Patents Represented by Attorney, Agent or Law Firm A. Kate Huffman
  • Patent number: 7754671
    Abstract: This invention relates to a aqueous liquid laundry composition which both cleans and conditions fabrics. The composition includes certain alcohol ethoxylates as a nonionic surfactant component, certain alkyl ether sulfates as an anionic component and a quaternary ammonium fabric softening agent. All of the foregoing are in specified proportions.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: July 13, 2010
    Assignee: The Dial Corporation
    Inventors: Bin Lin, Michael Lewis, Thorsten Bastigkeit
  • Patent number: 7099498
    Abstract: A system and a method for minutiae record matching is claimed that includes the processing a first plurality of ordered minutiae match values with weighting values corresponding to a function of at least the number of minutiae in the corresponding latent print and the corresponding print in the tenprint for a given unweighted match value to define a second plurality of weighted match values. The second plurality of weighted match values may be further normalized based at least on the highest unweighted match value to generated a third plurality of weighted match values.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: August 29, 2006
    Assignee: Motorola, Inc.
    Inventor: Peter Zhen-Ping Lo
  • Patent number: 7072496
    Abstract: A system and a method for segmenting slap fingerprints is described. The method includes providing a print image, optionally pre-processing the print image, detecting at least a plurality of image components of the print image, determining at least one segmentation boundary for the print image, and computing the convex hull of the image components. The orientation, relative orientation and placement of the image components are detected. The zone lines of each component are found and zone areas are defined. The components under the top component of each zone are deleted. The finger numbers are assigned in accordance with the anchor print component, the geometrical relationship among the components. The slap print image is segmented in accordance with the segmentation boundary and its neighboring boundaries.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: July 4, 2006
    Assignee: Motorola, Inc.
    Inventors: Peter Zhen-Ping Lo, Pathamadai V. Sankar
  • Patent number: 6805820
    Abstract: This invention relates to an apparatus end method for introducing various additives in solid form into a soap mass for the ultimate manufacture of soap bars. Specifically, the invention is directed to producing soap bars having a multicolored or marbleized appearance and made from a variety of different colored soap materials. Soap pellets having a color are introduced into a soap plodder as is customary. A second or alternate color of soap pellet is separately introduced into the interior of the plodder just before that point where the helical screw of the plodder enters the barrel of the extruder portion of the plodder.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: October 19, 2004
    Assignee: The Dial Corporation
    Inventor: E. Gary Myers
  • Patent number: 6541989
    Abstract: A testing device for semiconductor components and a method of making the device is described. The testing device includes a support structure having an outer edge, and an adhesive film disposed on the support structure to hold a semiconductor wafer in position on the support structure so that neither the adhesive film nor the semiconductor wafer extends beyond the outer edge of the support structure.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: April 1, 2003
    Assignee: Motorola, Inc.
    Inventors: Mark D. Norris, Jeffrey S. Hughes, Roy Russell Brown
  • Patent number: 6482073
    Abstract: Chemical mechanical planarization (CMP) of semiconductor wafers presents a harsh abrasive and chemical environment for equipment used in a polishing process. Prior art translation mechanisms are prone to failure due to corrosion and require maintenance that exposes the polishing process to contamination from lubricants. A translation mechanism (31) requiring no lubrication is designed to have maintenance at intervals greater than a CMP tool. The translation mechanism (31) includes a housing (32) and a moveable mount (33). The housing (32) and the moveable mount (33) are made of hardened stainless steel which is impervious to the CMP environment. Bearing shafts (39) buffer a threaded shaft (36) from side loading on the moveable mount (33). Polymer bearings (51) connected to moveable mount (33) provide a low friction contact surface to bearing shafts (39). A polymer translation nut (41) connects to the moveable mount (33) and is threaded onto the threaded shaft (36).
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: November 19, 2002
    Assignee: Motorola, Inc.
    Inventor: James F. Vanell
  • Patent number: 6465281
    Abstract: A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer before dicing of the wafer into individual chips. A cap wafer may be bonded to the semiconductor substrate using a low temperature frit glass layer as a bonding agent. The frit glass layer is in direct contact with the device. A hermetic seal is formed by a combination of the semiconductor substrate wafer, the cap wafer and the frit glass layer. A second embodiment of the package does not contain a cap wafer.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: October 15, 2002
    Assignee: Motorola, Inc.
    Inventors: DaXue Xu, Henry G. Hughes, Paul Bergstrom, Frank A. Shemansky, Jr., Hak-Yam Tsoi
  • Patent number: 6406555
    Abstract: A dilution tool (100) and a method to prepare a solution by mixing of two fluids in a filter (130) to form a desired solution. Sealless pumps (141, 142) are driven by a common motor (143) to pump the fluids at a constant ratio of their respective flow rates while the flow rate of the solution varies. The conductivity or resistivity of the solution is measured with a measurement device (166) to determine the concentration.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: June 18, 2002
    Assignee: Motorola Inc.
    Inventors: James A. Grootegoed, James F. Vanell
  • Patent number: 6368929
    Abstract: A method of manufacturing a semiconductor component and the component thereof includes forming a dielectric layer (620) over a portion of a passivation ledge (640) in an emitter layer (280) and overlapping a base contact (660) onto the dielectric layer (620).
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: April 9, 2002
    Assignee: Motorola, Inc.
    Inventors: Darrell G. Hill, Mariam G. Sadaka, Jonathan K. Abrokwah
  • Patent number: 6361675
    Abstract: A method of manufacturing a semiconductor component includes depositing a first electrically conductive layer (675) over a substrate (270), forming a patterned plating mask (673) over the first electrically conductive layer, coupling a first plating electrode (250) to the first electrically conductive layer without puncturing the plating mask, and plating a second electrically conductive layer onto portions of the first electrically conductive layer. A plating tool for the manufacturing method includes an inner weir (220) located within an outer weir (210), an elastic member (230) over a rim (211) of the outer weir, a pressure ring (240) located over the rim of the outer weir and the elastic member, and a plurality of cathode contacts (250, 251, 252, 253) located between the pressure ring and the outer weir. The substrate is positioned between the elastic member and the pressure ring.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: March 26, 2002
    Assignee: Motorola, Inc.
