Nitrogen-containing Compound Is A Reactant Other Than Wherein Nitrogen Is Solely Present As A Carboxylic Acid Derivative Patents (Class 528/172)
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Patent number: 6734276Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.Type: GrantFiled: April 11, 2002Date of Patent: May 11, 2004Assignee: Mitsui Chemicals, Inc.Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
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Patent number: 6713597Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.Type: GrantFiled: March 19, 2002Date of Patent: March 30, 2004Assignee: General Electric CompanyInventor: Martin John Lindway
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Patent number: 6710160Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimideType: GrantFiled: March 20, 2002Date of Patent: March 23, 2004Assignee: Mitsui Chemicals, Inc.Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
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Patent number: 6706835Abstract: Adhesion promoting compounds or resins containing a thiazole functionality (including benzothiazole) and a polymerizable functionality (Z) give improved adhesive strength to metal substrates. A representative structure is the following, in which R1 and R2 together can form a cyclic or aromatic structure, or are linear or branched organic moieties.Type: GrantFiled: July 19, 2002Date of Patent: March 16, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventor: Osama M. Musa
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Patent number: 6693162Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.Type: GrantFiled: October 9, 2001Date of Patent: February 17, 2004Assignee: Kaneka Japan CorporationInventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
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Patent number: 6680363Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.Type: GrantFiled: January 23, 2002Date of Patent: January 20, 2004Assignee: Hitachi Cable, Ltd.Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
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Patent number: 6653433Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.Type: GrantFiled: May 4, 2001Date of Patent: November 25, 2003Assignee: E. I. du Pont de Nemours and CompanyInventors: James Richard Edman, Meredith Lynn White
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Patent number: 6642348Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.Type: GrantFiled: March 2, 2001Date of Patent: November 4, 2003Assignee: The University of AkronInventors: Ronald Eby, Michael Meador, Christopher Gariepy
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Patent number: 6642347Abstract: Amine-terminated hyperbranched quinoxaline-amide polymers having repeating units of the formula: are useful to initiate bismaleimide polymerization and to increase the toughness of thermosets such as BMI and epoxies.Type: GrantFiled: February 27, 2002Date of Patent: November 4, 2003Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Jong-Beom Baek, Loon-Seng Tan, John B. Ferguson
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Patent number: 6639042Abstract: New hyperbranched polymers having repeating units of the formula The polymer is prepared by the polymerization of the AB2 monomer N-{3,5-bis(4-hydroxybenzoyl)benzene}-4-fluoroisophthalimide.Type: GrantFiled: February 27, 2002Date of Patent: October 28, 2003Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Jong-Beom Baek, Loon-Seng Tan
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Patent number: 6610815Abstract: Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.Type: GrantFiled: June 21, 2001Date of Patent: August 26, 2003Assignee: Asahi Kasei Kabushiki KaishaInventors: Keiko Hata, Yoko Tanizaki, Yoshio Matsuoka
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Patent number: 6600006Abstract: A polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one terminal of the polyamic ester molecule terminates with the same or different reactive end-capping monomer: wherein in Formula 1, R1 and R2 are independently a hydrogen atom, or an acid labile group; X is a tetravalent, an aromatic or an aliphatic organic group; Y is a divalent, an aromatic or an aliphatic organic group; and m is an integer equal to or greater than 1.Type: GrantFiled: December 31, 2001Date of Patent: July 29, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Myung Sup Jung, Sung Kyung Jung, Yong Young Park, Bong Seok Moon, Bong Kyu Kim
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Patent number: 6596838Abstract: The invention relates to a semi-permeable membrane separation process and device in which the said membranes comprise sulphonated polyimides. The present invention also relates to the use of sulphonated polyimide membranes in separation processes and devices using semi-permeable membranes.Type: GrantFiled: August 17, 2001Date of Patent: July 22, 2003Assignees: Commissariat A l'Energie Atomique, Centre National de la RechercheInventors: Michel Pinery, Gérald Pourcelly, Régis Mercier
