Material Contains A Nitrogen Compound Patents (Class 528/93)
  • Patent number: 5430112
    Abstract: Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.
    Type: Grant
    Filed: October 21, 1993
    Date of Patent: July 4, 1995
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hiroyuki Sakata, Tadahiko Yokota, Kenichi Mori, Kiyomiki Hirai, Koji Takeuchi, Toshihiko Hatajima
  • Patent number: 5427857
    Abstract: An improved aqueous cathodic electrocoating composition of an aqueous carrier having dispersed therein a film forming binder of (1) an epoxy resin-amine adduct and (2) a blocked polyisocyanate crosslinking agent; wherein the improvement is the use of a branched epoxy resin to form the adduct which is the reaction product of a polyhydric phenol and a branched epoxy macromonomer formed by the self condensation of an epoxy resin in the presence of a catalyst; the branched epoxy resin has an epoxy equivalent weight of about 700-2,000 and provides an electrocoating composition that has improved throw power and that forms coatings that have improved corrosion resistance in comparison to conventional electrocoating compositions formed from linear epoxy resins.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: June 27, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Stephen C. Peng
  • Patent number: 5420223
    Abstract: Described are several preferred acid salts and complexes of N,N-dimethylpyridine (DMAP) and 4-(4-methyl-1-piperidinyl)pyridine (MPP) which are useful as curing agents or as accelerators in preferred epoxy resin curing processes. Also described are particularly preferred processes for forming cured epoxy resin materials which are advantageously employed in large production line scale operations, and curable coating compositions.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: May 30, 1995
    Assignee: Reilly Industries, Inc.
    Inventor: John R. Johnson
  • Patent number: 5393805
    Abstract: An epoxy resin composition for insulating a coil which comprises at least one polyfunctional epoxy resin, at least one latent curing catalyst, at least one filler and at least one surfactant, wherein the ceiling is set to the acid anhydride content in the composition at 10% by weight based on the weight of the epoxy resin; and a coil molded out of said resin composition.
    Type: Grant
    Filed: June 19, 1991
    Date of Patent: February 28, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Toru Koyama, Hirokazu Takasaki, Hiroshi Suzuki, Akio Mukoh, Ikushi Kano, Toshiyuki Koide
  • Patent number: 5391687
    Abstract: Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.
    Type: Grant
    Filed: October 18, 1993
    Date of Patent: February 21, 1995
    Assignee: Hitachi Chemical Company Ltd.
    Inventors: Katsuji Shibata, Kazuhito Kobayashi, Nozomu Takano, Masami Arai, Ikuo Hoshi
  • Patent number: 5385990
    Abstract: A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210.degree. C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: January 31, 1995
    Assignee: Lord Corporation
    Inventors: Kirk J. Abbey, Stephen E. Howe, Beth C. Munoz
  • Patent number: 5364923
    Abstract: The present invention relates to an organopolysiloxane graft epoxy resin comprising a reaction product of (A) an epoxy resin having at least two epoxy groups in its molecule and (B) an amino modified polyorganosiloxane. The compositions of the present invention are characterized by superior surface lubricity after curing, superior release properties, and superior water repellency. The present invention also relates to a method of making an organopolysiloxane graft epoxy resin.
    Type: Grant
    Filed: September 28, 1993
    Date of Patent: November 15, 1994
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventor: Ryozo Mikami
  • Patent number: 5360886
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: November 1, 1994
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5359017
    Abstract: The present invention provides a cationically polymerizable organic material composition comprising a composition which contains a cationic polymerization catalyst(s) and a cationically polymerizable organic material(s) as essencial ingredients, and one or more onium salts having a nucleophilic pair anion represented by halogenide, alkyl sulfate or p-toluenesulfonate ions, or one or more iron aromatic compound salts represented by the following formula (I): ##STR1## The composition of the present invention is a cationically polymerizable organic material composition capable of being cured by irradiation of a radiation or by heat, and it also has excellent storage stability at room temperature in the dark and a long pot life.
