Abstract: A method of designing an integrated circuit (IC) device includes identifying, with a processor, a pin failing a test to determine an antenna effect, identifying, with the processor, a net corresponding to the identified pin failing the test to determine the antenna effect, and creating, with the processor, an engineering change order (ECO) script based on the identified net to insert a diode to address the antenna effect.

Abstract: A placement method for integrated circuit design is provided. Each net is considered as a soft module. The net will receive a larger penalty if it covers more routing congested regions. Therefore, it is easier to move the nets away from routing congested regions. In addition, to relieve local congestion, a novel inflation method is proposed to expand the area of a cluster according to its internal connectivity intensity and routing congestion occupied by the cluster. Accordingly, it can get better routability and wirelength.

Abstract: Provided are embodiments for a computer-implemented method for routing standard cells of an integrated circuit. Embodiments include obtaining a layout of a plurality of standard cells for routing, and determining existing output connections for each of the plurality of standard cells. Embodiments can also include generating a representation for the layout removing the existing output connections for each of the plurality of standard cells; and providing the representation of the layout to an autorouter. Also provided are embodiments for a system and computer program product for routing standard cells of an integrated circuit.

Abstract: A method of generating a layout diagram for an integrated circuit. The method includes arranging a plurality of cells in the layout diagram. The method further includes placing a plurality of cell pins over a plurality of selected via placement points in a first cell of the plurality of cells, wherein at least one cell pin of the plurality of cell pins extends along a routing track of a plurality of routing tracks across a boundary of the first cell and into a second cell of the plurality of cells abutting the first cell.

Abstract: A system, and corresponding method, is described for using a model to predict the physical behavior of IP from an HDL representation of the IP. The system generated data for training and testing the model by treating the logical parameters and physical parameters subset as one for the IP block. The system digitizes the non-numerical parameters and compresses timing arcs. The system uses the trained model to characteristic behavior for an IP block directly from the combined vector of logical parameter values and physical parameter values.

Abstract: An image sensor may be implemented using a stitched image sensor die. The stitched image sensor die may be formed from a step and repeat exposure process using a set of physical tiles in a reticle set. The physical tiles may include a center tile forming pixel circuitry on the image sensor die and peripheral tiles forming non-pixel circuitry on the image sensor die. Each of the physical tiles may be sized based on an integer multiple of a virtual unit tile. As such, the physical tiles may have dimensions that are not required to be an integer multiple of the smallest physical tile. The step and repeat exposure process may use the unit lengths of the virtual unit tile to properly position the die relative to the processing tools.

Abstract: Standard cell libraries include one or more standard cells and one or more corresponding standard cell variations. The one or more standard cell variations are different from their one or more standard cells in terms of geometric shapes, locations of the geometric shapes, and/or interconnections between the geometric shapes. The exemplary systems and methods described herein selectively choose from among the one or more standard cells and/or the one or more standard cell variations to form an electronic architectural design for an electronic device. In some situations, some of the one or more standard cells are unable to satisfy one or more electronic design constraints imposed by a semiconductor foundry and/or semiconductor technology node when placed onto the electronic device design real estate. In these situations, the one or more standard cell variations corresponding to these standard cells are placed onto the electronic device design real estate.

Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.

Abstract: A method is disclosed including: generating, based on design information for an integrated circuit, a circuit design that includes an initial power delivery network (PDN) for the integrated circuit; performing a pre-layout simulation to the circuit design that includes the initial power delivery network, to determine whether the circuit design meets a predetermined specification; generating a circuit layout of the integrated circuit when the circuit design meets the predetermined specification; and adding at least one additional conductive pillar or at least one additional power rail in the initial power delivery network according to a relationship of a pillar density of the initial power delivery network and a maximum pillar density when the circuit design does not meet the predetermined specification.

Abstract: Embodiments for tuning parameters to a synthesis program are provided. At least one set of parameter settings for the synthesis program is selected. A plurality of identical synthesis jobs for the at least one set of parameter settings is run in an iteration of the synthesis program. Results of the iteration of the synthesis program are analyzed utilizing a tuning optimization cost function. Combinations of the parameter settings are created based on the analysis. At least one synthesis job for is run each of the combinations of the parameter settings in a subsequent iteration of the synthesis program. The analysis of the results, the creating of the combinations of parameter settings, and the running at the at least one synthesis job for each of the combinations of parameter settings are repeated until an exit criteria has been achieved.

Abstract: Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.

