Abstract: Provided that an x-axis, a y-axis and a z-axis are three axes of a rectangular coordinate system, a micro electro mechanical systems element comprises a support section whose length in the y-direction is shorter than a length in the x-direction, parallel arranged two film-like beam sections whose length in the y-direction is shorter than a length in the x-direction, a weight section, whose length in the y-direction is shorter than a length in the x-direction, spanning centers of the two beam sections and comprising a connecting part spanning the two beam sections, two projection parts projecting to opposite directions from the connecting part in a space between the two beam sections, and a plurality of distortion detectors which are placed on each beam section and detect distortion corresponding to deformation of the beam sections to measure xyz components of a vector corresponding to force acting on the weight section.

Abstract: An acceleration sensor includes a base having an XY-substrate surface which is parallel to an XY plane, a beam portion having a frame shape which is arranged in a floating state above the XY-substrate surface of the base, a beam-supporting fixed portion which supports the beam on the base via supporting units like a beam supported by its both ends, weight portions 7 which are arranged so as to float above the XY-substrate surface of the base, and connecting portions which support the weight portions 7 to the beam portion in a cantilever manner. The weight portions are displaceable in the X-axis direction, the Y-axis direction, and the Z-axis direction by the bending deformation of the frame-shaped beam portion. The beam portion is provided with an X-axis direction acceleration detecting portion, a Y-axis direction acceleration detecting portion, and a Z-axis direction acceleration detecting portion.

Abstract: An acceleration sensor includes a weight portion; a frame portion disposed around the weight portion and away from the weight portion; a beam portion connecting the weight portion and the frame portion; and a stopper portion having a displacement restricting portion for restricting the weight portion from moving upwardly in a vertical direction and a flexible portion connected to the displacement restricting portion and away from the weight portion, the frame portion, and the beam portion.

Abstract: A long-period weak-motion inertial sensor includes a frame having a frame mounting surface, a movable mass having a movable mass mounting surface, a transducer for sensing displacements of the movable mass with respect to the frame, and a monolithic flexure element for suspending the movable mass in the frame. The monolithic flexure element includes: a stiff frame integral clamp attachable to the frame mounting surface of the frame, a stiff movable mass integral clamp attachable to the movable mass mounting surface of the movable mass, and a stiffest flexible region for operatively connecting the frame integral clamp to the movable mass integral clamp. The frame and movable mass mounting surfaces do not overlap the stiffest flexible region, thereby minimizing the generation of creep and hysteresis noise. The variation in stiffness of the monolithic flexure element is controlled by varying thickness along the length of the flexure element.

Abstract: An acceleration sensor includes a frame-shaped beam portion disposed above an XY substrate surface of a base in a floating state and a beam-portion supporting/fixing unit arranged to attach the beam portion to the base with support portions so as to be supported on two sides. The acceleration sensor also includes weight portions disposed above the XY substrate surface of the base in a floating state and connecting portions for attaching the weight portions to the beam portion in a cantilever state. The weight portions are movable in three axial directions including an X-axis direction, a Y-axis direction, and a Z-axis direction when the beam portion is deflected.

Abstract: An acceleration sensor includes a base having an XY-substrate surface which is parallel to an XY plane, a beam portion having a frame shape which is arranged in a floating state above the XY-substrate surface of the base, a beam-supporting fixed portion which supports the beam on the base via supporting units like a beam supported by its both ends, weight portions 7 which are arranged so as to float above the XY-substrate surface of the base, and connecting portions which support the weight portions 7 to the beam portion in a cantilever manner. The weight portions are displaceable in the X-axis direction, the Y-axis direction, and the Z-axis direction by the bending deformation of the frame-shaped beam portion. The beam portion is provided with an X-axis direction acceleration detecting portion, a Y-axis direction acceleration detecting portion, and a Z-axis direction acceleration detecting portion.