    Type: Grant
    Filed: August 18, 1993
    Date of Patent: October 25, 1994
    Assignees: Nippon Kayaku Kabushiki Kaisha, Sanshin Chemical Industry Co., Ltd.
    Inventors: Fumio Hamazu, Tatsuya Koizumi, Minoru Yokoshima, Masaki Fujimoto, Takeshi Endoh
  • Patent number: 5357008
    Abstract: A latent curing agent for epoxy resins in the form of finely divided particles is disclosed, along with its method of preparation. An amine/epoxy adduct is formed in small particles with an encapsulating layer of polyfunctional epoxy or isocyanate on the surface by an emulsion precipitation method.
    Type: Grant
    Filed: January 14, 1993
    Date of Patent: October 18, 1994
    Assignee: W. R. Grace & Co.-Conn.
    Inventors: Hsi-Chuan Tsai, Souichi Muroi
  • Patent number: 5350826
    Abstract: An epoxy resin composition for forming prepregs is disclosed which includes an epoxy resin having at least two epoxy groups, a latent curing agent for the epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of the epoxy resin, and a reactive, viscosity-increasing agent in an amount of 0.2-3.0 parts by weight per 100 parts by weight of the epoxy resin. The epoxy resin composition has an initial viscosity n.sub.I(50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I(23) at 23.degree. C. of at least 10,000 cP.
    Type: Grant
    Filed: November 27, 1992
    Date of Patent: September 27, 1994
    Assignee: Tonen Corporation
    Inventors: Osamu Watanabe, Makoto Takezawa
  • Patent number: 5328966
    Abstract: Disclosed is a curable resin composition comprising (a) 100 parts by weight of a siloxane-amide block copolymer of formula (1): ##STR1## where R.sup.1 is a substituted or unsubstituted divalent hydrocarbon group; R.sup.2 may be the same or different and each is a substituted or unsubstituted monovalent hydrocarbon group; R.sup.3 is substituted or unsubstituted divalent aromatic hydrocarbon group; and m and an each are a number of 1 or more; (b) from 1 to 100 parts by weight of a crosslinking agent containing 2 or more epoxy groups in the molecule, and (c) up to 15 parts by weight of a curable catalyst. The composition can be cured at room temperature and in the absence of moisture in a closed system to give a cured product having high oil resistance and mechanical strength.
    Type: Grant
    Filed: July 17, 1989
    Date of Patent: July 12, 1994
    Assignee: Toshiba Silicone Co., Ltd.
    Inventor: Hisayuki Nagaoka
  • Patent number: 5319062
    Abstract: An improvement is proposed in the curing method of an epoxy resin by the admixture of a polyamide as a crosslinking curing agent, in which the curing agent as well as the epoxy resin composition with admixture of the curing agent has an outstandingly low viscosity as compared with the use of a conventional polyamide to facilitate handling. The improvement can be obtained by using, as the polyamide, a condensation reaction product between (A) an alkylene polyamine having 4 to 20 carbon atoms in a molecule and (B) a dimeric acid mixture containing at least 50% by weight of a non-cyclic dimeric acid or an alkyl ester thereof represented by the general formula ##STR1## in which each R is, independently from the other, a hydrogen atom or a C.sub.1-4 alkyl group obtained by the dimerization reaction of oleic acid or an alkyl ester thereof. When flexibility or bendability is desired of the cured epoxy resin, the condensation reaction is performed, in addition to the reactants (A) and (B), with admixture of a C.sub.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: June 7, 1994
    Assignee: Lion Corporation
    Inventors: Hitoshi Kigawa, Akira Ohishida
  • Patent number: 5310853
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: May 10, 1994
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5304612
    Abstract: A plural liquid pack type heat curable resin compound useful for producing a shaped resin article having an enhanced resistance to heat and chemicals, and excellent mechanical and electrical properties, comprises a first individual liquid component (A) comprising a polyisocyanate compound (a) and a second individual liquid component (B) comprising a glycidyl acrylate compound (b) having ##STR1## groups in which R' and R" respectively and independently represent a --H or --CH.sub.3, a cyclization catalyst (c) and optionally at least one of polyol compounds (e) and polyepoxy compounds (f), the first and/or second individual liquid components (A) and/or (B) comprising a radical curing catalyst (d).
