date of Patent: December 30, 2014Assignee: Illinois Tool Works Inc.Inventor: Jim Surjan
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Patent number: 8729213Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.Type: GrantFiled: September 23, 2011Date of Patent: May 20, 2014Assignee: Air Products and Chemicals, Inc.Inventors: Williams Rene Edouard Raymond, Gamini Ananda Vedage
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Patent number: 8530604Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least ten times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature and a second phase having a second glass transition temperature that is lower than the first glass transition temperature. The polymer is transformable between a first shape and a second shape at the first glass transition temperature.Type: GrantFiled: November 30, 2010Date of Patent: September 10, 2013Assignee: GM Global Technology Operations LLCInventor: Ingrid A. Rousseau
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Patent number: 8524807Abstract: Compounds VB of the formula (I) or (II), said compounds being particularly suitable as curing agents for epoxide resins. The compounds can be produced easily and rapidly. They can be used in the form of aqueous curing agents and form stabile aqueous emulsions in particular. This facilitates the formulation of ECC compounds for use primarily as coatings.Type: GrantFiled: June 12, 2009Date of Patent: September 3, 2013Assignee: Sika Technology AGInventor: Pierre-André Bütikofer
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Patent number: 8512594Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.Type: GrantFiled: August 25, 2008Date of Patent: August 20, 2013Assignee: Air Products and Chemicals, Inc.Inventors: Frederick Herbert Walker, Robert Marjo Theodoor Rasing, Gamini Ananda Vedage, Michael Ian Cook, Peter Andrew Lucas
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Patent number: 8236195Abstract: A fluorine-containing curable composition containing (A) A fluorine-containing amino compound having primary or secondary amino groups at both ends, said compound being represented by the formula (1): Y-Q-Rf—(X—Rf)n-Q-Y??(1) wherein Rf is a divalent perfluorooxyalkylene group, each Q is independently a divalent organic group having 1 to 20 carbon atoms and, optionally, containing an oxygen atom and/or a nitrogen atom, X is a divalent organic group having 1 to 20 carbon atoms and, optionally, containing an oxygen atom and/or a nitrogen atom, Y is an organic group having a primary or secondary amino group and 1 to 20 carbon atoms and, optionally, containing an oxygen atom, and n is an integer of from 1 to 20, (B) An epoxy compound having at least two epoxy groups in a molecule, in an amount such that the amount of the epoxy groups is 0.Type: GrantFiled: January 9, 2009Date of Patent: August 7, 2012Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yasunori Sakano, Noriyuki Koike
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Patent number: 8168296Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.Type: GrantFiled: February 11, 2009Date of Patent: May 1, 2012Assignee: Air Products and Chemicals, Inc.Inventors: Gamini Ananda Vedage, Williams Rene Edouard Raymond, Michael Ian Cook, Robert Marjo Theodoor Rasing
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Patent number: 8147964Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.Type: GrantFiled: August 6, 2008Date of Patent: April 3, 2012Assignee: Air Products and Chemicals, Inc.Inventors: Gamini Ananda Vedage, Williams Rene Edouard Raymond, Michael Ian Cook, Robert Marjo Theodoor Rasing
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Patent number: 8114519Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.Type: GrantFiled: October 24, 2007Date of Patent: February 14, 2012Assignee: Sika Technology AGInventors: Andreas Kramer, Juergen Finter
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Patent number: 8093340Abstract: A reversible adhesive system for coupling together two objects may consist of two shape memory polymers with molecular “hooks and loops” on the surfaces (i.e. the surface away from each of the objects). Utilizing the shape memory properties of the polymers, the molecular hooks and molecular loops may be brought together to form non-covalent bonds, leading to macroscopic adhesion. Upon heating, the adhesive bond can be separated with a small peeling force. The adhesive bonding and debonding can be repeated for multiple cycles with significant adhesion retention.Type: GrantFiled: July 24, 2008Date of Patent: January 10, 2012Assignee: GM Global Technology Operations LLCInventors: Tao Xie, Ruomiao Wang, Xingcheng Xiao
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Patent number: 8039537Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.Type: GrantFiled: February 22, 2010Date of Patent: October 18, 2011Assignee: Industrial Technology Research InstituteInventors: Feng-Po Tseng, Lu-Shih Liao, Kuo-Chan Chiou
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Patent number: 7993751Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.Type: GrantFiled: August 6, 2008Date of Patent: August 9, 2011Assignee: Air Products and Chemicals, Inc.Inventors: Gamini Ananda Vedage, Williams Rene Raymond, Maw Lin Foo