Abstract: According to the present invention, a SOI substrate includes a first silicon substrate having first and second surfaces; a second silicon substrate having first and second surfaces; and a first insulating layer formed between first surface of the first silicon substrate and the first surface of the second silicon substrates. The first surface of the first silicon substrate is partly depressed to form a thin-layer region thereat. The first insulating layer is formed at least in the thin-layer region.

Abstract: An inverted pendulum type moving body according to the present invention includes: first actuators that rotationally drive wheels each disposed on an axle; and a turning motion control portion that controls the first actuators when the inverted pendulum type moving body comes into contact with an obstacle so as to allow the inverted pendulum type moving body to perform a turning motion.

Abstract: An acceleration sensor includes a frame-shaped beam portion disposed above an XY substrate surface of a base in a floating state and a beam-portion supporting/fixing unit arranged to attach the beam portion to the base with support portions so as to be supported on two sides. The acceleration sensor also includes weight portions disposed above the XY substrate surface of the base in a floating state and connecting portions for attaching the weight portions to the beam portion in a cantilever state. The weight portions are movable in three axial directions including an X-axis direction, a Y-axis direction, and a Z-axis direction when the beam portion is deflected.

Abstract: A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions.

Abstract: A compensating accelerometer includes a housing, and a sensing element mounted in the housing. The sensing element includes a pendulum flexibly mounted on a base. The sensing element includes a coil mounted on a movable plate, a curtain having a slit, and a load mass affixed to the curtain. An angle sensor within the housing includes the curtain, a fork, a light source and a differential light detector. A momentum sensor within the housing includes a permanent magnet, an inner magnetic conductor, an outer magnetic conductor and the coil. The permanent magnet is magnetized in a direction of an axis of the pendulum. A stopper is used to adjust position of the fork. A spring is on opposite side of the fork, for taking up slack in the fork. A fixator has an eccentric, for adjusting a gap between the curtain and the light detector.

Abstract: A acceleration sensor includes a supporting part, a beam part connected to the supporting part, a weight part connected to the beam part, and a protruding part formed beneath the beam part so that the protruding part supports the beam part. With such an arrangement, the adjustment of the sensitivity of the acceleration sensor can be easily performed, as well as the evaluation of the acceleration sensor.

Abstract: A technique for manufacturing a piezoresistive sensing structure includes a number of process steps. Initially, a piezoresistive element is implanted into a first side of an assembly that includes a semiconductor material. A passivation layer is then formed on the first side of the assembly over the element. The passivation layer is then removed from selected areas on the first side of the assembly. A first mask is then provided on the passivation layer in a desired pattern. A beam, which includes the element, is then formed in the assembly over at least a portion of the assembly that is to provide a cavity. The passivation layer provides a second mask, in the formation of the beam, that determines a width of the formed beam.

Abstract: A released-beam sensor includes a semiconductor substrate having a layer formed thereon, and an aperture formed in the layer. A beam is mechanically coupled at a first end to the layer and suspended above the layer such that a second end forms a cantilever above the aperture. A boss is coupled to a second end of the beam and suspended at least partially within the aperture. The beam is configured to flex in response to acceleration of the substrate along a vector substantially perpendicular to a surface of the substrate. Parameters of the sensor, such as the dimensions of the beam, the mass of the boss, and the distance between the boss and a contact surface within the aperture, are selected to establish an acceleration threshold at which the boss will make contact with the contact surface. The sensor may be employed to deploy an airbag in a vehicle.

Abstract: In a servo accelerometer, a support rod is formed integrally with a pole piece bottom, which is disposed between a magnetic yoke and a magnet. The support rod is extended to penetrates toward outside through a through-hole formed in a closure plate portion of the magnetic yokes. The sensing mechanism is connected via the support rod to a housing by fixing the support rod at the extended end thereof to the housing. The support rod may be formed integrally with the closure plate portion of the magnetic yoke, rather than the pole piece bottom.

