Base Metal One Or More Of Copper(cu) Or Noble Metal Patents (Class 75/247)
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Patent number: 7556669Abstract: The problem is to provide an Au—Sn alloy powder for use in producing an Au—Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au—Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 ?m or less are crystallized in a matrix.Type: GrantFiled: June 27, 2005Date of Patent: July 7, 2009Assignee: Mitsubishi Materials CorporationInventors: Masayuki Ishikawa, Masayoshi Kohinata, Akihumi Mishima
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Patent number: 7479174Abstract: An inner rotor having excellent corrosion resistance, which has an outer gear serving as a component of an internal gear pump, and an outer rotor having excellent corrosion resistance, which has an inner gear engaging with the outer gear. The inner rotor and outer rotor of are made of Cu—Ni-based sintered copper alloy that contains 12 to 50% by mass of Ni, 5 to 20% by mass of Sn, 0.5 to 5% by mass of C, and if necessary, further contains 5 to 20% by mass of Zn, 0.1 to 0.9% by mass of P, and a balance being Cu and inevitable impurities.Type: GrantFiled: March 29, 2005Date of Patent: January 20, 2009Assignee: Mitsubishi Materials PMG CorporationInventors: Teruo Shimizu, Tuneo Maruyama
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Patent number: 7449249Abstract: The invention relates to a spray powder for coating a substrate (2), in particular for coating a bearing part (2) of a bearing apparatus, the spray powder having at least the following composition: zinc=5% to 30% by weight, tin=1% to 10% by weight, silicon=0.1% to 3% by weight, aluminum=0.1% to 7% by weight, iron=0.01% to 2% by weight, manganese=0.01% to 4% by weight, cobalt=0.01 to 3% by weight, copper=the balance to 100% in % by weight.Type: GrantFiled: August 15, 2005Date of Patent: November 11, 2008Assignee: Sulzer Metco AGInventor: Gérard Barbezat
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Publication number: 20080148904Abstract: Copper microparticles that are fine and contain substantially none of agglomerated particles. For example, there are provided copper microparticles of 0.005 to 2.0 ?m average particle diameter (D) as measured by an electron microscope, 0.005 to 2.0 ?m average particle diameter (d) as measured by a dynamic light scattering particle size distribution measuring apparatus and 0.7 to 2 d/D ratio. There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide.Type: ApplicationFiled: August 18, 2005Publication date: June 26, 2008Inventors: Masanori Tomonari, Masatoshi Honma, Yoshiyuki Kunifusa
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Patent number: 7390344Abstract: Metal graphite material including a molded body having a collectivity of graphite particles and copper particles comprises graphite and copper as main elements, the copper particles including copper microparticles where each copper microparticle having average diameter between 5 and 100 nm contacts, and a cluster of the copper microparticles fixed on a surface of the graphite particle to form a conductive path of the contacting copper microparticles on the surface of the graphite particle, wherein a charge induced from the graphite particle is conducted, and a method for making metal graphite material comprises the steps of: applying a solution including metal complex whose main element is copper on a surface of a graphite particle and forming a coating film of the solution on the surface of the graphite particle, and calcinating a molded body of a collectivity of the graphite particles on which the coating films are formed under an oxygen including atmosphere, and heating the molded body under a deoxidizingType: GrantFiled: June 18, 2004Date of Patent: June 24, 2008Assignee: Aisin Seiki Kabushiki KaishaInventor: Hiroshi Kobayashi
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Patent number: 7378053Abstract: The invention proposes a copper-based material with low thermal expansion and high thermal conductivity having good machinability and adaptability to nickel plating and also proposes a method for producing the same. The copper-based material is prepared through the steps of: adding 5 to 60% of iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering it at temperatures of 400 to 600° C.Type: GrantFiled: April 27, 2004Date of Patent: May 27, 2008Assignee: Hitachi Powered Metals Co., Ltd.Inventor: Zenzo Ishijima
