Bridged- Or Fused-ring-containing Reactant Other Than As Anhydride Fused To A Nonfused- Or Bridged-ring System Patents (Class 528/344)
  • Patent number: 5320886
    Abstract: This invention relates primarily to organofunctional monomers, predominantly dimethacrylates and/or diacrylates containing one or more (predominantly two carboxyl groups, with moieties that provide sufficient affinity with water to allow any desired amount of water and/or miscible fugitive solvents to be mixed homogeneously with these monomers and formulations containing them. The activity of water in the monomer formulations can be adjusted so that it is equal to the water activity in biological tissues. This promotes biocompatibility and enhances the adhesive characteristics of polymers prepared from these formulations. Probability statistics are disclosed that optimize the compositions of polymer reaction products.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: June 14, 1994
    Assignee: American Dental Association Health Foundation
    Inventor: Rafael L. Bowen
  • Patent number: 5310861
    Abstract: Aramids, which in the drawn state have high tensile strengths tensile elongations, and tensile moduli, are made from units derived from p-phenylenediamine, terephthalic acid, a substituted terephthalic acid, and 4,4'-bibenzoic acid or 2,6-naphthalene dicarboxylic acid. The aramids are useful for ropes and composites.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: May 10, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Robert S. Irwin
  • Patent number: 5300620
    Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: April 5, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma
  • Patent number: 5290907
    Abstract: There are described aromatic copolyamides which are soluble in organic polyamide solvents and which consist essentially of recurring structural units of the formulae Ia, Ib and Ic on the one hand and Ia, Ib and Ie on the other[--OC--R.sup.1 --CO--NH--R.sup.2 --NH--] (Ia), [--OC--R.sup.1 --CO--NH--R.sup.3 --NH--] (Ib),[--OC--R.sup.1 --CO--NH--R.sup.4 --NH--] (Ic), [--OC--R.sup.1 --CO--NH--R.sup.7 --NH--] (Ie),where R.sup.1 and R.sup.7 are divalent aromatic radicals whose valence bonds are in the para or a comparable coaxial or parallel position relative to one another, R.sup.2 is a radical of the formula III ##STR1## and R.sup.3 and R.sup.4 are radicals of the formula IV ##STR2## where Z is --O--, --S--, --CO--, --SO.sub.2 --, C.sub.1 -C.sub.10 -alkylene or --O--R.sup.1 --O-- and R.sup.6 is in each case hydrogen or an inert substituent.The mole fractions of the individual structural features in the copolyamides are defined within selected limits.
    Type: Grant
    Filed: February 12, 1992
    Date of Patent: March 1, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Georg-Emerich Miess, Peter Klein, Karl Heinrich
  • Patent number: 5288793
    Abstract: Fiber- or particulate-filled polyphthalamide molding compositions, wherein the polyphthalamide comprises recurring units obtainable from terephthalic acid, 2,6-naphthalene dicarboxylic acid, aliphatic diamine and, optionally, isophthalic acid, exhibit a desirable combination of thermal, mechanical and solvent resistance properties.
    Type: Grant
    Filed: January 2, 1992
    Date of Patent: February 22, 1994
    Assignee: Amoco Corporation
    Inventor: Yu-Tsai Chen
  • Patent number: 5286839
    Abstract: Polyphthalamides having a useful combination of thermal and mechanical properties and excellent solvent resistance, particularly to alcohols, comprise recurring aliphatic terephthalamide and 2,6-naphthalene dicarboxylamide units and, optionally, isophthalamide units.
    Type: Grant
    Filed: January 2, 1992
    Date of Patent: February 15, 1994
    Assignee: Amoco Corporation
    Inventor: Yu-Tsai Chen
  • Patent number: 5276131
    Abstract: This invention relates to cyclic diamides that are readily polymerized to form poly(terephthalamides). The resulting poly(terephthalamides) have high crystallinity, high temperature capabilities, dimensional stability, low moisture sensitivity, and solvent and chemical resistance.
