Abstract: A polyimide precursor and a polyimide precursor resin composition, the polyimide precursor having repeating units represented by formula (1) and a photosensitive resin composition comprising the polyimide precursor and a photoacid generator or photobase generator: where R1 is a tetravalent organic group; R2 is a divalent organic group; R1s may be the same or different from each other and R2s may be the same or different from each other in the repeating units; R3 and R4 respectively represent a monovalent organic group having a structure represented by formula (2) and may be the same or different from each other; and R3s and R4s in the repeating units may be the same or different from each other, respectively. R5, R6, R7 and R8 are as described in the specification.

Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.

Abstract: The present invention provides a polyimide film which is both outstandingly transparent and highly heat resistance, and which can be usefully employed as a transparent electrically conductive film, a TFT substrate, a flexible printed circuit substrate, and the like.

Abstract: A single-layered thermally adhesive polyimide film; a method for producing the thermally adhesive polyimide film; and a method for producing a polyimide metal laminate produced using the thermally adhesive polyimide film. The single-layer thermally adhesive polyimide film is produced by polymerizing a tetracarboxylic acid dianhydride component and a diamine component, wherein the tetracarboxylic acid dianhydride component includes 2,3,3?,4?-biphenyltetracarboxylic acid dianhydride and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride and the diamine component includes an aromatic diamine compound represented by the following formula (I) as a main component wherein X is O, CO, C(CH3)2, CH2, SO2, S, or a direct bond, and in cases of two or more modes of bonding, each is the same or different; and n is an integer of 0 to 4.

Abstract: Disclosed are salt compositions of lysinol and dicarboxylic acids; and lysinol derived polymers including polyamide, polyimide, polyurea, cross-linked polyurea comprising urethane linkages, polyurea foams, cross-linked polyurea foams, and lysinol-epoxy thermoset.

Abstract: Disclosed are a polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing triazine compound used for manufacturing these. The polyimide precursor contains a structural unit represented by general formula (I): in which A is a tetravalent aromatic group or aliphatic group and B is a divalent aromatic group, wherein B in general formula (I) comprises a triazine moiety represented by following formula (B1): in which R1 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms, and R2 denotes hydrogen or alkyl or aryl having 1 to 12 carbon atoms.

Abstract: To provide a polyamic acid ester-containing polyimide precursor composition having a good storage stability, from which a polyimide film having a high imidization degree and excellent adhesion to an inorganic substrate can be obtained. A polyimide precursor composition comprising a polyamic acid ester, a thermal imidization accelerator and a solvent, wherein the thermal imidization accelerator is a compound which has a carboxy group and an amino group or an imino group which is deprotected by heat to show basicity, and which will not accelerate the imidization of the polyamic acid ester before the protecting group leaves, and a polyimide precursor composition containing a silane coupling agent.

Abstract: The present invention relates to polymer, homo- or copolymer or oligomer for the photoalignment of liquid crystals, especially for the planar orientation of liquid crystals, comprising a main chain and a side chain, wherein the side chain and/or main chain comprises a polar group, compositions thereof, and its use for optical and electro optical devices, especially liquid crystal devices (LCDs).

Abstract: A liquid crystal display is provided which is capable of reducing the occurrence of defective display due to variations in the initial alignment direction of a liquid crystal alignment control film in a liquid crystal display of an IPS scheme, realizing the stable liquid crystal alignment, providing excellent mass productivity, and having high image quality with a higher contrast ratio. The liquid crystal display has a liquid crystal layer disposed between a pair of substrates, at least one of the substrates being transparent, and an alignment control film formed between the liquid crystal layer and the substrate. At least one of the alignment control films 109 comprises photoreactive polyimide and/or polyamic acid provided with an alignment control ability by irradiation of substantially linearly polarized light.

Abstract: Disclosed herein are a polyimide-polybenzoxazole copolymer, a method for preparing thereof and a gas separation membrane comprising the same. More specifically, provided are a polyimide-polybenzoxazole copolymer simply prepared through thermal-rearrangement performed by thermally treating a polyimide-poly (hydroxyimide) copolymer as a precursor, a method for preparing the same, and a gas separation membrane comprising the same. The copolymer shows superior gas permeability and gas selectivity, thus being suitable for use in gas separation membranes in various forms such as films, fibers or hollow fibers. The gas separation membrane thus prepared can advantageously endure even harsh conditions such as long operation time acidic conditions and high humidity due to the rigid polymer backbone present in the copolymer.

