Abstract: A water cooler kit is provided for use with an evaporative cooler of a type comprising at least one cooling pad, a water reservoir, a water inlet to supply water to the reservoir from a water supply at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit. The water cooler kit comprises a cooling plate disposed in the reservoir, a heat dissipating structure disposed outside of the evaporative cooler, and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure to transfer heat from the cooling plate to the heat dissipating structure so that heat is extracted from water in the reservoir and dissipated outside the evaporative cooler.

Abstract: Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.

Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

Abstract: Cooling apparatus including a thermoelectric device (1618) either forming at least part of at least one body (1614, 1616) to be cooled, or being positioned adjacent, in use, at least one body to be cooled, wherein the at least one body contains coolant.

Abstract: A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being provided to those cores in a more active state and less cooling provided to those cores in a less active state.

Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter.

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

Abstract: A flexible cooling loop for providing a thermal path between a heat source and a heat sink includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality if mechanically flexible tubing sections configured for connecting the mechanically rigid tubing sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: A thermoelectric device comprising an elongated panel, formed of a thermally insulating material, and having a plurality of thermoelectric elements comprising compacted conductors inside the insulating material and expanded conductors outside the insulating material is combined with other layers for leakage current interception, bodily fluid absorption, and pillars that preserve pressure re-distribution. The thermoelectric device may be integrated into a variety of surfaces or enclosures needing heating or cooling and manufactured using pre-existing automated equipment.

Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

Abstract: The present invention relates to a photovoltaic module with a cooling device and a method of manufacturing the cooling device. The photovoltaic module includes a photovoltaic module, a cooling chamber and a heat sink. The photovoltaic module includes solar cells connected to each other in series and in parallel. The cooling chamber includes an upper plate, a lower plate and a working fluid. The upper plate is attached to the photovoltaic module and has a flange formed on the edge thereof. The lower plate has a flange formed on the edge thereof. The flanges of the upper and lower plates are joined to each other so that an inner space is defined between the upper and lower plates. The working fluid is injected into the inner space so that a cooling operation can be carried out by means of boiling and condensing. The heat sink is in surface contact with the lower plate of the cooling chamber.

Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

Abstract: Described herein are devices and methods for thawing frozen biological products efficiently without harming the products.

Abstract: Technologies are generally described herein for multistage thermal flow devices and methods effective to transfer thermal energy between a heat source and a heat sink having different surface areas and thermal energy flow characteristics. Some example multistage thermal flow devices may include multiple stages of heat transfer pumps utilizing electrocaloric effect material with thermal collection devices between stages. The heat flux associated with heat transfer pumps of consecutive stages may increase to concentrate the thermal energy through the multistage thermal flow device or may decrease to diffuse the thermal energy through the multistage thermal flow device.

Abstract: The application relates to thermoelectric temperature control units, for example for controlling the temperature of an energy storage device in a motor vehicle. An exemplary embodiment comprises a Peltier element, having a first and a second surface, wherein the second surface is substantially adjacent or opposite to the first. The first surface is connected in a thermally conductive manner to a first and/or second flow duct, through which a fluid can flow. The second surface is connected in a thermally conductive manner to a heat-producing element, wherein the first flow duct is in fluid communication at one of the ends thereof with a first header, and the second flow duct is in fluid communication at one of the ends thereof with a second header, and the first flow duct and the second flow duct are in fluid communication at the respective second ends thereof with a common reversing header.

Abstract: An air conditioning apparatus for a vehicle may include a Peltier module and a cooling core installed in an HVAC (heating ventilating and air conditioning) unit, the HVAC unit being provided with a blower, a nitrogen tank storing liquid nitrogen therein, a nitrogen line passing through the cooling core, wherein a first end of the nitrogen line may be connected to the nitrogen tank, and a second end of the nitrogen line fluid-communicates with an outside, a nitrogen evaporator provided on the nitrogen line, the nitrogen evaporator evaporating the liquid nitrogen into nitrogen gas, and a main cooling water line circulating water through the nitrogen evaporator, the Peltier module and a water pump in sequence.