    Type: Grant
    Filed: June 11, 1992
    Date of Patent: January 4, 1994
    Assignee: Allied Signal Inc.
    Inventors: Murali K. Akkapeddi, Jeffrey H. Glans
  • Patent number: 5266672
    Abstract: Aromatic copolyamides are described which are soluble in organic polyamide solvents and which essentially consist of the recurring structural units of the formulae Ia, Ib and Ic ##STR1## wherein R.sup.1 and R.sup.4 are divalent aromatic radicals, the valency bonds of which are in the para position or in a comparable coaxial or parallel position relative to one another, R.sup.2 is a radical of the formula III ##STR2## and R.sup.3 is a radical of the formula IV ##STR3## The mole fractions of the individual structural features in the copolyamides are fixed within selected limits. Fibers composed of the copolyamides claimed are distinguished by a high stretchability.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: November 30, 1993
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Georg-Emerich Miess, Peter Klein, Karl Heinrich
  • Patent number: 5264544
    Abstract: Amorphous polyamide compositions are provided which are transparent and have improved glass transition and thermal decomposition temperatures. The polyamide compositions of the present invention can be prepared as the polymeric condensation product of a diamine component comprising neopentyldiamine, and a diacid component comprising an aromatic dicarboxylic acid.
    Type: Grant
    Filed: July 15, 1992
    Date of Patent: November 23, 1993
    Assignee: Amoco Corporation
    Inventors: Edward E. Paschke, Wassily Poppe, David P. Sinclair
  • Patent number: 5252700
    Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.
    Type: Grant
    Filed: April 21, 1992
    Date of Patent: October 12, 1993
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma
  • Patent number: 5245005
    Abstract: A process is disclosed for the production of linear amorphous polyamides which results in polyamides having more amine endgroups than acid endgroups. It comprises condensing an aqueous solution of salts comprising at least one aromatic diacid containing from 7 to 20 carbon atoms and a greater than equimolar amount of at least one aliphatic diamine containing from 4 to 20 carbon atoms.
    Type: Grant
    Filed: April 10, 1992
    Date of Patent: September 14, 1993
    Assignee: Monsanto Company
    Inventors: Chris E. Schwier, Richard D. Chapman, Roger C. Ayotte
  • Patent number: 5235029
    Abstract: There are described copolyamides which are soluble in organic polyamide solvents and contain recurring structural units of the formulae Ia, Ib, Ic and Id or Ia, Ib, Id and Ig or Ia, Ib, Ic, Id and Ig and optionally of the formulae Ie and/or If--OC--Ar.sup.1 --CO-- (Ia),--NH--Ar.sup.2 --NH-- (Ib),--NH--Ar.sup.3 --NH-- (Ic), ##STR1##--OC--R.sup.2 --CO-- (Ie),--NH--R.sup.3 --NH-- (If),--OC--Ar.sup.4 --CO-- (Ig),whereAr.sup.1 and Ar.sup.2 are each independently of the other divalent aromatic radicals whose valence bonds are in the para or a comparable coaxial or parallel position relative to one another,Ar.sup.3 and Ar.sup.4 are each independently of the other divalent radicals whose valence bonds are in the meta or a comparable kinked position relative to one another,R.sup.1 is lower alkyl, lower alkoxy or halogen, andR.sup.2 and R.sup.3 are each independently of the other divalent aliphatic, cycloaliphatic or araliphatic radicals.
    Type: Grant
    Filed: January 16, 1992
    Date of Patent: August 10, 1993
    Assignee: Hoechst AG
    Inventors: Gunter Keil, Karl Heinrich
  • Patent number: 5235030
    Abstract: Linear aromatic copolyamides having good processability, superior thermal stability and excellent mechanical properties are provided. They comprise 55-90 mole % of a repearing unit of ##STR1## and 45-10 mole % of a repeating unit of ##STR2## wherein R.sub.1 and R.sub.2 each is a C.sub.4-12 aliphatic alkylene.