    Inventors: Timothy Lee Johnson, Joseph English, David Austin, George F. Carney, Kandis Mae Knoblauch, Douglas G. Mitchell
  • Patent number: 6318174
    Abstract: A sensor has an electrode (120) that is movable along three mutually perpendicular axes (10, 11, 12). The sensor also has stationary over-travel limiting structures that restrict the movement of the electrode (120) along the three axes (10, 11, 12).
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: November 20, 2001
    Assignee: Motorola, Inc
    Inventors: John E. Schmiesing, Guang X. Li, Juergen A. Foerstner, Muh-Ling Ger, Paul L. Bergstrom, Frank A. Shemansky, Jr.
  • Patent number: 6309908
    Abstract: An electrical 100 and a method of making the package is disclosed. Specifically the package 100 contains a lid 101 with at least one opening 105 through the lid 101 into a cavity 180 surrounding the die 120 between the lid 101 and the substrate 130 of the package 100. Underfill material 150 is injected through the opening 105 to at least partially fill the cavity 180 to prevent both vertical and horizontal die cracking and to provide a more reliable package.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: October 30, 2001
    Assignee: Motorola, Inc.
    Inventors: Vijay Sarihan, Lei L. Mercado
  • Patent number: 6309918
    Abstract: A manufacturable GaAs VFET process includes providing a doped GaAs substrate with a lightly doped first epitaxial layer thereon and a heavily doped second epitaxial layer positioned on the first epitaxial layer. A temperature tolerant conductive layer is positioned on the second epitaxial layer and patterned to define a plurality of elongated, spaced apart source areas. Using the patterned conductive layer, a plurality of gate trenches are etched into the first epitaxial layer adjacent the source areas. The bottoms of the gate trenches are implanted and activated to form gate areas. A gate contact is deposited in communication with the implanted gate areas, a source contact is deposited in communication with the patterned conductive layer overlying the source areas, and a drain contact is deposited on the rear surface of the substrate.
    Type: Grant
    Filed: September 21, 1998
    Date of Patent: October 30, 2001
    Assignee: Motorola, Inc.
    Inventors: Jenn-Hwa Huang, Benjamin W. Gable, Kurt Eisenbeiser, David Rhine
  • Patent number: 6307452
    Abstract: A micro electromechanical switch is formed on a substrate using a microplatform structure suspended on a spring suspension. The spring suspension is attached on one end to an anchor structure and extends in a substantially octagonal direction over a signal line. The microplatform has a shorting bar positioned facing a gap in the signal line and an electrical corset is formed on the signal fine to form a capacitor structure which is electrostatically attractable toward a bottom electrode upon application of a selected voltage. The switch functions from DC to at least 50 GHz with an electrical isolation of 35 dB and an insertion loss of 0.5 dB at 20 GHz. The RF switch has applications in telecommunications including wireless communications.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: October 23, 2001
    Assignee: Motorola, Inc.
    Inventor: Xi-Qing Sun
  • Patent number: 6263605
    Abstract: A pad conditioner coupling (58) holds an end effector (57) for abrading a polishing media surface. Pad conditioning planarizes the polishing media surface, removes particulates, and roughens the polishing media surface to promote the transport of polishing slurry. Pad conditioner coupling (58) comprises shoulder screws (50), polymer bearings (51), a static plate (52), a wave spring (54), and a floating plate (55). Wave spring (54) is placed between static plate (52) and floating plate (55). The shoulder screws (50) connect through the static plate (52) and fasten to the floating plate (55) to hold the wave spring (54) in a preloaded condition. The polymer bearings (51) prevent the shoulder screws (50) from contacting the static plate (52). Wave spring (54) allows the floating plate (55) to move in a non-parallel position to the static plate (52) for angular compensation in the pad conditioning process.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: July 24, 2001
    Assignee: Motorola, Inc.
    Inventor: James F. Vanell
  • Patent number: 6228275
    Abstract: A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: May 8, 2001
    Assignee: Motorola, Inc.
    Inventors: Daniel J. Koch, Jonathan H. Hammond, Daniel N. Koury, Jr., Jonathan F. Gorrell
  • Patent number: 6221686
    Abstract: An image sensor (10) has an image sensing element that includes an N-type conducting region (26) and a P-type pinned layer (37). The two regions form two P-N junctions at different depths that increase the efficiency of charge carrier collection at different frequencies of light. The conducting region (26) is formed by an angle implant that ensures that a portion of the conducting region (26) can function as a source of a MOS transistor (32).
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: April 24, 2001
    Assignee: Motorola, Inc.
    Inventors: Clifford I. Drowley, Mark S. Swenson, Jennifer J. Patterson, Shrinath Ramaswami
  • Patent number: D543855
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: June 5, 2007
    Assignee: The Dial Corporation
    Inventors: Keith Cardinal, Sheldon Eric Yourist, April Peacock
  • Patent number: D544085
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: June 5, 2007
    Assignee: The Dial Corporation
    Inventors: Gregory Schriner, Paul Pappalardo, Vanessa Kamerer, Ivan Brousseau, Marc Drucker, Jean Marcoux, Walter Francovich, Francois Duval
  • Patent number: D545681
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: July 3, 2007
    Assignee: The Dial Corporation
    Inventors: Keith Anthony Cardinal, Sheldon Eric Yourist, Henry Eric Hendrix