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: April 19, 1994
    Assignee: Teijin Limited
    Inventors: Hiroyuki Umetani, Takeyoshi Yamada
  • Patent number: 5300618
    Abstract: A curable resorcinol-based epoxy resin is disclosed having the general structural formula (I) ##STR1## wherein at least one of R.sub.1, R.sub.2, or R.sub.3 is selected from the group consisting of (a) the general structural formula (II) ##STR2## wherein R.sub.4 is selected from the group consisting of hydrogen and an alkyl group having 1 to about 4 carbon atoms, and (b) an allyl group.
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: April 5, 1994
    Assignee: Indspec Chemical Corporation
    Inventor: Raj B. Durairaj
  • Patent number: 5300559
    Abstract: Polyamines endowed with chain extension activity for formulations such as polyureas and polyurethanes are disclosed, which have the general formula: ##STR1## wherein n is 0-1000; R.sub.1 =R.sub.2, and R.sub.1 and R.sub.2 are from the group --CH.sub.2 --CH.sub.2 --; --CH.sub.2 --C(CH.sub.3)H--; and --C(CH.sub.3)H--CH.sub.2 --; and R.sub.3 and R.sub.4 are each independently selected from the group consisting of H, --CH.sub.3, --CH.sub.2 CH.sub.3, --CH.sub.2 OH, and --CH.sub.2 --CH.sub.2 --OH.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: April 5, 1994
    Assignee: Hoechst Celanese Corporation
    Inventors: Michael T. Sheehan, James R. Sounik
  • Patent number: 5298576
    Abstract: A sizing agent for carbon fibers which comprises, as the indispensable ingredients, an epoxy resin having a viscosity of more than 1,000 P but up to 20,000 P at 50 .degree. C. and a urethane compound prepared from a polyol having an oxyalkylene unit with a polyisocyanate.
    Type: Grant
    Filed: February 24, 1992
    Date of Patent: March 29, 1994
    Assignees: Toray Industries, Inc., Sanyo Chemical Industries, Ltd.
    Inventors: Atsushi Sumida, Toyokazu Minakuchi, Motoi Itoh, Itsuki Taniguchi, Hiroshi Hasegawa, Manabu Saito
  • Patent number: 5296557
    Abstract: This invention relates to two-component curable hot-melt compositions comprising thermoplastic polyamide resins that are substantially free of piperazine-containing polyamines. In one preferred embodiment the polyamide resins are the reaction product of an acid component with an amine component, wherein the amine component consists essentially of about (i) 20 to 100 equivalent percent of one or more acyclic diamines selected from the group consisting of 2-methyl-1,5-pentanediamine, 1,3-pentanediamine, 1,3-propanediamine, 1,5-pentanediamine, 1,7-heptanediamine, 1,9-nonanediamine, methyl-1,9-nonanediamine, 1,2-propanediamine, and 2-methyl-1,2-diaminopropane, and (ii) about 0 to 80 equivalent percent of one or more polyamines selected from the group consisting of cyclic and acyclic polyamines other than those amines of (i). The compositions possess excellent heat resistance, flexibility, elasticity and resistance to solvents, including organic solvents and water.
    Type: Grant
    Filed: July 2, 1992
    Date of Patent: March 22, 1994
    Assignee: Union Camp Corporation
    Inventor: Charles R. Frihart
  • Patent number: 5294582
    Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstitued urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.