Abstract: Disclosed is a process for producing a polyamic acid solution by reacting a diamine component consisting essentially of 20 mol % to 80 mol % of p-phenylenediamine and 80 mol % to 20 mol % of diaminodiphenyl ether with a tetracarboxylic acid component consisting essentially of 10 mol % to 60 mol % of 2,3,3?,4?-biphenyltetracarboxylic dianhydride and 90 mol % to 40 mol % of 3,3?,4,4?-biphenyltetracarboxylic dianhydride in a solvent, comprising: a first step in which a diamine component is reacted with a molar excess of a tetracarboxylic acid component in a solvent containing more than ? mole of water per mole of the tetracarboxylic acid component, whereby preparing a polyamic acid solution; and a second step in which a diamine component, or a diamine component and a tetracarboxylic acid component are added to the polyamic acid solution obtained in the first step so that the molar amount of the diamine component is substantially equal to the molar amount of the tetracarboxylic acid component, and then the dia

Abstract: Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.

Abstract: A transparent electro-conductive laminate comprising: a substrate film made of a polyimide; and a thin film made of an electro-conductive material and stacked on the substrate film, wherein the polyimide is a polyimide containing at least one repeating unit represented by the following general formula (1): [in the formula (1), R1, R2, and R3 each independently represent one selected from the group consisting of a hydrogen atom, alkyl groups having 1 to 10 carbon atoms, and a fluorine atom, R4 represents an aryl group having 6 to 40 carbon atoms, and n represents an integer of 0 to 12], having a glass transition temperature of 350° C. to 450° C., and having a linear expansion coefficient of 30 ppm/° C. or less, the linear expansion coefficient being determined by measuring change in length under a nitrogen atmosphere and under a condition of a rate of temperature rise of 5° C./minute in a temperature range from 50° C. to 200° C.

Abstract: The present invention relates to thermoplastic polyimides and to the synthesis thereof. The invention relates in particular to a method for manufacturing semi-aromatic thermoplastic polyimides by means of the solid-state polymerization of a solid ammonium carboxylate salt formed from an aliphatic diamine and an aromatic tetracarboxylic acid, thereby enabling powders having controlled particle sizes to be produced.

Abstract: A polyimide film suitable for insulating material is prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board.

Abstract: A thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70% by mol: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 12 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.

Abstract: Disclosed are (1) a method of preparing a polyimide membrane, including cross-linking polyimides via thermal labile side chains and decomposition of the thermal labile side chains; and (2) polyimide membranes thus prepared.

Abstract: A polyimide including a structure shown as Formula II is provided, wherein X is halogen, A1 is selected from one of Formula 1 to Formula 18, and n is from 2 to 500,

Abstract: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.

Abstract: Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.

Abstract: Disclosed is a transparent electrochromic polyimide, polymerized of a diamine and a cycloaliphatic dianhydride. The diamine includes a diamino triphenylamine having the formula: wherein R1 consists of hydrogen, halogen, C1-6 alkyl group, C1-6 alkoxy group, or and R2 consists of hydrogen, halogen, C1-6 alkyl group, or C1-6 alkoxy group.

Abstract: A gas separation membrane having a polyimide structure. The polyimide structure is provided to contain a repeating unit represented by general formula (1): (In the formula, R1 is a divalent organic group and R2 is a tetravalent organic group), wherein R1 is a divalent organic group represented by general formula (2): (In the formula, Raa is a single bond, an oxygen atom, a sulfur atom, —SO2— group, —CH2— group, —C(?O)— group, —C(CH3)2— group, —C(CH3)(CH2CH3)— group, —C(CF3)2— group or a divalent organic group formed by removing any two hydrogen atoms from a C3-C12 alicyclic hydrocarbon or C6-C25 aromatic hydrocarbon. Rab is a C1-C6 alkyl group. “ac” and “ad” mutually independently represent an integer of 0 to 2 such that 1?ac+ad?4. HFIP represents a —C(CF3)2OH group. A straight line that intersects with a wiggly line represents a bonding moiety).

