Abstract: Disclosed are epoxy resin compositions comprising a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin, hydroquinone and a reaction catalyst, or a 1,1-bis(4-hydroxyaryl) lower alkane type epoxy resin and N-aminoalkyl-substituted piperazine or a modified product thereof. These epoxy resin compositions as prepared are in a liquid state and hence resin moldings can be manufactured therefrom by such a simple technique as casting. It is also possible to cure these resin compositions at a temperature below 150.degree. C., and the resin moldings obtained therefrom are tough and excellent in impact resistance as well as in heat resistance.

Abstract: Novel melamine-poly(oxyethylene or oxypropylene) diamine condensates are prepared which have the formula: ##STR1## Wherein: R represents H or--NH--CHR'--(CH.sub.2).sub.x --[--O--CH.sub.2 --CHR"--].sub.n --O--(CH.sub.2).sub.x --CHR'--NH.sub.2R' represents H or --CH.sub.3,R" represents H or -CH.sub.3 or CH.sub.2 CH.sub.3,x represents an integer having a value of 1 or 2, andn is a number having an average value of about 1 to about 2.The melamine-poly(oxyethylene or oxypropylene) diamine condensates have utility as curing agents for epoxy resins.

Abstract: A piezoelectric pressure-sensitive element comprising a dispersion of a dipolarly oriented ferroelectric ceramic powder in a cured product of a composition comprised of an epoxy resin having at least two epoxy groups in the molecules, a compound having defined numbers of amino groups, benzene rings, carbonyl groups and methylene groups, and a crosslinking agent. A methd for making such a piezoelectric pressure-sensitive element is also described, in which the resin composition comprising a ferroelectric ceramic powder is thermally cured and applied with an electric field at a high temperature to cause dipolar orientation of at least the ceramic powder.

Abstract: Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

Abstract: A crosslinked and chain extended urethane-epoxy copolymer coating with high performance properties typical of two part urethane solution coatings results from cure at ambient temperatures (e.g. 70.degree. F.) when the two aqueous systems are merely mixed, stirred and spread at the site. One aqueous system is a dispersion of polyepoxides. The other aqueous system is a primary amine-terminated urethane oligomer in which no less than about 25% and no more than about 40% of the amine functionality is substituted by a salt of a volatile acid which aids dispersion of the oligomer. Minimal organic solvent is present, and as the acid evaporates, the primary amine is restored for linking with the epoxy groups.

Abstract: Aqueous solutions containing an epoxy resin in which epoxy groups have been replaced with a group M.sup.+ [--CH(OH)--CH.sub.2 --X--Ar--NH--C(O)--Q--C(O)--O].sup.- in which M is an alkali metal or onium ion, Q an organic bridging group having 2-3 carbon atoms in the bridge, Ar is arylene, X is S, O, NH, N-alkyl, SO.sub.2 NH or SO.sub.2 N-allyl, and preparation thereof by reacting an N-substituted imide with an epxoy resin and reacting the adduct thus formed with a base in the presence of water.

Abstract: A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

Abstract: A polyfunctional reaction product having functional phenolic OH groups is made available by reacting a phenol and an alkoxylated amino-aldehyde condensation product in the presence of a solvent and of an acid catalyst. This method makes it possible to prepare a polyfunctional phenolic reaction product which is soluble in organic solvents at a low ratio of phenolic OH groups to alkoxy groups without gelling. The reaction product is particularly useful as a curing agent for epoxy resins.

Abstract: A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) a curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.

Abstract: Amidines of the formula: ##STR1## wherein R.sub.1 and R.sub.2 are alkyl groups and the sum of the carbons in R.sub.1 and R.sub.2 is from 2 to 16 are produced by cyanoethylation of the lactam: ##STR2## wherein R.sub.1 and R.sub.2 are as defined above, followed by reduction and, finally, cyclization by dehydration. The compounds produced are useful for curing epoxy and urethane resins.

Abstract: A grinding wheel is described which is bonded with a phenol formaldehyde resin based bond containing hexamethylenetetramine as the curing agent. The wheels are made by first wetting the abrasive with furfural in varying quantities relative to the amount of hexamethylenetetramine in the phenol formaldehyde resin. Different amounts of the curing agent require different specific amounts of furfural to produce optimum properties in the finished grinding wheel.