    Type: Grant
    Filed: June 14, 1993
    Date of Patent: March 15, 1994
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Tadafumi Miyazono, Koji Tabuchi
  • Patent number: 5288820
    Abstract: Disclosed are thermosetting or curable coating compositions comprising (1) a film forming polymeric material bearing acetoacetate residues, (2) an amino resin cross-linking or curing material, (3) an organic sulfonic acid cross-linking or curing catalyst, and (4) an epoxide compound selected from limonene monoepoxide, limonene diepoxide and a mixture thereof. The presence of the limonene epoxide inhibit discoloration of the coating composition upon prolonged storage, especially at elevated temperatures.
    Type: Grant
    Filed: March 1, 1993
    Date of Patent: February 22, 1994
    Assignee: Eastman Kodak Company
    Inventors: Franklin D. Rector, Jr., J. Stewart Witzeman
  • Patent number: 5284702
    Abstract: A low fuming phenolic resin prepreg comprising a fibrous base impregnated with 20 to 60% by weight of a resin composition comprising (a) 100 parts by weight of a resol phenolic resin, (b) from 1.5 to 15 parts by weight of polyacrylamide, (c) from 1.5 to 25 parts by weight of an epoxy resin, and (d) from 1.5 to 15 parts by weight of an inorganic filler, and the method for preparing the prepreg by impregnating a solution of (a), (b) and (c) having dispersed therein the filler into a fibrous base. The method for the prepreg comprising impregnating the fibrous base with the resin composition. The phenolic resin prepreg has low fuming properties as well as excellent self-adhesion.
    Type: Grant
    Filed: August 15, 1991
    Date of Patent: February 8, 1994
    Assignee: Toho Rayon Co., Ltd.
    Inventors: Yoshitaka Umemoto, Takayuki Tanaka, Yasuo Furukawa
  • Patent number: 5283299
    Abstract: Aqueous-based crosslinkable coating composition comprising an aqueous dispersion of at least one polymer having epoxy-reactive functional groups, at least one polyepoxide compound, and at least one metal chelate complex epoxy-cure catalyst.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: February 1, 1994
    Assignee: ICI Americas, Inc.
    Inventors: Valentino J. Tramontano, Milton Lapkin, Scott D. Rothenberger
  • Patent number: 5279870
    Abstract: The present invention is directed to a novel epoxy polymeric composition resulting from reacting (A) at least one compound containing an average of more than one epoxide group per molecule with (B) at least one curing agent for component (A). At least a portion of the curing agent (B) is at least a first curing agent compound which contains (a) an average of more than one active amine hydrogen atom per molecule and (b) an average of at least one aromatic ring which contains at least one pendant monovalent electron withdrawing group. The present invention also includes a process for preparing the above polymeric materials. The polymeric materials of the present invention also exhibit nonlinear optical capabilities when formed into an optically transparent medium with a noncentrosymmetric alignment of molecules. The nonlinear optical materials of the present invention are useful in electrooptic devices for use in communications and data-processing.
    Type: Grant
    Filed: March 2, 1992
    Date of Patent: January 18, 1994
    Assignee: The Dow Chemical Company
    Inventor: John J. Kester
  • Patent number: 5278260
    Abstract: A process for the preparation of epoxy resins having a specific reproducible content of .alpha.-glycol groups, which process comprises adding at least 0.0085 mol of glycidol or glycidol precursor compound per hydroxy-equivalent of a phenolic compound A which contains 2, 3 or 4 phenolic hydroxyl groups during the reaction of said phenolic compound A with an epihalohydrin which is unsubstituted or substituted in 2- or 3-position by C.sub.1 -C.sub.4 alkyl. The products may be used for surface protection.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: January 11, 1994
    Assignee: Ciba-Geigy Corporation
    Inventors: Werner Schaffner, Dimiter Hadjistamov
  • Patent number: 5278247
    Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstituted urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents, compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: January 11, 1994
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Tadafumi Miyazono, Koji Tabuchi
  • Patent number: 5273792
    Abstract: The present invention is directed to a novel epoxy polymeric composition resulting from reacting (A) at least one compound containing an average of more than one epoxide group per molecule with (B) at least one curing agent for component (A). At least a portion of the curing agent (B) is at least a first curing agent compound which contains (a) an average of more than one active amine hydrogen atom per molecule and (b) an average of at least one aromatic ring which contains at least one pendant monovalent electron withdrawing group. The present invention also includes a process for preparing the above polymeric materials. The polymeric materials of the present invention also exhibit nonlinear optical capabilities when formed into an optically transparent medium with a noncentrosymmetric alignment of molecules. The nonlinear optical materials of the present invention are useful in electrooptic devices for use in communications and data-processing.