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Patent number: 7914844Abstract: A method of making a dispersion of reduced graphite oxide nanoplatelets involves providing a dispersion of graphite oxide nanoplatelets and reducing the graphite oxide nanoplatelets in the dispersion in the presence of a reducing agent and a polymer. The reduced graphite oxide nanoplatelets are reduced to an extent to provide a higher C/O ratio than graphite oxide. A stable dispersion having polymer-treated reduced graphite oxide nanoplatelets dispersed in a dispersing medium, such as water or organic liquid is provided. The polymer-treated, reduced graphite oxide nanoplatelets can be distributed in a polymer matrix to provide a composite material.Type: GrantFiled: November 16, 2006Date of Patent: March 29, 2011Assignee: Northwestern UniversityInventors: Sasha Stankovich, Sonbinh T. Nguyen, Rodney S. Ruoff
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Patent number: 7834126Abstract: The invention relates to amide-containing polymers of the general formula (I) A-X—CO—(CH2)2—NR1—R2—[Y—R3—Y—R4)a—B??(I) and also their salts with carboxylic acids, phosphoric esters and sulphonic acids. The invention further relates to processes for preparing the amide-containing polymers and to their use as rheology control agents.Type: GrantFiled: October 10, 2006Date of Patent: November 16, 2010Assignee: BYK-Chemie GmbHInventors: Karlheinz Haubennestel, Stefan Moessmer, Ulrich Orth, Daniela Betcke
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Patent number: 7468454Abstract: The present invention relates to a process for preparing amino-functional polyurethane prepolymers by a) preparing an NCO-functional polyurethane prepolymer by reacting an excess of one or more di- and/or polyisocyanates with at least one isocyanate-reactive compound having a functionality of at least 1.5, b) reacting the free NCO groups of the resulting polyurethane prepolymer with at least one compound containing one or more silanol groups to obtain the corresponding silylurethanes, and then c) converting the silylurethanes to amino-functional polyurethane prepolymers by hydrolysis and/or alcoholysis with decarboxylation. The present invention also relates coatings, adhesives, sealants, casting compounds or moldings obtained from these amino-functional polyurethene prepolymers.Type: GrantFiled: June 30, 2005Date of Patent: December 23, 2008Assignee: Bayer MaterialScience AGInventor: Michael Mager
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Patent number: 7459504Abstract: The present invention provides a film-forming composition. The composition includes a reaction product of: a) a polyamine containing a primary amino group and a secondary amino group; and b) an acyclic carbonate. Also provided is a method of preparing a film-forming composition and an article coated with such compositions.Type: GrantFiled: April 8, 2005Date of Patent: December 2, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Venkatachalam Eswarakrishnan, Gregory J. McCollum, Matthew Scott, Geoffrey R. Webster, Jr., Judith A. Orzechowski, Kevin J. Dufford, David Robert Fenn, Alan J. Kaylo, Thomas C. Moriarity
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Patent number: 7378461Abstract: The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable epoxy resin composition and a process for its production, and (3) a process for production of heat-resistant laminated sheets by using the curable epoxy resin composition. The invention provides (1) a curable epoxy resin composition capable of giving a cured article having a high glass transition temperature and excellent mechanical properties, (2) a powder form of curable epoxy resin composition having a high glass transition temperature, excellent mechanical properties and excellent storage stability and a process for its production, and (3) heat-resistant laminated sheets made by using the curable epoxy resin compositions and having excellent heat resistance and mechanical properties.Type: GrantFiled: October 31, 2002Date of Patent: May 27, 2008Assignee: Kawamura Institute of Chemical ResearchInventors: Kazutoshi Haraguchi, Akira Ohbayashi
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Patent number: 7307128Abstract: The present invention relates to an epoxy compound, represented by a general formula (I), which is solid at ordinary temperature, has extremely low melt viscosity and has excellent curing property and which can provide a cured product which is excellent in mechanical strength, heat resistance, and moisture resistance. It also relates to a preparation method of the epoxy compound, an epoxy resin composition, and a cured product thereof. The epoxy compound is represented by the following general formula (I): (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more).Type: GrantFiled: August 27, 2004Date of Patent: December 11, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7304120Abstract: An epoxy compound, represented by a general formula (I) is obtained by reacting an anthrahydroquinone compound having a following general formula (II) with epihalohydrin. (wherein R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms, and n represents an integer of 0 or more, and wherein A1, A2 each represent hydrogen atom or alkali metal atom, R1-R10 each represent hydrogen atom or alkyl group having 1-6 carbon atoms.Type: GrantFiled: January 26, 2007Date of Patent: December 4, 2007Assignee: Japan Epoxy Resins Co., Ltd.Inventors: Atsuhito Hayakawa, Akihiro Itou
