Abstract: An elastomeric epoxy composition and curing agents for elastomeric epoxy compositions, the elastomeric epoxy composition being the reaction product of a substituted amide and an epoxy.

Abstract: A resin composition, for use as a die attach adhesive, heat sink attach adhesive, encapsulant or underfill, comprises a resin system, including a mixture of an epoxy resin and a cyanate ester resin, and a polyamide catalyst. The composition is curable in one minute at 200.degree. C. and has a pot life of at least 18 hours at room temperature. The resin composition is flexible, develops high adhesion, high moisture resistance, low weight loss during curing and requires no solvents.

Abstract: An electrodepositable coating composition is provided comprising (a) an active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) a curing agent for transurethanation, transamidation or transesterification curing like at least a partially capped polyisocyanate curing agent; and (c) a catalytic mixture of bismuth and an amino acid or amino acid precursor. Optionally, an auxiliary acid may be present to increase the effectiveness of the amino acid in the mixture with bismuth.

Abstract: An electrically-conductive epoxy resin is disclosed having stable joint resistance over extended operating times and high impact strength where the resin is based on a silver flake-filled polymeric reaction product of a liquid bisphenol A having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents.

Abstract: A curing component (A) containing amino groups available for reaction with epoxy resins (B), wherein the curing component (A) is a condensation product of di- or polyhydroxyaromatics (A1) with polyamines (A2) is disclosed. The curing component (A) is useful in preparing curing mixtures (C) which include the curing component (A) and at least one epoxy resin (B), whereby the curing mixtures are useful in the production of shaped articles and as coatings.

Abstract: A composite coating is described. The composite comprises a substrate; one or more primer coating layers disposed on the substrate; and at least one topcoat layer disposed on the outermost primer coating layer. The outermost primer coating layer is obtained by reaction of a primer composition that includes a novolac resin having at least one carbamate group and an aminoplast resin.

Abstract: Hardeners for epoxy resins include a reaction product of (A) a compound having an average of at least one 1,2-epoxide group per molecule, compound (A) being a reaction products of (A1) a polyfunctional epoxide having ate least two 1,2-epoxide groups per molecule of said epoxide and (A2) a monohydroxyaromatic compound, and (B) an amine. Epoxy resins cured with the hardeners are useful as coatings.

Abstract: The present invention relates to a novel oxirane pre-polymer comprised of the catalyzed or uncatalyzed reaction product of phenyl intermediates with a difunctional oxirane oligomer having at least one aromatic moiety and at least one aliphatic moiety, characterized in that substantially hydrolyzable oxygen atoms in said phenyl are bonded to said oligomers, and there is substantially no bonding between oligomer moieties. In a particularly preferred embodiment the present invention relates to a novel oxirane prepolymer comprising the reaction product of a phenyl intermediate with an inorganic oxide having at least one hydrolyzable oxygen and a difunctional oxirane oligomer aliphatic moiety characterized in that a majority of all hydrolyzable oxygen atoms in said oxide are bonded to at least one of the phenyl groups of the intermediate phenyl and one phenyl group is bonded to said oligomer and there is substantially no bonding between oligomer moieties.

Abstract: This invention relates to coating compositions including one or more resins having amino-reactive groups; one or more polyamine curing agents; and one or more aminourethanes. The aminourethanes can be reaction products of (i) oligomeric or polymeric compounds which contain at least one, preferably two or more terminal 2-oxo-1,3-dioxolane groups (cyclic carbonate groups), and (ii) amines containing at least one primary, preferably two or more primary and, if desired, also secondary and tertiary amino groups. The ratios of equivalents of C1):C2) typically is from 1:1 to 1:10, preferably from 1:1.05 to 1:5 and particularly preferably from 1:1.1 to 1:2, and the end product preferably contains one or more free primary amino groups. The composition further may contain, if desired, pigments, fillers, one or more organic solvents, water and conventional additives.

Abstract: The invention provides for a process for the preparation of an advanced resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: A composition which consists essentially of the following components:A1) polyamines of formula (I) and/or (II) ##STR1## wherein R.sub.1 and R.sub.2 are each independently of the other a hydrogen atom or a methyl x is an integer from 1 to 3, and y is an integer from 0 to 2, the sum of x and y being up to and including 4, and z is an integer from 0 to 2; orA2) a mixture of polyamines of formula (I) and/or (II) with further polyamines; B) an aliphatic, cycloaliphatic or araliphatic alcohol or a mixture of corresponding alcohols; and C) an alkyl- and/or aralkyl-substituted monophenol or a mixture of corresponding monophenols, component C) constituting 20 to 50 percent of the total weight of the cited components. The compositions are useful as hardeners for epoxy resins to give cured material of particularly good resistance to chemicals.

Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.

Abstract: An amine curing agent composition for an epoxy resin is provided having low volatility and good processability containing a) a polyamine curing agent and b) an aliphatic alcohol-alkylene oxide adduct. An epoxy resin-polyamine curing agent system containing an aliphatic alcohol-alkylene oxide adduct is also provided.

Abstract: Provided are epoxy curing agents comprising the reaction product of reactants consisting essentially of a mono-alkylene polyamine having less than about 12 carbon atoms, an alicyclic diamine in an amount of greater than about 10% of the amine equivalents of said amine component, an aromatic mono-glycidyl ether having less than about 18 carbon atoms, and a diglycidyl ether of an aromatic diol having an average degree of oligomerization of less than about 3.5, wherein the ratio of primary amine equivalents of said alkylene polyamine to the total epoxide equivalents of said aromatic glycidyl ether and said diglycidyl ether of an aromatic diol is are greater than one, and the ratio of epoxide equivalents of said aromatic mono-glycidyl ether to epoxide equivalents of said diglycidyl ether of an aromatic diol is greater than one.

Abstract: A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or cure catalyst, e.g., by exposing the fusing coating powder to an ammonia-containing atmosphere.

Abstract: A class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures including an epoxy resin composition containinga) a polyepoxide;b) an amine or amide curing agent for the polyepoxide;c) at least about 15 meq (per equivalent of polyepoxide) of a catalyst for the reaction of the polyepoxide with the curing agent; andd) a cure inhibitor selected such that:(1) at about 171.degree. C. the composition has a gel time that is at least about 50 percent longer than a similar composition without the inhibitor, and(2) at about 175.degree. C. and higher the composition cures in no more than about 50 minutessuch that the composition cures rapidly with high cross-link density because it has a high catalyst loading, while the inhibitor lengthens the gel time to permit laminating and other processing.

Abstract: The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in which R.sup.1 and R.sup.2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.

Abstract: The present invention relates to an epoxy composition that is isolated in the form of an infusible, gelled, heat curable, epoxy functional reaction product. The reaction product is formed by mixing together: (A) one or more epoxy resins or epoxy group containing compounds and (B) a hardener system which will react with (A) to give a gelled solid, but which does not cause complete curing of (A) under the reaction conditions chosen for reaction of (A) and (B) to give a gelled solid. The reaction product can be formed by including (C) an optional further hardener system for (A) and the reaction product of (A) and (B), which is different from (B), and which remains largely unreacted with (A) and (B) under said reaction conditions. The present invention further relates to a cured product of said epoxy composition.

Abstract: Flexible epoxy resins are made by curing the epoxy with an amine curing agent in the presence of a low molecular weight acrylate copolymer made from a major amount of a lower aliphatic ester or amide of acrylic or methacrylic acid and a minor amount of an ethylenically unsaturated monomer having functionality reactive with functional groups present in the epoxy resin or its curing agent. The acrylate copolymer has a number average molecular weight in the range of 1000 to 6000, preferably 2000 to 3000, and a ratio of weight average to number average molecular weight in the range of 1 to 3.5. Copolymers of butylacrylate and acrylic acid or maleic anhydride are favored. Further advantages are realized by including in the cure formulation a monofunctional diluent reactive with the curative.

Abstract: A method of preparing epoxy parts wherein the interval of low viscosity of an amine-hardened epoxy system can be extended without sacrifice of cure time. Suitable catalysts for the epoxy-amine hardener reaction are generated in situ. As an advantage, more epoxy articles may be prepared with a given mold capacity having improved wet-out of fiber reinforcement attributed to a larger interval of low viscosity.

Abstract: A modified epoxy resin is prepared by mixing an isocyanate terminated urethane prepolymer with an epoxy resin in reactive conditions. The modified epoxy resin has a low internal stress when it is cured due to the flexible backbone of the urethane prepolymer incorporated therein, and has a high glass transition temperature due to a rigid oxazolidone structure formed via the epoxy ring opening with the isocyanate groups, and thus is useful as an electronic encapsulant.

Abstract: Liquid reactive thermosetting compositions comprising:A) At least one polyepoxide or a mixture of one or more polyepoxides with at least one monoepoxide, of an aliphatic, cycloaliphatic or mixed nature;B) at least one anhydride of a di- or polycarboxylic acid of an aliphatic, cycloaliphatic or mixed nature;C) at least one catalyst capable of promoting the rapid polymerization of the mixture A+B under microwave irradiation and having general formula (I):N.tbd.C--CH.sub.2 --CH(Z)--(O).sub.r --Y.sup.+ NR.sub.1 R.sub.2 R.sub.3 X.sup.-.

