Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.

Abstract: This invention relates to thermosetting compositions for the production of epoxide networks of very high impact strength, to a process for their preparation and to their use as polymer materials, coating compounds, adhesives and materials for electrical insulation.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: The present invention is directed to a process for the preparation of amines containing urethane and urea groups. The amines are produced by reacting A) isocyanate prepolymers containing urethane groups and in which the isocyanate groups are reversibly blocked with secondary monoamines with B) amines having molecular weights of from 60 to 500, which are at least difunctional and which have a total of at least two primary or secondary amino groups, with splitting off of the secondary monoamine. The invention is also directed to the amines so produced and to the use as a hardener for an epoxide resin.

Abstract: A lightly-crosslinked thermosettable formulation comprises (a) a diepoxy resin, (b) an aromatic diamine of the structural formula ##STR1## in which each R is a divalent linking moiety selected from C.sub.1-6 alkylene, --S-- and --O--, and R' is ethyl, (c) an amine or phenolic crosslinking agent, and (d) 2,6-dialkyl aniline. The formulation exhibits relatively long outlife and can be used as the matrix resin in aerospace composites applications.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120, the ratio by weight of the hydrogenated conjugated diene polymer rubber to the epoxy resin in the adhesive being 35-75 weight % to 65-25 weight %.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120.

Abstract: The invention relates to epoxide resin mixtures hardenable at room temperature, comprised of:(A) Polyepoxides with more than one epoxide group per molecular;(B) Aliphatic or cycloaliphatic polyamines with more than two active hydrogen atoms bound to the nitrogen of the amino groups;(C) A reaction product having mean m.w. 500-8,000 of:(c1) a polyalkylene ether polyol prepared from alkylene oxides and one member selected from the group consisting of di-functional alcohols, polyfunctional alcohols, or mixtures thereof, and(c2) an aliphatic or cycloaliphatic diisocyanate, wherein the NCO : OH ratio is 2:1, and wherein said reaction product is blocked with a certain sterically hindered piperidine derivative; and optionally(D) Customary fillers, pigments, reaction accelerators, and viscosity regulators.

Abstract: Pure diglycidylether of bisphenol A and pure diaminodiphenylmethane are mixed at a ratio of 1:1 and cured in a two-step curing comprising pre-curing at 80.degree..about.120 .degree. C. and main-curing at 140.degree..about.180.degree. C., to produce very pure epoxy resin having a purity of 99% or more. The product epoxy resin can detect radioactive rays through 630 nm light absorption band.

Abstract: The present invention is directed to a heat-curable composition comprising (1) a polyepoxide, (2) a polyacrylate or polymethyacrylate ester of a polyol, (3) an unsaturated aromatic monomer, (4) an aromatic amine, (5) a free-radical initiator, and optionally (6) an accelerator for the epoxy curing reaction.

Abstract: Blends of diaminoisopropylbenzene (DAIBP) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transition temperatures as compared with resins cured with either diamine alone.

Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.

Abstract: Novel mesogenic amine curing agent for reactive monomers, such as epoxy resins and diisocyanates, comprises a mesogenic moiety, a primary amine, and a flexible alkyl spacer connected between the mesogenic moiety and the primary amine and wherein the alkyl spacer is a saturated, linear alkyl group having from about one to about twenty carbon atoms. Novel mesogenic amine has the formula: ##STR1## where M is --O--, ##STR2## or --CH.sub.2 --, where R is --NO.sub.2 or --CN, andwhere x is 1 to 20.Novel mesogenic amine has a labile group subject to cross-linking and the formula: ##STR3## where K is ##STR4## where L is ##STR5## where M is --o--, ##STR6## or --CH.sub.2 --, where Z is cinnamate, an alkene having from one to ten carbons, an isocyanate, an alkoxy, or an alcohol having from one to ten carbons,where T is a cyano, a nitro or an alkyl group having from about one to ten carbons, andwhere X is 1 to 20.

Abstract: A two component-type curing agent composition is disclosed which comprises a first curing agent which is capable of cross-linking an epoxy resin and which is at least one member selected from primary amines, phenolic compounds and acid anhydrides, and a second curing agent which is at least one compounds represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attracting group; R is a lower alkyl; and m and n each is an integer of 1-4.

Abstract: Blends of diaminoisopropylbenzene (DAIPB) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transistion temperatures as compared with resins cured with either diamine alone.

Abstract: An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.

Abstract: A coating composition is provided comprising an epoxy resin, a polyacetoacetate, a curing agent for the epoxy resin, and an optional organic solvent. The presence of the polyacetoacetate permits the preparation of a fast-drying high-solids coating formulation.

Abstract: A method for curing a 1,2-epoxy resin by mixing the resin with an effective amount of an amine curing agent under epoxy resin curing conditions and accelerating the cure with acetoacetoxyethyl methacrylate (AAEM).

Abstract: Dissymmetric new epoxy polymer materials have improved processability because they can be cured at lower temperatures.