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Patent number: 7282553Abstract: Polyamides and polyimides containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents and their synthetic method are disclosed. Polyamide containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents is synthesized by reacting diamine compound (2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)-3,5-dimethylphenyl]propane) with an equimolar diacid via a polycondensation reaction. Polyimide containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents is synthesized by reacting diamine compound with an equimolar dianhydride via a polycondensation reaction.Type: GrantFiled: June 30, 2004Date of Patent: October 16, 2007Assignee: National Taiwan University of Science & TechnologyInventor: Der-Jang Liaw
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Patent number: 6987161Abstract: Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.Type: GrantFiled: April 25, 2003Date of Patent: January 17, 2006Assignee: Ardes Enterprise, Inc.Inventor: Richard D. Schile
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Patent number: 6962964Abstract: This invention relates to improved polyepoxide resins cured with a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines and a process for preparing such polyepoxide resins as well as to the methylene bridged poly(cycloaliphatic-aromatic)amine compositions and a method of making them. The improvement resides in using a curative (herein referred to as “Heavy MPCA”) comprised of the partially hydrogenated condensation product of formaldehyde and aniline or methyl substituted aniline containing a substantial amount (from 35 to 85% by weight, preferably 40 to 60% by weight) of oligomers in the form of 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 and 15 aniline or methyl substituted aniline derivatives.Type: GrantFiled: February 6, 2003Date of Patent: November 8, 2005Assignee: Air Products and Chemicals, Inc.Inventors: Michael Ulman, Gamini Ananda Vedage, David Alan Dubowik, Stephen Michael Boyce
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Patent number: 6908982Abstract: An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the composition. The amino composition is obtained by addition reaction of diamine such as metaxylylenediamine and 1,3-bis(aminomethyl) cyclohexane and styrene, wherein the content of the diamine is less than 15% by weight based upon the total weight of the amino composition and the content of 1-addition product of having one phenethyl group is 50 to 100% by weight based upon the total weight of amino compound(s) obtained by the addition reaction.Type: GrantFiled: June 18, 2003Date of Patent: June 21, 2005Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tetsushi Ichikawa, Hisayuki Kuwahara, Masatoshi Echigo
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Patent number: 6866803Abstract: A slip casting mold includes a water absorption layer having self water absorption capability and substantial water resistance. With the water saturation percentage of the water absorption layer being controlled, a slurry layer is deposited in the slip casting mold mainly under capillary attractive forces of the slip casting mold. The water absorption layer comprises an open porous body which is manufactured by stirring a mixture of an epoxy compound having at least one epoxy ring in one molecule, a hardener for reacting with the epoxy compound to harden the epoxy compound, a filler for developing self water absorption capability and mold releasability, and water into an O/W-type emulsion slurry, and casting the emulsion slurry into a mold impermeable to water, hardening the emulsion slurry in the mold while containing water.Type: GrantFiled: July 10, 2000Date of Patent: March 15, 2005Assignee: Toto Ltd.Inventors: Akio Matsumoto, Takeshi Sato, Yoshifumi Misumi, Akira Hirayama, Katsuhiro Hasebe, Yoshinori Yamashita
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Patent number: 6809130Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.Type: GrantFiled: March 11, 2003Date of Patent: October 26, 2004Assignee: Industrial Technology Research InstituteInventors: Kuo-Chan Chiou, Tzong-Ming Lee, Feng-Po Tseng, Lu-Shih Liao, Jia-Chi Huang, Tzu-Ting Lin
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Patent number: 6770370Abstract: An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the epoxy resin (B) to the phenol resin (C) is within a range from 1:0.6 to 1:1 in terms of a functional group equivalent ratio, and an adhesive sheet for a semiconductor device using the same are provided. The composition and the sheet are superior in reflow resistance and short-time and low-temperature bonding without lowering characteristics such as heat resistance, low hygroscopicity, high adhesion and electrical insulating properties of an epoxy resin cured article.Type: GrantFiled: August 5, 2002Date of Patent: August 3, 2004Assignee: Tomoegawa Paper Co., Ltd.Inventors: Naoji Suzuki, Osamu Oka, Jun Tochihira, Akihiro Maeda