Abstract: An electronic design flow generates an electronic architectural design layout for analog circuitry from a schematic diagram. The electronic design flow assigns analog circuits of the schematic diagram to various categories of analog circuits. The electronic design flow places various analog standard cells corresponding to these categories of analog circuits into analog placement sites assigned to the analog circuits. These analog standard cells have a uniform cell height which allows these analog standard cells to be readily connected or merged to digital standard cells which decreases the area of the electronic architectural design layout. This uniformity in height between these analog standard cells additionally provides a more reliable yield when compared to non-uniform analog standard cells.

Abstract: Example embodiments relate to a method for designing integrated circuit based on a computer program including at least one instruction performed by an integrated circuit design system including a processor, the method comprising mapping, by the processor, at least one netlist signal to at least one RTL signal, determining, by the processor, a target netlist signal among the at least one netlist signal, determining, by the processor, a target expression of the target netlist signal using the netlist signal mapped to the at least one RTL signal based on at least a part of the netlist circuit, simulating, by the processor, on the at least one RTL signal, calculating, by the processor, signal simulation predicting information for the target netlist signal using the target expression and generating, by the processor, a design model by designing an integrated circuit using the signal simulation predicting information.

Abstract: Area and routing overhead issues of traditional anamux incorporation in a semiconductor device are overcome by placing a functional anamux block on top of an I/O pad. In some embodiments, multiple anamux blocks can be stacked either vertically or placed on neighboring I/O pads for horizontal stacking. Embodiments provide the anamux blocks as the same width as the I/O pads and the width is optimized to minimize padring height. In some embodiments, a power/ground I/O (PGE) bond pad architecture is enabled by the incorporation of both I/O pad and anamux blocks in the same region, providing two bonding regions, which can further reduce chip area. Some embodiments also permit routing of signals through the anamux block to neighboring blocks and the I/O channels.

Abstract: A method for forming an integrated circuit (IC) is provided. The method includes obtaining an IC design; generating a layout according to the IC design; calculating a score of a region in the layout based on voltage levels in the region; and fabricating a semiconductor device according to the layout when the score of the region in the layout is equal to or less than a threshold value.

Abstract: This invention is embodied in a cost-optimization device for the layout and construction of a utility-scale photovoltaic (“PV”) power plant. The optimization device employs a set of algorithms designed to find the most cost-effective solution under given conditions. The algorithms are written in computer machine readable code and are highly customizable for the specific tracker equipment requirements and owner/builder/maintainer specifications or preferences. The preferred optimization device comprises three principal stages (or “units”) of computing: (1) an objective-state unit, (2) an optimum-feasible unit, and (3) a grading unit. In the first stage, the objective-state unit cost-optimizes site grading by orienting a ruling line between a maximum and a minimum pile reveal length for each tracker in the project (the objective-state solution”). When compared to the existing site topography, the ruling line indicates cost-optimized cut and fill locations.

Abstract: An emulation host system can configure a reprogrammable hardware emulation system to emulate an electronic circuit design. The emulation host system can analyze the electronic circuit design for electronic circuits that are repetitive. The emulation host system can partition the electronic circuits onto a single partition. The emulation host system can map the single partition onto a single programmable logic element (PLE) of the reprogrammable hardware emulation system. The emulation host system can configure the reprogrammable hardware emulation system to emulate the electronic circuits using the single PLE.

Abstract: Embodiments disclosed herein provide systems and methods for preparing geometry for 3D printing. In one embodiment, a 3D printing preparation application receives 3D geometry and repairs non-manifold edges and non-manifold vertices, producing a topological manifold geometry. The 3D printing preparation application then welds coincident edges without coincident faces and fills holes in the geometry. The 3D printing preparation application may further perform resolution-aware thickening of the geometry by estimating distances to a medial axis based on distances to distance field shocks, and advecting the distance field using a velocity field. A similar approach may be used to perform resolution-aware separation enforcement. Alternatively, one component may be globally thickened and subtracted from another for separation enforcement. The 3D printing preparation application may also split large models and add connectors for connecting the split pieces after printing.

Abstract: An integrated circuit including first and second macroblocks arranged in a first direction, and a plurality of cells between the first macroblock and the second macroblock, the plurality of cells including at least one first ending cell adjacent to the first macroblock and having a first width in the first direction, at least one second ending cell adjacent to the second macroblock and having a second width different from the first width in the first direction, and at least one standard cell between the at least one first ending cell and the at least one second ending cell may be provided.