    Type: Grant
    Filed: April 17, 1992
    Date of Patent: August 10, 1993
    Assignee: Showa Shell Sekiyu Kabushiki Kaisha
    Inventor: Shunichi Koide
  • Patent number: 5233004
    Abstract: Disclosed herein are chromium carbonyl complexes of polyamides containing units derived from aromatic diamines in which about 10 to about 90% of those units are complexed with a chromium carbonyl compound, and a process for making them. When aramids are used, the solubility of the polymer in organic solvents is enhanced, and in the case of certain aramids lyotropic solutions are formed. These solutions can be used to make anisotropic films and fibers.
    Type: Grant
    Filed: May 20, 1992
    Date of Patent: August 3, 1993
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Alexa A. Dembek, Andrew E. Feiring
  • Patent number: 5216110
    Abstract: Azole rings, such as oxazole and thiazole rings, can activate an aromatic ring bonded to a leaving group such as a halogen atom so that the aromatic ring will undergo aromatic nucleophilic substitution. The reaction is useful for making ethers, thioethers and amines containing azole rings. In particular, monomers having azole rings, activated aromatic rings with leaving groups and nucleophilic moieties can react under conditions of aromatic nucleophilic displacement to form non-rigid rod PBZ polymers. The non-rigid rod PBZ polymers can be used to form molecular composites with rigid rod PBZ polymers which molecular composites are not substantially phase separated.
    Type: Grant
    Filed: January 10, 1992
    Date of Patent: June 1, 1993
    Assignee: The Dow Chemical Company
    Inventors: Muthiah N. Inbasekaran, Michael J. Mullins
  • Patent number: 5214125
    Abstract: A polyamide comprising a recurring unit of the formula (I), ##STR1## wherein each of R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 is independently a hydrogen atom, a halogen atom, a hydroxyl group, or a group of a carbon skeleton which may contain a hetero atom or a halogen atom, and A.sup.1 is a divalent hydrocarbon group; and a process for the production of a polyamide comprising the recurring unit of the formula (I), which comprises subjecting to a polycondensation reaction a dicarboxylic acid comprising an alicyclic dicarboxylic acid of the formula (a)-1, ##STR2## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are as defined in the formula (I), and a diamine of the formula (b)-1,H.sub.2 N-A.sup.1 -NH.sub.2 (b)-1wherein A.sup.1 is as defined in the formula (I).
    Type: Grant
    Filed: September 19, 1991
    Date of Patent: May 25, 1993
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Makoto Mitani, Toshimasa Takata
  • Patent number: 5196501
    Abstract: Preparation of specially substituted aromatic polyamides containing structural units of the formula I mentioned and copolyamides containing at least 10 mol % of structural units of the formula I and structural units of the formula II mentioned and their use as orientation layer in liquid crystal display elements and/or liquid crystal switching elements.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: March 23, 1993
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Hans-Rolf Dubal, Mikio Murakami, Otto Herrmann-Schonherr, Arnold Schneller
  • Patent number: 5196505
    Abstract: A thermoplastically processable aromatic polyamide is prepared by polycondensing diacid monomer A with diamine monomer B: (A) HOOC--Ar--COOH;(B) H.sub.2 N--Ar'--NH.sub.2 ; wherein Ar is 1,3-- or 1,4-phenylene; 1,4--, 1,5--, 2,6-- or 2,7-naphthylene, ##STR1## and Ar' is ##STR2## wherein X is --SO.sub.2 -- or --CO--; Y is --O-- or --S--; Z is --O--, --S--, --SO.sub.2 --, --CO-- or ##STR3## wherein R and R' each is --H or C.sub.1 -- to C.sub.4 -alkyl and n is 0 or 1 in the melt at a temperature in the range of from 200.degree. to 400.degree. C. in the presence of a catalyst selected from the group consisting of alkyl- or aryl-phosphonic acids, -phosphonous acids, -phosphinic acids, esters thereof, halides thereof and mixtures thereof, the catalyst content being 0.01 to 2.0 mol % relative to the total content of components A and B.