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Patent number: 6759503Abstract: The invention provides N-cyanoethylated toluenediamines (CNTDAs), processes for synthesizing them, and compositions containing them. In preferred embodiments, the CNTDAs are represented by the following formula: where the nitrogen atoms are ortho or meta to each other on the aromatic ring. The CNTDAs are particularly suitable for use as latent curing agents for epoxy resins.Type: GrantFiled: January 31, 2003Date of Patent: July 6, 2004Assignee: Air Products and Chemicals, Inc.Inventors: William Edward Starner, Tammy Lynn Cush
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Patent number: 6753040Abstract: A curable composition comprising a) an epoxy resin having on average more than one epoxide group per molecule and b1) an alkyldipropylenetrimine of general formula (I) and/or b2) an adduct of an alkyldipropylenetrimine of general formula (I) with b3) an epoxide compound having on average at least one epoxide group per molecule in which R is hydrocarbon radical 8 to 22 carbon atoms, and the use of this composition for mineral and metallic substrates.Type: GrantFiled: March 21, 2002Date of Patent: June 22, 2004Assignee: Vantico GmbH & Co. KGInventors: Wolfgang Scherzer, Jörg Volle
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Patent number: 6734263Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.Type: GrantFiled: April 19, 2002Date of Patent: May 11, 2004Assignee: Diversified Chemical Technologies, Inc.Inventors: Rajan Eadara, Roy P. Jacob, Yushin Ahn, Biju Philip, Jori Joseff
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Patent number: 6727325Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.Type: GrantFiled: June 23, 1999Date of Patent: April 27, 2004Assignee: Nippon Soda Co. Ltd.Inventors: Hiroshi Suzuki, Satoru Abe, Izuo Aoki
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Patent number: 6670041Abstract: Water-dilutable binders which are self-crosslinking at room temperature, comprising reaction products ABF with epoxy-amine adducts A and formaldehyde resin formers B selected from phenols B1, (substituted) ureas B2, melamine B3, guanamines B4, and mixtures of said resin formers, with formaldehyde F or compounds which give off formaldehyde under the reaction conditions, may be formulated, following at least partial neutralization, to give aqueous coating materials which give coatings affording outstanding corrosion protection.Type: GrantFiled: November 2, 2001Date of Patent: December 30, 2003Assignee: Solutia Austria GmbHInventors: Willibald Paar, Roland Feola, Johann Gmoser, Michael Gobec
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Patent number: 6660386Abstract: A primer for flame sprayed polyolefin comprises an epoxy resin, preferably of low molecular weight and/or low viscosity; and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure of the composition under flame spray conditions. The invention is unique that it provides strong adhesion to steel, even where the surface preparation is less than ideal, as well as to concrete and other substrates. The primer eliminates the need to preheat the substrate. The primer has strong adhesion to the topcoat polyolefinic material, especially to a functionalized topcoat. The composition withstands open flame and does not char under polyolefin flame spray conditions, nor does it run or sag, and it is not prone to failure as it cools after the application of the polyolefin.Type: GrantFiled: May 21, 2001Date of Patent: December 9, 2003Assignee: Polymer Ventures, L.L.C.Inventor: Shah A. Haque
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Patent number: 6653369Abstract: Water dilutable amine curing agents for aqueous epoxy resin dispersions, comprising a combination of an epoxide-amine adduct with an emulsifier, the epoxide-amine adduct being obtainable by reacting a polyepoxide with a reaction product of an amine and an epoxide component or an amine and subsequent reaction with an epoxide component, the amount of amine being chosen such that the number of nitrogen-attached hydrogen atoms the number of epoxide groups by a factor of from 2 to 10, and the emulsifier being obtainable by reacting diepoxides or polyepoxides with compounds that are at least difunctional with respect to epoxides, optionally with compounds D that are monofunctional with respect to epoxides, and with amines G which contain at least one tertiary and at least one primary or at least two secondary amino group(s).Type: GrantFiled: May 6, 2002Date of Patent: November 25, 2003Assignee: Solutia Austria GmbHInventors: Martin Gerlitz, Thomas Fischer, Andreas Gollner, Manfred Gogg, Elfriede Prucher, Heike Schneeberger, Josef Wenzl