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Patent number: 6586561Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.Type: GrantFiled: February 18, 2000Date of Patent: July 1, 2003Assignee: Case Western Reserve UniversityInventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
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Patent number: 6586555Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.Type: GrantFiled: September 12, 2001Date of Patent: July 1, 2003Assignee: Japan Science and Technology CorporationInventors: Kazuaki Ishihara, Hisashi Yamamoto
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Patent number: 6569984Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.Type: GrantFiled: April 27, 2001Date of Patent: May 27, 2003Assignee: Virginia Tech Intellectual Properties, Inc.Inventors: James E. McGrath, Sue J. Mecham
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Patent number: 6555238Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.Type: GrantFiled: August 10, 2001Date of Patent: April 29, 2003Assignee: DuPont-Toray Co. Ltd.Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
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Patent number: 6538097Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: GrantFiled: October 29, 2001Date of Patent: March 25, 2003Assignee: UBE Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Patent number: 6538100Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.Type: GrantFiled: February 14, 2000Date of Patent: March 25, 2003Assignee: Sumitomo Bakelite Company LimitedInventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
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Patent number: 6534622Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: GrantFiled: October 29, 2001Date of Patent: March 18, 2003Assignee: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Patent number: 6531568Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.Type: GrantFiled: April 9, 2001Date of Patent: March 11, 2003Assignee: Mitsui Chemicals, Inc.Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
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Patent number: 6518392Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.Type: GrantFiled: March 8, 2001Date of Patent: February 11, 2003Assignee: International Business Machines CorporationInventors: Kenneth R. Carter, James L. Hedrick, Victor Yee-Way Lee, Dale C. McHerron, Robert D. Miller
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Patent number: 6506536Abstract: The present invention also includes an imageable element, comprising a substrate and a thermally imageable composition comprising a thermally sensitive polymer which exhibits an increased solubility in an aqueous developer solution upon heating. The thermally sensitive polymer includes at least one covalently bonded unit and at least one thermally reversible non-covalently bonded unit, which includes a two or more centered H-bond within each of the non-covalently bonded unit. The present invention also includes a method of producing the imaged element. The present invention still further includes a thermally imageable composition comprising comprising a thermally sensitive polymer according to the present invention and a process for preparing the thermally sensitive polymer, which is a supramolecular polymer.Type: GrantFiled: December 29, 2000Date of Patent: January 14, 2003Assignee: Kodak Polychrome Graphics, LLCInventors: S. Peter Pappas, Alan Monk, Shashikant Saraiya, Jianbing Huang
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Patent number: 6500913Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.Type: GrantFiled: March 13, 2001Date of Patent: December 31, 2002Assignees: Council of Scientific and Industrial Research, Laboratoire des Materiaux Organiques a Proprietes SpeciquesInventors: Jinu Suju Mathew, Subhash Pundlik Vernekar, Reges Mercier, Rachid Kerboua
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Patent number: 6500904Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.Type: GrantFiled: November 2, 2001Date of Patent: December 31, 2002Assignee: General Electric CompanyInventor: Robert F. Hayes
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Publication number: 20020198358Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).Type: ApplicationFiled: March 8, 2002Publication date: December 26, 2002Inventors: Jung-Ki Park, Shi-joon Sung, Jong-Woo Lee
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Patent number: 6498224Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.Type: GrantFiled: December 5, 2001Date of Patent: December 24, 2002Assignee: General Electric CompanyInventors: Roy Ray Odle, Thomas Link Guggenheim, William James Swatos, Michael J. Vollmer
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Patent number: 6498226Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.Type: GrantFiled: May 3, 2001Date of Patent: December 24, 2002Assignee: Industrial Technology Research InstituteInventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
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Publication number: 20020188090Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1Type: ApplicationFiled: March 20, 2002Publication date: December 12, 2002Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