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Publication number: 20080110334Abstract: Disclosed are a sintered composite machine part as a cylinder block for piston pumps or piston motors, and a manufacturing method thereof. The machine part has an air-tight main body of sintered porous iron alloy and having an iron oxide layer on the surface; and a sliding part of sintered porous copper alloy being bonded direct to the main body. The sliding part is to be slid in tight contact with a fluid supply/return device. The manufacturing is made by preparing a main body of sintered porous iron alloy and a green compact for sliding part from a raw material metal powder having a composition corresponding to the copper alloy; sintering the green compact for sliding part in contact with the main body to bond the sliding part to the main body by diffused junction; and subjecting the main body to steam treatment to provide an iron oxide layer.Type: ApplicationFiled: November 13, 2007Publication date: May 15, 2008Applicant: HITACHI POWDERED METALS CO., LTD.Inventor: Michiharu Mogami
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Patent number: 7288325Abstract: A hydrogen storage material includes a nano size material that can be formed in a multi-layered core/shell structure and/or in a nanotabular (or platelet) form.Type: GrantFiled: March 15, 2004Date of Patent: October 30, 2007Assignee: The Pennsylvania State UniversityInventors: Peter C. Eklund, Terumi Furuta, Hajime Goto, Yoshiya Fujiwara, James H. Adair, Jennifer A. Nelson, Kishore Sreenivasan
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Patent number: 7208439Abstract: A method is featured for fabricating Carbon-supported AuPt nanoparticle catalysts for fuel cells, and particularly fuel cells using methanol as the fuel. The method prepares AuPt-based fuel cell catalysts having a wide range of controllable Au:Pt ratios. The AuPt catalysis are supportable on both carbon black (C) and C/TiO2 support materials. These materials demonstrate electro-catalytic activity towards CO and methanol oxidation, and O2 reduction. The same catalyst material is useful in constructing both anodes and cathodes, and demonstrates bifunctional activity.Type: GrantFiled: February 4, 2005Date of Patent: April 24, 2007Assignee: The Research Foundation of State University of New YorkInventors: Chuan-Jian Zhong, Jin Luo, Mathew M. Maye, Nancy N. Kariuki
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Patent number: 7083859Abstract: Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.Type: GrantFiled: July 7, 2004Date of Patent: August 1, 2006Assignee: Hitachi Chemical Co., Ltd.Inventor: Hideji Kuwajima
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Patent number: 6844085Abstract: With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.Type: GrantFiled: July 12, 2002Date of Patent: January 18, 2005Inventors: Takemori Takayama, Tetsuo Ohnishi, Yoshikiyo Tanaka, Keiichi Maeda, Kan'ichi Sato
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Patent number: 6840979Abstract: A clay composition for shaping noble metal is formed of a kneaded mixture of a mixed powder of noble metal having as main components thereof 30 to 70% by weight of a powder having an average particle diameter in the range of 2.2 to 3.0 ?m and 70 to 30% by weight of a powder having an average particle diameter in the range of 5 to 20 ?m with an aqueous solution of an organic binder.Type: GrantFiled: November 5, 2003Date of Patent: January 11, 2005Assignee: AIDA Chemical Industries Co., Ltd.Inventors: Atsushi Fujimaru, Akiyoshi Yatsugi, Tomoaki Kasukawa
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Patent number: 6837915Abstract: High theoretical density, metal-based materials containing graphite or hexagonal boron nitride have low coefficients of friction and wear rates are useful for bearings, bushings and other articles subject to bearing loads.Type: GrantFiled: September 20, 2002Date of Patent: January 4, 2005Assignee: SCM Metal Products, Inc.Inventors: Stephen D. Dunmead, James M. Marder
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Publication number: 20040265615Abstract: Gold powders and methods for producing gold powders. The powders preferably have a small particle size, narrow size distribution and a spherical morphology. The method includes forming the particles by a spray pyrolysis technique. The invention also includes novel devices and products formed from the gold powders.Type: ApplicationFiled: July 16, 2004Publication date: December 30, 2004Inventors: Toivo T. Kodas, Mark J. Hampden-Smith, James Caruso, Daniel J. Skamser, Quint H. Powell, Clive D. Chandler
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Patent number: 6821313Abstract: Pressure powder metallurgy process for consolidating refractory or rhenium alloys using a reduced temperature and elevated pressure. Rhenium metal has high temperature strength and wear resistance but has a very high melting point as a pure metal and thus is difficult to use as a coating for many alloys having lower melting points. The reduced temperature and elevated pressure alloying process of the rhenium allows it to be used as a coating for other metal alloys, such as nickel and steel alloys, providing some high temperature and wear resistance due to the properties of the rhenium material in the coating.Type: GrantFiled: September 13, 2002Date of Patent: November 23, 2004Assignee: Honeywell International, Inc.Inventor: Robbie J. Adams
