Abstract: A pair of equivalent controlled impedance buffers are connected in a push-pull configuration to the primary coil of a transformer. A pair of equivalent pre-drivers are connected to the pair of buffers. Each pre-driver receives a driver input signal and outputs a buffer input signal and a flyback compensation signal proportional thereto. Each buffer receives the buffer input signal generated from one of the pre-drivers for buffered output as a line driver signal to the primary coil. A flyback voltage effect is induced in each buffer due to the line driver signal applied to the primary coil by the other buffer. Each buffer further receives the flyback compensation signal generated from the other one of the pre-drivers, with the buffer operating to cancel the flyback voltage effect induced in that buffer by the line driver signal applied to the primary coil by the other buffer using the flyback compensation signal received from the other one of the pre-drivers.

Abstract: A method and apparatus for testing a random access memory device, such as a dynamic random access memory device embedded within an integrated circuit chip. The apparatus includes one or more rows of transistors, each of which is connected to a bit line pair of the memory device and to a data line. Data is placed onto the bit lines by driving the data line to a predetermined voltage level and turning on the transistors in the transistor row. Data placed on the bit lines forms a test pattern that may be subsequently written into any row of memory cells. By directly controlling the bit lines of the memory device in this way, test patterns may be quickly and easily stored in the memory device for functional verification thereof.

Abstract: A fault-tolerant code semiconductor memory storage device includes a array of individual multi-level storage devices arranged in a prescribed sequence. A controller is provided for programming the array with sequential data. The controller detects an occurrence of a faulty storage device in the array during a programming of the array with the sequential data. The controller further codes the occurrence of the faulty storage device in a subsequent storage device in the sequence of devices using a fault-tolerant code. A method of fault-tolerant coding of a semiconductor memory storage device is also disclosed.

Abstract: A method and apparatus for reducing the time for determining a memory refresh frequency for a dynamic random access memory. The method includes disabling the bootstrap circuitry associated with a word line when writing data into a memory cell during a test operation. For instances in which data representing a high logic level is written into the memory cell, the resulting charge that is stored is less than the stored charge under normal operation of the dynamic memory. Consequently, the decay time for the stored charge is shortened, thereby shortening the time for testing the refresh frequency of the memory cell. Testing time for the dynamic memory is thus reduced.

Abstract: A device and method for accessing a row of data in a semiconductor memory device in a single operation is disclosed. The device includes a row of latches having a width which matches the width of the memory array in the semiconductor memory device. The device includes precharge and equilibration circuitry associated with the row of latches and the row of sense amplifiers in device, and timing circuitry for controlling the operation of each in performing full page read and write operations.

Abstract: A six transistor static random access memory (SRAM) cell with thin-film pull-up transistors and method of making the same includes providing two bulk silicon pull-down transistors of a first conductivity type, two active gated pull-up thin-film transistors (TFTs) of a second conductivity type, two pass gates, a common word line, and two bit line contacts. The bulk silicon pull-down transistors, two active gated pull-up TFTs, and two pass gates are connected at four shared contacts. In addition, the two bulk silicon pull-down transistors and the two active gated pull-up TFTs are formed with two polysilicon layers, a first of the polysilicon layers (poly1) is salicided and includes poly1 gate electrodes for the two bulk silicon pull-down transistors. A second of the polysilicon layers (poly2) includes desired poly2 stringers disposed along side edges of the poly1 gate electrodes, the desired poly2 stringers forming respective channel regions of the pull-up TFTs.

Abstract: A device for directly loading data onto bit lines of DRAMs. The device eliminates the need for performing a read cycle prior to a write cycle by bypassing the sense amplifiers of the DRAM. An I/O data line is connected to a bit line by a first transmission gate. A second transmission gate is electrically connected between the first transmission gate and the sense amplifier. A voltage level representing a data bit is loaded directly onto a bit line by turning off the second transmission gate to isolate the sense amplifier from the bit line and turning on the first transmission gate to connect the data line to the bit line. The voltage level on the bit line is then stored in a memory cell connected to the bit line.

Abstract: A technique for testing wordline and related circuitry of a memory array is disclosed. The memory array includes a plurality of memory cells arranged in a plurality of rows, wherein each of the plurality of rows has a respective wordline connected to respective ones of the plurality of memory cells. The related circuitry includes a decode circuit connected to each of the respective wordlines for activating at least one of the respective wordlines based upon a corresponding address signal that is decoded by the decode circuit. The technique involves applying an address signal to the decode circuit so as to activate a corresponding one of the respective wordlines, and then monitoring the corresponding one of the respective wordlines so as to determine if the corresponding one of the respective wordlines has been activated and thereby determine if the memory array and related circuitry are operating in a proper manner.

Abstract: A low/zero power memory device includes a deselect mode of operation wherein row decoders, column decoders, write decoders, pre-coders, post-coders and like operational circuits of the memory device needed for wordline and column activation are disabled until such time as a memory device supply voltage exceeds a certain threshold. An included test mode circuit detects test mode activation and overrides application of the power fail deselect mode of operation of the device. This activates the wordline and column related operational circuits immediately at power up such that the device powers up with multiple wordlines and columns activated and ready for application of a stress test overvoltage.