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Patent number: 6489436Abstract: Novel polyimide copolymer, which is a copolymer of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole or a copolymer of two kinds of tetracarboxylic acid dianhydrides consisting of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 3,3′,4,4′-benxophenonetetracarboxylic acid dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole, can form a metal laminate by direct lamination with metallic foils. The metal laminate can fully satisfy the peel strength.Type: GrantFiled: November 29, 2001Date of Patent: December 3, 2002Assignee: Nippon Mektron, LimitedInventors: Jenq-Tain Lin, Hiroyuki Sekine, Alexandre L'vovich Rusanov, Lyubov Borisovna Elchina, Calina Valentinovna Kazakova, Yakov Semionovich Vygodskii
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Patent number: 6489431Abstract: A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).Type: GrantFiled: April 12, 2001Date of Patent: December 3, 2002Assignee: Nissan Chemical Industries, Ltd.Inventors: Kazuhisa Ishii, Takayasu Nihira, Hiroyoshi Fukuro
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Patent number: 6486292Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl; A is a divalent aromatic or halogenated aromatic moiety; and Z is a tetravalent moiety which may be a partly or fully fluorinated aromatic ring, a partly or fully chlorinated aromatic ring, a partly or fully fluorinated cycloaliphatic group, a partly or fully chlorinated aliphatic group, or combinations thereof connected via hetero atoms.Type: GrantFiled: March 7, 2001Date of Patent: November 26, 2002Assignee: Samsung Electronics Co., Ltd.Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
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Patent number: 6479615Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.Type: GrantFiled: December 11, 2000Date of Patent: November 12, 2002Assignee: Nitto Denko CorporationInventors: Takahiro Fukuoka, Amane Mochizuki, Naoki Kurata, Naotaka Kinjo, Toshihiko Omote
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Patent number: 6476177Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: GrantFiled: December 21, 2000Date of Patent: November 5, 2002Assignee: E. I. du Pont de Nemours and CompanyInventors: Brian C. Auman, William R Corcoran, Jr., John R Dodd, Mark A Guidry, John D. Summers
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Patent number: 6476182Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: GrantFiled: December 21, 2000Date of Patent: November 5, 2002Assignee: E. I. du Pont de Nemours and CompanyInventors: Brian C Auman, William R Corcoran, Jr., John D Summers
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Publication number: 20020160299Abstract: The present invention includes a two-layer imageable element, including: a substrate, a top layer including a first thermally imageable composition including (a) a first thermally sensitive supramolecular polymer or (b) a thermally imageable composition free of the first thermally sensitive supramolecular polymer; and disposed between the substrate and the top layer, a bottom layer including a second thermally imageable composition, which includes a second thermally sensitive supramolecular polymer. The present invention also includes a method of producing the imaged element.Type: ApplicationFiled: December 28, 2001Publication date: October 31, 2002Applicant: Kodak Polychrome Graphics, L.L.C.Inventors: Yasuhiro Asawa, Yasuhiro Ishizuka, Eiji Hayakawa, S. Peter Pappas
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Publication number: 20020156231Abstract: An electronically active film comprising a compound of the formula: 1Type: ApplicationFiled: April 20, 2001Publication date: October 24, 2002Inventors: Geoffrey A. Lindsay, Richard A. Hollins, John D. Stenger-Smith, Peter Zarras
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Patent number: 6469126Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: GrantFiled: December 21, 2000Date of Patent: October 22, 2002Assignee: E. I. du Pont de Nmeours and CompanyInventors: Brian C. Auman, William R. Corcoran, Jr., John D. Summers
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Publication number: 20020150833Abstract: The present invention also includes an imageable element, comprising a substrate and a thermally imageable composition comprising a thermally sensitive polymer which exhibits an increased solubility in an aqueous developer solution upon heating. The thermally sensitive polymer includes at least one covalently bonded unit and at least one thermally reversible non-covalently bonded unit, which includes a two or more centered H-bond within each of the non-covalently bonded unit. The present invention also includes a method of producing the imaged element. The present invention still further includes a thermally imageable composition comprising comprising a thermally sensitive polymer according to the present invention and a process for preparing the thermally sensitive polymer, which is a supramolecular polymer.Type: ApplicationFiled: December 29, 2000Publication date: October 17, 2002Applicant: KODAK POLYCHROME GRAPHICS, L.L.C.Inventors: S. Peter Pappas, Alan Monk, Shashkant Saraiya, Jianbing Huang