    Type: Grant
    Filed: December 6, 1990
    Date of Patent: March 23, 1993
    Assignee: Huels Aktiengesellschaft
    Inventors: Gunter Poll, Jurgen Finke
  • Patent number: 5194562
    Abstract: Azole rings, such as oxazole and thiazole rings, can activate an aromatic ring bonded to a leaving group such as a halogen atom so that the aromatic ring will undergo aromatic nucleophilic substitution. The reaction is useful for making ethers, thioethers and amines containing azole rings. In particular, monomers having azole rings, activated aromatic rings with leaving groups and nucleophilic moieties can react under conditions of aromatic nucleophilic displacement to form non-rigid rob PBZ polymers. The non-rigid rod PBZ polymers can be used to form molecular composites with rigid rod PBZ polymers which molecular composites are not substantially phase separated.
    Type: Grant
    Filed: January 10, 1992
    Date of Patent: March 16, 1993
    Assignee: The Dow Chemical Company
    Inventors: Muthiah N. Inbasekaran, Michael J. Mullins
  • Patent number: 5177175
    Abstract: A wholly aromatic copolymer and a shaped article thereof having an excellent mechanical property, high resistances to heat and chemicals, and a satisfactory processability, is composed of (1) an aromatic dicarbonyl moiety consisting of recurring dicarbonyl units (A) and (B): ##STR1## and (2) an aromatic diamine moiety consisting of recurring diamine units (C) and (D): ##STR2## and the recurring dicarbonyl units (B) being in an amount of 0.01 molar % or more but less than 20 molar % based on the total molar amount of the dicarbonyl moiety (1), and the recurring diamine units (D) being in an amount of 60 molar % or less but more than 20 molar % based on the total molar amount of the diamine moiety (2).
    Type: Grant
    Filed: October 26, 1990
    Date of Patent: January 5, 1993
    Assignee: Teijin Limited
    Inventors: Tsutomu Kiriyama, Toshihiro Santa
  • Patent number: 5167882
    Abstract: An improved stereolithography method for building a three-dimensional article including the steps of patternwise curing successive layers of a bath of curable liquid resin formulation until the article has been completely built up, removing the article from the liquid resin bath and then post-curing the article, wherein the liquid resin is a "thiol/nene" formulation including:(a) a first compound having a plurality of norbornene groups thereon;(b) a second compound having a plurality of thiol groups therein; and(c) a free radical photoinitiator,the total functionality of the formulation being greater than 4.
    Type: Grant
    Filed: February 5, 1991
    Date of Patent: December 1, 1992
    Assignee: Loctite Corporation
    Inventors: Anthony F. Jacobine, Margaret A. Rakas, David M. Glaser
  • Patent number: 5166313
    Abstract: The present invention comprises diamantane groups interspersed among benzothiazole groups, benzoxazole groups or benzimidazole groups. This constitutes a rigid-rod polymer with stable cycloaliphatic groups interspersed into the aromatic-heteroaromatic backbone of the rods. The presence of the aliphatic groups decreases crystallinity by adding disorder to the rods thus minimizing interactions between the heteroaromatic groups. The interspersed aliphatic groups act as insulators and thus permit greater relative protonation. Also, the reduced conjugation of the aromatic-heteroaromatic rings reduces the color of the polymers. The preferred method of manufacturing this improved rigid-rod polymer is by condensation of dimethyl diamantanecarboxylate with 2,5-diamino-1,4-benzenedithiol, 1,2,4,5-tetraaminobenzene, or 4,6-diamino-1,3-benzenediol.
    Type: Grant
    Filed: April 29, 1991
    Date of Patent: November 24, 1992
    Assignee: Fluorochem, Inc.