Abstract: A structure with superior shock resistance is proposed for a parasol-type acceleration sensor. The acceleration sensor comprises a support portion the lower end of which is fixed to a substrate; a beam portion on which a detection element for applying changes to an output signal in correspondence with strain caused by acceleration acting on the detection element is formed, one end of the beam portion being connected to the top part of the support portion; a suspended weight connected to the other end of the beam portion; and a stopper substrate with a window portion through which, in order to guide an output signal of the detection element via a pad that is formed on the upper end face of the support portion, a conductor lead that is connected to the pad passes. Overswing of the weight is limited by means of the stopper substrate.

Abstract: A device for emission of high frequency signals is provided. The emission device is capable of emission of signals in the Gigahertz (GHz) and Terahertz (THz) range. The device may utilize, for example, a cantilever comprising a material that is capable of altering its electrical properties when flexed.

Abstract: A compensating accelerometer includes a housing, and a sensing element mounted in the housing. The sensing element includes a pendulum flexibly mounted on a base. The sensing element includes a coil mounted on a movable plate, a curtain having a slit, and a load mass affixed to the curtain. An angle sensor within the housing includes the curtain, a fork, a light source and a differential light detector. A momentum sensor within the housing includes a permanent magnet, an inner magnetic conductor, an outer magnetic conductor and the coil. The permanent magnet is magnetized in a direction of an axis of the pendulum. A stopper is used to adjust position of the fork. A spring is on opposite side of the fork, for taking up slack in the fork. A fixator has an eccentric, for adjusting a gap between the curtain and the light detector.

Abstract: A capacitance type dynamic quantity sensor has a first substrate, a second substrate disposed over the first substrate, and first and second electrodes each disposed on a main surface of a respective one of the first and second substrates. Each of the first and second electrodes has through-holes formed in a portion thereof. A third substrate is disposed between and connected to the main surface of each of the first and second substrates. A vibration member is mounted on the third substrate so as to confront the first and second electrodes with gaps therebetween. The vibration member is mounted on the third substrate to undergo vibrational movement in response to application of an acceleration or an angular velocity to the vibration member so that the capacitance type dynamic quantity sensor detects a dynamic quantity in accordance with a change in capacitance between the first and second electrodes due to vibrational movement of the vibration member.

Abstract: In one aspect, a microelectromechanical device and method of producing the device includes an accelerometer with a thinned flexure structure. In another embodiment, the device and method of producing the device includes an accelerometer and a pressure sensor integrated on a single chip.

Abstract: A multi-directional shock sensor having a central post surrounded by an omnidirectionally moveable toroidal mass. A plurality of anchor members surrounds the mass and carries one arm of a latching arm assembly. The other arm of each latching arm assembly is carried by, and radially extends from the mass to oppose a respective first arm. A shock event will cause the mass to move in a certain direction to an extent where one or more of the arm assemblies will latch. The latching may be determined by an electrical circuit connected to contact pads on the central post and on the anchor members.

Abstract: A Micro Electro-Mechanical System (MEMS) acceleration sensing device formed of a silicon substrate having a substantially planar surface; a pendulous sensing element having a substantially planar surface suspended in close proximity to the substrate planar surface; a flexure suspending the sensing element for motion relative to the substrate planar surface, the flexure having a both static geometric centerline and a dynamic centerline that is offset from the static geometric centerline; and a metal electrode positioned on the substrate surface for forming a capacitor with the pendulous sensing element, the metal electrode being positioned as a function of the dynamic centerline of the flexure.

Abstract: An accelerometer device comprises a dielectric seismic mass separated by a gap from an underlying comb-shaped planar capacitor. The principle for measuring acceleration detecting capacitance change according to movement of the dielectric mass in the fringe electrical field. This measuring principle is verified by FEM simulation. The simple structure of the accelerometer device allows the polymer Parylene to be used as the proof mass, greatly simplifying the technology by requiring only surface micromachining. Prototype accelerometers are fabricated and calibrated with the aid of off-chip capacitive readout IC.