Abstract: The thermal stability of epoxy resins prepared by dehydrohalogenating the reaction product of an epihalohydrin with an adduct prepared from a cyanuric halide and a polyhydric aromatic compound is improved by employing as the polyhydric aromatic compound one which is substituted with a hydrocarbyl group, a halogen atom or a nitro group at each ortho position relative to each aromatic hydroxyl group. These epoxy resins are useful in coating and molding compositions and in the preparation of laminates and composites.

Abstract: In a process of polymerizing ethylenically unsaturated compounds by polymerization of ethylenically unsaturated monomers in the presence of a free radical-forming initiator system and optionally customary protective colloids and/or emulsifiers and optional known additives in a reactor whose surfaces contact the reaction components, the improvement comprising providing the reactor surfaces with a coating that at least suppresses polymer deposit formation without effecting the color and quality of the polymer.

Abstract: The epoxy resin composition is comprised of an epoxy resin, a solvent and a hardener which is the reaction product of a hexa-alkyl ether of a methylol melamine having the general formula (I), wherein each R, independently, is an alkyl radical having from 1 to 4 carbon atoms with a polyhydric phenol and, optionally, a monohydric phenol, with the phenol compound(s) having been employed in an amount to provide a ratio of at least one reactive phenolic hydroxy group for each alkoxy group.

Abstract: Disclosed is a 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct represented by the following formula: ##STR1## wherein R stands for an alkyl group having 2 to 20 carbon atoms, an unsubstituted or cyano group-substituted aryl group, or a group of the formula R.sup.1 --CH.sub.2 CH.sub.2 -- in which R.sup.1 stands for an alkoxy group having up to 20 carbon atoms, an acyloxy group, an amino group, an N-substituted amino group, a benzotriazolyl group or a 2-alkylimidazolyl-(4)-dithiocarbonyl group, or by the following formula: ##STR2## wherein R.sup.2 stands for an alkylene group which may have an intervening imino or phenylene group.When this adduct is used for curing a polyepoxy resin, a cured product having good heat resistance, insulating property and adhesion and an excellent migration-preventing effect is formed.

Abstract: Heat-curable compositions are described, comprising(a) an epoxide resin and(b) an effective amount of a urea of formulaAr--NHCON(R.sup.3)R.sup.4whereAr represents an aromatic group linked through an aromatic carbon atom to the indicated nitrogen atom and which is substituted by an amido group, andR.sup.3 and R.sup.4 each represent an aliphatic, cycloaliphatic, or araliphatic hydrocarbyl group, optionally substituted by a halogen atom or a hydroxyl group, or R.sup.3 may further represent a hydrogen atom, or R.sup.3 nd R.sup.4, together with the indicated nitrogen atom, may represent a heterocyclic ring of 3 to 5 carbon atoms which may also have one oxygen atom in the ring.Such amidoarylureas may be used alone with the epoxide resin, or in combination with an accelerator for the heat-curing reaction, selected from dicyandiamide, carboxylic acid hydrazides, succinimide, cyanoacetamide, 1-cyano-3-(lower alkyl)guanidines, imidazoles, and carboxylic acid-tertiary amine salts.

Abstract: 2-(3H)-benzoxazolone and certain other benzo-N-heterocycles, as such or as their adduction products with epoxides, may be employed as organo-soluble, latent phenolic curing agents for epoxy resins. The phenolic hydroxyls are provided by rearrangement of the adduction products. Excellent shelf lives, pot lives, gel times and physical properties result.

Abstract: 4,4,6-trimethylhexahydropyrimidine is partially reacted with a polyepoxide to form a room temperature Stable "B" stage epoxy resin system. This system may be stored at or near 25.degree. C. for long periods of time without further reaction. Heating of the partially cured material rapidly transforms the B-Stage product into a cross-linked material which is both temperature and chemically resistant.These properties make the product useful as preimpregnates with laminae such as cloth, paper, glass cloth and the like and for filament windings.

Abstract: Disclosed is an isocyanuric acid adduct of 2-vinyl-4,6-diamino-S-triazine represented by the following structural formula: ##STR1## This adduct is prepared by heating 2-vinyl-4,6-diamino-S-triazine and isocyanuric acid in the presence of water, preferably by using sodium sulfide as a polymerization inhibitor. This adduct is valuable as a hardening agent for an epoxy resin.

Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic hydroxyl aldehydes or ketone compounds with diamines. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.

Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic dialdehydes or aromatic diketones with hdyroxyl-amino compounds. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.

Abstract: Fibre composite systems, in particular fibre composite laminates, can be prepared advantageously from a fibre composite impregnated with a curable epoxide resin matrix containing:(a) a liquid epoxide resin or a liquid mixture of epoxide resins,(b) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine and(c) a tertiary amine which cures by catalysis or(d) a cycloaliphatic diamine or an aliphatic diamine or polyamine, containing not more than one sterically unhindered primary amino group,by crosslinking and curing the resin matrix below 120.degree. C.

Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing ##STR1## groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.

Abstract: An epoxy resin composition comprising an epoxy resin, either 2-vinyl-4,6-diamino-s-triazine or 2-vinyl-4,6-diamino-s-triazine/isocyanuric acid adduct, and at least one compound selected from dicyandiamide, polyvinyl-p-phenol and specific imidazole compounds. The composition is useful, for example, in inks, insulating paints and adhesives for printed circuit base boards and in copper-clad laminated boards.

Abstract: Spherical particles of cured epoxy resin having an average size not larger than 50 .mu.m can be produced by adding a water-soluble amine curing agent to an emulsion of uncured epoxy resin.It is possible to prepare spherical particles incorporating a UV absorber or inorganic particles, to dye these particles with an acid dye, and to subject them to electroless plating.In addition, after-treatment of the cured particles enhances their heat resistance and destroys the epoxide groups left unreacted inside each particle.These particles may be used as an ingredient of cosmetic and coating compositions, as a toner of electrostatic copiers, and for other applications.

Abstract: A two component adhesive formulation comprising a mixture of A. an epoxy component comprising an epoxy resin and an additive selected from the group consisting of (a) a polyisocyanate, (b) a carboxylic anhydride and (c) a compound having unsaturated carbon-carbon bonds capable of undergoing Michael addition reaction with amines, and B. a hardener component for curing component A comprising a mixture of amido amines, primary and secondary amines having tertiary amine groups or ether groups in their backbone, and bisphenol-A is described.

Abstract: A curable composition is prepared by reacting (1) an alkenylphenyl cyanate or mixture thereof, (2) an aromatic polycyanate, polycyanamide or mixture thereof and (3) a polymerizable ethylenically unsaturated material or mixture of such materials. Said curable compositions provide polymeric (cured) compositions with improved mechanical strength relative to cured aromatic polycyanates and/or polycyanamides.

Abstract: An epoxy resin composition containing as a latent hardener a diaminotriazine-modified imidazole compound and dicyandiamide is improved in the usable life of an solder resist ink composition and can give a solder resist also excellent in resistance to an electroless plating bath.

Abstract: A novel process for the preparation of isomelamines of the formula I, ##STR1## which is characterized in that an N-cyano-N-(ar or cyclo)alkylcarboxylic acid amide or N-cyano-N-allylcarboxylic acid amide of the formula II or III ##STR2## is reacted with aqueous sodium hydroxide solution, potassium hydroxide solution or ammonia solution or a primary aliphatic or cycloaliphatic amine in a solvent or with a primary aliphatic alcohol in the presence of a catalytic amount of a basic compound in a temperature range from -20.degree. C. to 200.degree. C., at least 3 hydroxyl or amino group equivalents being used per 3 carboxylic acid amide group equivalents.The isomelamines prepared by the process according to the invention are valuable curing agents for epoxide resins.

Abstract: Epoxy resin compositions are disclosed which are the reaction products resulting from reacting (A) the reaction product of a cyanuric halide and at least one dihydric or polyhydric phenol with (B) at least one dihydric or polyhydric phenol and (C) at least one epoxy resin having an average of more than one epoxy group per molecule. These epoxy resin compositions are suitable for use as electrical laminates, structural laminates, coatings, castings, electrical encapsulation and the like.

Abstract: This invention is directed to polymeric compounds which contain the polyalkylpiperidine radical and at least two primary hydroxyl groups. These compounds are useful as light stabilizers for plastics and coatings. More particularly, the polymeric stabilizers is formed by chain extending polyalkylpiperidine with an excess of epoxy resin to form a diepoxide functional polymer which is then capped with hydroxy functional monomer.