    Type: Grant
    Filed: March 13, 1992
    Date of Patent: December 28, 1993
    Assignee: The Dow Chemical Company
    Inventor: John J. Kester
  • Patent number: 5273793
    Abstract: The present invention is directed to epoxy-based polymeric nonlinear optical materials in which a nonlinear optical active moiety or functionality forms the crosslink between polymer chains and a process for making the nonlinear optical (NLO) epoxy polymer including heating an epoxy resin and a curing agent such as a bi- or tri-functional aromatic amine containing an electron-withdrawing group, for example, diamino diphenylsulfone and poling the mixture under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical moieties in the polymer. The polymers have enhanced stability over polymers in which only one end of an NLO active moiety is attached to the polymer chain.
    Type: Grant
    Filed: August 19, 1992
    Date of Patent: December 28, 1993
    Assignee: The Dow Chemical Company
    Inventors: John J. Kester, Mark D. Newsham
  • Patent number: 5260414
    Abstract: This invention is directed to a thermoplastic polymer that is solid at room temperature and which expands on further polymerization, to form a crosslinked polymer, and to a process for preparing the polymer and the crosslinked polymer. In a preferred embodiment the polymer is prepared by polymerizing 10-90 but preferably 20-80 mole percent of a lower alkyl acrylic monomer containing a spirobislactone moiety, 10-90 but preferably 20-80 mole percent of a lower alkyl acrylic monomer containing an epoxide moiety, and 0.1-5 but preferably 0.5-1 mole percent of a lower alkyl acrylic monomer containing a functional moiety chosen from primary amino, secondary amino, mercaptan, and hydroxyl groups which can initiate crosslinking with the spirobislactone moiety. The crosslinked polymer is devoid of a spirobislactone carbonyl absorption band and is insoluble in conventional organic solvents.
    Type: Grant
    Filed: June 25, 1992
    Date of Patent: November 9, 1993
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Allison M. Sikes, Robert F. Brady, Jr.
  • Patent number: 5246984
    Abstract: This invention relates to a water compatible polyamine-epoxy adduct formed by the reaction of a polyamine with a mixture of a monoepoxide and polyepoxides, the monoepoxide being added in an amount to react with about 10 to 50% of the primary amino groups in said polyamine and the polyepoxides being added in an amount to react with from about 35 to 65% of the remaining primary amino groups.This invention also contemplates a water dispersible blend resin as an amine salt and comprises a water compatible polyamine-epoxy adduct and a resin compatible polyamine-epoxy adduct wherein the water compatible polyamine-epoxy adduct is as described above and the resin compatible polyamine-epoxy adduct is formed by reacting a polyamine with an aromatic monoepoxide, said aromatic monoepoxide reacted in an amount to provide from about 0.4 to 1 equivalents epoxide per primary amino group.
    Type: Grant
    Filed: June 3, 1992
    Date of Patent: September 21, 1993
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Stuart P. Darwen, Daniel A. Cornforth
  • Patent number: 5243014
    Abstract: The present invention relates to a homogeneous accelerator system for epoxy resins and to a method of curing such epoxy resins, wherein the system comprises (a) an inorganic salt which contains a nitrate ion, (b) aliphatic hydroxy compound selected from monohydric alcohols containing 1 to 10 carbon atoms in the molecule, polyhydric alcohols containing 2 to 10 carbon atoms and 2 to 4 hydroxy groups in the molecule, and poly (C.sub.2-5 alkylene) glycols and (c) an aminophenol.