Abstract: A force rebalance accelerometer (20) includes a silicon dioxide-based proof mass (28) having capacitive elements (40) engaged with excitation rings (61) made from alloys of Super Invar. The magnet assembly includes an excitation ring, a magnet, and a pole piece (65). The Super Invar of the excitation rings (61) substantially matches the coefficient of thermal expansion of the silicon dioxide-based proof mass (28) to substantially reduce distortion signals caused by temperature changes. Movement of the accelerometer causes the capacitive elements (40) to produce a signal proportional to the movement acceleration and not by temperature changes experienced by the accelerometer.

Abstract: An apparatus and method for sensing accelerations and other forces. The apparatus having a capacitance pick-off force sensor having a proof mass that is suspended relative to a relatively stationary frame by a plurality of serpentine suspension members having internal caging. The device provides easily implemented fabrication modification for trading-off between input range and pick-off sensitivity by altering etching periods of the serpentine suspension members. The input range and pick-off sensitivity can be traded-off by enlarging or reducing the quantity of elongated flexure fingers forming the serpentine suspension member. Different ones of the elongated flexure fingers are optionally formed with different thicknesses, whereby the serpentine suspension member exhibits a spring rate that progressively increases as it is compressed by in-plane motion of the proof mass relative to the relatively stationary frame.

Abstract: An accelerometer has a cantilever beam supported at one end and having an opposite free end with a longitudinal direction between the supported end and the free end, the beam being formed of a piezoelectric layer and a supporting layer. An inertial, sensing mass is mounted at the free end of the beam, and is located eccentrically relative to the longitudinal direction of the beam. The accelerometer has a primary direction of sensitivity to acceleration forces, and a secondary direction of sensitivity, which is orthogonal to the primary direction and in which the sensitivity is negligible. The secondary direction forms an angle relative to the longitudinal direction of the beam such that a line coinciding with a force proceeding through the center of gravity of the inertial mass, and which is directed in the secondary direction, also intersects the beam.

Abstract: An inertial sensor includes a sensing portion having a weight supported by beams, the weight being a movable portion, and a weight stopper that limits a movable range of the weight, the weight stopper being arranged in a vicinity of the weight with a given clearance and being a part of a substrate for the inertial sensor processed with MEMS techniques.

Abstract: An apparatus and method for sensing accelerations and other forces. The apparatus having a capacitance pick-off force sensor having a proof mass that is suspended relative to a relatively stationary frame by a plurality of serpentine suspension members having internal caging. The device provides easily implemented fabrication modification for trading-off between input range and pick-off sensitivity by altering etching periods of the serpentine suspension members. The input range and pick-off sensitivity can be traded-off by enlarging or reducing the quantity of elongated flexure fingers forming the serpentine suspension member. Different ones of the elongated flexure fingers are optionally formed with different thicknesses, whereby the serpentine suspension member exhibits a spring rate that progressively increases as it is compressed by in-plane motion of the proof mass relative to the relatively stationary frame.

Abstract: A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.

Abstract: An inertia device is constructed by both suspension structure and micro-electroplating structure. The suspension structure may be manufactured by surface micromachining technique of sacrificial layer process or bulk micromachining technique incorporating with thin film process. One side of the suspension structure is arranged firmly to a supporting piece, so that another side of the suspension structure is in a suspension state. The suspension side of the suspension structure is made as micro-electroplating structure through the micro-electroplating process and functions as inertia mass for an inertia sensor. The size of the micro-electroplating structure may be changed through the micro-electroplating process, such that the inertia sensor may be adapted for sensing in different levels.

Abstract: A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.

Abstract: A mechanical resonator having an electrical charge buried and substantially permanently trapped in a layer of insulating material grown or otherwise formed on either or both of the electrode and the vibratory beam, whereby the trapped electrical charge generates electrostatic forces between the beams and the electrodes of the opposing plates of the resultant capacitor.

