Nitrogen-containing Compound Is A Reactant Other Than Wherein Nitrogen Is Solely Present As A Carboxylic Acid Derivative Patents (Class 528/172)
  • Patent number: 5750633
    Abstract: A dope for cast formation comprising a fluorine including polyimide resin and an organic solvent (P) as main components. The fluorine including polyimide resin has at least one --CF.sub.3 group in the repeating molecular unit. The organic solvent (P) is present during the resin polymerization of the fluorine including polyimide resin. The organic solvent (P) is diethylene glycol dimethyl ether.
    Type: Grant
    Filed: October 24, 1995
    Date of Patent: May 12, 1998
    Assignee: Nitto Denko Corporation
    Inventors: Tomomi Ohara, Hisao Hachisuka
  • Patent number: 5744125
    Abstract: Disclosed are cosmetic melanins of different colors produced by procedures involving oxidative polymerization of monomeric precursors of melanin and/or co-monomers that enhance substantivity or adherence of the melanins to the skin and hair. Also disclosed are methods for preparing cosmetic melanins and methods for using these compositions topically to produce a natural-appearing tan and to prevent damage to skin caused by UV exposure.
    Type: Grant
    Filed: February 23, 1995
    Date of Patent: April 28, 1998
    Assignee: Yale University
    Inventors: John M. Pawelek, James T. Platt
  • Patent number: 5744575
    Abstract: An aromatic polyimide having a recurring unit of the formula (I): ##STR1## wherein Ar is a divalent aromatic group having one or two benzene rings which has a sulfonate group of --SO.sub.3 H, --SO.sub.3 M, and --SO.sub.3 N(L).sub.4 on the ring, wherein M is an alkali metal and L is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, is favorably employed in the form of a semipermeable film for gas separation.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: April 28, 1998
    Assignee: Ube Industries, Ltd.
    Inventors: Shunsuke Nakanishi, Kenji Ito, Yoshihiro Kusuki
  • Patent number: 5741883
    Abstract: Tough, soluble, aromatic, thermoplastic copolyimides were prepared by reacting 4,4'-oxydiphthalic anhydride, 3,4,3',4'-biphenyltetracarboxylic dianhydride and 3,4'-oxydianiline. These copolyimides were found to be soluble in common amide solvents such as N,N'-dimethyl acetamide, N-methylpyrrolidinone, and dimethylformamide allowing them to be applied as the fully imidized copolymer and to be used to prepare a wide range of articles.
    Type: Grant
    Filed: December 16, 1994
    Date of Patent: April 21, 1998
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Robert G. Bryant
  • Patent number: 5739263
    Abstract: The present invention provides a film adhesive comprising, as the main constituent, a polyimide resin having a glass transition temperature of 350.degree. C. or lower and soluble in organic solvents, which polyimide resin is obtained by reacting at least one of the following acid components (A) and (B)(A) 4,4'-oxydiphthalic acid dianhydride(B) 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and/or 3,3',4,4'-benzophenonetetracarboxylic acid dianhydridewith at least one of the following amine components (C) and (D)(C) a siloxane compound represented by the following general formula (1) and/or 2,2-bis(4-(4-amino-phenoxy)phenyl)propane ##STR1## wherein R.sub.1 and R.sub.2 are each a bivalent aliphatic (C.sub.1-4) or aromatic group; R.sub.3, R.sub.4, R.sub.5 and R.sub.6 are each a mono-valent aliphatic or aromatic group; and k is an integer of 1-20,(D) bis(aminophenoxy)benzene and/or dimethylphenylene-diamineto give rise to ring closure of imide, as well as a process for producing said film adhesive.
    Type: Grant
    Filed: January 28, 1994
    Date of Patent: April 14, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Tatsuhiro Yoshida, Yoshitaka Okugawa, Toshio Suzuki, Toshiro Takeda, Yushi Sakamoto, Takuya Tochimoto
  • Patent number: 5736592
    Abstract: A process for intramolecularly condensing a polyamic acid composition containing an NLO compound to form a polyimide host matrix composition containing as a guest the NLO compound, which process includes the step of uniformly heating the polyamic acid composition, in the absence of a solvent or diluent, to a temperature at which the intramolecular condensation will occur without thermal degradation of the NLO compound, so that the temperature differential within the polyamic acid is below that which will produce localized thermal degradation temperatures, until the intramolecular condensation of the polyamic acid composition to the polyimide host matrix composition is substantially complete. Polyimide host matrix compositions containing guest NLO compounds prepared by the inventive process are also disclosed, wherein the NLO compounds have external field-induced molecular alignments.