Abstract: A new thermosetting resin composition is disclosed which comprises a Bisphenol A-type epoxy resin having a number average molecular weight of smaller than 650 but not smaller than 450 and a ratio of the weight average molecular weight thereof to the number average molecular weight thereof of in the range of 1.3-3.0; and a curing agent capable of cross-linking the epoxy resin. The curing agent is preferably a compound represented by the following general formula: ##STR1## wherein X is --CR.sub.1 R.sub.2 --, --CO--, --COO--, --SO.sub.2 --, --SO--, --S--, --O--, --NR.sub.1 --, --SiR.sub.1 R.sub.2 -- or --POR.sub.1 -- where R.sub.1 and R.sub.2 each stands for hydrogen, a lower alkyl or a phenyl; Y and Y' each stands for hydrogen, a lower alkyl or an electron attractive group; R is a lower alkyl; and m and n each is an integer of 1-4, or a mixture thereof with a primary amine, a phenolic compound or an acid anhydride.

Abstract: A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) at least one compound selected from the group consisting of (i) a compound having a group, other than an imido group, which is represented by the formula --CONH and (ii) an aromatic amine, (c) an organic metal compound, where said metal is selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, aluminum and zirconium; and (d) an organic silicon compound having at least one group selected from the group consisting of a peroxysilyl group and an o-nitrobenzyloxy group capable of forming a silanol group by irradiation with light. The photo-curable epoxy resin type composition according to this invention is capable of readily curing by light (ultraviolet ray in particular) and also capable of heat curing at a temperature of 150.degree. C.

Abstract: A powdery adhesive comprised of spherical particles comprising 40 to 90 parts by weight of an epoxy resin component, 10 to 60 parts by weight of a rubber component and a latent curing agent contained inside the particles, the average particle size of the particles being from 0.1 to 500 .mu.m. The powdery adhesive may be prepared by a process comprising a step of preparing a compatible mixture comprising an epoxy resin component, a rubber component and a common organic solvent, a step of emulsifying or suspending the compatible mixture in an aqueous medium to form spherical particles, and a step of causing a phase separation of the epoxy resin component and the rubber component in the spherical particles.

Abstract: A curable epoxy resin composition comprising(a) a low viscosity liquid epoxy resin;(b) an alkyl hindered aromatic primary diamine curing agent having at least two aromatic rings;(c) a trialkylsulfonium salt amine cure accelerator; and(d) a liquid monoaromatic primary amine curing agent;(e) at least one reactive monomer; and(f) a peroxide polymerization initiator.

Abstract: The present invention relates to a new thermoplastic polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain amine compounds with certain diepoxide compounds to form linear units which are lightly crosslinked. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.

Abstract: A composition is provided comprising an epoxy resin and an aromatic amine curing agent, the latter which can be described by the formula ##STR1## in which each R is selected C.sub.2 -C.sub.7 alkyl and each R' is selected from C.sub.1 -C.sub.7 alkyl. The described composition has good physical properties for high-performance composite applications and has a relatively long working life.

Abstract: Novel sulfur containing polyarylene polyether oligomers are disclosed. The oligomers are prepared through condensing salts of hydroxy and/or thio aromatic compounds, halobenzenoid compounds bearing two replaceable halogens and metal or ammonium sulfides following by end capping the resultant oligomer intermediate with a salt of a hydroxy and/or thio aromatic compound.

Abstract: A crosslinked and chain extended urethane-epoxy copolymer coating with high performance properties typical of two part urethane solution coatings results from cure at ambient temperatures (e.g. 70.degree. F.) when the two aqueous systems are merely mixed, stirred and spread at the site. One aqueous system is a dispersion of polyepoxides. The other aqueous system is a primary amine-terminated urethane oligomer in which no less than about 25% and no more than about 40% of the amine functionality is substituted by a salt of a volatile acid which aids dispersion of the oligomer. Minimal organic solvent is present, and as the acid evaporates, the primary amine is restored for linking with the epoxy groups.

Abstract: An adhesive mixture comprising a multiplicity of contiguous deposits of a curable but uncured fluid resin and a fluid curing agent for the resin, said deposits being separated by a thin flexible barrier film of cured resin resulting from the interaction between the resin and curing agent.

Abstract: Epoxy resins have been found to be fortified (increased in strength and modulus yet not made brittle) by compounding:(a) a resin-forming polyepoxide(b) an amine curing agent for (a) and(c) a fortifier for (a)+(b) comprising the reaction product of(i) an aromatic polyhydroxy compound and(ii) a diepoxide with one epoxy group less reactive than the other:and heat curing the mixture. Strengths as high as 140 MPa and moduli as high as 4500 MPa have been attained with a ductile mode of failure.

Abstract: A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

Abstract: 2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

Abstract: A structural adhesive which is particularly useful in vertical substrates is composed of a mixture of two components, the first component being an epoxy resin component comprising a poly epoxide and a polyisocyanate which has been allowed to react with less than an equivalent weight of a polyamine which is a primary or secondary polyamine and the second component being a hardener for the polyepoxide comprising a mixture of primary, secondary and tertiary amines, amido amines and phenolics.