Abstract: In some embodiments, a cooling system for an induction charger includes a thermal conditioning module in fluid communication with an induction charging assembly, which includes a dock and an induction charging module. The dock can be configured to receive a portable electronic device, such as a cell phone, that is configured to accept inductive charging from the induction charging module. The thermal conditioning module can include a fan or other fluid encouraging assembly, ducting, and a thermoelectric device (e.g., a Peltier device). A fluid, such as air, can flow from the fan and across and/or through the thermoelectric device, thereby conditioning the fluid. The conditioned fluid can be provided to the dock to at least partially offset the heat generated by the inductive charging and/or the portable electronic device.

Abstract: An electrode member for generating plasma includes an electrode plate and a cooling unit having a plurality of thermoelectric modules that are thermally in contact with the electrode plate. The thermoelectric modules may regulate the temperature of the electrode plate based on the Peltier effect.

Abstract: A method of removing heat from a heat generating component. A geometrically reoriented heat pipe is formed including an evaporator section and a condenser section geometrically reoriented relative to the evaporator section. The evaporator section is positioned proximate to the heat generating component. A thermoelectric element is positioned between the at least one heat generating component and the evaporator section. Heat is transferred, via the thermoelectric element, from the heat generating component to a heat transfer fluid contained within the evaporator section. The heated fluid migrates to the condenser section. The fluid is cooled within the condenser section and the fluid is returned to the evaporator section.

Abstract: A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.

Abstract: Disclosed embodiments include systems for heating and cooling the interior climate of a vehicle. In some embodiments, the system comprises a conduit having a first fluid channel, a second fluid channel, a fluid diversion channel configured to divert fluid flow between the first and second channels, and a thermoelectric device operatively connected to the fluid conduit. In certain embodiments, the thermoelectric device comprises a plurality of thermal zones. In some embodiments, the plurality of thermal zones comprises a first thermal zone connected to a first electric circuit switchable between a first polarity and a second polarity and a second thermal zone connected to a second electric circuit switchable between the first polarity and the second polarity independent of the polarity of the first electric circuit.

Abstract: Heat accumulated inside the human body can affect performance and may also lead to heat stroke, hyperthermia and even death. A method and system for performance enhancing body cooling with the use of thermoelectric cooling plate for performance enhancement and prevention of heat stress/heat stroke/hyperthermia is described. The system targets the glabrous skins in the palm for optimal heat extraction and the portable device allows continuous cooling for longer duration. A heavy-duty version of the device using multiple thermoelectric cooling plates for cooling of body under extreme heat conditions such as inside a tank or armored personnel vehicle (APV) for military applications is also described.

Abstract: A heat exchanger is provided for an exhaust system of an internal combustion engine. The exchanger has a thermoelectric generator which comprises a hot side and a cold side with a heating pipe arranged on one hot side of the thermoelectric generator, and with a cooling pipe arranged on one cold side of the thermoelectric generator. The thermoelectric generator the heating pipe, and the cooling pipe are stacked in a stack direction on top of one another and form a pipe stack, in which the respective thermoelectric generator, heating pipe and cold pipe extend parallel to one another in a longitudinal direction of the pipe stack. An increased energetic efficiency is obtained. A heat transfer structure has a heat transfer capability favouring a heat transfer between the respective pipe and the respective media conducted therein.

Abstract: A projector is disclosed. The present invention relates to a projector that is able to radiate heat generated in a display device converting a video signal into a projected image.

Abstract: Apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; and a heat sink coupled to the one or more thermoelectric devices.

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract: The present disclosure provides a thermoelectric cooling system with improved performance. The thermoelectric cooling system comprises a thermoelectric cooling unit. The thermoelectric cooling unit comprises a thermoelectric device, heat pipes, condenser fins, a cold sink and a cold fan. The thermoelectric cooling unit can be easily assembled with a chamber which contains a fluid to be cooled. The thermoelectric cooling system comprises screws to attach the thermoelectric cooling unit to the chamber, and sealant rings to prevent heat leakage in the thermoelectric cooling system. Further, the present disclosure provides a thermoelectric cooling system with a freezer part and a refrigerator part. The freezer part encloses the cold sink and the cold fan. The freezer part is cooled by the thermoelectric device, and the refrigerator part is cooled by walls of the freezer part. Further, the present disclosure provides a thermoelectric cooling system for use as a wine cooler.

