Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the "flip chip" technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract: Heat transfer through a heat pipe from a heat source on one side of a hinge to a heat dissipation capability on the other side of the hinge is achieved by providing a rotatable coupler with a thermal transfer body mounted on the side of the hinge away from the heat source and wherein a rotational interface surface area between the thermal transfer body and the heat pipe is larger than the outside of the heat pipe.

Abstract: An improved primary to secondary heat pipe thermal transfer connector for a hinged electronic apparatus package is achieved through the use of a thermal transfer block with a sleeve positioned on the hinge centerline of a hinged apparatus package and in a groove in the thermal transfer block. The primary heat pipe end is fused into the thermal transfer block and all secondary heat pipe ends are fused into the sleeve. The contact interface between the thermal transfer block and the sleeve is spring loaded.

Abstract: A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.

Abstract: A portable or notebook type computer communication interface that permits portable computers to be reliably used in a data processing network. The interface involves communication circuitry, special device inputs and power monitoring and charging. A flexible portable computer wireless time and frequency division network is formed using a time and frequency division multiplexed communication channel assignment feature that together with a wireless link establishes a unique direct communication channel between data processing devices on different levels with data packet type transmission security. The principle permits each portable computer in the network to communicate with any other and any and all can transmit and receive at the same time.

Abstract: The invention makes the size of the apparent image of the display screen of the display screen larger than the real size. A flat optical magnifier such as a lens of the fresnel type is positioned in an optically enhancing location between the operator and the display screen so that the apparent image at the operator side of the magnifier is greater than the actual image that is present on the display screen. A mechanism is provided for a notebook type portable computer that is passive to a user, folds into the case when the display screen closes over the keyboard and positions a fresnel lens, coplanar with and at a fixed distance from the display screen, when the notebook computer is opened and remains at that fixed distance as the display screen moves to maximum travel.

Abstract: Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device interfaced with the thermal reservoir and the ambient surrounding the housing so as to provide a refrigeration function for the thermal reservoir. A high heat capacity or high latent heat of phase transition material can be used for the thermal reservoir. In a portable computer with a battery power supply, the thermal reservoir can be independent or the battery can be employed in the thermal reservoir functions.

Abstract: Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.

Abstract: A component machine testing technique is provided that performs diagnostic analysis on a vibration signal of the component machine that has been separated from power and load machine background noise in a first neural network. The diagnostic analysis, with operator direction through an interactive interface, uses a second neural network in performing a series of diagnostic operations followed by archival of any experience acquired in the testing operation being performed.In the diagnostic analysis, both time based and frequency based vibration signal information from the component machine under test are used together through a simultaneous multiple display interactive interface under operator direction.

Abstract: The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding.

Abstract: A structural principle is described for control of the gap and the area around the periphery of a liquid crystal display by the formation of an insulating layer out of which, gap dimension maintaining posts and contaminant diffusion inhibiting segmented walls, remain after the display area is etched back out of the layer.

Abstract: The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the cirduit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.

Abstract: An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Abstract: A piston position sensing system in which tabulated resonance width related information is stored in a form correlated with piston travel so that measured resonance width information can be compared with the stored information in determining piston position and compensation for the velocity of the piston is provided by correction for a time difference in serial sensing between the initial and the following extremes of a resonance signal as the piston moves. the compensation is developed from velocity information identified through previous and current processing cycles which assures reliability in detection of the subsequently sensed portion of the resonance signal envelope and enhanced sensitivity and accuracy through automatic application incrementally in a dynamic gain adjustment of the sensing system.

Abstract: A system of using a rotatable key in the insertion of a conductor bearing card edge into a slotted supporting connector to accommodate a large number of different cards. A rotatable key opening in the slot face of the slotted supporting connector together with a specific card feature accommodating key positioned in the opening are arranged so that the key can be in one of several positions controlled by the opening with the shape of the key providing an interruption to the continuity of the slot at different distances along the slot length. The card has at least one notch in the insertion edge positioned to be at the slot interruption distance for the particular position of the key. A large number of unique distances are achievable with a single key part.

Abstract: An intraoral interactive communication system wherein through a mouthpiece tongue pressure coded electrical signals are delivered to a processor. The mouthpiece is constructed to conform to the shape of the roof of the mouth, and is positioned behind the upper teeth. The mouthpiece is laminar in structure with an array of pressure responsive locations. A separate pressure responsive location is provided which may actuate a head aimed light. A display is connected to the processor and viewable by the human communicator providing feedback to the communicator.

Abstract: In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability for optical alignment and for bonding heat and pressure. The tool members retain a first, position registered, apparatus part, with "X" - "Y" registration capability, in position with an edge bearing a fine conductor periodicity accessable by a tapered edge of the tool which permits optical fine alignment adjustment and bonding heat and pressure application.

Abstract: Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Abstract: A control system for the use of the main engine of a vehicle as a heat source in maintaining the temperature of an operator compartment. The system is manually enabled subject to multiple criteria, the temperature in the operator compartment is monitored, and signals for the desired operator compartment temperature within an about plus or minus 10 degrees control range are produced. The main engine of the vehicle is enabled to start and run by all standard safety features and with a fuel flow controlled idle power output. Cycling through the starting and stopping of the engine is accomplished in response only to the temperature monitor signals. Disconnect of the operator compartment temperature control is accomplished manually by the operator, usually by actuating the operator controls.

Abstract: In a bonding station the parts of the apparatus to be bonded are retained at a thermal bias temperature at a permitted level and a thermal check valve interface is provided between the bonding location and the part of the station that would serve as a conduction heat sink, thereby thermally insulating other uninvolved parts of the structure and and confining the bonding heat to the bonding region. Such confinement reduces the dwell time that the bond must remain at the bonding temperature. The bonding station has a number of features: the parts to be bonded are maintained on a support member that is provided with a heat biasing capability that can establish the assembly at a specified temperature; a retention capability, such as the use of vacuum, is provided to maintain registration and thermal contact of the part with the support; and a thermal check valve capability is provided to control the rate of heat flow through the support member so that locallized heat is controlled in dissipation.