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Patent number: 6649729Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.Type: GrantFiled: May 19, 2000Date of Patent: November 18, 2003Assignee: Vantico GmbH & Co. KGInventors: Wolfgang Scherzer, Jörg Volle
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Patent number: 6583528Abstract: A flywheel system for storing and delivering on demand electrical energy includes a flywheel supported for high speed rotation on bearings in a vacuum enclosure, and a motor-generator for spinning the flywheel up to speed and then for converting the rotational inertia in the flywheel back to electrical power. The flywheel includes a solid steel hub and a rim having only two rings press-fit on the hub with an interference fit. The rings are filament wound construction made primarily from standard modulus carbon fiber/epoxy. The steel hub stores between 40% and 60% of the energy in the flywheel. The press-fitting of the rings on the hub creates radial interference pressure between the hub and each of the composite rings that is greater than 5 ksi when at rest. The outer carbon fiber/epoxy ring is radially thinner than the inner ring, and both the hub outer diameter and the inner diameter of the assembled composite rim are tapered with the same angle.Type: GrantFiled: May 23, 2001Date of Patent: June 24, 2003Assignee: Indigo Energy, Inc.Inventor: Christopher W. Gabrys
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Patent number: 6548576Abstract: A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.Type: GrantFiled: November 7, 2001Date of Patent: April 15, 2003Assignee: Bourns, Inc.Inventor: Raymond L. Winter
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Patent number: 6531567Abstract: The invention relates to Mannich bases prepared using alkyldipropylenetriamines and to addition compounds (adducts) of alkyldipropylenetriamines with acrylonitrile and ethylene oxide or propylene oxide, and to products obtained therefrom by the further addition of epoxy compounds having on average at least one epoxy group per molecule, and to the use of such products as hardeners for curable epoxy resin systems.Type: GrantFiled: March 23, 2001Date of Patent: March 11, 2003Assignee: Vantico GmbH & Co.Inventors: Wolfgang Scherzer, Jörg Volle
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Patent number: 6525160Abstract: The present invention provides an epoxy resin composition which comprises an alkoxy-containing silane-modified epoxy resin (A) which is obtainable by dealcoholization condensation reaction between a bisphenol epoxy resin (1) and hydrolyzable alkoxysilane (2); and a curing agent (B) for epoxy resin. The present invention also provides a method for preparing an alkoxy-containing silane-modified epoxy resin, the method comprising dealcoholization condensation reaction between the bisphenol epoxy resin (1) and the hydrolyzable alkoxysilane (2).Type: GrantFiled: January 12, 2001Date of Patent: February 25, 2003Assignee: Arakawa Chemical Industries Ltd.Inventors: Hideki Goda, Tetsuji Higashino
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Patent number: 6492437Abstract: Solvent-based processes for producing latent curing catalysts without causing an extreme exotherm. The process of the present invention includes combining an amine compound curing agent with a solvent, heating the mixture, adding an epoxy/solvent mixture via slow addition, removing the solvent and then heating the remaining composition. Following the heating, a phenolic resin is added to produce the final catalyst. The final catalyst comprises an amine compound, an epoxy, phenolic resin and a solvent. Catalysts having differing properties may be produced by varying the elements of the catalyst.Type: GrantFiled: June 21, 2001Date of Patent: December 10, 2002Assignee: National Starch and Chemical Investment Holding CorporationInventors: Osama M. Musa, Michael J. Cipullo
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Patent number: 6482899Abstract: A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A); and a curable epoxy resin composition comprising such curing agent and an epoxy compound having more than one epoxy group on the average in the molecule.Type: GrantFiled: April 16, 1999Date of Patent: November 19, 2002Assignee: Ajinomoto Co., Inc.Inventors: Junji Ohashi, Tetsuo Hinoma
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Patent number: 6476160Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.Type: GrantFiled: July 16, 1999Date of Patent: November 5, 2002Assignee: The Yokohama Rubber Co., Ltd.Inventors: Hiroyuki Okuhira, Naoya Adachi
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Patent number: 6465598Abstract: Amine-terminated urethane oligomer compositions are described that include very high oligomer concentrations. The compositions are melts of the amine-terminated oligomers. The compositions can include one or more property modifiers. The compositions are useful in the formation of crosslinked copolymers, especially with epoxy resins. The resulting copolymers are useful in the formation of coatings.Type: GrantFiled: February 26, 2001Date of Patent: October 15, 2002Assignee: Tennant CompanyInventors: Joseph S. Keute, Anne-Marie Thunnissen, Robert J. Tweedy, Jr.