Abstract: A system for preparing an integrated circuit device design includes a memory for storing a plurality of preliminary integrated circuit design files; a processor for retrieving a preliminary integrated circuit design file from the memory; locating vertical abutments between adjacent device cell designs, identifying internal metal cuts on the adjacent device cell designs; determining and evaluating a horizontal spacing between the internal metal cuts a spacing threshold; and if the threshold is note met, shifting one cell horizontally relative to the other cell design by a predetermined distance to define a modified device layout, repeating the determining, evaluating, and shifting operations until the spacing threshold is satisfied; and identifying a next vertical abutment between and repeating the identifying, determining, shifting operations until the spacing threshold has been satisfied for all vertical abutments.

Abstract: Provided is an integrated circuit including a plurality of standard cells each including a front-end-of-line (FEOL) region and a back-end-of-line (BEOL) region on the FEOL region, the FEOL region including at least one gate line extending in a first horizontal direction. A BEOL region of a first standard cell among the plurality of standard cells includes an eaves section not overlapping an FEOL region of the first standard cell in a vertical direction, the eaves section protruding in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: This application is directed to methods and systems of verifying integrated circuit including an irregular shaped transistor device. The irregular shaped transistor device has a gate, a source, a drain, and a first channel connecting the source and drain and having an irregular shape. An equivalent resistance of the first channel is determined based on the irregular shape of the first channel. A length of the first channel is determined optionally based on locations of the source and drain. An equivalent width of the first channel of the irregular shaped transistor device is determined based on the equivalent resistance and length of the first channel, thereby enabling representation of the irregular shaped transistor device, by a regular shaped transistor device having a second channel, in analysis of the integrated circuit. The second channel optionally has a rectangular shape measured by the equivalent width and the length of the first channel.

Abstract: An integrated circuit including first and second macroblocks arranged in a first direction, and a plurality of cells between the first macroblock and the second macroblock, the plurality of cells including at least one first ending cell adjacent to the first macroblock and having a first width in the first direction, at least one second ending cell adjacent to the second macroblock and having a second width different from the first width in the first direction, and at least one standard cell between the at least one first ending cell and the at least one second ending cell may be provided.

Abstract: In a method of forming an integrated circuit (IC) layout, an empty region in the IC layout is identified by a processor circuit, wherein the empty region is a region of the IC layout not including any active fins. A first portion of the empty region is filled with a first plurality of dummy fin cells, wherein each of the first plurality of dummy fin cells is based on a first standard dummy fin cell, and wherein the first standard dummy fin cell has a first gate width and comprises a first plurality of partitions. A second portion of the empty region is filled with a second plurality of dummy fin cells, wherein each of the second plurality of dummy fin cells is based on a second standard dummy fin cell, and wherein the second standard dummy fin cell has a second gate width and comprises a second plurality of partitions.

Abstract: A method includes providing, on a printed circuit board, a first circuit trace having a first unit cell length and a second circuit trace having a second unit cell length, determining a time delay associated with the first unit cell length and the second unit cell length, estimating a floquet frequency associated with the time delay, where the floquet frequency is determined as f floquet = 1 2 ? t delay , where ffloquet is the floquet frequency, and tdelay is the time delay, and comparing the estimated floquet frequency with a first interface frequency associated with the first trace.

Abstract: In a system automatically processing data from a first computing device for use on a second computing device, a registry file including a plurality of filename parameters is read. Each filename parameter identifies a matching filename pattern, an extract script indicator, and a read file indicator. The extract script indicator indicates an extract script for a file having a filename that matches the matching filename pattern. The read file indicator indicates how to read the file having the filename that matches the matching filename pattern. One parameter of the plurality of filename parameters is selected by matching a filename of a source file to the matching filename pattern of the one parameter. The associated extract script is selected and used to read data from the source file using the associated read file indicator and the read data is output to a different file and in a different format.

Abstract: Apparatus and methods provide the effectiveness decay rate of actual police enforcement by allowing the user to chart the speeds in a particular location and overlay times when an officer was present and providing on-site enforcement. The system can monitor the speed in the location and when the speeds creep back up to a set speed or multiple of the speed after the enforcement period, the officer can be notified to provide enforcement again and reduce the speeds. For example, once the police car goes away, some locations may take longer for the average speed to creep back up to normal and others may have the average speed increase more quickly. A visual display of the situation provides a systematic method for determining enforcement locations and timing in place of conventional “seat-of-the-pants” enforcement planning.