    Type: Grant
    Filed: February 15, 1995
    Date of Patent: April 7, 1998
    Assignee: Enichem S.p.A.
    Inventors: Mark Thomas DeMeuse, Diana Marie Applegate, Kwan-Yue Alex Jen, John Thomas Kenney
  • Patent number: 5734008
    Abstract: The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1): ##STR1## wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;with a tetracarboxylic dianhydride represented by the general formula (2) ##STR2## wherein Y represents a tetravalent organic group having 2 or more carbon atoms.The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: March 31, 1998
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Mika Shirasaki, Youichi Ueda, Mitsuhiro Shibata
  • Patent number: 5731405
    Abstract: A process for inducing pre-tilt in alignment of a liquid crystal medium comprising exposing at least one optical alignment layer, comprising anisotropically absorbing molecules and hydrophobic moieties, to polarized light; the polarized light having a wavelength within the absorption band of said anisotropically absorbing molecules; wherein the exposed anisotropically absorbing molecules induce alignment of the liquid crystal medium at an angle + and -.theta. with respect to the direction of the polarization of the incident light beam and along the surface of the optical alignment layer, and induce a pre-tilt at an angle .PHI. with respect to the surface of the optical alignment layer and applying a liquid crystal medium to said optical alignment layer, is described. The invention also is directed to liquid crystal display elements made by the process of the invention and to novel polyimide compositions that are useful as optical alignment layers in the invention.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: March 24, 1998
    Assignee: Alliant Techsystems Inc.
    Inventors: Wayne M. Gibbons, Paul J. Shannon, Shao-Tang Sun
  • Patent number: 5731404
    Abstract: A polyimide alignment film based on pyromellitic dianhydride and a bis(4-aminophenoxy) aromatic compound, such as 1,3-bis(4-aminophenoxy)benzene or 1,4-bis(4-aminophenoxy)benzene, providing low tilt angles of from to 2 degrees when used in liquid crystal displays.
    Type: Grant
    Filed: November 1, 1995
    Date of Patent: March 24, 1998
    Assignees: E. I. du Pont de Nemours and Company, Merck Patent GmbH
    Inventors: Brian Carl Auman, Edgar Bohm
  • Patent number: 5723571
    Abstract: A novel polyimide is soluble in organic solvents and excels in heat resistance. The polyimide comprises 95-40 mol % of the repeating unit represented by the formulas (1) and 60-5 mol % of the repeating unit represented by the formula (2) and has a number average molecular weight of 4,000-200,000: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1-10 carbon atoms or a group: --CH.sub.2 OC.sub.6 H.sub.4 --, and n is an integer of 1-20.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: March 3, 1998
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Nishigaya
  • Patent number: 5714566
    Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## in the oligomers, wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## --O--.O slashed.--COOH, --O--.O slashed.--COX, --X, --O.paren open-st.(R.sub.8 .paren close-st.OH, ##STR4## --O--.O slashed.--NH.sub.2 ; E= ##STR5## R.sub.8 =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --, --S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.THETA.=--C.tbd.N; --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.2.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: February 3, 1998
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowtiz, Clyde H. Sheppard
  • Patent number: 5714572
    Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: February 3, 1998
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Hideto Kato
  • Patent number: 5708122
    Abstract: Poly(ester-imides) containing t-butylhydroquinone and trimellitic anhydride as part of the repeat units, as well as other monomers, are useful as molding resins. The polymers have a high glass transition temperature and are particularly useful in applications requiring good wear resistance.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: January 13, 1998
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Robert Ralph Luise
  • Patent number: 5708128
    Abstract: Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: January 13, 1998
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Hideaki Oikawa, Shoji Tamai, Masahiro Ohta, Akihiro Yamaguchi
  • Patent number: 5708127
    Abstract: The invention relates to a PMR type resin which comprises a mixture of:(a) nadic acid of Formula (Ia) or a derivative thereof ##STR1## (b) a diaminobisimide of Formula (Ib) ##STR2## (c) an aromatic tetracarboxylic acid of Formula (Ic) or a derivative thereof ##STR3## the components (a), (b) and (c) being present in the approximate molar proportions of 2:n:n-1 respectively.