Abstract: A drive component that comprises a drive axis, a pendulous sensor component that comprises a center of mass, and a hinge component that comprises a rotation axis of an electromechanical system. The drive component makes a determination of a drive direction. Upon the determination of the drive direction, the drive component determines an alignment of a pendulous axis, that intersects the center of mass of the pendulous sensor component and the rotation axis of the hinge component, with the drive axis of the drive component. The drive component and the pendulous sensor component are coupled with the hinge component. A location of the hinge component causes the alignment of the pendulous axis to be substantially parallel with the drive direction of the drive component.

Abstract: A method of manufacturing a monolithic silicon acceleration sensor is disclosed. The monolithic silicon acceleration sensor includes one or more sensor cells, each sensor cell having an inertial mass positioned by beam members fixed to a silicon support structure. According to the method, a sandwiched etch-stop layer is formed. First sections of the inertia mass and beam members are also formed. In addition, a second section of the inertial mass is formed. Further, an inertial mass positioned by beam members fixed to a silicon support structure is formed. Also, a first cover plate structure is bonded to a first surface of the silicon support structure.

Abstract: A low cost, pendulous, capacitive-sensing Micro Electro-Mechanical Systems (MEMS) accelerometer is provided. The accelerometer includes a pendulous proof mass, one or more securing pads, and one or more flexures coupled with the pendulous proof mass and the one or more securing pads. The flexures flex linearly with respect to motion of the pendulous proof mass. First and second capacitor plates are positioned relative to the pendulous proof mass for detecting motion of the proof mass according to a sensed difference in capacitance. One or more strain isolation beams are connected between the one or more flexures and the pendulous proof mass or the securing pads. The strain isolation beams protect the flexures from mechanical strain.

Abstract: A physical quantity sensor for detecting physical quantity includes a substrate having an opening; a beam protruding in the opening of the substrate and supported on the substrate; and a fixed electrode supported on the substrate. The beam is movable in a vertical direction of the substrate so that the physical quantity in the vertical direction is detectable. The sensor can be minimized, and has excellent output characteristics. Further, a manufacturing cost of the sensor is small.

Abstract: An acceleration sensor includes: a vibrator that is polarized in one direction; a weight that is connected to the vibrator; and a pair of electrodes that are adjacent to each other in the polarization direction and are placed on a first face of the vibrator. The pair of electrodes are located on a diagonal line on the first face of the vibrator. With this electrode structure, voltage is constantly produced in the pair of electrodes, no matter which one of the three axes of the vibrator receives acceleration. Thus, a non-directional acceleration sensor can be realized. Also, the sensitivity to tri-axial acceleration can be easily adjusted by changing the sizes of the electrodes in relation to the size of the vibrator.

Abstract: An acceleration sensor in which a regulation plate is fixed with adhesive onto a support frame of a sensor chip of the sensor to limit the movement of a mass portion of the sensor chip within a predetermined gap range. In the acceleration sensor, the adhesion area of the adhesive can be controlled to a predetermined value to prevent a variation of the sensitivity due to the variation of the adhesion area. The sensor chip comprises the mass portion, the frame surrounding the mass portion and having on an upper surface of the frame a plurality of the recesses to fill adhesive into, elastic support arms bridging the mass portion and the frame, and strain gauges formed on the elastic support arms. The regulation plate is fixed with paste onto the frame with the predetermined gap with an upper surface of the mass portion. The paste contains hard plastic balls, of a diameter larger than the predetermined gap, mixed with adhesive. The adhesive is preferably of silicon-rubber resin.

Abstract: A micro-electromechanical systems (MEMS) device is described which includes a substrate having at least one anchor, a proof mass having either of at least one deceleration extension extending from the proof mass or at least one deceleration indentation formed in the proof mass, a motor drive comb, and a motor sense comb. The MEMS device further includes a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb, and the suspensions are anchored to the substrate. The MEMS device also includes a body attached to the substrate and at least one deceleration beam extending from the body. The deceleration extensions are configured to engage either deceleration beams or deceleration indentations and slow or stop the proof mass before it contacts either of the motor drive comb or the motor sense comb.