Abstract: Methods and apparatus for recovery of precursor vapor from a gas and precursor vapor mixture used in a deposition process. The gas and precursor vapor mixture is passed through a multitude of heat transfer surfaces in a heat conducting housing causing the precursor vapor to condense. The precursor vapor in liquid form is then collected after condensation.

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract: Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

Abstract: There is provided an image display device including: a laser element that generates light for projecting and displaying an image on a display screen; a Peltier device unit that cools the laser element; a detecting unit that detects a temperature of the laser element; and a control unit that controls driving of the Peltier device unit so that a temperature detected by the detecting unit becomes a target temperature, wherein the control unit controls driving of the laser element to reduce a light output of the laser element when a driving rate of the Peltier device unit exceeds a threshold that indicates that the driving rate approaches a maximum value.

Abstract: The disclosed embodiments describe a cost and energy efficient combined lighting and air conditioning fixture. This combined system may employ a flexible distributed air handler that can employ distributed heat exchangers to a liquid loop. The described system may be comprised of distributed dampers, heat exchangers, and air handlers that are controlled from a controller integrated into a ceiling, floor, or wall unit. The controller may also be part of a combined LED lighting drop-in ceiling fixture.

Abstract: The present disclosure relates to a user-installable room cooling system. This system is both energy and cost efficient and utilizes distributed heat exchangers to a liquid loop. An exemplary embodiment may be comprised of a heat to air transfer plate, a heat pump, a block of heat conductive material, a pump, a pipe interface, a temperature control system, an outside radiator or evaporation cooler, and will be filled at the highest point.

Abstract: A method for managing thermal energy in an internal combustion engine including an exhaust gas recirculation system and an engine cooling system includes recirculating a portion of an exhaust gas through the exhaust gas recirculation system that is in thermal communication with a first side of a thermoelectric device, flowing an engine coolant into thermal communication with a second side of a thermoelectric device, and controlling electric current between an electrical energy storage device and the thermoelectric device to transfer thermal energy between the recirculated exhaust gas and the engine coolant.

Abstract: A current lead apparatus includes a pipe surrounding a current lead connected between a low temperature side terminal and an ambient side terminal. The refrigerant gas discharged at the ambient temperature side is circulated via a plurality of stages of freezers to a low temperature side of the pipe.

Abstract: A position measurement device includes a light source, a reflector coupled to a test object, a light detector between the light source and reflector, and a controller to measure a position of the test object based on an interference pattern generated by a reference beam and a measurement beam output from the light detector. The controller also controls a temperature of the light detector by generating signals for a heat exchanger having a Peltier region coupled to the light detector. The signals including a first signal to cause the heat exchanger to remove heat from the light receiver and a second signal to cause the heat exchanger to apply heat to the light receiver.

Abstract: A method for reducing airborne contamination within a home includes installing an air-pressure control system within a window of the home, and drawing air from outside the home through the system inlet and an airflow path through the system. As it passes through the airflow path, a germicidal radiation chamber with a UV light source sterilizes the air. Additionally, filter(s) may clean the drawn air by removing particulates from the air as it passes through the filter. The method may then introduce the sterilized/cleaned air into the home through the system outlet. The sterilized/cleaned air may displace an equal volume of contaminated air within the home.

Abstract: A device (301) is provided which includes a Peltier device (303); a heat sink (305) in thermal contact with the Peltier device; and a synthetic jet ejector (307, 309) which directs a synthetic jet (319, 321) onto or adjacent to a surface of the heat sink.

Abstract: The invention relates to a vacuum container for an adsorption refrigeration machine, said vacuum container being connected to a condenser unit of the adsorption refrigeration machine via connection means that permit the passage of vapor. The container has a discharge arrangement and at least one cooling element. The connection means are provided with at least one component for shutting off or regulating the flow of fluids.