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Publication number: 20040211290Abstract: A sintered alloy has prolonged life span in a state where it is in contact with pure water. A bearing 5 is made of a Cu-based sintered alloy 51 having excellent corrosion resistance against liquid including sulfur or its compounds. A tetrafluoroethylene resin layer 53 is provided at the external surface of the sintered alloy 51. The Cu-based sintered alloy 51 is covered with a tetrafluoroethylene resin layer 53 having corrosion resistance, so that it is possible to secure high corrosion resistance even when the sintered alloy 51 is in contact with ionized pure water. It is also possible to provide a sintered alloy having prolonged life span while it is in contact with pure water.Type: ApplicationFiled: March 10, 2004Publication date: October 28, 2004Applicant: Mitsubishi Materials CorporationInventors: Teruo Shimizu, Tsuneo Maruyama
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Patent number: 6790253Abstract: A biaxially textured alloy article having a magnetism less than pure Ni includes a rolled and annealed compacted and sintered powder-metallurgy preform article, the preform article having been formed from a powder mixture selected from the group of mixtures consisting of: at least 60 at % Ni powder and at least one of Cr powder, W powder, V powder, Mo powder, Cu powder, Al powder, Ce powder, YSZ powder, Y powder, Mg powder, and RE powder; the article having a fine and homogeneous grain structure; and having a dominant cube oriented {100}<100> orientation texture; and further having a Curie temperature less than that of pure Ni.Type: GrantFiled: October 28, 2002Date of Patent: September 14, 2004Assignee: UT-Battelle, LLCInventors: Amit Goyal, Robert K. Williams, Donald M. Kroeger
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Patent number: 6758881Abstract: Ag particles produced by chemical reduction and having a mean particle size of 5 &mgr;m are added by 0.05-3 wt % and Zn are added by 2-10 wt % to a Pb-less brush body containing graphite, Cu and a metal sulfide solid lubricant of a metal-graphite brush.Type: GrantFiled: March 25, 2003Date of Patent: July 6, 2004Assignees: Tris Inc., Denso CorporationInventors: Takayoshi Otani, Osamu Takada, Mitsuo Ikeda, Yoichi Sakaura, Naoki Morita, Takahiro Sakamoto, Kyoji Inukai, Youichi Murakami, Yasuyuki Wakahara, Masami Niimi, Ryochi Honbo
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Patent number: 6746551Abstract: A make-and-break contact material which is less worn out and is able to achieve an increased life compared to a conventional material of Ag—CdO-based alloy, in an AC general relay used for a resistive load of about 1 to 20A in a range of AC 100V to 250V. In the present invention, the make-and-break contact material of Ag—Ni-based alloy used for a switching part performing electrical switching through mechanical switching operation is the make-and-break contact material of Ag—Ni-based alloy with Ni metal particles dispersed therein which is obtained through mixing and stirring 3.1 to 20.0 wt % of Ni powder, a certain amount of Li2CO3 powder corresponding to 0.01 to 0.50 wt % of metal Li as an additive, and a balance being Ag powder to make a mixture with the above described powders uniformly dispersed therein, and through compacting and sintering the above described mixture.Type: GrantFiled: March 15, 2002Date of Patent: June 8, 2004Assignee: Tanaka Kikinzoku Kogyo K.K.Inventors: Osamu Sakaguchi, Kengo Taneichi, Toshiya Yamamoto
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Patent number: 6692548Abstract: A copper-based sliding material produced by sintering, comprising at least two phases of copper and/or copper alloys which phases have hardness levels different form each other, and hard particles with an average particle size of 0.1 to 10 &mgr;m which are dispersed in at least one phase with the exception of a softest phase in an amount of 0.1 to 10 vol. % of the whole copper-based sliding material, said sliding material satisfying (H2/H1)≧1.2 in which H1 is the Vickers hardness of the softest phase and in which H2 is the Vickers hardness of a phase hardest in hardness including said hard particles.Type: GrantFiled: June 25, 2001Date of Patent: February 17, 2004Assignee: Daido Metal Company Ltd.Inventors: Kenji Sakai, Naohisa Kawakami, Satoru Kurimoto, Takashi Inaba, Koichi Yamamoto, Takayuki Shibayama