    Inventors: Thomas G. Archibald, Aslam A. Malik, Kurt Baum
  • Patent number: 5162489
    Abstract: Diamines having a 1,1,3-trimethylphenylindane dicarboxylic moiety linked on both sides to phenylene diamine by an amide bond (PIDA diamines) are disclosed. By reacting these diamines with aromatic difunctional acid derivatives, amorphous polymers having high glass transition temperatures (Tg) can be prepared. If aliphatic diacid derivatives are used the resulting polymers have a lower Tg, but have the advantage of melt-processability. The PIDA-diamines can also be used in the preparation of polyimides, being reacted either with tri-or tetracarboxylic anhydrides or with imide group-containing acid derivatives.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: November 10, 1992
    Assignee: Akzo N.V.
    Inventors: Cornelis R. H. I. De Jonge, Gerrit Hoentjen, Theodorus J. Bouwmans
  • Patent number: 5128443
    Abstract: Provided is a para-ordered aromatic heterocyclic copolymer having repeating units of the formula --(--Q--Ar--).sub.m --(--Q--Ph--).sub.n -- wherein Q is ##STR1## wherein X is --O--, --NH-- or --S--, m is 0.05 to 0.50 and n is 1.
    Type: Grant
    Filed: April 16, 1991
    Date of Patent: July 7, 1992
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Fred E. Arnold, Loon-Seng Tan, Thuy D. Dang
  • Patent number: 5102982
    Abstract: Aromatic polyamides of the invention are polyamides comprising a recurring unit ##STR1## and a recurring unit [--NH--Ar.sub.1 --NH--] and copolyamides comprising a recurring unit ##STR2## and a recurring unit [--NH--Ar.sub.2 --NHCO--Ar.sub.3 --CO--] wherein Ar.sub.1 and Ar.sub.2 are, for example, phenylene group, naphthylene group, biphenylene group, and 4,4'-methylenediphenylene group and Ar.sub.3 is, for example, phenylene group, naphthylene group and biphenylene group in which both the bonding chains extend in the coaxial direction or in the parallel direction to axis.The aromatic polyamide of the invention has high glass transition temperature and has heat resistance, high strength, and high elasticity and besides is soluble in various solvents and is excellent in spinnability and film-formability. The aromatic polyamide is molded into fibers or films and can be utilized as electric insulating materials, laminates, varnishes, fabrics, synthetic papers, etc.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: April 7, 1992
    Assignee: Showa Shell Sekiyu Kabushiki Kaisha
    Inventor: Shunichi Koide
  • Patent number: 5081223
    Abstract: Amorphous polyamide compositions are provided which are transparent and have improved glass transition and thermal decomposition temperatures. The polyamide compositions of the present invention can be prepared as the polymeric condensation product of a diamine component comprising neopentyldiamine, and a diacid component comprising an aromatic dicarboxylic acid.
    Type: Grant
    Filed: February 27, 1990
    Date of Patent: January 14, 1992
    Assignee: Amoco Corporation
    Inventors: Edward E. Paschke, Wassily Poppe, David P. Sinclair
  • Patent number: 5079339
    Abstract: The present invention is an improved polyamide copolymer having monomer units including repeat units of the formula ##STR1## where n is from 10 to 14 and preferably is 12 (1,12-dodecanediamine), units derived from a symmetrical diacid or derivatives of said diacid, preferably a symmetrical aromatic dicarboxylic acid. The copolymer has minor amounts, preferably 3 to 30 and more preferably 5 to 10 mol percent, of units derived from an additional comonomer.
    Type: Grant
    Filed: August 13, 1990
    Date of Patent: January 7, 1992
    Assignee: Allied-Signal Inc.
    Inventors: Murali K. Akkapeddi, Jeffrey H. Glans
  • Patent number: 5077383
    Abstract: New polybenzimidazolone polymers produced from the reaction of an aromatic tetraamine with a hexafluoro dianhydride. These hexafluoro polybenzimidazolone polymers based on an aromatic hexafluoro dianhydrides show improved solubility, easy processability, low moisture uptake, high thermal stability, resistance to solvent and other improvements over conventional polybenzimidazolone polymers.
