Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

Abstract: An apparatus and related process for producing large glass preforms with minimal clad to-core waveguide distortion from a glass body having a weight, an outer surface, core rods, and a cladding surrounding and separated from the core rods by a gap. The apparatus includes collars affixed to the top and bottom of the cladding; a spacer upon which the core rods rest; a first unit holding and supporting both the bottom collar and the spacer; a second unit holding and supporting the top collar; and a frame defining a heating zone having a heating element to heat the glass body. The weight of the glass body above and below the molten glass in the heating zone is supported by the first and second units without contacting the outer surface of the glass body.

Abstract: A microelectromechanical (MEMS) system may comprise multiple sensors within cavities of the MEMS system. The operation of different sensors requires different pressures within the respective cavities. A first cavity may be sealed at a first pressure. A through-hole may be etched into a cap layer of the MEMS system to introduce gas into a second cavity such that the cavity has a desired pressure. The cavity may then be sealed by a MEMS valve to maintain the desired pressure in the second cavity.

Abstract: A system for positioning an optical preform in a furnace is provided that includes an upper muffle and a downfeed handle assembly with a tube defining a first end and a second end, the second end extending into the upper muffle. A handle is disposed within the tube. A second end of the handle extends into the upper muffle and a seal assembly is positioned around both the tube and the handle. The first end of the handle extends through the seal assembly and a drive assembly is coupled with the downfeed handle.

Abstract: Methods and systems for localized strengthening of features of a component formed from a sapphire material include a combination of holistic heating and localized surface heating. In one example, the localized heating may occur via laser thermal, flame polishing, hot wire heating, plasma etching, or chemical treatment. By combining the localized surface heating with holistic heating, near-melt or melt processing in a localized area can be achieved while avoiding overheating of well-polished areas, and therefore minimizing defects that would otherwise be caused by excessive heating. This may be used for strengthening features of components formed from sapphire material that are difficult to polish, such as non-planar features.

Abstract: A low cost method for producing a mechanically and thermally stable composite body containing a first layer of a material with a high silicic acid content and an additional component connected to a second layer of a material with a high silicic acid content and an additional component in a second concentration differing from the first concentration is provided. The method involves (a) preparing a first slurry layer having a free surface using a first shirt mass containing SiO2 particles and an additional component dispersed in a first dispersing agent, (b) providing a second slurry mass containing SiO2 particles and an additional component in a second concentration dispersed in a second dispersing agent, (c) forming a composite-body intermediate product by applying the second slurry mass to the free surface of the first slurry layer, and (d) heating the composite-body intermediate product while forming the composite body.

Abstract: A semiconductor structure includes a first device, a second device, a first hole, a second hole, and a sealing object. The second device is contacted to the first device, wherein a chamber is formed between the first device and the second device. The first hole is disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference. The second hole is disposed in the second device and aligned to the first hole. The sealing object seals the second hole. The first end links with the chamber, and the first circumference is different from the second circumference.

Abstract: An open roof construction for a vehicle having an opening in its fixed roof comprises a stationary part and at least a panel supported by the stationary part and configured to close the opening in the fixed roof. The panel include two substantially parallel sheets connected and sealed to each other at least along their circumference in order to create a space there between containing gas. The space communicates with a pressure equalizing device equalizing the pressure in the space with the ambient pressure. The pressure equalizing device can be an open or closed system.

Abstract: Disclosed are a vacuum glass panel and a manufacturing method of the same. The vacuum glass panel according to the present invention includes a first glass plate, a second glass plate facing the first glass plate with a vacuum space therebetween, an edge of the second glass plate being in contact with the first glass plate, and a plurality of spacers disposed between the first glass plate and the second glass plates to separate the first glass plate and the second glass plate from each other. The plurality of spacers are formed of a glass including alumina (Al2O3) particles and silica (SiO2) particles.

Abstract: A measuring arrangement with a ceramic measuring cell and a metal process connection for connecting the measuring cell to a measuring environment, with the measuring cell being fastened in the process connection without gaskets and in a diffusion-resistant fashion, with the measuring cell being fastened at a ceramic ring, which is arranged at a metal ring for fastening in the process connection.

Abstract: A cover glass element can extend to the edges of an electronic device while maintaining the optical flatness and thickness needed for the cover glass. A first glass sheet with the desired thickness and flatness can be thermally bonded to a second glass sheet machined to include an opening to be received by the edges of the electronic device. The resulting three-dimensional cover element forms a uni-body frame that is significantly stiffer than a single sheet of glass, and the larger surface area of the edge provides for enhances pressure distribution, particularly after chemical strengthening, thus enhancing the durability of the electronic device. Further, the thermal bonding process uses lower temperatures than processes such as slumping or pressing, which could potentially affect the flatness and optical clarity of the original sheet glass.