    Type: Grant
    Filed: July 24, 1992
    Date of Patent: September 7, 1993
    Inventor: John A. Shomer
  • Patent number: 5235007
    Abstract: An epoxy resin composition comprises the cured reaction product of an epoxy base resin and a curing agent mixture. The curing agent mixture comprises a di-primary amine and a carbamate which is the reaction product of the amine and a cyclic carbonate. The amine has a molecular weight of 60 to 400. Ethylene carbonate and propylene carbonate are the preferred carbonates. The preferred curative comprises a 1:1 to 2:1 molar amine:carbamate mixture.
    Type: Grant
    Filed: October 3, 1991
    Date of Patent: August 10, 1993
    Assignee: Texaco Chemical Company
    Inventors: David C. Alexander, Wheeler C. Crawford, Howard P. Klein
  • Patent number: 5235008
    Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more rodlike mesogenic moieties. These adducts are useful as epoxy resin curing agents.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: August 10, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5221726
    Abstract: Improved hydrophilic materials, such as foams and films, are provided. These material find use in a wide variety of fluid absorbent products, especially those relating to the absorption of bodily fluids. The soft, absorbent, and resilient foams of this invention exhibit greater wet and dry mechanical strength when compared with those known in the art, as well as improved fluid wicking capacity and lower density. These improved properties are believed attributable to the incorporation into the foams of at least one polyfunctional aliphatic amine.The provided hydrophilic materials comprise the polymeric reaction product of a mixture which comprises at least one epoxy resin, at least one amine-terminated poly(alkylene oxide), and at least one polyfunctional aliphatic amine. Methods for preparing foams and other hydrophilic materials are also provided.
    Type: Grant
    Filed: February 3, 1992
    Date of Patent: June 22, 1993
    Assignee: McNeil-PPC, Inc.
    Inventors: Shmuel Dabi, Ram L. Kataria
  • Patent number: 5219956
    Abstract: There is disclosed a method for hardening a curable one-package epoxy resin system formed of an epoxy resin and a hardener, which comprises heating the curable one-package epoxy resin system to start the reaction between the epoxy resin and the hardener, and, before the reaction ratio reaches 50%, leaving the curable one-package epoxy resin system to stand at an ambient temperature.
    Type: Grant
    Filed: April 6, 1992
    Date of Patent: June 15, 1993
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventor: Masayuki Fukuoka
  • Patent number: 5214098
    Abstract: Hardenable mixtures comprising(a) an epoxide resin,(b) a latent epoxide resin hardener which starts to react only at a temperature of at least 80.degree. C. (measured by DSC at a heating rate of 10.degree. C./minute),(c) an amine having at least one amine hydrogen and(d) a thiol having at least one SH group, either the amine (c) having at least two hydrogen atoms bound to one or more nitrogen atoms or the thiol (d) having at least two SH groups, and the difference between the reaction maxima in the DSC diagram at a heating rate of 10.degree. C./minutes being at least 30.degree. C., are suitable for the production of crosslinked products, especially for the production of flexible prepregs having a non-critical B stage and a very good storability.
    Type: Grant
    Filed: November 16, 1990
    Date of Patent: May 25, 1993
    Assignee: Ciba-Geigy Corporation
    Inventors: Frans Setiabudi, Urs Gruber
  • Patent number: 5212261
    Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.
    Type: Grant
    Filed: December 17, 1990
    Date of Patent: May 18, 1993
    Assignee: Henkel Research Corporation
    Inventor: Thomas J. Stierman
  • Patent number: 5202407
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorus atom per molecule.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: April 13, 1993
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5198146
    Abstract: The present invention provides a homogeneous accelerator system, having improved efficacy for curing epoxy resins, which comprises (A) an inorganic salt which contains a nitrate ion, (B) an aliphatic hydroxy compound selected from monohydric alcohols containing 1 to 10 carbon atoms in the molecule, polyhydric alcohols containing 2 to 10 carbon atoms and 2 to 4 hydroxy groups in the molecule, and poly (c.sub.2-5 alkylene)glycols and (C) an aminophenol accelerator.
