Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorus atom per molecule.

Abstract: A lightly-crosslinked thermosettable formulation comprises (a) a diepoxy resin, (b) an aromatic diamine of the structural formula ##STR1## in which each R is a divalent linking moiety selected from C.sub.1-6 alkylene, --S-- and --O--, and R' is ethyl, (c) an amine or phenolic crosslinking agent, and (d) 2,6-dialkyl aniline. The formulation exhibits relatively long outlife and can be used as the matrix resin in aerospace composites applications.

Abstract: A series of oligomeric adducts of diols and diepoxides are disclosed which are precursors of amine resins for use in electrodeposition coatings. The adducts are epoxide-alcohol addition products of a polyaromatic and/or a mono-aromatic diol and a polyaromatic bis-glycidyl ether, and/or a monoaromatic bis-glycidyl ether and/or an alkoxy arylene bis-glycidyl ether, thioether or amine. The coatings which include amine resin, cross linking agent, grind resin and pigment exhibit excellent corrosion resistance.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.

Abstract: This application describes a water dispersible polymeric vehicle comprising epoxy polymers having about 5 to 50 weight percent mesogens or a cross-linkable blend of an amine salt of a mesogenic carboxylic acid, cross-linker resin and an epoxy polymer, the mesogenic acid providing about 5 to 50 weight percent mesogenic groups to the blend.

Abstract: An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

Abstract: Polyethers having improved barrier to oxygen are normally solid, thermoplastic polyethers having backbone repeating units of m-phenylene, p-phenylene, carbonyldiphenylene and/or sulfonyldiphenyl and pendent hydroxyl moieties. Such polyethers are prepared by reacting diglycidyl ethers of dihydric aromatic compounds such as the diglycidyl ether of bisphenol A with resorcinol.

Abstract: An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.

Abstract: A phenolic novolak resin comprising a compound represented by the general formula [I]: ##STR1## wherein X is H or ##STR2## R is an alkyl group having 1 to 4 carbon atoms, and n is 1 to 10, particularly a phenolic novolak epoxy resin, and material, and a cured substance therefrom, and a process for producing the resin are disclosed. This resin is excellent in heat resistance and in reluctance to absorb water as compared with conventional phenolic resins, and useful in sealing electronic parts, molding, and laminating.

Abstract: Epoxy resin formulations having improved storage stability comprising epoxys selected from the group consisting of polyglcidyl ethers of polycyclic bridged hydroxy-substituted polyaromatic compounds and N,N,N',N'-tetraglycidyl-bis(4-amino-3-ethylphenyl) methane with from about 6 to about 150 pbw, per hundred parts by weight of the epoxy resin components, of a solid aromatic diamine hardener insoluble in said composition at room temperature in an amount effective to cure said epoxy resin.

Abstract: Hydroxy-functional poly(ether sulfonamides) prepared by polymerizing an N,N'-dialkyl or N,N'-diaryldisulfonamide with a diepoxide in the presence of a suitable catalyst exhibit high barrier properties. These are suitable for use in the manufacture of articles such as rigid containers and flexible films exhibiting high barrier to oxygen.

Abstract: Polyethers having improved barrier to oxygen are normally solid, thermoplastic polyethers having aromatic ether repeating units in their backbones and pendent hydroxyl moieties and pendent amido, N-substituted amido and/or hydroxyalkyl moieties. Such polyethers are prepared by reacting diglycidyl ethers of dihydric aromatic compounds such as diglycidyl ether of bisphenol A with dihydric phenols having pendent amido, N-substituted amido and/or hydroxyalkyl moieties such as 2,2-bis(4-hydroxyphenyl)acetamide and 3,5-dihydroxybenzamide.

Abstract: An epoxy resin having the formula: ##STR1## wherein R is a hydrogen atom or a methyl group, and n is an integer of from 0 to 15, and wherein the resin has an epoxy equivalent in the range of 320-345 g/eq.

Abstract: Hydroxy-functional poly(amide-ethers) are fabricated into articles such as rigid containers and flexible films exhibiting high barrier to oxygen transmission in both dry and moist environments. For example, a polymer prepared by reacting the diglycidyl ether of 4,4'-biphenol with N,N'-bis(m-hydroxyphenyl)-adipamide exhibits especially high barrier.