Abstract: Methods and systems for creating and implementing improved routing polygon abstracts that can be used to efficiently find areas to route through in electrical designs, where the routing polygon abstracts include at least a horizontal routing polygon abstract, a maximum horizontal routing polygon abstract, a vertical routing polygon abstract, and a maximum vertical routing polygon abstract, that are created through various steps including bloating, shrinking, merging, and extending the objects towards an outer boundary.

Abstract: A circuit layout method comprises inputting layout data into a circuit layout system. The layout data represents a plurality of patterns in a plurality of cells. Each pattern of the plurality of patterns has a plurality of runs, ends, and corners. The method also comprises specifying a plurality of G1-rule criteria. The method further comprises reviewing a representation of G0-space and G0 rule violations for each cell of the plurality of cells. The method additionally comprises inputting an adjustment to the layout data. The method also comprises reviewing a representation of adjusted cell edge spacings, and selecting to output a final layout.

Abstract: In a system automatically processing data from a first computing device for use on a second computing device, a registry file including a plurality of filename parameters is read. Each filename parameter identifies a matching filename pattern, an extract script indicator, and a read file indicator. The extract script indicator indicates an extract script for a file having a filename that matches the matching filename pattern. The read file indicator indicates how to read the file having the filename that matches the matching filename pattern. One parameter of the plurality of filename parameters is selected by matching a filename of a source file to the matching filename pattern of the one parameter. The associated extract script is selected and used to read data from the source file using the associated read file indicator and the read data is output to a different file and in a different format.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Abstract: A method includes providing, on a printed circuit board, a first circuit trace having a first unit cell length and a second circuit trace having a second unit cell length, determining a time delay associated with the first unit cell length and the second unit cell length, estimating a floquet frequency associated with the time delay, where the floquet frequency is determined as f floquet = 1 2 ? ? t delay , where ffloquet is the floquet frequency, and tdelay is the time delay, and comparing the estimated floquet frequency with a first interface frequency associated with the first trace.

Abstract: A method embodiment includes identifying, by a processor, an empty region in an integrated circuit (IC) layout, wherein the empty region is a region not including any active fins. The method further includes providing a standard dummy fin cell and forming an expanded dummy fin cell. The standard dummy fin cell includes a plurality of partitions. The expanded dummy fin cell is larger than the standard dummy fin cell, and the expanded dummy fin cell includes integer multiples of each of the plurality of partitions. The empty region is filled with a plurality of dummy fin cells, wherein the plurality of dummy fin cells includes the expanded dummy fin cell. The plurality of dummy fin cells is implemented in an IC.

Abstract: Disclosed are methods, systems, and articles of manufactures for implementing physical designs by using multiple force models to iteratively morph a layout decomposition. In addition to attractive force model(s) or repulsive force model(s), the physical implementation also uses a containment force model for grouping multiple design blocks or for confining a node of a cell within the boundary of a container. Another aspect is directed at deriving a first force model at the first hierarchical level from a second force model at the second hierarchical level by directly modifying the second model based at least in part on characteristic(s) of the first hierarchical level and of the second hierarchical level. In a design with multiple hierarchies, a cell-based force model is also used to ensure child nodes of a parent cell stay within a close proximity of the parent node of the parent cell.

Abstract: Semiconductor device design methods and conductive bump pattern enhancement methods are disclosed. In some embodiments, a method of designing a semiconductor device includes designing a conductive bump pattern design, and implementing a conductive bump pattern enhancement algorithm on the conductive bump pattern design to create an enhanced conductive bump pattern design. A routing pattern is designed based on the enhanced conductive bump pattern design. A design rule checking (DRC) procedure is performed on the routing pattern.

Abstract: A system, method, and computer program product for automatically optimizing circuit designs. A graphical user interface based environment allows arbitrary selection of a circuit design region to be optimized based on physical layout, without regard for logical hierarchy. Embodiments analyze circuit paths crossing optimization region boundaries and replace externally connected circuitry with an interface logic model describing such circuitry from the optimization region boundary to a first register occurrence. A reduced netlist spans the regional circuitry and the modeled external circuitry. Embodiments optimize the reduced netlist under design constraints applicable to the full circuit design. Changes to the original circuit design made by the optimization are tangibly saved as engineering change orders. The optimization process may be applied to other regions, including via parallel execution by multiple processors.