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Patent number: 6679933Abstract: A copper graphite composite material suitable for use in applications such as brushes, switches and contact materials for rail systems and other industrial devices. The composite comprises a copper network matrix having a plurality of pores containing graphite. The composite may have an IACS value of at least 40% which may even be higher than 70% and a density value of at least 6.0 g/cm3. The method for preparation of the composite comprises mixing graphite and copper powder under non-oxidising conditions, compacting the mixture and sintering under non-oxidising conditions.Type: GrantFiled: September 7, 2001Date of Patent: January 20, 2004Assignees: Victorian Rail TrackInventors: Da Hai He, Rafael R. Manory, Norman J. Grady, Harry Sinkis, Clim Pacheco
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Patent number: 6638334Abstract: The present invention is aimed at providing a sliding contact material that has an alloy composition containing no harmful substance like Cd, especially excellent contact resistance properties, electrical functions that are good and is not subject to secular change, and abrasion resistance practically bearing comparison with conventional sliding contact materials, and is aimed at lengthening the life of a motor by the use of a sliding contact material having excellent durability as a commutator for a small direct-current motor. The present invention is a sliding contact material of an Ag—Ni-based alloy that is used in sliding part electrically switching on and off by mechanical sliding action, and the material is a sliding contact material of Ni metal particle-dispersed-type Ag—Ni-based alloy that is produced in such a method that 0.7 to 3.0 wt. % Ni powder, an additive of Li2CO3 powder corresponding to 0.01 to 0.50 wt.Type: GrantFiled: July 1, 2002Date of Patent: October 28, 2003Assignees: Mabuchi Motor Co., Ltd., Tanaka Kikinzoku Kogyo K.K.Inventors: Keiji Nakamura, Takemasa Honma, Yasuhiro Hashimoto, Osamu Sakaguchi, Kengo Taneichi, Toshiya Yamamoto
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Patent number: 6635099Abstract: This invention provides a process for forming sintered, molded articles having improved dimensional stability. More particularly, this invention pertains to process for forming heat sinks. This process includes forming a substantially uniform copper composition comprising a polysaccharide binder, water, and copper particles; molding the copper composition under conditions sufficient to form a solid molded intermediate; and sintering the solid molded intermediate at a sufficient temperature and for a sufficient time to form a heat sink.Type: GrantFiled: January 24, 2001Date of Patent: October 21, 2003Assignee: Rutgers, The State University of New JerseyInventors: Jerry C. LaSalle, Mohammad Behi, George A. Glandz, Joan V. Burlew
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Patent number: 6623542Abstract: The slide member 5 slidably guided on the outer peripheral surface of a shaft is formed by adding 10-50% by volume of thermosetting resin to a metal powder consisting mainly of copper powder, iron powder or a mixture thereof and sintering the same at temperatures not less than the sintering temperature of the metal powder.Type: GrantFiled: October 23, 2001Date of Patent: September 23, 2003Assignee: NTN CorporationInventors: Atsuko Yamashita, Yoshinori Itou, Fuminori Satoji
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Patent number: 6613121Abstract: There is provided a sintered material of which dimensional accuracy has been increased by improving the sinterability of Cu—Al based sintered material. More specifically, there are provided a sintered material and a composite sintered contact component, which are excellent in strength, wear resistance, seizure resistance and corrosion resistance. The sintered material is a Cu—Al based sintered material containing at least 1 to 12 wt % Sn and 2 to 14 wt % Al, and the composite sintered contact component is formed by sinter-bonding this sintered material to a metal backing.Type: GrantFiled: June 19, 2001Date of Patent: September 2, 2003Assignee: Komatsu Ltd.Inventors: Takemori Takayama, Yoshikiyo Tanaka
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Patent number: 6572670Abstract: A composition for forming metal objects includes (a) first particles containing a jewelry-metal, and (b) second particles containing a refractory metal oxide. The composition allows the preparation of jewelry-metal in a large variety of colors.Type: GrantFiled: November 14, 2000Date of Patent: June 3, 2003Assignee: Board of Trustees of University of IllinoisInventors: Billie Jean Theide, Rimas T. VisGirda