    Type: Grant
    Filed: March 15, 1990
    Date of Patent: December 31, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr., Joseph D. Menczel
  • Patent number: 5075419
    Abstract: This invention discloses new polybenzimidazolone polymers produced by the reaction of a hexafluoro aromatic tetraamine with a dianhydride reactant. These hexafluoro polybenzimidazolone polymers based on an aromatic hexafluoro tetraamine show improved solubility, easy processability, low moisture uptake, high thermal stability, resistance to solvent and other improvements over conventional polybenzimidazolone polymers.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: December 24, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Chen, Sr. Paul N., Joseph D. Menczel
  • Patent number: 5072003
    Abstract: Compounds are disclosed which are anhydrides containing additional carboxylic acid moieties and dianhydrides of disubstituted maleic anhydride compounds wherein the acid anhydrides and dianhydrides retain their alkene character. These compounds are useful as precursors for polyesters, thermally stable polyamide-imides and polyimides.
    Type: Grant
    Filed: June 11, 1990
    Date of Patent: December 10, 1991
    Assignee: Amoco Corporation
    Inventors: Steven J. Behrend, Ellis K. Fields
  • Patent number: 5066769
    Abstract: There is provided a para-ordered, rigid-rod aromatic heterocyclic copolymer having repeating groups of the formula:--Ba--Ar).sub.x (Ba--Fl).sub.1.0-xwherein x has a value of 0.50 to 0.99, Fl is a 2,7-fluorene moiety, Ar is a para-ordered arylene group and Ba is a benzazole group of the formula: ##STR1## wherein Y is S or O.
    Type: Grant
    Filed: March 23, 1990
    Date of Patent: November 19, 1991
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Robert C. Evers, My Dotrong
  • Patent number: 5055616
    Abstract: Diamine compounds having the structural formula: ##STR1## wherein R.sub.1 is a methyl or ethyl group, can be used in preparing various polymers which are useful components in gas separation membranes. The combined effect of specific substituents ortho to the amino groups and the fluorenylidene bridging group imparts useful properties to polymeric membranes formed with these monomers.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: October 8, 1991
    Assignee: Air Products and Chemicals, Inc.
    Inventors: William F. Burgoyne, Jr., Michael Langsam
  • Patent number: 5047500
    Abstract: A fiber product comprising one or more fibers of aromatic polyamide polymer having a microscopic structure of an extended molecular chain, free of crystal defect layers perpendicular to the fiber axis, a high inherent viscosity of at least 3.0 [dl/g], and a high tensile strength of at least 15 g/d, said inherent viscosity being determined at 30.degree. C. using a concentration of 0.5 grams of said polymer in 100 ml of concentration sulfuric acid.
    Type: Grant
    Filed: October 23, 1989
    Date of Patent: September 10, 1991
    Assignee: Kolon Industries, Inc.
    Inventors: Ho J. Park, Moo S. Rhim, Hak M. Kim, Du H. Kim, Seog C. Yoo, Sang H. Kim, Sa N. B. Park, Ink S. Han, John T. Park, Si M. Kim
  • Patent number: 5037948
    Abstract: A novel class of cyano-, cyanoalkyl-, carboxy- or carboxyalkylaryl-substituted 1,6-diaza [4.4] spirodilactams, having a cyano-, cyanoalkyl-, carboxy- or carboxyalkylaryl substituent attached to each spiro ring nitrogen atom, are useful for the preparation of polyesters and polyamides.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: August 6, 1991
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5026823
    Abstract: This invention relates to novel polyimides derived from alicyclic dianhydrides and a process for synthesizing the polyimides.
    Type: Grant
    Filed: September 12, 1989
    Date of Patent: June 25, 1991
    Assignee: The Dow Chemical Company
    Inventors: John D. Summers, Thomas O. Jeanes
  • Patent number: 5006630
    Abstract: Amorphous para-oriented aromatic homo- and co-polyamides are prepared from terephthaloyl chloride or 2,6-naphthoyl chloride and 2,2'-dibromo-5,5'-dimethoxy-[1,1'-biphenyl]-4,4'-diamine with up to 92.5 mol % of certain other diamines.