    Type: Grant
    Filed: July 21, 1995
    Date of Patent: January 13, 1998
    Assignee: Commonwealth Scientific and Industrial Research Organisation
    Inventors: Jonathan Howard Hodgkin, Robert Eibl
  • Patent number: 5705605
    Abstract: There is described a process for the preparation of basic poIycondensates, which comprises(a) reacting an amine of formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are each independently of one another hydrogen or alkyl which is unsubstituted or substituted by amino, hydroxy, cyano or C.sub.1 -C.sub.4 alkoxy, and A is alkylene which may be substituted or interrupted by one or more than one hetero atom, with an ammonium salt in the presence of an anhydrous solvent, and(b) reacting the protonised product obtained according to (a) with a cyanamide at elevated temperature.The polycondensates or salts thereof prepared according to this process are particularly suitable aftertreatment agents for enhancing the wetfastness properties of dyed or printed textile material.
    Type: Grant
    Filed: July 6, 1995
    Date of Patent: January 6, 1998
    Assignee: Ciba Specialty Chemicals Corporation
    Inventors: Rolf Tittmann, Ruth Roth
  • Patent number: 5696235
    Abstract: Novel polyimides which are soluble in various organic solvents and excellent in thermal resistance, processability are disclosed. The polyimides comprise repeating units represented by the following formula (1) and/or (2) and having a number average molecular weight of 4,000-200,000. ##STR1## wherein Ar is a divalent group represented by the following formula (2) or (3): ##STR2## wherein Y is --O--, --CO--, --S--, --SO.sub.2 -- or --C(CH.sub.3).sub.2 --, ##STR3## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group, Ra is a divalent group having 2-6 benzene rings, X.sup.1 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group) or S, Rb is C.sub.2-20 alkylene group, ether group or dimethylsiloxane group, and X.sub.2 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: December 9, 1997
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Hashimoto, Takeshi Nishigaya
  • Patent number: 5686558
    Abstract: The invention relates to a liquid crystal orientation film having a specific polymer, the main chain of the polymer formed of urea bonds and imide bonds, and a liquid crystal display element incorporating the film. The liquid crystal orientation film does not require high temperature heat treatment when prepared, allowing treatment below about 150.degree. C. Hence, the production of a liquid crystal display element using the liquid crystal orientation film is simplified. Furthermore, other element materials are protected, and the substrate used can be a plastic substrate lower in heat resistance than glass. Moreover, the liquid crystal orientation film is excellent in such properties as liquid crystal orienting capability, heat resistance, transparency, strength and adhesion to the substrate, and has an especially large and stable pre-tilt angle.
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: November 11, 1997
    Assignee: Toray Industries, Inc.
    Inventors: Kazuo Kitamura, Satoshi Okawa
  • Patent number: 5686559
    Abstract: A poly(imide amic ester) having repeating unit of formula (I) and a process for the preparation thereof are provided, wherein formula (I) has the structure ##STR1## wherein Ar is, ##STR2## Ar' is, ##STR3## Ar" is ##STR4## R is selected from the group consisting of CH.sub.3, CH.sub.2 CH.sub.3, CH(CH.sub.3).sub.2, CH.sub.2 CH.sub.2 CH.sub.3, CH.sub.2 (CH(CH.sub.3).sub.2 and C(CH.sub.3).sub.3. Further, processes for the preparation of polyimide, polyimide film and polyimide fiber using the above poly(imide amic ester) are provided.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: November 11, 1997
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Suh Bong Rhee, Myong Hoon Lee, Ji Woong Park
  • Patent number: 5670603
    Abstract: This invention relates to polymers having non-linear optical properties which polymers include fluorene moieties having at least one electron accepting group and at least one electon donating group substituted to different phenyl rings of the fluorene moiety.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: September 23, 1997
    Assignee: AlliedSignal Inc.
    Inventors: Chengjiu Wu, Jianhui Shan, Ajay Nahata
  • Patent number: 5670609
    Abstract: A polyimide alignment film based on pyromellitic dianhydride and a 2,2'-bis(perfluoroalkoxy)benzidine, as major components, for use in liquid crystal display devices.
    Type: Grant
    Filed: August 8, 1995
    Date of Patent: September 23, 1997
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Brian Carl Auman, Edgar Bohm
  • Patent number: 5668247
    Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.
    Type: Grant
    Filed: December 16, 1993
    Date of Patent: September 16, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Furutani, Kazuhisa Danno, Yoshifumi Okamoto, Junya Ida, Yoshihide Oonari, Hitoshi Nojiri, Hirosaku Nagano
  • Patent number: 5668248
    Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
    Type: Grant
    Filed: August 22, 1995
    Date of Patent: September 16, 1997
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
  • Patent number: 5665856
    Abstract: A diaminobenzene derivative of the formula (I): ##STR1## wherein each of P and Q which may be the same or different from each other, is a single bond, or a bivalent organic group selected from the group consisting of --O--, --COO-- and --CONH--, R.sub.1 is a C.sub.2-22 straight chain alkylene group, and R.sub.2 is a cyclic group selected from the group consisting of an aromatic ring, an aliphatic ring, a heterocyclic ring and substituted forms of such rings.
    Type: Grant
    Filed: April 25, 1995
    Date of Patent: September 9, 1997
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Takayasu Nihira, Yoshio Miyamoto, Hideyuki Endo, Toyohiko Abe
  • Patent number: 5665855
    Abstract: Disclosed are polymers and copolymers containing at least one repeating unit of the formula ##STR1## in which X is O or NH; R is a single bond or a hydrocarbon chain; R' is a hydrocarbon chain containing one or two carbon atoms, and P is the residue of an oligomer HX--P--XH whose solution viscosity determined in meta-cresol at 30.degree. C. at concentrations of 0.5 g/dl is lower than 0.50 dl/g.sup.-1. Also disclosed is a process for obtaining the polymers and copolymers.
    Type: Grant
    Filed: July 23, 1993
    Date of Patent: September 9, 1997
    Assignee: Elf Atochem S.A.
    Inventors: Margarita Acevedo, Alain Fradet, Didier Judas
  • Patent number: 5663287
    Abstract: The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. ##STR1## wherein X is --SO.sub.2 -- or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, and R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
    Type: Grant
    Filed: March 1, 1996
    Date of Patent: September 2, 1997
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Osamu Oka, Takeshi Hashimoto, Takeshi Nishigaya, Tatsuya Hariko
  • Patent number: 5654392
    Abstract: Rigid-rod and segmented rigid-rod polymers, methods for preparing the polymers and useful articles incorporating the polymers are provided. The polymers incorporate rigid-rod backbones with pendant solubilizing groups attached thereto for rendering the polymers soluble.
    Type: Grant
    Filed: January 5, 1995
    Date of Patent: August 5, 1997
    Assignee: Maxdem Incorporated
    Inventors: Matthew Louis Marrocco, III, Robert R. Gagne, Mark Steven Trimmer, Ying Wang
  • Patent number: 5654396
    Abstract: We achieve solvent resistance and extended use life for advanced polyimides by including at least some solvent-resistant linkages in the backbone in place of phenoxyphenyl sulfone linkages and using diPEPA or PEPA crosslinking end caps.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 5, 1997
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Patent number: 5648451
    Abstract: A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.
    Type: Grant
    Filed: October 10, 1995
    Date of Patent: July 15, 1997
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Nobuyuki Sashida, Toshio Banba, Naoshige Takeda
  • Patent number: 5646231
    Abstract: Rigid-rod and segmented rigid-rod polymers, methods for preparing the polymers and useful articles incorporating the polymers are provided. The polymers incorporate rigid-rod backbones with pendant solubilizing groups attached thereto for rendering the polymers soluble.
    Type: Grant
    Filed: January 5, 1995
    Date of Patent: July 8, 1997
    Assignee: Maxdem, Incorporated
    Inventors: Matthew Louis Marrocco, III, Robert R. Gagne, Mark Steven Trimmer
  • Patent number: 5644022
    Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA), and terminating with an effective amount of a reactive endcapper. The reactive endcappers employed include 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride) (NA). Within a relatively narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA and terminated with reactive endgroups have a unique combination of properties that make them very attractive for a number of applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 300.degree. C.
    Type: Grant
    Filed: February 14, 1995
    Date of Patent: July 1, 1997
    Assignee: The United States of America as represented by the Admninistrator of the National Aeronautics and Space Administration
    Inventor: Brian J. Jensen
  • Patent number: 5639850
    Abstract: A process for preparing a tough, soluble, aromatic, thermoplastic copolyimide is provided. The process comprises the steps of (a) providing 4,4'-oxydiphthalic anhydride to 3,4,3',4'-biphenyltetracarboxylic dianhydride at a mole ratio ranging from about 25 mole percent to 75 mole percent to 75 mole percent to about 25 mole percent; (b) adding 3,4'-oxydianiline to form a mixture; c) adding a polar aprotic or polar protic solvent to the mixture to form a solution having a percentage of solids capable of maintaining polymer solubility; (d) stirring the solution to allow it to react; (e) adding an azeotropic solvent to the solution and heating to remove water; (f) cooling the solution of step (e) to room temperature and recovering the tough, soluble, aromatic, thermoplastic copolyimide.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: June 17, 1997
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Robert G. Bryant
  • Patent number: 5637670
    Abstract: Novel molecular weight controlled and endcapped polybenzimidazoles (PBI) are prepared by the aromatic nucleophilic displacement reaction of di(hydroxyphenylbenzimidazole) monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The PBI are endcapped with mono(hydroxyphenyl)benzimidazoles. The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide using alkali metal bases such as potassium carbonate at elevated temperatures under nitrogen. Mono(hydroxyphenyl)benzimidazoles are synthesized by reacting phenyl-4-hydroxybenzoate with aromatic (o-diamine)s in diphenylsulfone. Molecular weight controlled and endcapped PBI of new chemical structures are prepared that exhibit a favorable combination of physical and mechanical properties.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: June 10, 1997
    Assignee: The United States of America as represented by the Administrator, National Aeronautics and Space Administration
    Inventors: John W. Connell, Paul M. Hergenrother, Joseph G. Smith, Jr.
  • Patent number: 5637672
    Abstract: Polyamide esters which can be prepared from tetracarboxylic dianhydrides and can be converted into polyimides by alcohol cleavage with cyclization, characterized in that the radicals OR of the ester groups --COOR which are substituted during the polyimide formation are alkoxy radicals having 2 to 5 C atoms which are monosubstituted or polysubstituted by fluorine.Polyimides prepared therefrom are suitable as orientation layers in liquid-crystal display elements and in optical wave guides.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: June 10, 1997
    Assignee: Merck Patent Gesellschaft mit beschrankter Haftung
    Inventors: Bernhard Rieger, Ekkehard Bartmann, Eike Poetsch
  • Patent number: 5631333
    Abstract: Blends compriseA) from 55 to 99% by weight of a matrix of copolyarylene ether sulfones composed ofa.sub.1) from 91 to 97 mol % of structural units ##STR1## a.sub.2) from 3 to 9 mol % of structural units ##STR2## B) from 1 to 45% by weight of a disperse phase comprising copolyarylene ether sulfones, composed ofb.sub.1) from 91 to 97 mol % of structural units II andb.sub.2) from 3 to 9 mol % of structural units I,C) from 0 to 40% by weight of rubber impact modifiers,D) from 0 to 60% by weight of fibrous or particulate fillers or of mixtures thereof andE) from 0 to 40% by weight of processing assistants and/or additives.
    Type: Grant
    Filed: January 10, 1995
    Date of Patent: May 20, 1997
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Gerhard Leiter, J urgen Streib, Eckhard M. Koch
  • Patent number: 5621068
    Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.
    Type: Grant
    Filed: February 22, 1995
    Date of Patent: April 15, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshifumi Okamoto, Hiroyuki Furutani, Kazuhisa Danno, Junya Ida, Hirosaku Nagano
  • Patent number: 5621067
    Abstract: Wholly aromatic polyamides and their shaped articles containing at least 85 mole percent of repeat units of m-phenylene isophthalamide: ##STR1## and repeat units of selected aromatic diamines and diacid chlorides exhibit improved flame resistance while retaining good thermal stability.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: April 15, 1997
    Assignee: Industrial Technology Research Institute
    Inventors: Jin-Chyueh Lin, Jen-Chang Yang, Ting-Hsiu Chen
  • Patent number: 5614606
    Abstract: Polyamic acids and corresponding polyimides are prepared by reacting polyfunctional amines, aromatic polyfunctional anhydrides or esters thereof, and allyl-nadic anhydride end capping agents, the resulting products exhibiting excellent properties and being suitable for the preparation of prepregs, composites, adhesives, coatings, and the like.
    Type: Grant
    Filed: December 31, 1986
    Date of Patent: March 25, 1997
    Assignee: Ciba-Geigy Corporation
    Inventors: Mohammad A. Chaudhari, John J. King, Byung Lee
  • Patent number: 5614607
    Abstract: The invention provides a method of preparing a polyimide by reacting together a dianhydride and a diisocyanate or equivalent, the polyimide having repeating units of the general formula (I): ##STR1## in which D is a group comprising one or more aromatic rings, to which the imide carbon atoms are directly bonded, andE is a group comprising one or more cycloaliphatic or aromatic rings, to which the imide nitrogen atoms are bonded directly or via an aliphatic group, provided that the imide nitrogen atoms are not bonded directly to an aromatic ring. Such polyimide is colourless or of low colour.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: March 25, 1997
    Assignee: Kabushiki Kaisha Kobe Seiko Sho
    Inventors: John N. Hay, Barry Woodfine
  • Patent number: 5612450
    Abstract: A liquid crystal aligning agent comprising a polyamic acid containing an aliphatic and/or alicyclic hydrocarbon group and a polyimide containing an aliphatic and/or alicyclic hydrocarbon group; and a liquid crystal display device using the liquid crystal aligning agent. This liquid crystal aligning agent gives a liquid crystal aligning film which has good liquid crystal aligning property and in which pretilt angle can be changed by radiation with a small energy and which is suitable for domain-divided alignment type liquid crystal display having a wide view angle.
    Type: Grant
    Filed: May 16, 1995
    Date of Patent: March 18, 1997
    Assignees: Japan Synthetic Rubber Co., Ltd., Sharp Corporation
    Inventors: Shigeaki Mizushima, Noriko Watanabe, Hiroko Iwagoe, Seiji Makino, Sigeo Kawamura, Yusuke Tsuda, Nobuo Bessho
  • Patent number: 5610265
    Abstract: A rigid-rod aromatic polyimide having repeating units of the formula: ##STR1##
    Type: Grant
    Filed: February 2, 1996
    Date of Patent: March 11, 1997
    Assignee: The United States of America as represented by The Secretary of the Air Force
    Inventor: Loon-Seng Tan
  • Patent number: 5608033
    Abstract: A liquid crystal alignment film made of a polyimide which has, on its side chain, a benzene or biphenyl ring substituted by a monovalent substituent having a positive value as the .sigma.p value under Hammett's rule.
    Type: Grant
    Filed: May 5, 1995
    Date of Patent: March 4, 1997
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Takayasu Nihira, Yoshio Miyamoto, Hideyuki Endo, Toyohiko Abe
  • Patent number: 5606013
    Abstract: Polyamic acids and corresponding polyimides are prepared by reacting phenylindane diamines, aromatic polyfunctional anhydrides or esters thereof, and nadic anhydride or allylnadic anhydride end capping agents, the resulting products exhibiting excellent properties and being suitable for the preparation of prepregs, composites, adhesives, coatings, and the like.
    Type: Grant
    Filed: December 31, 1986
    Date of Patent: February 25, 1997
    Assignee: Ciba-Geigy Corporation
    Inventors: Mohammad A. Chaudhari, John J. King, Byung Lee
  • Patent number: 5606014
    Abstract: Controlled molecular weight imide oligomers and co-oligomers containing pendent phenylethynyl groups (PEPIs) and endcapped with nonreactive or phenylethynyl groups have been prepared by the cyclodehydration of the precursor amide acid oligomers or co-oligomers containing pendent phenylethynyl groups and endcapped with nonreactive or phenylethynyl groups. The amine terminated amide acid oligomers or co-oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and diamine containing pendent phenylethynyl groups and subsequently endcapped with a phenylethynyl phthalic anhydride or monofunctional anhydride. The anhydride terminated amide acid oligomers and co-oligomers are prepared from the reaction of diamine(s) and diamine containing pendent phenylethynyl group(s) with an excess of dianhydride(s) and subsequently endcapped with a phenylethynyl amine or monofunctional amine. The polymerizations are carried out in polar aprotic solvents such as under nitrogen at room temperature.
    Type: Grant
    Filed: August 4, 1995
    Date of Patent: February 25, 1997
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: John W. Connell, Joseph G. Smith, Jr., Paul M. Hergenrother
  • Patent number: 5597889
    Abstract: An alternating copolymer comprising a repeating unit of the formula:--Z--(X-Y).sub.n -- (I)wherein n is at least 2, X is O, S, Se or Te, and Y and Z are independently an aromatic or substituted aromatic group, and at least one other repeating unit, which is useful as a photosensitive material used in a spatial light modulator.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: January 28, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akio Takimoto, Hirofumi Wakemoto, Eiichiro Tanaka, Masanori Watanabe, Junko Asayama, Hisahito Ogawa, Shigehiro Sato, Fumiko Yokotani
  • Patent number: 5596073
    Abstract: The present invention relates to solutions which can be directly shaped in anhydrous dimethylalkyleneurea, based on a polyimide obtained from an aromatic dianhydride and an aromatic diisocyanate.It also relates to the process for the production of the above solutions, as well as to a process for spinning these solutions and to the yarns and fibres thus obtained.
    Type: Grant
    Filed: April 14, 1995
    Date of Patent: January 21, 1997
    Assignee: S.N.C. Kermel
    Inventors: Philippe Michaud, Jean Russo
  • Patent number: 5594093
    Abstract: A nonlinear optical polymer material comprising at least one polymer selected from the group consiting of polyimides, acrylic resins and benzocyclobutene resins containing, as a guest molecule, as a side chain, or in the main chain, a molecule or a chemical moiety having a basic structure of merocyanine dye represented by the formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 independently represent hydrogen or an organic group, provided that R.sup.1 and R.sup.2 or R.sup.3 and R.sup.5 may independently combine together to form an organo ring structure, and n is an integer of 1 to 3.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: January 14, 1997
    Assignee: Fujitsu Limited
    Inventors: Wataru Sotoyama, Satoshi Tatsuura, Tetsuzo Yoshimura, Azuma Matsuura, Tomoaki Hayano
  • Patent number: 5594089
    Abstract: Thermomechanical and thermo-oxidative stabilities in heterocycle or heterocycle sulfone resin composites are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities.
    Type: Grant
    Filed: October 21, 1994
    Date of Patent: January 14, 1997
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowtiz, Clyde H. Sheppard
  • Patent number: 5587452
    Abstract: The invention relates to a polyamide-imide containing recurring units according to the formula ##STR1## where Y is an arylene group, andR and R' are alkylene groups, in which at least 50 mole % of R and/or R' is a butylene group.The polyamide-imides are semi-crystalline.They are suitable for injection moulding applications, structural moulded parts, films, coatings and fibres. They can preferably be used in fields of application where temperatures above 200.degree. C. occur.
    Type: Grant
    Filed: July 3, 1995
    Date of Patent: December 24, 1996
    Assignee: DSM N.V.
    Inventors: Cornelis E. Koning, Lilian M. J. Teuwen
  • Patent number: 5585457
    Abstract: Unimolecular micelies, generally referred to as cascade polymers, are constructed via the addition of successive layers, or tiers, of designed monomers, or building blocks, that possess a predetermined, branched superstructure consisting of connected physical matter inherently defining an internal void volume or void area within the molecular framework. Each of the branches define a flexible arm from a central core atom and terminate with a hydrodynamic reactive group. A method is described for manipulating such cascade polymers.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: December 17, 1996
    Assignee: University of South Florida
    Inventors: George R. Newkome, Charles N. Moorefield