Abstract: A curable epoxy resin composition comprises (I) an epoxy resin and (II) a curing agent. It may comprise (III) another curing agent. It is preferable for it to comprise 25 to 95 wt.% of (I) and 5 to 45 wt.% of (II).1 an epoxy resin (I) represented by the general formula: ##STR1## wherein Z represents a group selected from among a hydrogen atom, a methyl group and an ethyl group, R represents a group selected from among a hydrogen atom and alkyl groups, and n represents a number of 0 to 1.6, and2 a curing agent comprising a polyamine reaction composition (II) obtained by reacting 1 mol of a phenol (II-1) having at least one unsubstituted reactive site in the aromatic nucleus with at least 1 mol of an aliphatic polyamine (II-2) and at least 1 mol of a carbonyl compound (II-3) having at least one carbonyl group in the molecule.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a substituted fluorene unit in the composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: The invention relates to naphthol-based epoxy resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15, naphthol aralkyl resins which are intermediates for said epoxy resins, a process for the preparation of said naphthol aralkyl resins, and epoxy resin compositions containing said naphthol-based epoxy resins which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.

Abstract: New epoxy polymers comprise lightly crosslinked linear molecules prepared from segments containing stiff units interconnected to form internally non-rotating, planar segments.

Abstract: This invention relates to ditertiary-butyl substituted bridged di(cyclohexylamines) where the tert-butyl substituent is alpha to the amine group and to polyepoxide formulations incorporating the di(cyclohexylamine). The formula of the diamine is: ##STR1## wherein R is tert-butyl. The di(tertiary butyl)methylene bridged cyclohexylamines have delayed reactivity when incorporated in epoxy resins and they also enhance physical properties in high resilience polyurethane foams.

Abstract: A liquid epoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.

Abstract: Epoxy resins are modified by reaction with an acidified polytertiary amine-containing compound. These modified epoxy resins when cured result in products having improved properties.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a 9,9-bis(hydroxphenyl)fluorene composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: Chain extended tougheners derived from the reaction of a propenylphenol, a di- or polyphenol, and an epoxy resin may be used to increase the toughness of bismaleimide resin systems.

Abstract: A series of oligomeric adducts of diols and diepoxides are disclosed which are precursors of amine resins for use in electrodeposition coatings. The adducts are epoxide-alcohol addition products of a polyaromatic and/or a mono-aromatic diol and a polyaromatic bis-glycidyl ether, and/or a monoaromatic bis-glycidyl ether and/or an alkoxy arylene bis-glycidyl ether, thioether or amine. The coatings which include amine resin, cross linking agent, grind resin and pigment exhibit excellent corrosion resistance.

Abstract: Dissymmetric new epoxy polymer materials have improved processability because they can be cured at lower temperatures.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a 9,9-bis(hydroxphenyl)fluorene composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a substituted fluorene unit in the composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: Polymeric tertiary arylamine compounds of the phenoxy resin type which find utility especially in electrophotographic imaging.

Abstract: A curable resin composition comprises an epoxy compound and a propargyl aromatic ether.

Abstract: Certain bis-anthrols and bis-naphthols and their diglycidyl ethers are novel and useful in the preparation of new polyether thermoplastic compositions.

Abstract: The invention relates to compounds of the formula I or II ##STR1## in which A is a radical ##STR2## R.sup.1 is hydrogen or methyl, R.sup.2 is the radical of an aliphatic, cycloaliphatic, aromatic or araliphatic diol after both of the hydroxyl groups have been removed, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 independently of one another are hydrogen, C.sub.1 -C.sub.6 alkyl, chlorine or bromine, R.sup.7 is a radical of the formula III, IV, V or VI ##STR3## R.sup.8, R.sup.10, R.sup.12 and R.sup.14 are hydrogen, C.sub.1 -C.sub.6 alkyl or phenyl, R.sup.9, R.sup.11, R.sup.13 and R.sup.15 are hydrogen or C.sub.1 -C.sub.6 alkyl and the average value of n (number average) is a number from 1 to 20, it being possible for the radicals R.sup.1 to R.sup.15, within a given molecule, to assume different meanings within the scope of the definitions given.These compounds or also the epoxidized intermediates of the formula X ##STR4## in which R.sup.1 to R.sup.3 are as defined above and R.sup.