Abstract: A method includes electrically connecting a plurality of cells of a standard cell library to a power rail. A contact area is deposited to connect a first active area and a second active area of a cell of a plurality cells. The first area and the second area are located on opposite sides of the rail and electrically connected to different drains. The contact area is electrically connected to the power rail using a via. The contact area is masked to remove a portion of the contact area to electrically separate the first active are from the second active area.

Abstract: In congestion aware point-to-point routing using a random point in an integrated circuit (IC) design, the random point is selected in a bounding area defined in a layout of the IC design. A set of pattern routes is constructed between a source pin and a sink pin in the bounding area, a pattern route in the set of pattern routes passing through the random point. A set of congestion cost corresponding to the set of pattern routes is computed. A congestion cost in the set of congestion costs corresponds to a pattern route in the set of pattern routes. A preferred pattern route is selected from the set of pattern routes, the preferred pattern route having the smallest congestion cost in the set of congestion costs. The preferred pattern route is output as a point-to-point route between the source pin and the sink pin.

Abstract: The present disclosure relates to a method of improving pattern density with a low OPC (optical proximity correction) cycle time, and an associated apparatus. In some embodiments, the method is performed by forming an integrated chip (IC) design that is a graphical representation of an integrated chip. One or more low-pattern-density areas of the IC design are identified having a pattern density that results in a processing failure. The low-pattern-density areas are a subset of the IC design. The pattern density is adjusted within the low-pattern-density area by adding one or more dummy shapes within the low-pattern-density areas. A data preparation process is then performed on the IC design to modify shapes of the one or more dummy shapes within the low-pattern-density areas. By introducing dummy shapes into a local area, rather than into an entire integrated chip design, the demands of the subsequent data preparation process are reduced.

Abstract: Systems and techniques are described for performing area recovery on a circuit design. Some embodiments can select a gate for area recovery in accordance with a reverse-levelized processing order, wherein an output pin of a driver gate is electrically coupled to an input pin of the gate. Next, the embodiment can determine a maximum delay value from an input pin of the driver gate to an output pin of the gate that does not create new timing requirement violations or worsen existing timing requirement violations at any of the timing endpoints of the circuit design. The embodiment can then downsize the gate based on the maximum delay value, wherein said downsizing comprises inputting the maximum delay value in a closed-form expression. Timing margin computation can be used to ensure that timing violations are not worsened when the embodiment recovers area from non-timing-critical regions of the circuit design.

Abstract: An electronic apparatus may include a circuit board, a processor disposed on an upper surface of the circuit board, and a memory disposed on a lower surface of the circuit board, such that the lower surface of the circuit board where the processor is arranged overlaps an area corresponding to where the memory is disposed.

Abstract: A process of optimizing a resistor-2 resistor (R-2R) digital-to-analog converter (DAC) by partial resistor network reconfiguration is disclosed. The method includes analyzing a circuit to determine whether any specifications are outside predetermined limits. The method further includes determining one or more addresses that cause the circuit to be outside of the predetermined limits. The method further includes defining logic to detect address information and control function to alter the circuit to improve the specifications. The method further includes installing the control function into the circuit to improve the specifications.

Abstract: A method includes electrically connecting a plurality of cells of a standard cell library to a power rail. A contact area is deposited to connect a first active area and a second active area of a cell of a plurality cells. The first area and the second area are located on opposite sides of the rail and electrically connected to different drains. The contact area is electrically connected to the power rail using a via. The contact area is masked to remove a portion of the contact area to electrically separate the first active are from the second active area.

Abstract: A method of generating an integrated circuit layout comprises a step of determining a placement of standard cells selected from a standard cell library while permitting boundary conflicts in which incompatible boundary regions of standard cells are placed next to each other. After determining routing connections between the standard cells, the integrated circuit layout is generated. The generation of the integrated circuit layout includes a mapping step of mapping at least one incompatible boundary region to an alternative boundary region to resolve at least one boundary conflict.

Abstract: A capacitor arrangement assisting method wherein data entered by a user, such as the width w of a power supply wiring, the thickness h of a dielectric between the power supply wiring and a ground plane, the ESLcap of a capacitor, and a target frequency fT and a target impedance ZT of an IC, are received, the maximum allowable wiring length lmax of the power supply wiring is calculated on the basis of the received width w of the power supply wiring, the thickness h of the dielectric, the ESLcap of the capacitor, and the target impedance ZT of the IC at the target frequency fT, and the calculated maximum allowable wiring length lmax is displayed.