    Type: Grant
    Filed: July 24, 1991
    Date of Patent: March 30, 1993
    Inventor: John A. Shomer
  • Patent number: 5198524
    Abstract: An adhesive composition for adhering two substrates includes a mixture of acrylate and epoxy with a tri- or tetrafunctional ketimine as a curing agent. The adhesive composition provides a two-stage cure in which, in a first stage, the adhesive is moisture cured at ambient temperature to provide green strength. In a second stage, the adhesive is post-cured at elevated temperatures to provide a high strength bond. The ketimine is formed form the reaction of diisopropyl ketone and an amine.
    Type: Grant
    Filed: April 22, 1991
    Date of Patent: March 30, 1993
    Assignee: W.R. Grace & Co.-Conn.
    Inventors: Richard W. Bush, Eugene E. Carney
  • Patent number: 5171820
    Abstract: Polyesters having improved barrier to oxygen are normally solid, thermoplastic methylol polyesters having backbone repeating units containing pendent hydroxyl and methylol moieties and divalent organic moieties such as m-phenylene, p-phenylene, and isopropylidene diphenylene. Such polyesters are prepared by reacting diglycidyl esters of aromatic diacids such as diglycidyl terephthalate or diglycidyl ethers of dihydric phenols with diacids such as isophthalic acid.
    Type: Grant
    Filed: May 13, 1991
    Date of Patent: December 15, 1992
    Assignee: The Dow Chemical Company
    Inventors: Michael N. Mang, Jerry E. White
  • Patent number: 5169473
    Abstract: Products resulting from contacting (1) at least one compound selected from the group consisting of (a) at least one onium compound of the element nitrogen, phosphorus, sulfur or arsenic; (b) at least one amine compound; and (c) a mixture of any two or more of the (a) and (b) components; with (2) either (a) boric acid or (b) a mixture of boric acid and at least one acid having a weak nucleophilic anion are suitable catalysts for reacting vicinal epoxy-containing compounds with aromatic hydroxyl-containing compounds.
    Type: Grant
    Filed: May 21, 1990
    Date of Patent: December 8, 1992
    Assignee: The Dow Chemical Company
    Inventors: James L. Bertram, Louis L. Walker, Charlie Z. Hotz
  • Patent number: 5149768
    Abstract: Hydroxy-functional poly(ether sulfonamides) prepared by polymerizing an N,N'-dialkyl or N,N'-diaryldisulfonamide with a diepoxide in the presence of a suitable catalyst exhibit high barrier properties. These are suitable for use in the manufacture of articles such as rigid containers and flexible films exhibiting high barrier to oxygen.
    Type: Grant
    Filed: June 21, 1991
    Date of Patent: September 22, 1992
    Assignee: The Dow Chemical Company
    Inventors: Jerry E. White, Anthony P. Haag, R. Garth Pews
  • Patent number: 5130407
    Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).
    Type: Grant
    Filed: January 18, 1991
    Date of Patent: July 14, 1992
    Assignee: Industrial Technology Research Institute
    Inventors: Tzong-Ming Lee, Ker-Ming Chen
  • Patent number: 5128425
    Abstract: An epoxy resin composition for use in carbon fiber reinforced plastics which comprises the following components (A), (B), (C), and (D):(A) an epoxy resin of the bisphenol A diglycidyl ether type;(B) at least one compound selected from the group consisting of dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipyldihydrazide, azelayldihydrazide, and isophthalic acid dihydrazide;(C) a compound represented by general formula (I) ##STR1## wherein X.sub.1 and X.sub.