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Patent number: 6551374Abstract: The present invention relates to a method of controlling the microstructures of Cu—Cr-based contact materials for vacuum interrupters, in which a heat-resistant element is added to the Cu—Cr-based contact materials to obtain an excellent current interrupting characteristic and voltage withstanding capability, and contact materials manufactured thereby. The method of controlling the microstructures of Cu—Cr-based contact materials includes the steps of mixing a copper powder used as a matrix material, a chromium powder improving an electrical characteristic of the contact material and a heat-resistant element powder making the chromium particles in the matrix material fine to thereby obtain mixed powder, and subjecting the mixed powder to one treatment selected from sintering, infiltration and hot pressing to thereby obtain a sintered product.Type: GrantFiled: April 10, 2001Date of Patent: April 22, 2003Assignee: Korea Institute of Science and TechnologyInventors: Jung Mann Doh, Jong Ku Park, Mi Jin Kim
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Patent number: 6544315Abstract: An item of jewelry or decorative article of attractive and original appearance, formed from spheres of sinterable material using a low pressure sintering process such that the spheres retain their individual shapes. The spheres may have diameters in the range 0.1-2.0 mm and may be solid or hollow. Items may be produced using a combination of materials and sphere sizes and may combine elements produced by sintering and by casting. Items of jewelry produced by this method are lighter and more comfortable to wear than those produced by casting.Type: GrantFiled: March 12, 2001Date of Patent: April 8, 2003Inventor: Gadi Har-Shai
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Publication number: 20030049151Abstract: These forged articles are useful as connecting rods. The bushing is assembled during the forging operation of the powder metal connecting rod. This reduces the number of manufacturing operations required to process a powder metal article. The main components of this article are a sintered powder metal perform and preferably a bronze bushing. The bronze bushing is inserted in the bore of the sintered perform of a connecting rod and thereafter forged in during forging then heated to provide bonding between the bushing and connecting rod.Type: ApplicationFiled: September 6, 2001Publication date: March 13, 2003Inventor: Dale E. Wehler
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Publication number: 20030049148Abstract: There is provided a sintered material of which dimensional accuracy has been increased by improving the sinterability of Cu—Al based sintered material. More specifically, there are provided a sintered material and a composite sintered contact component, which are excellent in strength, wear resistance, seizure resistance and corrosion resistance. The sintered material is a Cu—Al based sintered material containing at least 1 to 12 wt % Sn and 2 to 14 wt % Al, and the composite sintered contact component is formed by sinter-bonding this sintered material to a metal baking.Type: ApplicationFiled: June 19, 2001Publication date: March 13, 2003Inventors: Takemori Takayama, Yoshikiyo Tanaka
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Patent number: 6524525Abstract: A method for producing a contact material made of copper and chromium in a proportion of 40 to 75 wt.-% copper and 25 to 60 wt.-% of chromium for contact pieces for vacuum switch devices by pressing the powder mixture, sintering and infiltrating the compact and subsequent reshaping into a semi-finished contact material product having a density which corresponds to at least 99% of the theoretical density, as well as to contact pieces made of this semi-finished contact material product.Type: GrantFiled: March 2, 2001Date of Patent: February 25, 2003Assignees: Metalor Technologies International SA, Moeller GmbHInventors: Franz Hauner, Susett Rolle, Alfredo Lietz
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Publication number: 20030015062Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 &mgr;m to less than 1.5 &mgr;m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C.Type: ApplicationFiled: August 13, 2002Publication date: January 23, 2003Applicant: Dowa Mining Co., LTDInventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
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Patent number: 6436550Abstract: A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink main body 2 comprises a substrate 3, a plurality of projections 4 integrally formed with the substrate 3 on its heat dissipation surface, and a molded frame 5 integrally formed with the substrate 3 to surround the projections 4. On each corner of the substrate 3 is formed a circular molded hole 6. The opposite surface of the substrate 3 is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver.Type: GrantFiled: August 25, 1997Date of Patent: August 20, 2002Assignee: Injex CorporationInventors: Masaaki Sakata, Shoji Takahashi, Kenichi Shimodaira