Abstract: A memory, such as a static random access memory (SRAM), includes at least one memory cell. The bit lines for that memory cell are selectively connected to corresponding write bit lines through a column select pass transistor and a selectively blowable fuse. A reset circuit is connected to the same write bit lines through a fuse structure mimic circuit. Responsive to data transitions on the write bit lines, the reset circuit operates to detect the occurrence of a memory operation to the memory cell and generate a reset signal for resetting the memory in preparation for a next write operation. To support substantially simultaneous presentation of write data to both the reset circuit and the memory cell, the fuse structure mimic circuit delays presentation of the write bit line data to the reset circuit.

Abstract: An integrated circuit memory fabrication process and structure, in which salicidation is performed on the periphery (and optionally on the ground lines) of a memory chip, but not on the transistors of the memory cells.

Abstract: A circuit and method are provided for generating an initializing signal to a master enable fuse circuit on a redundant line decoder. An initialization pulse may be applied to a master enable circuit having a master enable fuse. The master enable fuse may be coupled to a switched voltage supply powered selectively by battery voltage and external Vcc. A circuit for generating the INITIAL signal determines the transition from a power down state to a powered state. A series of delay elements in a generating circuit generates a predetermined initialization pulse of around 3 ns to 5 ns. Half-latch circuits may be initialized between a first and second voltage threshold. Accordingly, the master enable circuits may be set to the proper initialization states for proper operation and minimum power consumption.

Abstract: A circuit for controlling isolation transmission gates connected to the bit lines of a dynamic random access memory (DRAM) device. The circuit includes tri-state circuits which selectively configure transmission gate impedance. The transmission gates are configured for low impedance when stored data is provided to the bit lines. The transmission gates are configured for intermediate impedance when the bit lines are driven towards reference voltage levels. Further, the transmission gates are configured for high impedance to isolate the sense amplifiers from blocks of memory cells that are not involved in the execution of an access to a row of memory cells.

Abstract: A control circuit for terminating a memory access cycle in a memory block having at least one memory cell is disclosed. The at least one memory cell has unique process characteristics. The control circuit includes a memory block activation circuit for generating a memory block activation signal. The memory block activation circuit includes a reset circuit for terminating the memory block activation signal when activated. The control circuit also includes a memory access cycle tracking circuit, responsive to the memory block activation signal, for generating a reset signal. The memory access cycle tracking circuit includes the unique process characteristics of the at least one memory cell for tracking an operation of the at least one memory cell. The reset signal activates the reset circuit so as to terminate the memory block activation signal and terminate the memory access cycle in the memory block.

Abstract: A method and apparatus for testing a random access memory device, such as a dynamic random access memory device embedded within an integrated circuit chip. The apparatus includes one or more rows of transistors, each of which is connected to a bit line pair of the memory device and to a data line. Data is placed onto the bit lines by driving the data line to a predetermined voltage level and turning on the transistors in the transistor row. Data placed on the bit lines forms a test pattern that may be subsequently written into any row of memory cells. By directly controlling the bit lines of the memory device in this way, test patterns may be quickly and easily stored in the memory device for functional verification thereof.

Abstract: A planar, capacitive-type, rectangular, and multi-pixel fingerprint sensing array is mounted on the horizontal and generally rectangular top-surface of a dome that extends upward generally from the center of a horizontally disposed and generally rectangular silicon substrate member. The dome is formed by four upward extending and inclined, or tapered, side wall surfaces, at least one wall surface of which carries electrical circuit paths that electrically connected to the various circuit elements of the sensing array. A generally rectangular, encircling and wall-like card carrier assembly includes a generally horizontal upper-surface having a generally centered opening through which only the dome and sensing array project upward. The bottom-surface of the card carrier assembly is mounted to edge portions of the silicon substrate member in a manner to surround and protect all but the upward extending dome.

Abstract: A short circuit protection circuit which has a first short circuit protection circuit in parallel with a second short circuit protection circuit is disclosed. The first short circuit protection circuit includes a sense resistor and a comparator for detecting the short circuit, and a transistor and current source for turning off the low side driver when the short circuit is detected. The second short circuit protection circuit includes a current mirror, zener diode, transistor, and current source connected in series. The second short circuit protection circuit is in parallel with the first short circuit protection circuit. The second short circuit protection circuit accelerates the turn-off of the low-side driver with out affecting the stability of the circuit.

Abstract: A circuit for clamping the voltage appearing on the bit lines of a dynamic random access memory (DRAM) device so that the voltage thereon is maintained above the low reference voltage source. The circuit includes pull-up devices connected to the bit lines of the DRAM device. The pull-up devices are active only when pull-down devices connected to the bit lines pull some of the bit lines towards the low reference voltage level.