Abstract: An integrated circuit and method are provided for sensing activity such as acceleration in a predetermined direction of movement. The integrated released beam sensor preferably includes a switch detecting circuit region and a sensor switching region connected to and positioned adjacent the switch detecting circuit region. The sensor switching region preferably includes a plurality of floating contacts positioned adjacent and lengthwise extending outwardly from said switch detecting circuit region for defining a plurality of released beams so that each of said plurality of released beams displaces in a predetermined direction responsive to acceleration. The plurality of released beams preferably includes at least two released beams lengthwise extending outwardly from the switch detecting circuit region to different predetermined lengths and at least two released beams lengthwise extending outwardly from the switch detecting circuit region to substantially the same predetermined lengths.

Abstract: A process for forming a microelectromechanical system (MEMS) device by a deep reactive ion etching (DRIE) process during which a substrate overlying a cavity is etched to form trenches that breach the cavity to delineate suspended structures. A first general feature of the process is to define suspended structures with a DRIE process, such that the dimensions desired for the suspended structures are obtained. A second general feature is the proper location of specialized features, such as stiction bumps, vulnerable to erosion caused by the DRIE process. Yet another general feature is to control the environment surrounding suspended structures delineated by DRIE in order to obtain their desired dimensions. A significant problem identified and solved by the invention is the propensity for the DRIE process to etch certain suspended features at different rates.

Abstract: A semiconductor torsional micro-electromechanical (MEM) switch is described having a conductive movable control electrode; an insulated semiconductor torsion beam attached to the movable control electrode, the insulated torsion beam and the movable control electrode being parallel to each other; and a movable contact attached to the insulated torsion beam, wherein the combination of the insulated torsion beam and the control electrode is perpendicular to the movable contact. The torsional MEM switch is characterized by having its control electrodes substantially perpendicular to the switching electrodes. The MEM switch may also include multiple controls to activate the device to form a single-pole, single-throw switch or a multiple-pole, multiple-throw switch. The method of fabricating the torsional MEM switch is fully compatible with the CMOS manufacturing process.

Abstract: An apparatus and method for suspending two or more force-versus-displacement sensors for measuring displacement of a pendular structure relative to a frame structure, wherein a suspension structure includes the frame and pendular structures, the pendular structure having a base structure suspended from the frame structure for rotation about a first axis, a beam structure spaced away from the first axis, and a flexure suspending the beam structure from the base structure for rotation about a second axis that is substantially perpendicular to the first axis. The flexure suspending the beam structure from the base structure is positioned substantially intermediate between suspension positions of the force-versus-displacement sensors, and constrains the beam structure to motion substantially within the plane of the pendular structure.

Abstract: In an accelerometer in which a frame supporting a pendulum through hinges is held between a pair of opposed housings and a displacement of the pendulum is detected as changes in electrostatic capacitances between electrodes formed on both sides of the pendulum and electrodes surfaces formed integrally with the housings in opposing relation to the electrodes, a C-shaped outer ring having a slit formed in its periphery is mounted around the housings and bonded thereto by a conductive adhesive to provide conduction between the housings. The-shaped configuration of the outer ring effectively prevents thermal stress from being produced in the outer ring, suppressing development of cracks in the conductive adhesive which causes changes in the conduction between the housings.

Abstract: A micromachined shock sensor has a substrate with a surface on which are formed an array of acceleration sensing units. Each sensing unit has a mount fixed to the substrate, a cantilever beam extending from the mount, and a proof mass fixed to the cantilever beam and supported above the substrate to permit translation of the proof mass and bending of the cantilever beam in a plane parallel to the substrate surface. Sensing electrodes are formed on the substrate on opposite sides of the proof mass such that displacement of the proof mass in response to acceleration brings the proof mass into contact with one or the other of the electrodes at a sufficient acceleration level, effectively closing a switch and providing an electrical output signal that can be detected. The multiple acceleration sensing units are formed to make contact at different levels of acceleration, allowing the shock sensor to allow measurements over a range of accelerations.