    Type: Grant
    Filed: June 30, 1989
    Date of Patent: April 9, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Robert S. Irwin
  • Patent number: 5003037
    Abstract: Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: March 26, 1991
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, Edwin F. Morello, Neal B. Nowicki
  • Patent number: 5001219
    Abstract: High modulus, high tenacity fibers of poly-p-phenylene terephthalamide (PPD-T) are disclosed along with a fiber heat treating process for increasing the inherent viscosity and the crystallinity index of the PPD-T. Never-dried fibers swollen with water of controlled acidity are heated beyond dryness.
    Type: Grant
    Filed: January 23, 1989
    Date of Patent: March 19, 1991
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Terry S. Chern, Stephan C. De La Veaux, Jacob Lahijani, James E. Van Trump
  • Patent number: 4992527
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: February 12, 1991
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist, Edwin F. Morello, Neal R. Nowicki
  • Patent number: 4975190
    Abstract: A separation membrane consisting of a polyamide having a unit (I) or a mixing of polyamides having units (I) and (II) an (II') or a polyester having a unit (III) or (IV) and (IV') or a mixture of polyesters having units (III) and (IV) and (IV'):--HN--X--NH--Z.sub.1 -- (I)--(HN--X--NH--Z.sub.1).sub.l -- (II)--HN--X--NH--Z.sub.1 ').sub.n -- (II')--O--X--O--Z.sub.2 -- (III)--(O--X--O--Z.sub.2).sub.r -- (IV)--O--X--O--Z.sub.2 ').sub.s -- (IV')wherein X represents ##STR1## where R represents H, CH.sub.3, or C.sub.2 H.sub.5 ; Z.sub.1 and Z.sub.2 represent ##STR2## Z.sub.1 ' represents --CO--(CH.sub.2).sub.p --CO--, Z.sub.2 ' represents --CO--CH.dbd.CH--CO--, p is an integer of 4 to 8, n/l is 1.0 to 20, and r/s is 0.5 to 100.
    Type: Grant
    Filed: March 14, 1990
    Date of Patent: December 4, 1990
    Assignee: Nippon Steel Corporation
    Inventors: Masao Sakashita, Tetsuo Sakamoto, Shingo Kazama, Yoshiyuki Harada, Takero Teramoto, Kazuhiro Watanabe, Bunji Shimomura, Tsutomu Kaneta
  • Patent number: 4973659
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: November 30, 1988
    Date of Patent: November 27, 1990
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist, Edwin F. Morello, Neal R. Nowicki
  • Patent number: 4973660
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butyltoluene are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butyltoluene which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: November 30, 1988
    Date of Patent: November 27, 1990
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist
  • Patent number: 4946934
    Abstract: Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: June 28, 1988
    Date of Patent: August 7, 1990
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, Edwin F. Morello, Neal R. Nowicki
  • Patent number: 4914180
    Abstract: Polyamides having improved solubility and processing characteristics are provided having incorporated into the polymeric chain a novel aromatic diamine compound, 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoropropane (3-4'-6F Diamine). The polyamides are prepared by reacting the 3,4'-6F Diamine with an aliphatic or aromatic di-acid or acid halide. It has been found that the polyamides of this invention have improved solubility characteristics, low dielectric constants and improved thermal flow properties as a consequence of the meta/para positioning of the amino groups on the daimine, which renders these polymers more readily melt spinnable for the production of fibers. The polymers may also be compression molded and fabricated into composites at moderate temperatures and pressures.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: April 3, 1990
    Assignee: Hoechst Celanese Corporation
    Inventor: Rohitkumar H. Vora
  • Patent number: 4868279
    Abstract: Copolyamides are prepared by the reaction of monocyclic spiro(bis)indane polyamide oligomers with lactams in the presence of basic reagents.