Abstract: An inexpensive pulse laser device that outputs a laser pulse capable of welding a transparent member is provided. There is provided a pulse laser device including: a laser light source 1 that outputs a repeated pulse laser; a demultiplexer 2 that demultiplexes the pulse laser output from the laser light source 1 into two pulse lasers; first pulse train generation means 3 that generates a first pulse train by changing at least a peak power and/or a pulse width of one of the two pulse lasers demultiplexed by the demultiplexer 2; and a multiplexer 4 that multiplexes the other of the two pulse lasers demultiplexed by the demultiplexer 2 and the first pulse train generated by the first pulse train generation means 3, in which a pulse laser in which a low-peak power pulse laser is superimposed on a high-peak power ultra-short pulse laser is output.

Abstract: In a method for manufacturing a glass sealed body, a paste including powdered glass and a binder is discharged from an outlet whose shape is a closed curve to form a partition whose shape is a closed curve over a first glass substrate; the partition is heated so that the binder is volatilized and the powdered glass is fused to be a frit glass; and the frit glass and a second glass substrate are heated while disposing in close contact with each other, so that the frit glass and the second glass substrate are welded together to form a closed space by the frit glass, the first glass substrate, and the second glass substrate. A light-emitting element is sealed with the glass sealed body, so that the sealing is hardly broken even when impact or external force is applied.

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract: To use a monolithic silica body in chromatography with a HPLC column or a GC column and to simplify the use thereof as a separation medium, it is intended to provide a method of cladding a main body of a monolithic adsorbent or separating agent with glass so as to protect the outer surface, and to provide a separation medium prepared by the method. To this end, a monolithic silica body alone is formed by molding, and the molding is coated with a glass body; and then the glass body and the monolithic silica body are fused and integrated at the melting temperature of the glass body at an appropriate pressure. The surface of the resulting monolithic silica body clad with glass is strongly protected by the glass, and the homogeneity of the interior of the monolithic silica body is maintained, and thus uniform flow of a sample solution ensures analytical accuracy.

Abstract: A laser resonator arrangement includes multiple glass optical components, and a glass carrier plate, in which at least one of the optical components is secured to the carrier plate by at least one laser welding connection or is secured to the carrier plate through an intermediate glass element, in which the intermediate glass element is connected to both the at least one optical component and to the carrier plate by at least one laser welding connection.

Abstract: A surface treatment for a glass substrate includes at least following steps: the glass substrate is provided; a fastening device is provided, the fastening device defines a receiving groove corresponding to the glass substrate; the glass substrate is positioned in the receiving groove, and the fastening device is heated to achieve a softened glass substrate; a insert is provided; and the insert is hot pressed and inserted to the softened glass substrate. An article manufactured by the surface treatment method is also disclosed.

Abstract: A glass layer 3 is disposed between a glass member 4 and a thermal conductor 7 along a region to be fused. The glass layer 3 is formed by removing an organic solvent and a binder from the paste layer while using the thermal conductor 7 as a hotplate. Then, a laser beam L1 is emitted while using the thermal conductor 7 as a heatsink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. Thereafter, another glass member is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.

Abstract: When fixing a glass layer 3 to a glass member 4, a region to be fused R from an irradiation initiation position A in the region to be fused R to the irradiation initiation position A is irradiated therealong with a laser beam L1, and successively an unstable region extending from the irradiation initiation position A in the region to be fused R to a stable region initiation position B is therealong irradiated with the laser beam L1 again, so as to remelt the glass layer 3 in the unstable region, turn the unstable region into a stable region, and then fix the glass layer 3 to the glass member 4. Thereafter, a laser beam L2 fuses glass members 4, 5 together through the glass layer 3 having the whole region to be fused R turned into the stable region, so as to yield a glass fusing structure 1.

Abstract: Disclosed herein is an infrared emitter welder for fusion welding pipe joints. In one representative embodiment, the welder comprises a fuel tank adapted to contain a fuel under pressure and a heating element in fluid communication with the fuel tank. The heating element includes a pair of porous ceramic plates, each having opposing first and second surfaces, wherein the first surfaces of the ceramic plates are joined together, and wherein at least one of the first surfaces includes fuel distribution channels formed therein. A catalytic material, such as platinum, is disposed on at least one of the second surfaces and is operative to ignite the fuel as it reaches the second surface. A supply conduit interconnects the fuel tank and heating element.