Abstract: Novel piperazinoethyl ureas are prepared by reacting an aminoethyl piperazine with urea and recovering the monosubstituted urea product. These products are useful as curing agents for epoxy resins.

Abstract: Heat-curable compositions comprising an ester of an ethylenically unsaturated acid and a polyhydric alcohol, an oxopropyl isocyanurate formed by the addition of from 2 to 3 moles of acrolein to 1 mole of isocyanuric acid and a free radical or ionic initiator. The compositions are useful as coatings, adhesives and the like.

Abstract: Tertiary aromatic amines derived from aminoglutethimide or para-aminophenylacetic acid act as accelerators for the peroxide catalyzed polymerization of acrylic resins, especially methacrylates, acrylates and unsaturated polyesters. The amines are characterized by good hardening, strength, color and toxicity characteristics, and are thereby particularly suited for use in the filling and restoration of human teeth and the cementing of bone.

Abstract: A curable composition, and composites comprising (A) an epoxy resin and (B) a heterocyclic compound prepared by reacting at least one aromatic or aliphatic polyamine compound having at least two amine groups, which are separated by no more than one carbon atom, with at least one carbonyl-containing compound selected from the group consisting of aldehydes and ketones.

Abstract: Nylon compositions are prepared by anionic polymerization of at least 75% of a lactam with up to about 25% of an epoxy component in the presence of a basic catalyst and a promoter that can be used in lactam polymerization wherein, in a preferred embodiment, the epoxy component is a modified epoxy resin containing physical property enhancing constituents. The nylon compositions are prepared by mixing a fraction of a lactam with the epoxy component and the promotor to form liquid mixture A, mixing remaining lactam with the catalyst to form liquid mixture B, mixing liquid mixtures A and B in the ratio ranging from 1/1 to 4/1 to form liquid mixture C, injecting liquid mixture C into a mold maintained at a temperature of about 100.degree. to 200.degree. C. wherein a chemical reaction takes place whereby the liquid is converted to a solidified mass in less than about 2 minutes, and removing the nylon composition in the form of a molded object.

Abstract: The present invention is directed to epoxy curing agents prepared by reacting a polyhydric phenol with a hexa-alkyl ether of hexamethylol melamine in an amount to provide at least two phenolic hydroxyl groups to one methoxy group. The invention is further directed to curable epoxy compositions.

Abstract: Hardenable mixtures which contain a polyepoxide compound with, on average, more than one epoxide group in the molecule, and a hardener of the formula I ##STR1## The symbol n is an integer from 3 to 5. The methylene carbon atoms can be substituted by one or two methyl or ethyl groups.The hardenable mixtures can be used, for example, in the fields of the protection of surfaces or of adhesives technology.

Abstract: Resin-forming polyepoxides are mixed with polyoxazolidinyl compounds or polymers containing pendant oxazolidinyl groups in which the carbon atom in the 2-position of the heterocyclic ring is substituted with saturated hydrocarbon groups, such as dialkyl, or with an alkylene group forming a saturated ring with the carbon atom in the 2-position of the oxazolidinyl ring to form, in the absence of water, a stable composition which can be stored in closed containers for months without undergoing gelation. When such compositions are spread into films and the films exposed to moisture at ambient temperature, e.g., to ambient air having a relative humidity of at least 20% and temperature of about 15.degree. to 25.degree. C., the polymer serves to react with and cure the polyepoxide.

Abstract: A mixture for the preparation of novel cross-linked nitrogen-containing polyadducts, which contains(a) a N-cyanolactam of the formula I or II ##STR1## and (b) a monomeric or oligomeric organic compound having not less than 2 C atoms and not less than 2 hydroxyl groups.The mixture, with or without addition of a monohydroxy compound, can be used as a casting resin or adhesive, or for the production of foams or coatings.The symbols in the formula are all as defined in claim 1.

Abstract: The process according to the invention is performed by reaction of epoxide resins with primary and/or secondary polyamines with simultaneous quaternizing by means of aromatic and aliphatic polysulfonic esters, halogen-free organic phosphoric esters, or organic compounds which contain at least 1 chlorine or bromine atom, and which are free from -COOH groups and corresponding salt groups. The crosslinked plastics thus obtained are distinguished by an improved electrical conductivity.

Abstract: Resin-forming polyepoxides are mixed with polyoxazolidinyl compounds or polymers containing pendant oxazolidinyl groups in which the carbon atom in the 2-position of the heterocyclic ring is substituted with saturated hydrocarbon groups, such as dialkyl, or with an alkylene group forming a saturated ring with the carbon atom in the 2-position of the oxazolidinyl ring to form, in the absence of water, a stable composition which can be stored in closed containers for months without undergoing gelation. When such compositions are spread into films and the films exposed to moisture at ambient temperature, e.g., to ambient air having a relative humidity of at least 20% and temperature of about 15.degree. to 25.degree. C., the polymer serves to react with and cure the polyepoxide.

Abstract: A process for preparing a flame-retardant antistatic polymer additive useful for incorporation into the melt prior to extruding fibers or other polymers or for dispersing on fibers. Improved flame-retardant properties are obtained by including with said flame-retardant additive an effective flame-retardant proportion of a compound from group Vb of the periodic table.

Abstract: Condensation polymers or addition polymers which contain sterically hindered polyalkylpiperidine groups are proposed as light stabilizers for plastics. The polymers concerned are relatively low-molecular polymers and a difunctional derivatives of a polyalkylpiperidine is additionally used for the manufacture of these. The piperidine radical can be present in the main chain or as a side group of the polymeric stabilizer. Polymeric stabilizers of this type do not tend to migrate out of the plastic or to be removed by extraction; they are therefore very permanent in use.

Abstract: A sprayable, solventless bracing composition is made from the admixture of 100 parts of bisphenol A epoxy resin, up to about 8 parts of a coloring pigment, about 0.5 to about 4 parts of a thixotropic agent, about 100 to about 200 parts of butadiene/acrylonitrile polymer, and about 20 to about 40 parts of an amine terminated curing agent.

Abstract: Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a maleimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.

Abstract: Mixtures hardenable under the influence of air moisture are provided. They comprise at least one organic polyisocyanate or an polyepoxide and as a moisture activated hardener an N,N'-substituted imidazolidine derivative or an N,N'-substituted hexahydropyrimidine derivative, which show at no nitrogen atom a --CO--NH-- grouping and which are present in sufficient amount to provide for cross-linking. The mixtures for example provide lacquers and adhesives having various touch dry times.

Abstract: The invention entitled "Polymers containing polyalkylpiperidines and use thereof as stabilizers" provides a class of polymers in which groups containing sterically hindered polyalkylpiperidines are linked in the main chain of the polymers via bridging members containing 2-hydroxy-1,3-trimethylene groups.The polymers show superior stabilizing effects for various synthetic polymers such as polyolefins against degradation thereof induced by light and/or heat. The polymers have advantages, as compared with known stabilizer compounds, that they hardly volatile upon processing with heating or during storage of articles containing thereof, and that they are resistant to extraction with solvents from articles containing thereof.

Abstract: Hardeners for polyepoxides containing more than one, 1,2-epoxide group per molecule comprising a cyanoethylated polyamide amine containing free secondary or primary or secondary and primary amino groups, said cyanoethylated poly-amide amine is a reaction product of polyadded units of(A) 1 mole of a polyamine corresponding to the formula: ##STR1## in which p=0, n=2 or 3, m=0 to 6 and X=NH.sub.2, or p=1, n=2 or 3, m=0 and X=H,(B) from 0.5 to 2.3 moles of a saturated lactam, and(C) from 0.4 to 2.8 moles of acrylonitrile, methacrylonitrile or mixtures thereof.The hardener may be additionally modified with from 0.01 to 1.8 moles of a 1,2-alkylene oxide containing from 2 to 4 carbon atoms or with from 0.001 to 0.3 moles of a carboxylic acid or with the 1,2-alkylene oxide and the carboxylic acid in the quantities indicated, based in each case on 1 mole of the polyamine.

Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of .[.,.]. .Iadd.4,4-bis-(para-aminobenzoyl)-piperazine .Iaddend.as a curing agent for the epoxy resin, .[.an aromatic diamine containing ##STR1## groups,.]. with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. .[.The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone..]. The curable composition is used in particular for the preparation of fiber-reinforced materials.