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Patent number: 6451931Abstract: A curing agent composition for an epoxy resin which comprises (B) a reaction product obtained from (a) an amine compound represented by formula (I): wherein R1 and R2 each represent an alkyl group having 1 to 8 carbon atoms, of R1 and R2 are connected together to form an alkylene group which may contain an oxygen atom or a nitrogen atom; and n represents 1 to 6, (b) a polyamine compound comprising a dicarboxylic acid dihydrazide, (c) an organic polyisocyanate, and, optionally; (d) an epoxy compound.Type: GrantFiled: December 29, 2000Date of Patent: September 17, 2002Assignee: Asahi Denki Kogyo Kabushiki KaishaInventors: Akio Ogawa, Manabu Abe
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Patent number: 6388163Abstract: A method for rendering nondetonble energetic materials, such as are contained in or removed from decommissioned ordnance. The energetic materials are either combined with epoxy hardener or are combined with other compounds, preferably amine compounds, to form a substance that functions as an epoxy hardener. According to the invention, energetic materials (including TNT, RDX and Composition B) that are treated according to the invention method yield a reaction product that is non-explosive, that serves to harden or cure conventional epoxy resin to form a stable, nonexplosive waste product. Epoxy hardener made using the method of the invention is also described.Type: GrantFiled: June 29, 1999Date of Patent: May 14, 2002Assignee: Sandia CorporationInventor: Maher E. Tadros
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Patent number: 6365708Abstract: This invention relates to novel polyamines which are the reaction product of A) at least one nonaromatic diamine containing from 2 to 40 carbon atoms, wherein the amine groups are primary amine groups; and B) at least one epihalohydrin of the formula where R is hydrogen or methyl and X is chlorine or bromine; and the coatings resulting from the reaction between the above reaction product and nonaromatic epoxy resins.Type: GrantFiled: December 20, 1999Date of Patent: April 2, 2002Assignee: Cognis CorporationInventors: Shailesh Shah, Anbazhagan Natesh, Joseph Mulvey, Ronald C. LaFreeda, Gaetano D. DeAngelis, Ronald T. Cash, Jr.
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Patent number: 6362359Abstract: The present invention relates to compounds containing modified hydrazide groups and corresponding to formula I wherein R represents the residue obtained by removing the isocyanate groups from a monomeric polyisocyanate, a polyisocyanate adduct or an NCO prepolymer, X represents OR′ or NHR′ and R′ represents a group which is inert to isocyanate groups under the conditions used to form the compound of formula I, R″ represents a divalent, linear or branched aliphatic group containing 2 to 10 carbon atoms, provided that there are at least two carbons between the oxygen atoms wherein the aliphatic group may optionally be substituted by heteroatoms to form ether or ester groups, and n is 2 to 6.Type: GrantFiled: December 1, 2000Date of Patent: March 26, 2002Assignee: Bayer CorporationInventors: Sze-Ming Lee, Karen M. Henderson, Patricia B. Jacobs, Robert A. Sylvester, Douglas A. Wicks
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Patent number: 6350843Abstract: Conductive thermosetting epoxy resins are produced by mixing a metallic salt or oxide with an inorganic acid to form a metallic ion solution. An alcohol is added to effect a secondary dehydration and form a complex ion polymer with double bonds and p electrons. The mixture is neutralized to produce a high molecular weight polymer of low electronic impedance. This polymer is then copolymerized with an epoxy resin.Type: GrantFiled: June 2, 1999Date of Patent: February 26, 2002Inventor: Hsu San Fa
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Patent number: 6329473Abstract: Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as disecondary polyoxyalkylenediamines, and/or diprimary diamines, if desired with the addition of further 1,2-epoxide compounds and also hardeners, and use thereof as a coating for crack bridging, as an adhesive and in powder surface coatings.Type: GrantFiled: March 23, 1995Date of Patent: December 11, 2001Assignee: Solutia Germany GmbH & Co., KGInventors: Manfred Marten, Claus Godau