Abstract: The present invention provides a precursor composition for polyimides, said composition comprising an amic acid oligomer of formula (1) and a dianhydride derivative with ester (—C(O)OR) and carboxy (—C(O)OH) terminal groups of formula (2): wherein R, G, G1, P, D and m are as defined in the specification. The invention also provides polyimides synthesized from the above-mentioned precursor composition.

Abstract: A polyimide laminate obtained by casting a polyamic acid solution composition including a phosphorus compound and a polyamic acid, which is obtained from a tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, on a substrate; and then heating the polyamic acid solution composition to form a polyimide layer having a thickness of less than 50 ?m on the substrate.

Abstract: A method of improving the mechanical properties of polymers is described. The method involves heat treating the polymer at a temperature below the glass transition temperature in a wet or in a dry environment. Polymer articles capable of moisture uptake in humid environments, as well as polymer articles less susceptible to moisture uptake, have improved mechanical properties, particularly improved stress relaxation behavior and set properties, when treated in accord with the heat treatment method.

Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.

Abstract: An aromatic ring-containing polymer, an underlayer composition including the same, and associated methods, the aromatic ring-containing polymer including a group represented by one of the following Chemical Formulae 1-1, 1-2, 2-1, and 2-2:

Abstract: The present invention provides a carbon black-dispersed polyamic acid solution composition having a high solids content and a high carbon black content. The invention further provides an intermediate transfer belt using the polyamic acid solution composition. The carbon black-dispersed polyamic acid solution composition is obtained by uniformly dispersing carbon black in a polyamic acid solution obtained by reacting biphenyltetracarboxylic dianhydride and an aromatic diamine in an organic polar solvent. The biphenyltetracarboxylic dianhydride includes 2,3,3?,4?-biphenyltetracarboxylic dianhydride and 3,3?,4,4?-biphenyltetracarboxylic dianhydride. The aromatic diamine includes 4,4?-diaminodiphenyl ether and p-phenylenediamine. The polyamic acid solution has a solids content of 25 weight % or more.

Abstract: Provided are novel polyimides, poly(amide-imides) and polyamides, which are generated from new two photon diamino-monomers of the formula: wherein para or meta X—C6H4—O— and X?NH2; and CnHn+1 is either a straight or branched alkyl chain, and wherein n is an integer from 1 to 20.

Abstract: What is described is a transparent polyamide-imide based on one or more different imido-dicarboxylic acids (AB) or derivatives thereof, and cycloaliphatic diamines (C) comprising 6 to 24 carbon atoms, wherein the imido-dicarboxylic acids (AB) or derivatives thereof are selected from the group of imido-dicarboxylic acids (AB) having the following structural formulas: wherein: ASL=(CH2)5-11, phenylene, (ylomethyl)phenyl, bis(ylomethyl)benzene, cyclohexanediyl, (ylomethyl)cyclohexyl, bis(ylomethyl)cyclohexane, cyclopentanediyl, (ylomethyl)cyclopentyl, bis(ylomethyl)cyclopentane, R?OH, O-alkyl, O-aryl, Cl, NH-ASL-COOH, Br, O—(CO)-alkyl, O—(CO)-aryl, R1=H, methyl, ethyl, propyl, with the provision that the ring can be substituted once or twice, and, with double substitution of the ring, the two substituents can be selected from the group, but may be different, and also moulding compounds based thereon, a method for production, and uses.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: A polyimide film which rarely undergoes the formation of bubbles, blisters or the like, even when heated to a high temperature; and a production method and a production apparatus for the polyimide film. The polyimide film production apparatus includes a support body, a cast furnace and a cure furnace, wherein the cure furnace is partitioned into multiple zones so that the temperature of a self-supporting film can be increased in a stepwise manner, and an infrared electric heater, which is disposed at a predetermined distance from the film, is arranged in a zone for heating the atmosphere of the self-supporting film to a temperature of 450° C. or higher on the upper surface side and/or the lower surface side of the self-supporting film. The polyimide production apparatus enables the production of a polyimide film which has a volatile content of 0.1 mass % or less after being heated at 450° C. for 20 minutes.

Abstract: A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.

Abstract: Disclosed are a polyimide precursor composition that includes a polyamic acid selected from compounds represented by Chemical Formulae 1 to 3, and a combination thereof; and a cross-linking agent selected from a compound represented by Chemical Formula 4, a compound represented by Chemical Formula 5, and a combination thereof; an article including a cross-linked polyimide using the same; and a display device including the article.