Abstract: An adhesive mixture comprising a multiplicity of contiguous deposits of a curable but uncured fluid resin and a fluid curing agent for the resin, said deposits being separated by a thin flexible barrier film of cured resin resulting from the interaction between the resin and curing agent.

Abstract: Epoxy resin compositions which on curing yield cured resins having a high glass transition temperature, high ductility, and low moisture pick-up are disclosed. To obtain such cured resins, 9,9-bis(aminophenyl)fluorenes are used as curing agents.

Abstract: Curable compositions comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured resin fiber matrix compositions exhibit high toughness combined with excellent hot/wet strength.

Abstract: Resinous materials are produced in the substantial absence of a solvent by feeding to an extruder operated at a temperature sufficient to cause a reaction between the reactants (A) at least one material having an average of more than one vicinal epoxy group per molecule, (B) at least one material having an average of more than one group reactive with component (A) such as hydroxyl, thiol, carboxyl, isocyanate, thioisocyanate or secondary amine groups or a combination of such groups per molecule or a material having only one primary amine group per molecule, (C) at least one catalyst for promoting a reaction between components (A) and (B) if a catalyst is required to effect the reaction between components (A) and (B), and (D) optionally one or more chain terminators and thereafter recovering a resinous material resulting from the reaction between components (A) and (B) from said extruder.This process is useful in preparing advanced epoxy resins and phenoxy thermoplastic resins.

Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing ##STR1## groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.

Abstract: A novel polyamine compound, N,N'-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine, having the formula ##STR1## which is useful as a hardening agent for epoxy resins and as a modifier for polyamide resins.

Abstract: Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.

Abstract: Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.

Abstract: Spherical particles of cured epoxy resin having an average size not larger than 50 .mu.m can be produced by adding a water-soluble amine curing agent to an emulsion of uncured epoxy resin.It is possible to prepare spherical particles incorporating a UV absorber or inorganic particles, to dye these particles with an acid dye, and to subject them to electroless plating.In addition, after-treatment of the cured particles enhances their heat resistance and destroys the epoxide groups left unreacted inside each particle.These particles may be used as an ingredient of cosmetic and coating compositions, as a toner of electrostatic copiers, and for other applications.

Abstract: Compounds having the general formula 1 ##STR1## wherein X and Y are functional groups, preferably amino groups, are polymerized with, for example, polyfunctional epoxides to provide heat and fire resistant polymers useful for making flame and fire resistant polymer structures such as for aircraft secondary structures. The groups R in 1 are preferably alkyl and lower halo (e.g., chloro) alkyl.

Abstract: Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from composition comprising (1) a polyepoxide, (2) an aromatic or aliphatic amine, (3) a trihydrocarbyl sulfonium salt, (4) an unsaturated monomer and (5) a free radical curing agent.

Abstract: Described herein is a composition comprising a select group of substituted diamine hardeners and an expoxy resin containing two or more 1,2-epoxide groups per molecule. These compositions exhibit reduced moisture absorption, and controlled reactivity which comprises the processing characteristics of the composition.

Abstract: Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from composition comprising (1) a polyepoxide, (2) an aromatic or aliphatic amine, (3) a trihydrocarbyl sulfonium salt, (4) at least one unsaturated aromatic monomer, (5) an unsaturated co-monomer and (6) a free radical curing agent.

Abstract: Storage stable, heat curable mixtures obtained from epoxy resins as a binder system containing latent hardening agents as well as fillers and additive materials which have outstanding mechanical and electrical properties and which are obtained as epoxy resin components of an adduct of a high molecular solid epoxy resin and 4,4'-diaminodiarylalkane in a molecular ratio of 1:0.01 to 0.05. The preferred economical curing agent is a phenol formaldehyde condensation product.

Abstract: Curable compositions comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured resin fiber matrix compositions exhibit high toughness combined with excellent hot/wet strength.

Abstract: The tensile properties and compressive strength of composites comprising epoxy resins and structural fibers are improved by the inclusion of a novel class of polynuclear aromatic diamine hardners exemplified by 4,4'-bis-(4-aminophenoxy) diphenyl sulfone and its analogs.

Abstract: An epoxy resin latently curable composition including a novel curing agent comprising the liquid salt of a substituted pentafluoroantimonic acid and an aromatic amine selected from the group consisting of aniline and a hindered amine has a desirably long pot life yet cures rapidly with heating to a cured composition.

Abstract: A polymerizable composition comprising a poly(3,4-dihydro-3-substituted-1,3 benzoxazine) and a reactive polyamine, wherein the polyamine is at least difunctional and its reactive groups are primary or secondary amine and wherein the poly(dihydrobenzoxazine) is the reaction product of about 1 equivalent of a primary amine, about 1 equivalent of a phenol and about two equivalents of formaldehyde. The compositions are useful as potting, encapsulating and laminating resins and as surface coatings.