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Patent number: 6451956Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.Type: GrantFiled: June 8, 2001Date of Patent: September 17, 2002Assignee: Nex Press Solutions LLCInventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
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Patent number: 6451955Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.Type: GrantFiled: September 28, 2000Date of Patent: September 17, 2002Assignee: Sumitomo Bakelite Company LimitedInventors: Michael C. Hausladen, Jin-O Choi
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Publication number: 20020120095Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.Type: ApplicationFiled: February 14, 2000Publication date: August 29, 2002Inventors: Yoshiyuki Yamamori, Hiroyuki Yasuda
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Patent number: 6441127Abstract: An alignment treating agent for a liquid crystal cell, which comprises a polyimide resin of the formula (I): wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, R2 is a bivalent organic group constituting a diamine, and m is a positive integer, provided that at least 10 mol % of R2 is a bivalent organic group selected from the group consisting of: wherein X is H, OH, an alkyl group, an alkoxy group, a carboxyl group, an acyl group or a halogen atom, said polyimide resin being made insoluble in an organic solvent by coating a precursor solution of said polyimide resin on a substrate, followed by heating.Type: GrantFiled: January 19, 1994Date of Patent: August 27, 2002Assignee: Nissan Chemical Industries Ltd.Inventors: Kiyoshi Sawahata, Toyohiko Abe, Yoshihiro Tsuruoka, Hiroyoshi Fukuro
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Publication number: 20020099166Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.Type: ApplicationFiled: January 23, 2002Publication date: July 25, 2002Applicant: HITACHI CABLE,LTD.Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
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Patent number: 6417321Abstract: A thermally cured polyimide is provided, and in particular a crosslinked polyimide, comprising a fluorenyl diamine and comprising an aromatic ring having at least one C1-C10 branched or unbranched alkyl substituent, where the alkyl substituent includes a benzylic hydrogen. The present invention provides a crosslinked polyimide made by a process comprising the step of crosslinking a polyimide comprising diamines comprising pendent fluorenyl groups and comprising aromatic rings having at least one C1-C10 branched or unbranched alkyl substituent, the alkyl substituent including a benzylic hydrogen, by raising the temperature of said polyimide above its glass transition temperature.Type: GrantFiled: August 21, 2000Date of Patent: July 9, 2002Assignee: 3M Innovative Properties CompanyInventors: Kazuhiko Minami, Hiroshi Ayukawa, Toshihiro Suwa, Mitsuaki Kobayashi, Bert T. Chien, Stephen A. Ezzell
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Publication number: 20020086968Abstract: There are disclosed polybenzoxazole precursors which can be processed by centrifugal techniques, which can be cyclized to polybenzoxazoles on substrates without difficulty, and which after cyclization to polybenzoxazoles exhibit a high temperature stability. In particular, these precursors and the polybenzoxazoles prepared from them possess high resistance against the diffusion of metals.Type: ApplicationFiled: November 13, 2001Publication date: July 4, 2002Inventors: Jorg Haussmann, Gerhard Maier, Gunter Schmid, Recai Sezi
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Patent number: 6392004Abstract: An element of a gigahertz electronic device is provided comprising a polyimide selected to have an imide equivalent weight of 375 or greater. The polyimide preferably has a dielectric loss at 12.8 GHz of 0.009 or less and a Tg of 260° C. or greater. Such elements include circuit substrates and antennas.Type: GrantFiled: August 21, 2000Date of Patent: May 21, 2002Assignee: 3M Innovative Properties CompanyInventors: Bert T. Chien, Stephen A. Ezzell
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Publication number: 20020052464Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxlic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: ApplicationFiled: October 29, 2001Publication date: May 2, 2002Applicant: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Publication number: 20020052463Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: ApplicationFiled: October 29, 2001Publication date: May 2, 2002Applicant: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Publication number: 20020037991Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to 1-line, developed and heated to form a polyimide relief pattern.Type: ApplicationFiled: August 30, 2001Publication date: March 28, 2002Applicant: Hitachi Chemical DuPont MicroSystems Ltd.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara