Material Is A Nitrogen-containing Compound Patents (Class 528/182)
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Patent number: 5218077Abstract: A high-temperature stable, highly optically transparent-to-colorless, low dielectric linear aromatic polyimide is prepared by reacting an aromatic diamine with 3,3'bis(3,4-dicarboxyphenoxy)diphenylmethane dianhydride in an amide solvent to form a linear aromatic polyamic acid. This polyamic acid is then cyclized to form the corresponding polyimide, which has the following general structural formula: ##STR1## wherein Ar is any aromatic or substituted aromatic group, and n is 10-100.Type: GrantFiled: August 26, 1991Date of Patent: June 8, 1993Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Anne K. St. Clair, Harold G. Boston, J. Richard Pratt
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Patent number: 5216115Abstract: Bioerodible polyarylates derived from biocompatible dicarboxylic acids and natural amino acid-derived diphenol starting materials. Molded articles and controlled drug delivery systems prepared from the polyarylates are also disclosed.Type: GrantFiled: August 13, 1992Date of Patent: June 1, 1993Assignee: Rutgers, The State University of New JerseyInventors: Joachim B. Kohn, James J. Fiordeliso
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Patent number: 5200496Abstract: A process for preparing polycarbonate wherein a chain terminator is added to the reaction mixture after substantial reaction of a carbonate precursor, a coupling catalyst is added to the reaction mixture after substantial reaction of the chain terminator, and base is added to the reaction mixture after reaction mixture after substantial reaction of the chain terminator in an amount sufficient to give a negative chloroformate test.Type: GrantFiled: July 2, 1991Date of Patent: April 6, 1993Assignee: The Dow Chemical CompanyInventors: Sarat Munjal, Thomas M. Wardlow, Andrew F. Hall
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Patent number: 5189137Abstract: A method for preparing high molecular weight polyethermide polymers in a dual solvent system is disclosed. The inventive method provides for polymerizing a diamine monomer and a dianhydride monomer in a solvent system comprised of at least two solvents, a first solvent is selected for its solubility characteristics such that the polyethermide polymer is highly soluble therein and a second solvent is selected for its relatively high boiling point characteristics such that when the second solvent and first solvent are mixed together, the boiling point of the dual solvent system is at least as high as the temperature at which polymerization of said monomers occurs. In one embodiment, a diamine monomer of 4,4'-sulfonyl dianiline (SDAN) is reacted with a dianhydride monomer of bisphenol A dianhydride (BPADA) in the presence of a catalyst and a chain stopper in a dual solvent system comprised of chloroform and ortho-dichlorobenzene. The resulting polyethermide has an intrinsic viscosity exceeding 0.Type: GrantFiled: October 7, 1991Date of Patent: February 23, 1993Assignee: General Electric CompanyInventors: Paul E. Howson, Patricia D. Mackenzie
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Patent number: 5187255Abstract: A method of producing a polyether copolymer by reacting a dihalogenobenzonitrile, 1,4-bis(4'-halobenzoyl)benzene, with 4,4'-biphenol in an aprotic polar solvent in the presence of an alkali metal compound to produce a polyether copolymer having repeating units represented by the following general formula (I) ##STR1## and the repeating units represented by the following formula (II) ##STR2## The molar ratio of the repeating units represented by the formula (I) based on the total of the repeating units represented by the formula (I) and the repeating units represented by the formula (II) (the molar ratio of (I)/{(I)+(II)}) is from 0.1 to 0.8. The polyether copolymer has a melt viscosity (the viscosity under no shearing stress) of at least 500 poise as measured 400.degree. C.Type: GrantFiled: April 30, 1992Date of Patent: February 16, 1993Assignee: Idemitsu Kosan Co., Ltd.Inventor: Shigeru Matsuo
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Patent number: 5171820Abstract: Polyesters having improved barrier to oxygen are normally solid, thermoplastic methylol polyesters having backbone repeating units containing pendent hydroxyl and methylol moieties and divalent organic moieties such as m-phenylene, p-phenylene, and isopropylidene diphenylene. Such polyesters are prepared by reacting diglycidyl esters of aromatic diacids such as diglycidyl terephthalate or diglycidyl ethers of dihydric phenols with diacids such as isophthalic acid.Type: GrantFiled: May 13, 1991Date of Patent: December 15, 1992Assignee: The Dow Chemical CompanyInventors: Michael N. Mang, Jerry E. White
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Patent number: 5149759Abstract: There is described a process for preparing aromatic polyamides of high hydrolysis resistance by reacting aromatic diamines in a conventional organic solvent and in the presence or absence of inorganic salts wherein the diamine, which has a water content of up to 25% by weight, is dissolved in the organic solvent, which may likewise contain water, and the solution is subjected to a vacuum distillation until the water content of the bottom product is <100 ppm and subsequently the inorganic salts if necessary and then the dicarbonyl dichloride are added in a conventional manner and the condensation reaction is performed and concluded in a conventional manner.Type: GrantFiled: April 3, 1991Date of Patent: September 22, 1992Assignee: Hoechst AktiengesellschaftInventors: Georg-Emrich Miess, Peter Klein, Wilfried Pressler
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Patent number: 5149762Abstract: A silicon-modified thermoplastic resin is prepared by heating a mixture comprised of 10 to 90% by weight of an imide group-containing thermoplastic resin and 90 to 10% by weight of a modified silicon compound having an amino group--NH.sub.2 at one end of the molecule and an alkyl group --C.sub.n H.sub.2n+1 (n is an integer of at least 1) at the other end of the molecule, to chemically bond the imide group-containing thermoplastic resin to the modified silicon compound.Type: GrantFiled: November 8, 1989Date of Patent: September 22, 1992Assignee: Mitsubishi Rayon Company Ltd.Inventors: Yoshio Murashige, Junko Soga
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Patent number: 5147966Abstract: The invention is a novel polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhydride (ODPA), in 2-methoxyethyl ether (diglyme). The polymer has been prepared in ultra high molecular weight and in a controlled molecular weight form which has a 2.5 percent offset is stoichiometry (excess diamine) with a 5.0 percent level of phthalic anhydride as an endcap. This controlled molecular weight form allows for greatly improved processing of the polymer for moldings, adhesive bonding, and composite fabrication. The higher molecular weight version affords tougher films and coatings. The overall polymer structure groups in the dianhydride, the diamine, and a metal linkage in the diamine affords adequate flow properties for making this polymer useful as a molding powder, adhesive, and matrix resin.Type: GrantFiled: July 31, 1990Date of Patent: September 15, 1992Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Terry L. St. Clair, Donald J. Progar
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Patent number: 5147961Abstract: Hydroxypolyamides can be obtained in a simple and economical way in a chloride-free manner when(a) aromatic amino hydroxy carboxylic acids or(b) aromatic diaminodihydroxy compounds and aromatic dicarboxylic acids or(c) aromatic diaminodihydroxy compounds, aromatic dicarboxylic acids and aromatic amino hydroxy carboxylic acids are converted in the presence of 1-ethoxycarbonyl-2-ethoxy-1.2-dihydroquinoline, 1.1'-carbonyldioxy-di-1.2.3-benzotriazole or dicyclohexyl carbodiimide/1-hydroxy-1.2.3-benzotriazole.Type: GrantFiled: October 9, 1991Date of Patent: September 15, 1992Assignee: Siemens AktiengesellschaftInventors: Hellmut Ahne, Peter Baeuerlein, Albert Hammerschmidt
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Patent number: 5136015Abstract: An addition type imide resin prepolymer is obtained by a reaction of unsaturated bisimide of 1.0 mol to diamine of 0.25 to 0.43 mol and an addition of polyamine having three or more benzene rings. The prepolymer is thereby made to contain substantially no unreacted diamine component which affects human body of operators, and to have remarkably excellent heat resistance and adhesive properties, while effective to restrain a production of any component of a molecular weight exceeding 15,000.Type: GrantFiled: April 10, 1990Date of Patent: August 4, 1992Assignee: Matsushita Electric Works, Ltd.Inventors: Tatsuo Yonemoto, Masahiro Matsumura, Yoshihisa Sugawa, Eiichiro Saito, Hiroshi Yamamoto, Keiko Kashihara
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Patent number: 5128444Abstract: A thermosetting resin composition, a solution composition of the resin and a thermosetting dry film formed out of the resin are disclosed. The thermosetting resin composition contains a specific resin component as the main component. The resin component consists of (A) 100 weight parts of an aromatic polyimide; and (B) 5 to 2,000 weight parts of (a) a terminal-modified imide oligomer or (b) an unsaturated imide compound. The aromatic polyimide (A) is formed from a tetracarboxylic acid ingredient which contains 2,3,3',4'-biphenyltetracarboxylic acid or its derivative in an amount of at least 60 mole % and an aromatic diamine ingredient. The polyimide has such a high molecular weight that the logarithmic viscosity (concentration: 0.5 g/100 ml of solvent; solvent: N-methyl-2-pyrrolidone; and temperature of measurement: 30.degree. C.) is not less than 0.2. The polyimide is soluble in an organic polar solvent.Type: GrantFiled: April 17, 1990Date of Patent: July 7, 1992Assignee: Ube Industries, Ltd.Inventors: Hiroshi Inoue, Tadao Muramatsu, Tetsuji Hirano
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Patent number: 5115088Abstract: The invention provides aromatic polyamides having a reduced melt viscosity which are derived from aromatic dicarboxylic acids, aromatic diamines and aromatic monocarboxylic acids being present in the polyamide in an amount of from 0.01 to 10 mol %. The invention allows molding compositions to be provided which have improved processability and good mechanical properties.Type: GrantFiled: October 24, 1990Date of Patent: May 19, 1992Assignee: Huels AktiengesellschaftInventors: Gunter Poll, Martin Bartmann, Jurgen Finke
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Patent number: 5098991Abstract: A process is disclosed for preparation of anhydrides containing additional carboxylic acid moieties and dianhydrides of disubstituted maleic anhydride compounds wherein the acid anhydrides and dianhydrides retain their alkene character. The resulting alkene compounds are useful as precursors for polyesters, thermally stable polyamide-imides and polyimides which are also disclosed, as well as a process for their preparation.Type: GrantFiled: January 8, 1990Date of Patent: March 24, 1992Assignee: Amoco CorporationInventors: Steven J. Behrend, David A. Young, Ellis K. Fields
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Patent number: 5096999Abstract: Hydroxypolyamides can be obtained in a simple and economical way in a chloride-free manner when(a) aromatic amino hydroxy carboxylic acids or(b) aromatic diaminodihydroxy compounds and aromatic dicarboxylic acids or(c) aromatic diaminodihydroxy compounds, aromatic dicarboxylic acids and aromatic amino hydroxy carboxylic acids are converted in the presence of 1-ethoxycarbonyl-2-ethoxy-1.2-dihydroquinoline, 1-1'-carbonyldioxy-di-1.2.3-benzotriazole or dicyclohexyl carbodiimide/1-hydroxy-1.2.3-benzotriazole.Type: GrantFiled: March 29, 1990Date of Patent: March 17, 1992Assignee: Siemens AktiengesellschaftInventors: Ahne Hellmut, Peter Baeuerlein, Albert Hammerschmidt
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Patent number: 5082919Abstract: A toner composition comprised of a crosslinked thermotropic liquid crystalline polymer, a branched liquid crystalline polymer, or mixtures thereof.Type: GrantFiled: July 30, 1990Date of Patent: January 21, 1992Assignee: Xerox CorporationInventors: Guerino Sacripante, T. Brian McAneney, Stephan Drappel, Sheau Van Kao, Lupu Alexandru
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Patent number: 5081229Abstract: The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.Type: GrantFiled: June 7, 1989Date of Patent: January 14, 1992Assignee: Kanegafuchi Chemical Ind. Co., Ltd.Inventors: Kiyokazu Akahori, Hideki Kawai, Hirosaku Nagano
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Patent number: 5070182Abstract: A polyimide resin having a repeating unit of the formula: ##STR1## wherein R.sub.1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, wherein four atoms directly bonded to the four carbonyl groups are carbon atoms having no unsaturated bond, and R.sub.2 is a bivalent organic group constituting a diamine.Type: GrantFiled: April 26, 1990Date of Patent: December 3, 1991Assignee: Nissan Chemical Industries Ltd.Inventors: Noriaki Kohtoh, Takashi Kobayashi, Masahiko Yukawa
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Patent number: 5064930Abstract: A process comprising(A) preparing a solid polyarylate prepolymer having an inherent viscosity of at least about 0.1 by heating at a temperature in the range of 140.degree. C. to 300.degree. C. in the melt phase an acid anhydride derived from a carboxylic acid containing 2 to 6 carbon atoms, a dihydric phenol and an aromatic dicarboxylic acid in the presence of a hypernucleophilic base which comprises a heterocyclic aromatic compound containing nitrogen and having an aprotic electron releasing group directly bonded to a carbon atom in the aromatic compound, and(B) increasing the molecular weight of the solid polyarylate prepolymer to an inherent viscosity of at least 0.4.Type: GrantFiled: September 27, 1990Date of Patent: November 12, 1991Assignee: Eastman Kodak CompanyInventors: Bruce C. Bell, Winston J. Jackson, Jr.
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Patent number: 5061783Abstract: The process of the present invention includes first treating a polyamide-acid (such as LARC-TPI polyamide-acid) in an amide-containing solvent (such as N-methylpyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.Type: GrantFiled: April 30, 1990Date of Patent: October 29, 1991Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Terry L. St. Clair
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Patent number: 5055549Abstract: The present invention is connected with a process for preparing a novel photosensitive polyimide precursor having excellent shelf stability and high sensitivity and containing less impurities.The process for preparing a photosensitive heat-resistant polymer containing a repeating unit represented by the formula (III) comprises the step of reacting a photosensitive group-containing isoimide represented by the formula (I) with a diamine represented by the formula (II) at a temperature of 0.degree. to 100.degree. C. in the presence of a solvent: ##STR1## wherein R.sup.1 is independently a tetravalent carbon cyclic aromatic group or heterocyclic group; R.sup.2 is independently an aliphatic group having at least 2 carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbon cyclic aromatic group, a heterocyclic group or a polysiloxane group; R.sup.3 is a monovalent organic group having a photosensitive unsaturated group; and D is an oxygen atom or .dbd.N--R.sup.3.Type: GrantFiled: January 8, 1990Date of Patent: October 8, 1991Assignee: Chisso CorporationInventors: Hirotoshi Maeda, Kouichi Kunimune
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Patent number: 5039785Abstract: High molecular weight aromatic polyamides with pendant carboxyl groups.Type: GrantFiled: December 5, 1989Date of Patent: August 13, 1991Assignee: E. I. du Pont de Nemours and CompanyInventor: Robert S. Irwin
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Patent number: 5037220Abstract: Films from aromatic polyesters and from aromatic polyestercarbonates are excellently suitable for preparing printing ribbons, in particular for thermal and electrothermal recording processes.Type: GrantFiled: July 13, 1988Date of Patent: August 6, 1991Assignee: Bayer AktiengesellschaftInventors: Volker Serini, Bernhard Schulte, Claus Burkhardt, Dieter Freitag, Uwe Hucks, Werner Waldenrath, Hans-Leo Weber
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Patent number: 5026819Abstract: The reactivity of aromatic copolyamide fiber and film is enhanced by incorporation of small amounts of 4,4'-diaminodiphenic acid units in the polymer chain.Type: GrantFiled: December 5, 1989Date of Patent: June 25, 1991Assignee: E. I. Du Pont de Nemours and CompanyInventor: Robert S. Irwin
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Patent number: 5025081Abstract: A process for preparing a copolyestercarbonate which comprises reacting interfacially a dihydric phenol, a carbonate precursor, and a saturated aliphatic alpha omega dicarboxylic acid having from 9 to about 40 carbon atoms wherein the said diacid is from about 2 to about 20 mole percent based on the dihydric phenol reactant content and wherein the initial pH is from about 8 to about 9 for about 70 to about 95% of the carbonate precursor addition time period time period and is then raised to a final pH of from about 10 to 12 for the remainder of the carbonate precursor addition time period.Type: GrantFiled: January 30, 1990Date of Patent: June 18, 1991Assignee: General Electric CompanyInventors: Luca P. Fontana, Paul W. Buckley
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Patent number: 5025089Abstract: Copolyimides derived from the reaction product of 3,3'-6 F diamine or 4,4'-6 F diamine, at least one other diamine, and pyromellitic dianhydride can be rendered solvent soluble while at the same time exhibiting an improvement in both mechanical and electrical properties by the inclusion of at least one other dianhydride having a diaryl nucleus in the reaction media. Suitable such dianhydrides include bis (3,4 dicarboxy phenyl) ether dianhydride, 3,3'4,4' benzophenone tetracarboxylic dianhydride, 3,3',4,4' diphenyl tetracarboxylic acid dianhydride and 2,2 bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride (6F-DA). Such polyimides are soluble in common organic solvents such as methyl ethyl ketone or N-methyl pyrrolidone, and exhibit excellent film forming properties with improved mechanical and electrical properties as compared to the corresponding homopolyimides. They possess excellent heat stability (Tg's in excess of about 350.degree. C.Type: GrantFiled: November 13, 1989Date of Patent: June 18, 1991Assignee: Hoechst Celanese Corp.Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
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Patent number: 5021541Abstract: A polycarbonate resin comprising either a structural unit derived from a spiro ring-containing dihydric phenol, or such a structural unit and a structural unit derived from a dihydric phenol, and a process for producing the same. The polycarbonate resin has excellent flowability and moldability, and also improved optical properties (low refractive index, large Abbe number, etc.), and can be advantageously used in various fields, e.g., as a material for molded articles for optical use and other precision molded articles.Type: GrantFiled: February 15, 1990Date of Patent: June 4, 1991Assignee: Mitsubishi Gas Chemical Co., Ltd.Inventors: Mitsuhiko Masumoto, Satoshi Kanayama, Toshiaki Asoh, Teruo Kawahigashi
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Patent number: 5015720Abstract: Polycarbonates containing aliphatic dicarboxylic ester groups, and having glass transition temperatures and processing temperatures lower than the corresponding homopolycarbonates are prepared via an intermediate which is in turn prepared from a dihydroxyaromatic compound and a C.sub.4-6 aliphatic dicarboxylic acid anhydride, preferably succinic anhydride. Phosgenation of said intermediate produces the desired soft segment polycarbonate.Type: GrantFiled: June 8, 1990Date of Patent: May 14, 1991Assignee: General Electric CompanyInventors: Eugene P. Boden, Peter D. Phelps
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Patent number: 5006628Abstract: A process for preparing a polyarylate by heating in the melt phase in the presence of a 4-dialkylaminopyridine, an acid anhydride which is in the range of stoichiometric amount to 25% molar excess, bisphenol-A and a dicarboxylic acid selected from the group consisting of isophthalic acid and mixtures of isophthalic acid and terephthalic acid wherein the ratio of isophthalic acid to terephthalic acid is in the range of 100:0 to 25:75.Type: GrantFiled: August 15, 1990Date of Patent: April 9, 1991Assignee: Eastman Kodak CompanyInventors: Winston J. Jackson, Jr., W. Ronald Darnell, Bruce C. Bell, Marc A. Strand
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Patent number: 5003031Abstract: Novel polyimides and co-polyimides are prepared by the condensation polymerization of an aryl diamine with dioxydiphthalic anhydride or a mixture thereof with oxydiphthalic anhydride. The polyimides and co-polyimides prepared exhibit a low moisture absorption and improved dielectric properties and can be tailored to provide a composition having desirable mechanical properties, specifically, rigidity.Type: GrantFiled: May 15, 1989Date of Patent: March 26, 1991Assignee: Occidental Chemical CorporationInventors: Willis T. Schwartz, Jeffrey S. Stults
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Patent number: 4992526Abstract: High molecular weight polyarylate polymers comprise alternating moieties derived from an aromatic dicarboxylic acid halide, with moieties derived from a hydroxyaryl-substituted 1,6-diaza [4.4] spirodilactam compound and, optionally, with moieties derived from a di(hydroxyphenyl) compound are prepared by interfacial polymerization in an aqueous-organic medium containing an alcohol.Type: GrantFiled: December 21, 1989Date of Patent: February 12, 1991Assignee: Shell Oil CompanyInventor: Pen-Chung Wang
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Patent number: 4963645Abstract: A terminal-modified imide oligomer having an unsaturated group as a terminal group and an imide bond inside of the oligomer which is produced by reacting 2,3,3',4'-or 3,3',4,4'-biphenyltetracarboxylic acid or its derivative, a diamine compound, and an unsaturated dicarboxylic acid or its derivative and/or an unsaturated monoamine in an organic solvent is disclosed. This oligomer has a logarithmic viscosity of not more than 1.0. This logarithmic viscosity is measured under the conditions of concentration of 0.5 g/100 ml-solvent (N-methyl-2-pyrrolidone) and a temperature of 30.degree. C., and has a melting point of 50.degree. to 300.degree. C.Type: GrantFiled: August 24, 1988Date of Patent: October 16, 1990Assignee: Ube Industries, Ltd.Inventors: Hiroshi Inoue, Tadao Muramatsu, Tetsuji Hirano
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Patent number: 4959437Abstract: A process for producing a silicon-containing polyamic acid affording a silicon-containing polyimide having a low thermal expansion coefficient and a process for producing the silicon-containing polyimide are provided, the former process comprising reacting pyromellitic acid dianhydride (A.sup.1 mols) and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (A.sup.2 mols) with a diamine of the following formula (I) (B mols) and an aminosilicon compound of the formula (II) so as to satisfy the following expressions (III) and (IV): ##STR1## wherein R.sup.1 is methyl, ethyl, methoxy, ethoxy or halogen; R.sup.2 is alkyl or alkyl-substituted phenyl; X is a hydrolyzable alkoxy, acetoxy or halogen; m is 0, 1 or 2; n is 1 or 2; and k is 1, 2 or 3; andthe latter process comprising baking a solution of the above silicon-containing polyamic acid at 50.degree. to 500.degree. C.Type: GrantFiled: June 1, 1988Date of Patent: September 25, 1990Assignee: Chisso CorporationInventors: Kouichi Kunimune, Yoshiya Kutsuzawa, Shiro Konotsune
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Patent number: 4952662Abstract: Molding compounds comprisign aromatic polyamides which contain from 0.01 to 10 mole % of a low molecular weight carboxylic acid amide display low melt viscosities and an increased resistance to hydrolysis and are thermoplastically processible.Type: GrantFiled: January 27, 1989Date of Patent: August 28, 1990Assignee: Huels AktiengaellscaftInventors: Juergen Finke, Martin Bartmann, Joachim Muegge, Friedrich-Georg Schmidt
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Patent number: 4940771Abstract: Polycarbonate and polyarylate resins are chain-terminated with a group selected from those of the formula: ##STR1## wherein each R independently represents one of hydrogen or lower alkyl. The resins are reactive polycarbonates, poly(ester carbonates) and polyarylates, useful as intermediates in the preparation of block and graft copolymers, with other polymers having functional, reactive groups.Type: GrantFiled: January 30, 1989Date of Patent: July 10, 1990Assignee: General Electric CompanyInventor: Louis M. Maresca
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Patent number: 4927904Abstract: Cyclic polyarylate oligomer compositions are prepared by the reaction of an aromatic dicarboxylic acid halide, such as isophthaloyl chloride or terephthaloyl chloride, with a water-soluble salt of a dihydroxyaromatic compound, such as bisphenol A disodium salt. Freshly prepared solutions of the halide in an organic liquid such as methylene chloride, and of the salt in water, are simultaneously introduced into an organic liquid containing a catalytic amount of at least one quaternary ammonium salt having a single alkyl group containing about 8-20 carbon atoms and having not more than 5 additional carbon atoms. The dihydroxyaromatic compound salt is employed in the amount of at least about 3% in excess of stoichiometric.Type: GrantFiled: June 12, 1989Date of Patent: May 22, 1990Assignee: General Electric CompanyInventors: Thomas L. Guggenheim, Sharon J. McCormick, Alice M. Colley
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Patent number: 4902740Abstract: A polyamideimide having an inherent viscosity of above 0.48 which comprises a unit of the following formula (II) ##STR1## and a unit of the following formula (IV) ##STR2## as main units forming the molecular chains of the polyamideimide, and an intimate mixture of the polyamideimide and a plasticizing material for the polyamideimide.Type: GrantFiled: November 8, 1988Date of Patent: February 20, 1990Assignee: Teijin LimitedInventors: Shigeyoshi Hara, Hiroo Inata, Shunichi Matsumura
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Patent number: 4895922Abstract: This invention disclosed a process for the synthesis of polyesteramides. By utilizing the phosphorus containing catalyst systems of the present invention, such polyesteramides can be synthesized at relatively low temperatures. The present invention specifically discloses a process for the synthesis of a polyesteramide which comprises polymerizing at least one diamine, at least one diol, and at least one dicarboxylic acid in the presence of (1) at least one acid acceptor; (2) at least one halogenated organic compound; and (3) at least one phosphorus containing compound selected from the group consisting of (a) triphenylphosphine, (b) triphenylphosphine oxide, (c) triphenylphosphine sulfide, (d) polymeric agents having pendant diphenylphosphine groups, (e) silicon-phosphorus compositions which contain at least one divalent oxygen atom which is bonded directly to a tetravalent silicon atom and a trivalent or pentavalent phosphorus atom; (f) compounds with the structural formula (C.sub.6 H.sub.5).sub.Type: GrantFiled: May 5, 1988Date of Patent: January 23, 1990Assignee: The Goodyear Tire & Rubber CompanyInventor: Naoya Ogata
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Patent number: 4889911Abstract: Thermotropic, fully aromatic polyesters and polyester carbonates are produced by esterification of optionally substituted p-hydroxybenzoic acids and aromatic dicarboxylic acids with diaryl carbonate at temperatures in the range from 100.degree. to 220.degree. C. and subsequent transesterification of the aryl ester obtained with diphenols and, optinally, more diaryl carbonate, accompanied by polycondensation, at temperatures in the range from 250.degree. to 330.degree. C., the esterification, the transesterification and the polycondensation being carried out in the presence of heterocyclic compounds containing 1 to 3 nitrogen atoms.Type: GrantFiled: August 11, 1988Date of Patent: December 26, 1989Assignee: Bayer AktiengesellschaftInventors: Harald Pielartzik, Wolfgang Ebert, Rolf-Volker Meyer, Hans-Joachim Traenckner, Edgar Ostlinning
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Patent number: 4874836Abstract: Disclosed herein are a thermoplastic wholly aromatic polyimide ester consisting essentially of structural units represented by the general formulas I, II, III, and IV: ##STR1## wherein X and Y are either --O-- or --CO-- and may be either identical with or different from each other, n is an integrer of 0 or 1, X group and imide group and imide group in unit II are present at para or meta position to each other, two carbonyl gorups in unit IV are present at para or meta position to each other, and each end of units I, II, III, and IV is bonded to another end trough ester bond, and wherein the polyimide ester has a melt viscosity of 1.0 to 1.0.times.10.sup.5 Pa.multidot.s measured at a shear stress of 0.025 MPa and a temperature of 300.degree. to 400.degree. C.; and a process for producing the thermoplastic wholly aromatic polyimide ester.Type: GrantFiled: October 26, 1988Date of Patent: October 17, 1989Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Makoto Wakabayashi, Kenichi Fujiwara, Hideo Hayashi
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Patent number: 4873310Abstract: Aromatic polyamides based on phenoxyterephthalic acid and a process for preparing them. Polyamides and copolyamides based on phenoxyterephthalic acid are resistant to chemicals and can be processed as thermoplastics with no problems.Type: GrantFiled: March 2, 1988Date of Patent: October 10, 1989Assignees: Huls Aktiengesellschaft, Daicel Chemical Industries, Ltd.Inventors: Martin Bartmann, Naoki Ikeda
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Patent number: 4855390Abstract: The present invention provides a bis(hydroxyphthalimide) prepared by reacting 4-hydroxyphthalic anhydride and an organic diamine in the presence of an organic solvent under heating. The bis(hydroxyphthalimide) has two intramolecular imide rings and active hydrogens, and is thus polymerizable to form a variety of polycondensation products each having imide rings by condensation. The bis(hydroxyphthalimide) is also reacted with a dicarboxylic acid dihalide to form a polyesterimide, through condensation, which is excellent in transparency and heat resisting property.Type: GrantFiled: April 22, 1988Date of Patent: August 8, 1989Assignee: Nippon Telegraph and Telephone CorporationInventors: Shigekuni Sasaki, Yoshinori Hasuda
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Patent number: 4845183Abstract: Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino-3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the invention may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.The polyamides of the invention may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.Type: GrantFiled: November 24, 1987Date of Patent: July 4, 1989Assignee: Hoechst Celanese CorporationInventors: Werner H. Mueller, Dinesh N. Khanna
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Patent number: 4843141Abstract: Melt-processable polyesteramides capable of exhibiting melt-phase anisotropy at temperatures of approximately 360.degree. C. and lower are disclosed. The polyesteramides contain certain essential 2,2'-substituted biphenylene radicals and repeating units which provide ester and amide linkages. The polyesteramides exhibit melt processability suitable for processing into films and fibers.Type: GrantFiled: December 28, 1987Date of Patent: June 27, 1989Assignee: Polaroid Corporation, Patent DepartmentInventors: Russell A. Gaudiana, Howard G. Rogers, Roger F. Sinta
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Patent number: 4837300Abstract: Novel copolyimides are prepared by reacting one or more aromatic dianhydrides with a meta-substituted phenylene diamine and an aromatic bridged diamine. The incorporation of meta-substituted phenylene diamine derived units and bridged aromatic diamine derived units into the linear aromatic polymer backbone results in a copolyimide of improved flexibility, processability, and melt-flow characteristics. The novel copolyimides are especially useful as thermoplastic hot-melt adhesives.Type: GrantFiled: July 9, 1987Date of Patent: June 6, 1989Assignee: The United States of America as represented by the Administration of the National Aeronautics and Space AdministrationInventors: Terry L. St. Clair, Harold D. Burks, Donald J. Progar
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Patent number: 4835244Abstract: This invention relates to polyesters corresponding to formula (I) ##STR1## wherein R.sup.1 and R.sup.2 stand for --CH.sub.2 --CH.sub.2 --Ar wherein Ar denotes an aromatic group or one of these two groups is --CH.sub.2 --CH.sub.2 --Ar while the other is an alkyl group, a substituted alkyl or an aryl group or halogen andn represents an integer with a value from 5 to 2000, and to a process for their preparation.Type: GrantFiled: May 31, 1988Date of Patent: May 30, 1989Assignee: Bayer AktiengesellschaftInventors: Walter Heitz, Wilhelm Brugging
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Patent number: 4829144Abstract: Cyclic polyester and especially polyarylate oligomers, typically having degrees of polymerization from 2 to about 7, are prepared by reacting a bisphenol such as bisphenol A or 6,6'-dihydroxy-3,3,3',3'-tetramethylspiro-(bis)indane with a dicarboxylic acid chloride such as isophthaloyl or terephthaloyl chloride in the presence of a catalyst, under conditions of low concentration. The cyclic oligomers may be polymerized to linear polyesters by contact with a transesterification catalyst at a temperature in the range of about 200.degree.-300.degree. C.Type: GrantFiled: February 1, 1988Date of Patent: May 9, 1989Assignee: General Electric CompanyInventors: Daniel J. Brunelle, Thomas G. Shannon
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Patent number: 4814395Abstract: A method for the preparation of polycarbonate resins bearing terminal ester groups comprises the interfacial polymerization of a dihydric phenol with a carbonyl halide in the presence of a molecular weight controlling proportion of a compound of the formula: ##STR1## wherein R represents a hydrocarbyl group amenable to beta-elimination upon thermolytic degradation. The product resins are useful as intermediates in the preparation of copolymers with, for example, polyamides.Type: GrantFiled: December 14, 1987Date of Patent: March 21, 1989Assignee: General Electric CompanyInventor: Niles R. Rosenquist
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Patent number: 4814417Abstract: A process for directly producing liquid crystalline polymers from cyclohexanedicarboxylic acids and aromatic diols is provided. These raw materials can be converted into polyesters capable of finishing into fibers, films, etc., using the combination of thionyl chloride and pyridine as a condensing agent. In the present invention, aromatic oxycarboxylic acids can be used in combination in an optional proportion, in addition to the above two raw materials.Type: GrantFiled: March 18, 1988Date of Patent: March 21, 1989Assignee: Chisso CorporationInventor: Shigeru Sugimori
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Patent number: RE33342Abstract: A liquid crystal aligning agent consisting essentially of a polyimide resin obtained by the polymerization of a diamine, a tetracarboxylic acid dianhydride and a monoamine of the formula:R.sup.2 (R.sup.1).sub.n NH.sub.2 (I)wherein R.sup.1 is a divalent organic group, R.sup.2 is an alkyl group having from 6 to 20 carbon atoms, and n is 0 or 1.Type: GrantFiled: September 1, 1988Date of Patent: September 18, 1990Assignee: Nissan Chemical Industries Ltd.Inventors: Noriaki Kohtoh, Toyohiko Abe, Hiroyoshi Fukuro