Abstract: A liquid crystal copolyester having a blocked molecular chain terminal comprising a copolyester which exhibits anisotropy in a molten state and has a functional group located at the terminal of its molecular chain and is blocked with a low-molecular compound having at least one aromatic ring and a molecular weight of 350 or less.

Abstract: A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiber-reinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.

Abstract: Novel polymeric polyhydroxy polyethers containing moieties of 2,2-di(oxyphenyl)propane and a 1,6-diazaspiro[4.4] spirodilactam having oxyaryl substituents on each spiro ring nitrogen atom, which moieties are connected by 2-hydroxy-1,3-propylidene connecting groups, are characterized by relatively high glass transition temperatures.

Abstract: Novel linear polymeric polyhydroxy polyethers characterized by alternating moieties of (1) a 1,6-diaza [4.4] spirodilactam having oxyaryl-containing substituents on each ring nitrogen atom and (2) a 2-hydroxy-1,3-propylene connecting group, exhibit relatively high glass transition temperatures.

Abstract: A series of oligomeric adducts of diols and diepoxides are disclosed which are precursors of amine resins for use in electrodeposition coatings. The adducts are epoxide-alcohol addition products of a polyaromatic and/or a mono-aromatic diol and a polyaromatic bis-glycidyl ether, and/or a monoaromatic bis-glycidyl ether and/or an alkoxy arylene bis-glycidyl ether, thioether or amine. The coatings which include amine resin, cross linking agent, grind resin and pigment exhibit excellent corrosion resistance.

Abstract: A low viscosity product is obtained when an adduct is prepared by reacting (A) at least one polyglycidyl ether of: (1) a compound containing an average of more than one hydroxyl group per molecule and also at least one cycloalkadiene or oligomer of a cycloalkadiene per molecule or (2) a compound represented by the formula HO--(--A--Y--).sub.n --A--OH wherein each A is independently a divalent hydrocarbyl group having from about 2 to about 6 carbon atoms; each Y independently is --S-- or --S--S--; and n has a value from 1 to about 11; with (B) at least one aliphatic monocarboxylic acid containing from about 6 to about 18 carbon atoms per molecule; wherein components (A) and (B) are present in amounts which provide a ratio of carboxylic acid group per epoxide group of from about 0.01:1 to about 0.2:1.

Abstract: Co-advanced epoxy resins prepared by the reaction of polyethers of polyhydric phenols, diglycidyl ethers of di-secondary alcohols and dihydric phenols, said co-advanced resins being heat curable with suitable curing agents to afford cured coating compositions exhibiting a variety of excellent physical properties and performance characteristics.The diglycidyl ethers have the following formula: ##STR1## as defined in the specification.

Abstract: Novel epoxy resins are prepared by dehydrohalogenating the reaction product of an epihalohydrin and a hydroxyalkyl containing polysulfide.

Abstract: Thermoset products are prepared by polymerizing (A) at least one thermosettable compound which contains both a maleimide group and a cyanate group such as 3-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)phenyl cyanate and optionally (B) at least one of (1) at least one aromatic polycyanate such as bisphenol A dicyanate; (2) at least one polymaleimide such as N,N'-(methylenedi-p-phenylene)bismaleimide; (3) at least one material having an average of more than one vicinal epoxide group per molecule such as a diglycidyl ether of bisphenol A; (4) at least one polymerizable ethylenically unsaturated material such as styrene; or (5) a mixture of any two or more of components 1-4 in any combination.

Abstract: Thermoset products are prepared by polymerizing (A) at least one thermosettable compound which contains both a maleimide group and a cyanate group such as 3-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)phenyl cyanate and optionally (B) at least one of (1) at least one aromatic polycyanate such as bisphenol A dicyanate; (2) at least one polymaleimide such as N,N'-(methylenedi-p-phenylene)bismaleimide; (3) at least one material having an average of more than one vicinal epoxide group per molecule such as a diglycidyl ether of bisphenol A; (4) at least one polymerizable ethylenically unsaturated material such as styrene; or (5) a mixture of any two or more of components 1-4 in any combination.