    Type: Grant
    Filed: June 19, 1990
    Date of Patent: July 7, 1992
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Yoshinobu Shiraishi, Hisashi Tada
  • Patent number: 5098965
    Abstract: A process is disclosed for preparing a low-chlorine epoxy resin which employs crystallization of the epoxy from solution in a finishing step of the preparation process. The process involves (a) contacting, in a basic reaction medium, epichlorohydrin and a biphenol to produce a reaction product mixture containing a diglycidyl ether of the biphenol; (b) dissolving the diglycidyl ether in an organic solvent and, optionally, contacting the diglycidyl ether with a dehydrochlorination agent; and (c) reducing the temperature of the organic solvent so as to effect crystallization of a low-chlorine fraction of the diglycidyl ether.
    Type: Grant
    Filed: January 31, 1991
    Date of Patent: March 24, 1992
    Assignee: Shell Oil Company
    Inventors: Ronald S. Bauer, Kailash C. B. Dangayach
  • Patent number: 5098964
    Abstract: A process is disclosed for preparing a low-chlorine tetrafunctional epoxy resin which employs crystallization of the epoxy resin from solution in a finishing step of the preparation process. The process involves (a) contacting, in a basic reaction medium, epichlorohydrin and a tetraphenol of ethane to produce a reaction product mixture containing a polyglycidyl ether of the tetraphenol of ethane; (b) dissolving the polyglycidyl ether in an organic solvent and, optionally, contacting the polyglycidyl ether with a dehydrochlorination agent; and (c) reducing the temperature of the organic solvent so as to effect crystallization of a low-chlorine fraction of the polyglycidyl ether.
    Type: Grant
    Filed: January 31, 1991
    Date of Patent: March 24, 1992
    Assignee: Shell Oil Company
    Inventors: Ronald S. Bauer, Kailash C. B. Dangayach
  • Patent number: 5087688
    Abstract: A fibrous composite structure impregnated with a solvent-free, curable epoxy resin matrix and comprising(a) a liquid epoxy resin or a liquid mixture of epoxy resins,(b) a liquid .beta.-hydroxyamine of formula I ##STR1## wherein X is phenyl or the radical R--O--CH.sub.2 --, wherein R is an alkyl group of 4 to 20 carbons or is phenyl or phenyl which is substituted by one or more C.sub.1 -C.sub.4 alkyl groups, a liquid mixture of .beta.-hydroxyamines of formula I or a liquid mixture of one more .beta.-hydroxyamines of formula I and of a primary monomaine different from formula I or of a primary or secondary diamine, and optionally(c) a catalytically curing tertiary amine,is virtually odourless, can be stored for several days at room temperature, and has good processing properties.
    Type: Grant
    Filed: June 20, 1990
    Date of Patent: February 11, 1992
    Assignee: Ciba-Geigy Corporation
    Inventors: Urs Gruber, Friedrich Stockinger, Elvio Manso
  • Patent number: 5084546
    Abstract: Thermosetting epoxy resin compositions having improved flame retardancy having combined therewith an effective amount of a dihydroxymethyl phosphine oxide having the general formula ##STR1## wherein R represents an alkyl group having from 1 to about 8 carbon atoms or --R'OH where R' represents an alkylene group having from 2 to about 8 carbon atoms, are disclosed.
    Type: Grant
    Filed: December 12, 1990
    Date of Patent: January 28, 1992
    Assignee: American Cyanamid Company
    Inventors: Robert G. Fischer, Jr., Chester J. Calbick
  • Patent number: 5070161
    Abstract: Benzyl pyridinium or ammonium salts of a non-nucleophilic anion are useful as a cationic polymerization initiator having a heat latency. A variety of resinous compositions containing this initiator is also disclosed.
    Type: Grant
    Filed: May 25, 1989
    Date of Patent: December 3, 1991
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Shinji Nakano, Hiroharu Ohsugi, Yasuhiko Nakae, Hisaki Tanabe, Ryozo Takagawa, Yoshio Eguchi, Koichi Tsutsui, Takeshi Endo