    Type: Grant
    Filed: February 16, 1988
    Date of Patent: September 19, 1989
    Assignee: General Electric Company
    Inventors: Thomas L. Guggenheim, Sharon J. McCormick, Alice M. Colley, Joseph W. Guiles
  • Patent number: 4855395
    Abstract: Novel hydroxyethylnorbornene esters are disclosed which are prepared by reacting cyclopentadienylethanol with an acrylate ester. Novel polyesters are disclosed which are prepared by the self-polymerization of the hydroxyethylnorborane (HEN) esters. Novel polyesters are also obtained by reacting HEN compounds and a diol or other polyol in the presence of diacids or their esters or anhydrides. The polyesters of the present invention are useful as tackifying agents, adhesives, coatings, and for other purposes.
    Type: Grant
    Filed: September 16, 1988
    Date of Patent: August 8, 1989
    Assignee: Eastman Kodak Company
    Inventors: Jerome L. Stavinoha, Anthony W. McCollum
  • Patent number: 4833214
    Abstract: A soluble heat-resistant aromatic polyamide having amide bonds at the terminal ends thereof represented by the formula (I):R.sup.1 CO--NH--Y--NH--X).sub.n NH--Y--NHCOR.sup.1 (I)wherein R.sup.1 represents an alkyl group or aromatic group,Y represents ##STR1## wherein R.sup.2 represents hydrogen, methyl, or ethyl, X represents ##STR2## wherein Z represents an aromatic ring which may be substituted with an alkyl group, andn is a recurring unit number; said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.30 dl/g as measured in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide at 30.degree. C.
    Type: Grant
    Filed: December 23, 1986
    Date of Patent: May 23, 1989
    Assignees: Nippon Steel Corporation, Nippon Steel Chemical Co., Ltd.
    Inventors: Takero Teramoto, Kazuaki Harada, Hiroharu Inoue
  • Patent number: 4808754
    Abstract: Cyclic polyamide oligomers are prepared by the reaction of various spirobiindane diamines, including spirobiindane bisphenol bis-aminophenoxy ethers, with dicarboxylic acid chloride such as isophthaloyl chloride. The oligomer compositions may be converted to copolyamides by reaction with lactams in the presence of basic reagents.
    Type: Grant
    Filed: February 27, 1987
    Date of Patent: February 28, 1989
    Assignee: General Electric Company
    Inventors: Thomas L. Guggenheim, Joseph W. Guiles, Sharon J. McCormick
  • Patent number: 4808638
    Abstract: A curable thiol-ene formulation comprising(a) a polythiol(b) a 'ene compound having a plurality of groups of the formula: ##STR1## where Q is CH.sub.2, CHCH.sub.3, C(Ch.sub.3).sub.2, O, S, NR.sup.1 or SO.sub.2 R.sup.1 is H or alkyl, and m is 0-10, and(c) an effective amount of a free radical initiator.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: February 28, 1989
    Assignee: Loctite Corporation
    Inventors: Walter J. Steinkraus, John Woods, John M. Rooney, Anthony F. Jacobine, David M. Glaser
  • Patent number: 4794159
    Abstract: A heat-resistant polyamide having a repeating unit represented by the formula (I):--X--NH--Y--NH--(I)wherein X represents the structure (A): ##STR1## or the structure (A) and the structure (B) --C.sub.m H.sub.2m -- wherein R represents hydrogen, methyl, or ethyl and m is an integer of 2 to 8; and Y represents the structure (C) ##STR2## and the structure (D) --CO--C.sub.n H.sub.2n --CO-- wherein n is 2 to 6, provided that Y may be the structure (C) when X is the structures (A) and (B), said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.25 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide.
    Type: Grant
    Filed: April 22, 1987
    Date of Patent: December 27, 1988
    Assignees: Nippon Steel Corporation, Nippon Steel Chemical Co., Ltd.
    Inventors: Takero Teramoto, Kazuaki Harada, Hiroharu Inoue