Abstract: Disclosed is a liquid crystal alignment agent that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, X1, X2, Y1 and Y2 are the same as defined in the detailed description.

Abstract: An intermediate transfer member that includes a fluorinated polyamic acid and a conductive component.

Abstract: Bis(halophthalimides) are prepared in mixture in an organic liquid such as ortho-dichlorobenzene or anisole, by a reaction at a temperature of at least 150° C. between at least one diamine compound and at least one halophthalic anhydride in the presence of imidization catalyst. The reaction mixture is maintained at about 15% by weight solids content and rich in the halophthalic anhydride by constantly monitoring the reaction mixture using analytical methods such as high performance liquid chromatography. The product mixture may be directly employed in the direct preparation of polyetherimides, and similar slurries may be employed to prepare other polyether polymers.

Abstract: Polyamic acid including structural units of the following Chemical Formulae 1 and 2 is provided: In Chemical Formulae 1 and 2, each substituent is as defined in the detailed description.

Abstract: A material for an optical film including a compound represented by Chemical Formula 1; a polymer including a repeating unit represented by Chemical Formula 10; a polymer including a repeating unit represented by Chemical Formula 20 and a repeating unit represented by Chemical Formula 21; an article prepared by using the polymer; and a display device including the article:

Abstract: A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a molecule having a repeating unit represented by a structure of any one of the following formulae (1) to (3) in a specified proportion, whose molecular end is capped by an end-capping agent.

Abstract: The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A?, C, C? are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A?, or C, C?.

Abstract: An object of the present invention is to provide a method for producing polyamide acid particles which is used as a raw material for polyimide particles with a small average particle diameter having high heat resistance. Other objects of the present invention are to provide a method for producing polyimide particles using the method for producing polyamide acid particles, and polyimide particles produced by the method for producing polyimide particles. Yet another object of the present invention is to provide a bonding material for an electronic component, which has a low linear expansion coefficient and a low elastic modulus after being cured in the temperature range equal to or less than the glass transition temperature, so that a joined body with high reliability can be produced.

Abstract: An aromatic polyimide film can be formed from a plurality of monomers comprising an aromatic dianhydride, and a first aromatic diamine selected from a group consisting of formulae (I) and (II): and wherein X and Y are respectively selected from the group consisting of oxygen, nitrogen and sulfur, and R and R? are respectively selected from the group consisting of NH2, wherein the aromatic polyimide film has an average linear coefficient of thermal expansion equal to or below about 5 ppm/° C. in a temperature range between about 50° C. and about 500° C.

Abstract: In one aspect, a water soluble binder composition, a method of producing the same and an electrode for a rechargeable battery employing the same is provided.

Abstract: A liquid crystal alignment agent is provided that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, each X1, X2, Y1 and Y2 is the same as in the detailed description.

Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.

Abstract: A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give

Abstract: Exemplary embodiments provide an intermediate transfer belt, materials and processes for producing an intermediate transfer belt, and an image transfer apparatus used in electrophotographic printing devices, wherein the intermediate transfer belt can comprise a thermosetting polyimide comprising the reaction product of a polyamic acid and a hydroxyl-terminated polybutadiene.

Abstract: The object is to propose an improved process for the production of a polyimide foam by which a large-sized polyimide foam in a state of fine and homogeneous cells can be readily obtained by easy operations and convenient steps. A melt-shaped body of a polyimide precursor obtainable by melt-treating in a closed state a powder of a polyimide precursor including at least an aromatic tetracarboxylic acid ester component and an aromatic amine component. A process for the production of a polyimide foam including the steps of melt-shaping in a closed state a powder of a polyimide precursor including at least aromatic tetracarboxylic acid ester component and an aromatic amine component to give a melt-shaped body of the polyimide precursor, and foaming the melt-shaped body of the polyimide precursor by a heat treatment.

Abstract: A method for the manufacture of a polymer is provided, the method comprising: Providing a first monomer, the first monomer comprising a bicyclic diamine moiety, a first nucleophilic group provided on a carbon atom of an aromatic moiety, and a second nucleophilic group provided on a carbon atom of an aromatic moiety; Providing a bridging compound comprising at least two sites vulnerable to nucleophilic attack; and Contacting the first monomer with the bridging compound. Polymers made by said method and uses of such polymers are also disclosed.