Abstract: The invention relates to compounds of the formula I or II ##STR1## in which A is a radical ##STR2## R.sup.1 is hydrogen or methyl, R.sup.2 is the radical of an aliphatic, cycloaliphatic, aromatic or araliphatic diol after both of the hydroxyl groups have been removed, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 independently of one another are hydrogen, C.sub.1 -C.sub.6 alkyl, chlorine or bromine, R.sup.7 is a radical of the formula III, IV, V or VI ##STR3## R.sup.8, R.sup.10, R.sup.12 and R.sup.14 are hydrogen, C.sub.1 -C.sub.6 alkyl or phenyl, R.sup.9, R.sup.11, R.sup.13 and R.sup.15 are hydrogen or C.sub.1 -C.sub.6 alkyl and the average value of n (number average) is a number from 1 to 20, it being possible for the radicals R.sup.1 to R.sup.15, within a given molecule, to assume different meanings within the scope of the definitions given.These compounds or also the epoxidized intermediates of the formula X ##STR4## in which R.sup.1 to R.sup.3 are defined above and R.sup.

Abstract: The present invention relates to a new thermoplastic polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including solvent resistance and improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain diphenolic compounds with certain diepoxide compounds to form linear units which are lightly crosslinked through the resulting secondary hydroxyl groups. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.

Abstract: The present invention relates to a new polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain diphenolic compounds with certain diepoxide compounds to form linear units which are lightly crosslinked through the resulting secondary hydroxyl groups. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.

Abstract: An epoxy resin having the formula: ##STR1## wherein R is a hydrogen atom or a methyl group, and n is an integer of from 0 to 15, and wherein said resin has an epoxy equivalent in the range of 260-345 g/eq.

Abstract: Advanced epoxy resins prepared by the reaction of diglycidyl ethers of di-secondary alcohols and dihydric phenols, said advanced resins being heat curable with suitable curing agents to afford cured coating compositions exhibiting a variety of excellent physical properties and performance characteristics.

Abstract: An epoxy resin curing composition comprising a novel curing agent which is obtained by the amidation with elimination of alcohol between an adduct of a carboxyl-containing acrylonitrile-butadiene copolymer with an epoxidized fatty acid ester and an amide-forming nitrogenous compound. This composition exhibits improved adhesion involving peel strength to plastics, rubbers or flexible vinyl chloride resins and is excellent in mechanical strength and resistance to water and alkali and particularly to acid.

Abstract: Laminates are prepared for reinforced expoxy resin compositions comprising (A) a reinforcing material such as fiberglass, (B) one or more epoxy resins such as a hydrocarbon-phenol eposy resin and (C) one or more epoxy resin curing agents such as a hydrocarbon-phenol resin or phenol-formaldehyde novolac resin. These laminates are particularly suitable for use in electrical applications such as the manufacture of printed circuit boards.

Abstract: Diglycidyl ethers of ortho-substituted-4-hydroxyphenylfluorenes, curable compositions comprising the diglycidyl ethers, and cured resins thereof have a high glass transition and an improved modulus of elasticity. The diglycidyl ethers of the invention for use in the curable composition of the invention can be mixtures obtained by the reaction of epihalohydrin with mixtures of fluorenebisphenols obtained by the reaction of one mole of one or more fluorenones with two or more moles or mixtures of two or more ortho-substituted phenols. The compositions are useful in molding and coating applications and in composite articles where the operating temperature of the article or material is elevated.

Abstract: A composition comprising a polymeric resin derived from (A) at least one compound containing an average of more than one 1-oxa-3-aza-tetraline group per molecule with (B) at least one cycloaliphatic epoxide containing at least two epoxide groups, at least one of said epoxide groups being part of said ring, the mole ratio of (b) to (a) .Iadd.epoxide groups to 1-oxa-3-aza-tetraline groups .Iaddend.being in the range of about 0.2 to about 2.