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Method for preparing Ag-ZnO electric contact material and electric contact material produced thereby
Patent number: 6432157Abstract: An object of the present invention is to provide a method of producing an Ag—ZnO electric contact material which can uniformly disperse ZnO micrograms in Ag; which maintains low contact resistance; which exhibits enhanced welding resistance and wear resistance; and which is suitable in view of production costs. The method of producing an Ag—ZnO electrical contact material comprises casting Ag and Zn at predetermined proportions and subjecting the resultant Ag—ZnO alloy to internal oxidation so as to disperse ZnO in Ag, the method being characterized in that an Ag—Zn alloy comprising 5-10 wt. % (as reduced to weight of metal) Zn, the balance being Ag, is formed into chips; the chips are subjected to internal oxidation; the internally oxidized chips are compacted to thereby form billets; the billets are pressed and sintered; and subsequently, the sintered billets are extruded, to thereby yield uniform dispersion, in Ag, of ZnO micrograms.Type: GrantFiled: November 30, 2000Date of Patent: August 13, 2002Assignee: Tanaka Kikinzoku Kogyo K.K.Inventors: Tetsuya Nakamura, Osamu Sakaguchi, Hiroyuki Kusamori, Osamu Matsuzawa, Masahiro Takahashi, Toshiya Yamamoto -
Patent number: 6399019Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.Type: GrantFiled: August 16, 2000Date of Patent: June 4, 2002Assignee: Dowa Mining Co., Ltd.Inventors: Masami Sakuraba, Masami Kimura, Masaya Takahara, Junji Nakamura
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Patent number: 6383248Abstract: A wedding ring is manufactured by a process comprising the production of a metal powder by the atomizing of a stream of molten precious metal, for example a gold alloy, the compaction of the metal powder into a hollow cylindrical body, the sintering of the compacted body, optionally the compression of the sintered body into a more toroidal shape, optionally the sintering of the toroidal body and the subjecting of the body to ring-rolling and annealing. The powder that is compacted any also comprise a minor proportion of precious-metal powder obtained by means other than atomization. The process may also be applied to the manufacture of artifacts other than rings by compacting the powder into an appropriate shape and modifying the compressing step, if employed, as appropriate to the intended product; in such embodiments, the ring-rolling step may be replaced by an appropriate step of further modifying the shape and/or dimension of the body. or may be omitted entirely.Type: GrantFiled: March 23, 2000Date of Patent: May 7, 2002Assignee: Engelhard-CLAL UK Ltd.Inventors: Terence Ernest Taylor, Stephen Paul Hurford
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Patent number: 6375706Abstract: A composition for drill bit bodies and a method for making drill bits from the composition are disclosed. The composition includes powdered tungsten carbide, and binder metal consisting of a composition by weight of manganese in a range of about zero to 25 percent, nickel in a range of about zero to 15 percent, zinc in a range of about 3 to 20 percent, tin in a range of more than 1 percent to about 10 percent, and copper making up the remainder by weight of the composition. In one embodiment, the composition includes about 6 to 7 percent tin therein. The composition is heated to at least the infiltration temperature in a mold for form a drill bit body.Type: GrantFiled: January 11, 2001Date of Patent: April 23, 2002Assignee: Smith International, Inc.Inventors: Kuttaripalayam T. Kembaiyan, Thomas W. Oldham
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Publication number: 20020026855Abstract: A copper-based sliding material produced by sintering, comprising at least two phases of copper and/or copper alloys which phases have hardness levels different form each other, and hard particles with an average particle size of 0.1 to 10 &mgr;m which are dispersed in at least one phase with the exception of a softest phase in an amount of 0.1 to 10 vol.% of the whole copper-based sliding material, said sliding material satisfying (H2/H1)≧1.2 in which H1 is the Vickers hardness of the softest phase and in which H2 is the Vickers hardness of a phase hardest in hardness including said hard particles.Type: ApplicationFiled: June 25, 2001Publication date: March 7, 2002Applicant: DAIDO METAL COMPANY LTD.Inventors: Kenji Sakai, Naohisa Kawakami, Satoru Kurimoto, Takashi Inaba, Koichi Yamamoto, Takayuki Shibayama
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Patent number: 6352649Abstract: The present invention provides magnetostrictive composites that include an oxide ferrite and metallic binders which provides mechanical properties that make the magnetostrictive compositions effective for use as sensors and actuators.Type: GrantFiled: April 17, 2000Date of Patent: March 5, 2002Assignee: Iowa State University Research Foundation Inc.Inventors: R. William McCallum, John E. Snyder, Kevin W. Dennis, Carl R. Schwichtenberg, David C. Jiles