Abstract: An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

Abstract: A curable, structural epoxy adhesive composition comprising two parts is provided. The first part comprises an amine curing agent and a catalyst; the second part comprises an epoxy resin having an average epoxide functionality of greater than one.

Abstract: Disclosed are novel cyanoguanidine derivatives which are usable as an epoxy resin curing agent and are represented by the following general formula (1). A thermosetting resin composition and a photocurable and thermosetting resin composition containing the following cyanoguanidine derivatives and other derivatives as the epoxy resin curing agent are also disclosed. ##STR1## wherein R.sup.1 represents a substituent selected from the group consisting of the following substituents (a) through (k).

Abstract: A curing agent for a composition useful for the production of matt epoxy resin and hybrid powder coatings, comprising a mixture ofa) salts of phthalic acid, isophthalic acid and terephthalic acid with the following amines ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 are identical or different aliphatic, cycloaliphatic, araliphatic or aromatic hydrocarbon radicals having 1-20 carbon atoms and in which one or more CH.sub.2 groups in the carbon chain may be replaced by 0 atoms, by NR.sub.4 groups where R.sub.4 =C.sub.1-6 -alkyl, CH--OH groups, and/or one or more terminal methyl groups may be replaced by dialkyl-substituted amino groups having 1 to 6 carbon atoms, and R.sub.1 and R.sub.2 may form a joint ring in which one CH.sub.2 group may be replaced by an O atom or by an NR.sub.4 group, and R.sub.1 =R.sub.2 =R.sub.3 --CH.sub.2 --CH.sub.2 -- attached via a common nitrogen atom, and n=3-11, and 0.5-2 mol of amine A)-C) per mole of acid, andb) pyromellitic acid and/or trimellitic acid, 0.

Abstract: The invention relates to salts of pyromellitic acid which comprise 1 mol of pyromellitic acid and 0.5 to 2 mol of a guanidine of the following composition: ##STR1## in which R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different radicals from the group consisting of hydrogen, alkyl, cycloalkyl and aromatic hydrocarbon residues having 1 to 8 carbon atoms, and R.sup.1 and R.sup.2 and R.sup.3 and R.sup.4 may form a joint ring which may contain an oxygen atom as heteroatom. Also claimed are the preparation of the salts and their use for matt epoxide and hybrid powder coatings.

Abstract: A new epoxy hardener composition is the product of the reaction of (A) a poly(alkylene oxide) monoamine or diamine with a molecular weight (Mn) of about 500 to 3000 and (B) a di- or polycarboxylic acid, in a ratio of moles of carboxylic acid to equivalents of amine of about 1:1 to 6:1 to yield an intermediate (C), which in a second step is reacted with (D) a di- or polyamine. The compositions of the invention are excellent emulsifiers of liquid epoxy resins in aqueous media without the addition of added surfactants or acidic compounds, and can be used to prepare water resistant water-borne coatings and related products from both liquid and solid epoxy resins, that possess long pot lives and contain relatively small amounts of volatile organic compounds.

Abstract: An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree.C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C.

Abstract: A thermosetting resin composition which comprises (A) a resin in which at least one compound having a graft-reactive group such as a carboxyl group, a primary amino group or a secondary amino group and a carboxylic anhydride group has been grafted on a polycarbodiimide and (B) an epoxy compound. The said thermosetting resin composition retains heat resistance, electrically insulating properties and mechanical properties characteristic of polycarbodiimide, is excellent in solubility in various solvents and storage stability in the form of a solution and can be easily cured under mild conditions, and can produce a cured product excellent in humidity resistance, transparency, chemical stability and adhesiveness to various substrates.

Abstract: A self-dispersing curable epoxy composition is prepared upon contacting (a) 1.0 reactive equivalents of an epoxy resin, (b) from about 0.65 to 0.95 reactive equivalents of a polyhydric phenol, and (c) between 0.005 and 0.5 reactive equivalents of an amine-epoxy adduct, wherein the amine-epoxy adduct is formed upon contacting 1.0 equivalents of an aliphatic polyepoxide and between 0.3 and 0.9 reactive equivalents of a polyoxyalkyleneamine. The self-dispersing curable epoxy resin forms an aqueous dispersion upon mixing with water. When cured, the dispersion is useful as a coating composition.

Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

Abstract: The invention relates to salts of pyromellitic acid which comprise 1 mol of pyromellitic acid and 0.5. to 2 mol of a guanidine of the following composition: ##STR1## in which R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different radicals from the group consisting of hydrogen, alkyl, cycloalkyl and aromatic hydrocarbon residues having 1 to 8 carbon atoms, and R.sup.1 and R.sup.2 and R.sup.3 and R.sup.4 may form a joint ring which may contain an oxygen atom as heteroatom. Also claimed are the preparation of the salts and their use for matt epoxide and hybrid powder coatings.

Abstract: Nitrogenous multiacrylic monomers having the formula (I) are produced by reacting at least one diamine having the formula H.sub.2 N--R--NH.sub.2 with at least one polyepoxide resin and at least one (meth)acrylic epoxide. Application in the production of polymers for use in the preparation of varnishes, adhesives, films and composite materials.

Abstract: The present invention relates to novel polyamines containing urea groups and a process for the preparation of these polyamines, represented by the general formula: ##STR1## where n is: 2.ltoreq.n.gtoreq.1; and R denotes an alkylene radical having 2-14 C atoms which may optionally be substituted by 1-3 CH.sub.3 or C.sub.2 H.sub.5 groups, or 1-3 CH.sub.2 groups of the alkylene radical R may be substituted by --O--, --NH-- or --NCH.sub.3 --.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: An epoxy resin composition characterized by comprising (A) an epoxy resin containing an oxazolidone ring, (B) a halogen-containing epoxy resin and (C) a curing agent as its ingredients, wherein the ratio by weight of ingredients (A) to (B) is 5-100:95-0, the hydrolizable chlorine content of ingredients (A) and (B) is no more than 500 ppm and the amount of .alpha.-glycol is no more than 100 m eq/kg has excellent properties and can be employed as the materials for electronic applications and as paints, adhesives, molding materials, composite materials, laminates and sealing materials.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (I)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

Abstract: N-Alkyl-N'-aryl-p-phenylenediamines, when added at 2.5 to 12.5% by weight, based on the total weight of the epoxy resin and hardener, cause the epoxy resin after curing to exhibit substantial increases in physical properties, such as strength, stiffness, toughness and hot/wet properties, compared to the properties of the cured, but unmodified epoxy resin.

Abstract: The invention relates to new salts of pyromellitic acid, to a process for their preparation and to their use for the production of matt epoxide and hybrid powder coatings.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.

Abstract: A curing agent for a composition for the production of matt epoxide and hybrid powder coatings which is a mixture comprising:a) salts of phthalic, isophthalic and terephthalic acid and the following guanidines. ##STR1## wherein R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 may be identical or different radicals selected from the group consisting of H, (cyclo)alkyl and aromatic hydrocarbon radicals having 1-9 carbon atoms and where R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 each form a ring which contains an oxygen atom as heteroatom, and 0.5-2 mol of the guanidine A) react per mole of acid, andb) pyromellitic acid and/or trimellitic acid, 0.25-2 mol of b) employed per mole of a).

Abstract: A reaction product formed between an epoxy resin, a phenol compound such as bisphenol or the like and an isocyanate compound contains oxazolidone rings and it is a polymeric epoxy resin. Herein is provided an epoxy resin composition comprising said reaction product and a curing agent.The said reaction product contains oxazolidone rings and epoxy groups, and is excellent in heat resistance and adhesive property. Further said reaction product is made into a polymer by the use of the bisphenol compound and at the same time it contains oxazolidone rings; it is excellent in toughness and water resistance. When a tetrabromobisphenol is used as the bisphenol compound, flame retardance is also good.Accordingly, the epoxy resin composition of the present invention is excellent in heat resistance, toughness, adhesive property and water resistance. When a brominated compound is used as the phenol compound, the epoxy resin composition of the invention exhibits an excellent flame retardance.

Abstract: Curable systems for the preparation of polymeric products in which the curable system comprises an epoxy resin or an isocyanate, wherein the system contains a condensation reaction product ofa) a polyamine having only one primary amino group and only one tertiary amino group, and a non-cyclic backbone containing from 1 to 18 carbon atoms; andb) at least one of urea, guanidine, guanylurea, thiourea, and a mono-N,N' alkyl substituted urea or thiourea having from 1 to 3 carbon atoms in the alkyl moieties.

Abstract: One component water-based coatings, inks, adhesives and sealants comprising enhanced molecular weight epoxy emulsions and inactivated amines.

Abstract: An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.