Abstract: A cutting apparatus is provided with a first blade (48, 82), a second blade (50, 84) intersecting with the first blade (48, 82), and a switching unit (72). The switching unit (72) switches between a first mode and a second mode. In the first mode, the first blade (48, 82) positions in a cutting position in which it is possible to cut a work-piece (12) and the second blade (50, 84) positions in a non-cutting position in which it is impossible to cut the work-piece (12). In the second mode, the second blade (50, 84) positions in the cutting position in which it is possible to cut the work-piece (12) and the first blade (48, 82) positions in the non-cutting position in which it is impossible to cut the work-piece (12).
Abstract: A method and related apparatus for scoring a workpiece are disclosed. A first scoring die has a score section structured to score a workpiece in a predetermined pattern, a second scoring die having as a score section structured to score a workpiece in a predetermined pattern substantially identical to the predetermined pattern of the first score scoring die. In operation the method and apparatus align the first scoring die and second scoring die and score the workpiece from opposite sides to effect complete or substantially complete reduction of the workpiece in a predetermined path to define a part. The workpiece will generally be a sheet. The scoring dies will each have score sections having one surface configured to be substantially perpendicular to the longitudinal axis of the workpiece and an adjacent angularly disposed surface structured to be adjacent to the scrap being produced by the scoring operation.
Type:
Application
Filed:
June 9, 2014
Publication date:
December 18, 2014
Applicant:
OBERG INDUSTRIES
Inventors:
MATTHEW RAYMOND KONIECZNY, RICHARD GENE DeCROO
Abstract: A sheet metal blanking die assembly is described. The assembly has a lower and an upper part and guide columns to maintain the parts aligned during the movement of the upper part relative to the lower part. The upper and lower part present flat parallel mutually opposing horizontal portions. The lower flat portion receives the sheet metal, while the upper flat portion presents a plurality of punches projecting downwards from it when the die assembly is closed by the action of a press. Blanking recesses are present in the flat lower portion to receive the respective punches. The die assembly presents a differential rotation device for a blanking unit positioned to correspond with at least one blanking position.
Type:
Grant
Filed:
July 20, 2012
Date of Patent:
July 29, 2014
Assignee:
Corrada S.p.A.
Inventors:
Massimo Negrello, Dario Muti, Maurizio Perucchi, Mario Checchin
Abstract: A die cutting system that includes a press and a substantially planar die with a plate and at least one cutting edge protruding from a surface of the plate. The press is manually operated and may be hand-held or supported upon a flat surface, such as a tabletop. A first member of the press receives the substantially planar die, while a second member of the press provides support for a sheet of material from which the die will cut a pattern upon biasing the die against the sheet of material. Manually operated presses and die cutting methods that employ teachings of the invention are also disclosed.
Abstract: To provide a die set having rigid guide posts and rigid guide bushes which are fitted to each other. In the guide post and the guide bush having a sliding portion with a fitting clearance on the fitting surface thereof, even if an axis of the guide bush is tilted with respect to an axis of the guide post, the guide bush can be externally fitted onto the guide post easily. The guide post or the guide bush has a tip portion with a clearance slightly larger than the fitting clearance with respect to a mating element near the fitting tip end on the fitting surface, and a relief groove is provided around an entire circumference between a sliding portion having the fitting clearance and the tip portion. A distance from the tip portion to the sliding portion preferably has a predetermined or greater length.
Abstract: A combination of a die retention pallet and a material cutting device for cutting material using blade-cut dies includes the device having a base, a pressing device mounted on and spaced from the base operative to exert force towards the base, and a pressing device engager operative to engage the pressing device and thereby drive the pressing device to exert force towards the base and the die retention pallet. The die retention pallet includes an open-top box having a base wall and at least two opposite side walls mounted on and extending upwards from the base wall, the die retention pallet dimensioned to fit within the material cutting device between the base and the pressing device of the material cutting device. The present invention also includes a die cover lid operative to cover a blade-cut die supported on the base wall of the die retention pallet.
Abstract: A punch and die set is provided for use in a stamping press having a punch assembly and a die assembly reciprocated by a driving mechanism. The punch and die assemblies are aligned to a common center and are structured to slidably engage one another for positive guidance of the punch and die tools without the need for other guidance by shafts, bars or the like. One of the punch assembly and die assembly can be non-fixedly carried by the drive mechanism, allowing the guidance of the engaged punch and die assemblies to define the relative positions of the tools. This arrangement eliminates any stack-up of tolerances between the assemblies and substantially reduces misalignment during stamping, including any misalignment that may be introduced by the press driving mechanism.
Abstract: A combination of a die retention pallet and a material cutting device for cutting material using blade-cut dies includes the device having a base, a pressing device mounted on and spaced from the base operative to exert force towards the base, and a pressing device engager operative to engage the pressing device and thereby drive the pressing device to exert force towards the base and the die retention pallet. The die retention pallet includes an open-top box having a base wall and at least two opposite side walls mounted on and extending upwards from the base wall, the die retention pallet dimensioned to fit within the material cutting device between the base and the pressing device of the material cutting device. The present invention also includes a die cover lid operative to cover a blade-cut die supported on the base wall of the die retention pallet.
Abstract: Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includes upper and lower die assemblies mounted for movement relative to each other on a support base. The upper die assembly includes an actuator and a die block supporting plural sets of cutter blades arranged in patterns to cut rectangular shaped semiconductor packages out of the substrate in a single cutting operation at a single station. The lower die assembly includes plural punch members movable relative to a die block, which includes a support surface for supporting the substrate in a predetermined position as determined by spaced apart locator pins on the lower die assembly registerable with corresponding locator holes in a carrier frame for the substrate.
Type:
Grant
Filed:
February 1, 2000
Date of Patent:
January 30, 2001
Assignee:
Semiconductor Technologies & Instruments, Inc.
Abstract: Apparatus for cutting single or multiple semiconductor packages from a multilayer substrate wherein the semiconductor packages are partially encapsulated by an elastomer sealant layer disposed on a polymer film layer of the substrate. The apparatus includes upper and lower die assemblies mounted for movement relative to each other on a support base. The upper die assembly includes an actuator and a die block supporting plural sets of cutter blades arranged in patterns to cut rectangular shaped semiconductor packages out of the substrate in a single cutting operation at a single station. The lower die assembly includes plural punch members movable relative to a die block, which includes a support surface for supporting the substrate in a predetermined position as determined by spaced apart locator pins on the lower die assembly registerable with corresponding locator holes in a carrier frame for the substrate.
Type:
Grant
Filed:
November 23, 1998
Date of Patent:
January 16, 2001
Assignee:
Semiconductor Technologies & Instruments, Inc.
Abstract: An apparatus is disclosed for bringing a cutting die into engagement with a workpiece such as leather, the apparatus includes first and second plates secured to C-shaped frame members and a platen for supporting the workpiece that is movable relative to the second plate upon inflation of a bladder secured to the periphery of the second plate upon actuation of first and second valves connected between a source of pressurized air and the bladder.