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Patent number: 6350294Abstract: The present invention relates to powder-metallurgically produced composite material comprising a matrix of a metal with a melting point of at most 1,200° C. and a granular additive which consists of at least two refractory components embedded in said matrix, characterized in that the refractory components are present as mixed crystals or intermetallic phases. In one embodiment of the invention one or a first group of refractory component(s) has a melting point in the range of 1,500 to 2,400° C. and the second or the second group of refractory component(s) has a melting point above 2,400° C. The composite material is produced by heating a pulverized mixture of the refractory components, thus converting it into a mixed crystal or an intermetallic phase, and then combining the powder obtained by cooling and pulverizing with a metal matrix having a melting point of at most 1,200° C. by means of powder-metallurgy.Type: GrantFiled: January 25, 2000Date of Patent: February 26, 2002Assignee: Louis Renner GmbHInventors: Gerd Renner, Udo Siefken
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Patent number: 6334914Abstract: Disclosed is a copper alloy sliding material comprising 0.5 to 15 mass % Sn and 0.1 to 10 vol % of hard particles consisting of one or more selected from WC, W2C and Mo2C. The hard particles have preferably an average particle size of 0.1 to 10 &mgr;m, whereby they are dispersed in the copper alloy matrix so as to make the sliding-contact surface uneven, from which the hard particles protrude partially. The sliding material comprises an amount or a total amount of not more than 40 mass % of one or more selected from Ni, Ag, Fe, Al, Zn, Mn, Co, Si and P, an amount or a total amount of not more than 10 mass % of Bi and/or Pb, and/or an amount or a total amount of not more than 10 vol % of a solid lubricant comprising BN, graphite, MoS2 and/or WS2.Type: GrantFiled: December 28, 2000Date of Patent: January 1, 2002Assignee: Daido Metal Company Ltd.Inventors: Kenji Sakai, Naohisa Kawakami, Satoru Kurimoto, Takashi Inaba, Koichi Yamamoto, Takayuki Shibayama
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Publication number: 20010055695Abstract: A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 &mgr;m Ra and then fine finished by polishing to a roughness of at most 0.1 &mgr;Ra.Type: ApplicationFiled: March 19, 2001Publication date: December 27, 2001Inventors: Issaku Sato, Naoki Sato
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Patent number: 6325839Abstract: Metal materials are sintered using microwave energy to provide high strength dental restorations. The metal materials used to manufacture the dental restorations herein are sintered to high density to provide high strength products that have a density close to the density achieved when the same materials are cast. A dense solid having a fine microstructure is achieved using microwave heating. Through the process described herein, higher heating rates may be achieved, reducing the time necessary for sintering the materials. The process is faster than conventional processes used in the manufacture of dental restorations, eliminates time-consuming steps typically involved in the lost wax process and provides materials with better grain-size control and properties. It is possible to produce high strength dental restorations at lower temperatures having high hardness and density and small grain size.Type: GrantFiled: July 20, 2000Date of Patent: December 4, 2001Assignee: Jeneric/Pentron, Inc.Inventors: Arun Prasad, Gordon S. Cohen
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Patent number: 6322902Abstract: There are disclosed copper-base and/or iron-base contact materials which contain a Pb intermetallic compound dispersedly precipitated therein and which have highly improved sliding properties. Double layered contact elements improved in oil impregnation and lubricity are formed by sinter bonding the above contact materials to an iron-base metal backing, respectively. Economical producing methods for such double layered contact materials are also disclosed. In the copper-base and/or iron-base contact materials, one or more kinds of Pb intermetallic compounds are dispersedly precipitated.Type: GrantFiled: January 22, 1999Date of Patent: November 27, 2001Assignee: Komatsu Ltd.Inventors: Takemori Takayama, Yoshikiyo Tanaka