Abstract: An apparatus and method for heat treating a plurality of glass substrates. The glass substrates are supported on support platform and housed in a heat treating furnace. The substrates are supported in a substantially vertical orientation by restraining pins extending through walls of the furnace, and are separated from each other by frame-shaped spacing members. The spacing members reduce convection currents between the substrates and reduce or eliminate the post-heat treating distortion of each glass substrate to less than 100 ?m over the entire surface of the substrate.

Abstract: The invention relates to a composite material made of a layer of inorganic, non-metal material and a sandwich element, and to a method for producing said composite material.

Abstract: An optical fiber which, at an optical fiber connecting end having a plurality of voids around the periphery of a core, has a light-permeable substance, such as a resin or glass whose refractive index is lower than that of quartz type substances, filled in the voids adjacent to the connecting end. An optical fiber connecting section where an optical fiber having a plurality of voids in a clad around the periphery of a core is connected to another optical fiber, wherein the optical fiber is connected end-to-end to aforesaid another optical fiber through a refractive index matching agent whose refractive index at the minimum temperature in actual use is lower than that of the core.

Abstract: When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

Abstract: A cover glass for an electronic display comprises a plurality of layers of sapphire material, each of the layers having a substantially single crystal plane orientation, with adjacent layers having different substantially single crystal plane orientations. One or more interface layers are defined between adjacent layers of the sapphire material, with the adjacent layers of sapphire material bonded together at the one or more interface layers. A display window is defined in the cover glass, and configured for viewing a viewable area of the electronic display through the plurality of layers of the sapphire material bonded together at the one or more interface layers.

Abstract: To manufacture a low-temperature co-fired ceramic/high-temperature co-fired ceramic laminated substrate by laminating a porous layer on a dense layer. The porous layer includes a first glass layer, a porous ceramic layer, and a second glass layer laminated on the dense layer in the stated order. The porous ceramic layer contains a glass component and ceramic filler, and has a porosity of 10% or more and 40% or less. A concentration of the glass component at least one of surfaces of the porous ceramic layer in a thickness direction thereof is higher than an average concentration of the glass component in the porous ceramic layer. The dense layer contains a ceramic component, and has a higher transverse rupture strength than the porous ceramic layer.

Abstract: A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.

Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Abstract: The invention relates to a method of producing lightweight structural elements which are produced as a composition construction element having at least one cover plate and one carrier element which are connected to one another. A carrier element, at which at least one apertures and/or at least one cut-out is/are formed and at least one further element, which is a cover plate, are connected to one another. A carrier element and at least one cover plate can be formed from a glass, a glass ceramic material, a ceramic material and/or silicon having an oxide surface layer which is formed at least in the bonding region of the elements to be connected to one another. The carrier element should have at least a double thickness with respect to the thickness of a cover plate.

Abstract: A surface treatment for a glass substrate includes at least following steps: the glass substrate is provided; a fastening device is provided, the fastening device defines a receiving groove corresponding to the glass substrate; the glass substrate is positioned in the receiving groove, and the fastening device is heated to achieve a softened glass substrate; a insert is provided; and the insert is hot pressed and inserted to the softened glass substrate. An article manufactured by the surface treatment method is also disclosed.

Abstract: A method of making a vacuum insulating glass (VIG) unit. The method includes providing first and second substantially parallel spaced-apart glass substrates, a glass frit being provided at least partially between the first and second glass substrates for sealing said one or more edge portions to be sealed; and irradiating infrared energy towards the one or more edge portions to be sealed in forming an edge seal. The glass frit has a glass redox (FeO/Fe2O3) that is higher than a glass redox (FeO/Fe2O3) of the first and second substrates.

Abstract: A high-purity fragment is obtained by a simple mechanism and method for separating and purifying a nucleic acid, particularly fragment DNA, extremely efficiently and with a high reproducibility, wherein elution with a high-concentration salt is not performed and necessity of elution and purification is eliminated. This mechanism is a mechanism for purifying a nucleic acid, particularly fragment DNA using a monolith structure formed with glass or silica, specifically, an integral porous body having an open structure with pores that communicate the upper end with the lower end, wherein through-pores corresponding to nucleic acid sizes of 35 bp (mer) to 100 Kbp (mer) are provided.

Abstract: A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber.

Abstract: A source material, which is based on a glass, is arranged on a working surface of a mold substrate. The mold substrate is made of a single-crystalline material. A cavity is formed in the working surface. The source material is pressed against the mold substrate. During pressing a temperature of the source material and a force exerted on the source material are controlled to fluidify source material. The fluidified source material flows into the cavity. Re-solidified source material forms a glass piece with a protrusion extending into the cavity. After re-solidifying, the glass piece may be bonded to the mold substrate. On the glass piece, protrusions and cavities can be formed with slope angles less than 80 degrees, with different slope angles, with different depths and widths of 10 micrometers and more.