Abstract: A method for producing an acceleration sensor comprising an electromechanical transducer having a piezoelectric element includes providing at least two piezoelectric substrates where each has two opposing main surfaces. The piezoelectric element is formed by directly connecting one of the main surfaces of one of the at least two piezoelectric substrates with an opposing one of the main surfaces of another one of the at least two piezoelectric substrates. Supporters are provided to support the electromechanical transducer and are directly connected to the at least two piezoelectric substrates composing the piezoelectric element. Electrodes that extend continuously from the unconnected main surfaces of the at least two piezoelectric substrates composing the piezoelectric element to surfaces of the supporters are then formed.

Abstract: A dynamic quantity sensor includes a semiconductor substrate, a movable electrode, first fixed electrodes and second fixed electrodes. The movable electrode includes a mass portion and electrode portions. The mass portion includes two rod portions which cross each other in an X-shaped configuration. The first fixed electrodes form, with the electrode portions, first capacitors for detecting displacement of the movable electrode in a first direction. The second fixed electrodes form, with the electrode portions, second capacitors for detecting displacement of the movable electrode in a second direction. The movable electrode is constructed so that a ratio of its resonant frequency corresponding to the second direction to its resonant frequency corresponding to the first direction is equal to or larger than 1.41.

Abstract: A single crystal silicon substrate (1) is bonded through an SiO2 film (9) to a single crystal silicon substrate (8), and the single crystal silicon substrate (1) is made into a thin film. A cantilever (13) is formed on the single crystal silicon substrate (1), and the thickness of the cantilever (13) in a direction parallel to the surface of the single crystal silicon substrate (1) is made smaller than the thickness of the cantilever in the direction of the depth of the single crystal silicon substrate (1), and movable in a direction parallel to the substrate surface. In addition, the surface of the cantilever (13) and the part of the single crystal silicon substrate (1), opposing the cantilever (13), are respectively, coated with an SiO2 film (5), so that an electrode short circuit is prevented in a capacity-type sensor. In addition, a signal-processing circuit (10) is formed on the single crystal silicon substrate (1), so that signal processing is performed as the cantilever (13) moves.

Abstract: A single crystal silicon substrate (1) is bonded through an SiO2 film (9) to a single crystal silicon substrate (8), and the single crystal silicon substrate (1) is made into a thin film. A cantilever (13) is formed on the single crystal silicon substrate (1), and the thickness of the cantilever (13) in a direction parallel to the surface of the single crystal silicon substrate (1) is made smaller than the thickness of the cantilever in the direction of the depth of the single crystal silicon substrate (1), and movable in a direction parallel to the substrate surface. In addition, the surface of the cantilever (13) and the part of the single crystal silicon substrate (1), opposing the cantilever (13), are, respectively, coated with an SiO2 film (5), so that an electrode short circuit is prevented in a capacity-type sensor. In addition, a signal-processing circuit (10) is formed on the single crystal silicon substrate (1), so that signal processing is performed as the cantilever (13) moves.

Abstract: A single crystal silicon substrate (1) is bonded through an SiO2 film (9) to a single crystal silicon substrate (8), and the single crystal silicon substrate (1) is made into a thin film. A cantilever (13) is formed on the single crystal silicon substrate (1), and the thickness of the cantilever (13) in a direction parallel to the surface of the single crystal silicon substrate (1) is made smaller than the thickness of the cantilever in the direction of the depth of the single crystal silicon substrate (1), and movable in a direction parallel to the substrate surface. In addition, the surface of the cantilever (13) and the part of the single crystal silicon substrate (1), opposing the cantilever (13), are, respectively, coated with an SiO2 film (5), so that an electrode short circuit is prevented in a capacity-type sensor. In addition, a signal-processing circuit (10) is formed on the single crystal silicon substrate (1), so that signal processing is performed as the cantilever (13) moves.