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Patent number: 6312495Abstract: The present invention relates to a powder-metallurgically produced composite material comprising a matrix and a granular additive comprising at least one fine-grained refractory metal with an average grain size of at most 2 &mgr;m uniformly distributed in the matrix, so that the composite exhibits a residual porosity of <0.5%. Furthermore, the invention relates to a method for the production of the composite and its use as an electrical contact material.Type: GrantFiled: April 7, 2000Date of Patent: November 6, 2001Assignee: Louis Renner GmbHInventors: Gerd Renner, Udo Siefken
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Patent number: 6290744Abstract: A sinter of noble metal produced by forming in a required shape or attaching to a given object a plastic art grade clayish composition or adhesion composition comprising a noble metal powder containing at least one member selected from the group consisting of pure noble metal powders and noble metal alloy powders, 0.022-3.0 wt. % of a water-soluble cellulose type resin, 0.02-3.0 wt. % of starch, or 0-0.5 wt. % of a reticular macromolecular substance formed by condensation of a component unit having phenyl propane as a backbone as an organic type binder, and water, drying to hardness the shaped composition or adhering composition, and sintering the hardened shaped composition or adhering composition at a temperature in the range of from the melting point of the noble metal and 70° C. lower than the melting point. A method for the production of the sinter of noble metal. A sinter of noble metal and an attached sinter of noble metal.Type: GrantFiled: November 19, 1999Date of Patent: September 18, 2001Assignee: Aida Chemical Industries Co., Ltd.Inventors: Atsushi Fujimaru, Katsuhiko Shimamoto, Hitoshi Araki, Makoto Miyata
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Patent number: 6284013Abstract: There is provided a high-purity ruthenium sputtering target with a low impurity content, in particular producing extremely few particles, which is suitable for applications such as the formation of semiconductor thin films. The high-purity ruthenium sputtering target is manufactured by feeding crude ruthenium powder into a sodium hydroxide solution; blowing an ozone-containing gas while or after blowing chlorine gas into the solution to form ruthenium tetroxide; absorbing the ruthenium tetroxide in a hydrochloric acid solution or a mixed solution of hydrochloric acid and ammonium chloride, and evaporating the solution to dryness; sintering the resultant ruthenium salt in a hydrogen atmosphere to form high-purity ruthenium powder; and hot-pressing the ruthenium powder into a sputtering target.Type: GrantFiled: March 8, 2000Date of Patent: September 4, 2001Assignee: Japan Energy CorporationInventors: Yuichiro Shindo, Tsuneo Suzuki
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Patent number: 6280496Abstract: A silicon carbide based composite material includes as a first component, a metal mainly consisting of aluminum or copper, and as a second component, particles mainly consisting of silicon carbide having high purity and few defects. The material is obtained by heating a compact of the raw material powder containing the first and second components at a temperature not lower than the melting point of the metal mainly consisting of aluminum or copper, and by forging and solidifying under pressure. Preferably, the silicon carbide raw material powder is prepared to have high purity by carrying out a preliminary treatment, or the material after forging or a material obtained through a conventional infiltration process is further heated at a temperature lower than the melting point of the first component. In this manner, an improved superior thermal conductivity can be obtained.Type: GrantFiled: September 8, 1999Date of Patent: August 28, 2001Assignee: Sumitomo Electric Industries, Ltd.Inventors: Chihiro Kawai, Shin-ichi Yamagata, Akira Fukui, Yoshinobu Takeda
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Patent number: 6271585Abstract: A heat sink substrate comprises a Cu—Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu—Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.Type: GrantFiled: July 7, 1998Date of Patent: August 7, 2001Assignee: Tokyo Tungsten Co., Ltd.Inventors: Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa
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Publication number: 20010008703Abstract: A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink main body 2 comprises a substrate 3, a plurality of projections 4 integrally formed with the substrate 3 on its heat dissipation surface, and a molded frame 5 integrally formed with the substrate 3 to surround the projections 4. On each corner of the substrate 3 is formed a circular molded hole 6. The opposite surface of the substrate 3 is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver.Type: ApplicationFiled: August 25, 1997Publication date: July 19, 2001Inventors: MASAAKI SAKATA, SHOJI TAKAHASHI, KENICHI SHIMODAIRA