Abstract: A unit for an ejector-type refrigeration cycle includes an ejector, first and second evaporators connected in parallel to a downstream side of the ejector and configured to evaporate the refrigerant discharged from the outlet of the ejector, and a refrigerant distributor configured to distribute the refrigerant discharged from an outlet of the ejector to a side of the first evaporator and a side of the second evaporator. The ejector draws refrigerant from a refrigerant suction port by a high-velocity refrigerant flow jetted from a nozzle portion, and mixes the refrigerant injected from the nozzle portion with the refrigerant drawn from the refrigerant suction port so as to discharge the mixed refrigerant from the outlet of the ejector. The ejector and the refrigerant distributor are connected to each other such that the refrigerant discharged from the outlet of the ejector directly flows into the refrigerant distributor.

Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Abstract: A backup cooling storage system comprising at least one cooling and storage unit configured to cool a liquid supply using a quantity of cooled material when a main chiller of the liquid supply is not operational, and at least one chilling element configured to generate the quantity of cooled material for the at least one cooling and storage unit when the main chiller of the liquid supply is operational. Additional embodiments and methods are further disclosed.

Abstract: In one embodiment, a system includes a first thermoelectric assembly that includes a first set of thermoelectric elements and a first plate and a second plate are coupled to the first set of thermoelectric elements. A second thermoelectric assembly is spaced apart from the first thermoelectric assembly. It includes a second set of thermoelectric elements and a third plate and a fourth plate are coupled to the second set of thermoelectric elements. A first set of fins is coupled to the first plate and a second set of fins is coupled to the third plate. A third set of fins is coupled to the second plate and a fourth set of fins is coupled to the fourth plate. A fan is coupled to the first and second sets of fins and is substantially centered with respect to a gap between the first and second sets of fins.

Abstract: Apparatus (10) for extracting water from the atmosphere and supplying the extracted water to a domestic water supply to the dwelling, said apparatus being dimensioned and arranged relative to an access opening that leads from the dwelling into a roof space to be small enough to pass through the opening and be located in the roof space, said apparatus further comprising an air intake (12) located to receive humid air from outside the dwelling, a water extractor having a fan (13) operable to draw air in through the air intake (12) and pass the air over a cooling means for condensing water out of the air and means—for collecting the condensed water and supplying the collected water to the water supply tank (30) of the dwelling to replenish water in the tank.

Abstract: A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising a temperature-forcing head, including a face configured to be put in thermal contact with the device and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser and a metering device; wherein the subsystem is configured to circulate a bi-phase refrigerant, in closed loop fashion, through the evaporator so that, during circulation, the refrigerant is maintained at high pressure between the compressor and the metering device and at low pressure while flowing through the evaporator. More specifically, in the disclosed system the refrigerant, while flowing through the evaporator at a low pressure, is operative to dissipate heat therefrom by evaporation and the evaporator or any part thereof is formed as a heat exchanger.

Abstract: A thermal flux steering device and method for steering thermal flux into a concentrated area is provided. The thermal flux steering device includes a matrix impregnated with a plurality of thermally conductive inclusions. The thermally conductive inclusions are angled so as to steer thermal flux into a concentrated area such as a thermal energy sink in communication with the matrix. The thermally conductive inclusions may be filler fibers or thermally conductive particles impregnated within the matrix. Orientation of the thermally conductive inclusions may be determined by detecting the thermal flux of the thermal energy source, the thermodynamic properties of the matrix and the thermally conductive inclusions, and the location of the flux concentration area.

Abstract: The invention relates to a device for converting thermal energy into electrical energy with at least one thermocouple, which thermocouple comprises two thermoelectric branches (A, B) electrically connected in series, and the thermocouple has a first passage surface (F1) and a second passage surface (F) for the heat flow (Q) and for the electrical current (7, 7?). In this connection, the value of the first passage surface (F1) is less than 5% of the value of the second passage surface (F).