Abstract: MEMS and microelectronic devices and fabrication methods feature providing a first material including a glass, providing a second material having an elastic modulus greater than the elastic modulus of silicon, causing the second material to have a surface with a RMS surface roughness of greater than 0.001 ?m and less than approximately 0.15 ?m, contacting the surface of the second material to a surface of the first material, and applying a voltage between the first and second materials to cause an anodic bond to form.

Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.

Abstract: After a glass layer 3 is disposed between a glass member 4 and a thermal conductor 7 along a region to be fused, a laser beam L1 is emitted while the thermal conductor 7 is used as a heat sink, so as to melt the glass layer 3, thereby burning and fixing the glass layer 3 onto the glass member 4. While the glass layer 3 drastically increases its laser absorptance at the time of burning, the thermal conductor 7 serves as the heatsink and draws heat from the glass layer 3, thereby inhibiting the glass layer 3 from falling into an excessive heat input state. Thereafter, another glass member is overlaid on the glass member 4 having the glass layer 3 burned thereonto, such that the glass layer 3 is interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.

Abstract: A method for forming a fritted cover sheet includes providing a substrate and depositing an initial frit bead on the substrate. Thereafter, at least one additional frit bead is deposited on the substrate such that a base of the at least one additional frit bead contacts a base of an adjacent frit bead thereby forming a frit seal on the substrate.

Abstract: An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step

Abstract: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused along the edge of a planar glass member to enhance the thickness of the edge. A rounded edge feature may be formed by machining the thickened edge. Raised fused glass features may surround openings in the planar glass member. Multiple planar glass members may be fused together to form a five-sided box in which electronic components may be mounted. Raised support structure ribs may be formed by fusing glass structures to a planar glass member. Opaque masking material and colored glass may be used to create portions of the glass housing structures that hide internal device components from view.

Abstract: An optical reactor configured such that a large number of particles 3 . . . formed of a glass material are accommodated in a glass tube 2, and a fluid L can flow through the glass tube 2 is characterized in that a contact portion between the glass tube 2 and the particles 3 . . . and a contact portion between the particles 3 . . . serve as welding surfaces J . . . each having a predetermined area so that light guides C are provided continuing to the glass tube 2 and the particles 3 . . . through the welding surfaces J. An photocatalyst layer 4 can be provided on the surfaces of the particles 3 . . . and an inner surface of the glass tube 2 except the welding surfaces J . . . . The glass tube 2 may be formed having a circular cross sectional shape or may be formed having a non-circular cross sectional shape.

Abstract: An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.

Abstract: Provided are a method for producing a phosphor-encapsulating capillary tube in which, when a phosphor is encapsulated thereinto, fluorescence from the phosphor is less likely to leak from an end of the capillary tube; and such a phosphor-encapsulating capillary tube. One end portion 10A of an elongate glass capillary tube 10 having an outer shape of a transverse cross-section elongated in a width direction thereof is heated until the one end portion 10A of the glass capillary tube 10 has been melted, integrated, and thus sealed.

Abstract: To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Abstract: A cover glass element can extend to the edges of an electronic device while maintaining the optical flatness and thickness needed for the cover glass. A first glass sheet with the desired thickness and flatness can be thermally bonded to a second glass sheet machined to include an opening to be received by the edges of the electronic device. The resulting three-dimensional cover element forms a uni-body frame that is significantly stiffer than a single sheet of glass, and the larger surface area of the edge provides for enhances pressure distribution, particularly after chemical strengthening, thus enhancing the durability of the electronic device. Further, the thermal bonding process uses lower temperatures than processes such as slumping or pressing, which could potentially affect the flatness and optical clarity of the original sheet glass.

Abstract: In a known method for producing a component with a layer of transparent quartz glass, comprising: applying particles of synthetically produced quartz glass to a base body made of quartz glass and sintering the particles so as to form the quartz glass layer. Starting therefrom, in order to permit a comparatively inexpensive and reproducible production of a component with at least one layer of transparent quartz glass that is distinguished by ultrahigh purity and the absence of bubbles, it is suggested according to the invention that at least part of the SiO2 particles should be present in the form of cylindrical fragments of quartz glass fibers having a mean diameter ranging from 0.1 mm to 3 mm and a mean length ranging from 0.5 mm to 20 mm.

Abstract: A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.

Abstract: A process including holding sensor chip; holding glass tube surrounding the outer periphery of the side surface of sensor chip; applying a wind pressure to the side surface of glass tube from the outside of glass tube and melting glass tube to be glass-welded to the side surface of sensor chip. Thereby, the outer periphery of sensor chip can be surrounded by a highly hydrophilic glass tube. Thus, a cell electrophysiological sensor with high measurement accuracy can be produced.