Abstract: In a base station for use in a mobile communication system for communication with mobile subscribers over a plurality of radio channels, an improved transceiver unit is provided including a traffic controller handling downlink and uplink communication traffic with mobile subscribers over the plurality of radio channels, and a measuring device measuring arrival times of burst signals from a mobile subscriber communicating on a select one of the radio channels, or from a mobile subscriber communicating on another transceiver unit, on one of the plurality of radio channels.

Abstract: A system (10) for coupling conductive pellets (40) to a component (12) of an integrated circuit has a substantially planar ribbon (14) that includes a conductive material. A punching apparatus (16) and (38) penetrates the ribbon (14) to form the conductive pellets (40). The punching apparatus (16) and (38) also moves relative to the component (12) to the conductive pellets (40) to the component (12).

Abstract: An apparatus for mass fabrication of a semiconductor assembly comprising optical sources for supplying radiant energy for rapid and controlled heating of a multitude of integrated circuit chips and substrates. The resultant thermal profile is applied to reflowing solder interconnections as well as to filling chip-to-substrate gaps with polymeric precursors whereby any mechanical stress detrimental to mechanically weak solder joints and dielectric layers is avoided. The apparatus contains dispensing equipment with multiple degrees of freedom so that the chips and substraters to be assembled do not have to be moved within or from the apparatus. Processing in controlled environment is feasible.

Abstract: A system (12) and method for automatically monitoring and/or controlling the actual speed of a vehicle (10) relative to the legal speed limit of the geographic area the vehicle is located in. A wireless transmission (32) containing location or legal speed limit information is received from a transmission source (24). If location information is obtained, database (40) is queried to obtain legal speed limit information for the physical location of the vehicle. The legal speed limit is stored into a memory space (36). Alternatively, the legal speed limit is used to control the actual speed of the vehicle. In a monitor mode, the system (12) compares the actual speed of the vehicle to the legal speed limit with a processor (37), and the relative information may be communicated to the driver. In an offset mode, the system (12) controls the actual speed of the vehicle to an offset amount relative to the legal speed limit, where the offset amount is set by the driver of the vehicle.

Abstract: A method for attaching particles (12) to a substrate (14), comprising the steps of aligning particles (12) attached to an adhesive sheet (35) with contact pads (42) of a substrate (14), transferring thermal energy (38) to the adhesive sheet (35) by maintaining a temperature below the melting point of particles (12), and removing the adhesive sheet (35) prior to reflow, is disclosed. The adhesive sheet (35) may be composed of an adhesive coating (22) laminated to a film (24). The particles may be composed of a variety of compositions, including compounds such as solder or plastic, for example.

Abstract: An architecture and method of fabrication for an integrated circuit having a reinforced bond pad comprising at least one portion of the integrated circuit disposed under the bond pad; and this at least one circuit portion comprises at least one dielectric layer and a patterned electrically conductive reinforcing structure disposed in this at least one dielectric layer.

Abstract: A semiconductor assembly and method of fabrication comprising an integrated circuit chip, an electrically insulating substrate, a multitude of solder balls for interconnecting both parts while spacing them apart by a gap, and a polymeric encapsulant filling the gap. The method of fabrication includes heating and cooling cycles, based on stress modeling, such that all mechanical stress levels in the dielectric layers of the circuit chip and in the solder balls are reduced to levels safe for operating the semiconductor assembly.

Abstract: The invention is, in one embodiment, a method of reporting the location of a mobile phone by locating a Global Positioning System (GPS) receiver in a mobile communications network. The method first determines the location of the GPS receiver, processes data identifying the location, then synthesizes the location information into a Tele-type (TTY/TDD) compatible format and transmits the location. A TTY/TDD device at a receiving station will process the location data to identify the location of the mobile phone. In one aspect, the method is implemented through modular programming. The invention is also a mobile phone capable of transmitting location information gathered by a Global Positioning System (GPS) receiver to a Public Safety Answering Point (PSAP). The mobile phone houses a transceiver, a GPS receiver, and a Tele-type (TTY/TDD) synthesizer in communication with the GPS receiver and the transceiver.

Abstract: A method of sending a short message service (SMS) message to a mobile station operating within a Global System for Mobile Communications (GSM) radio telecommunications network which utilizes a satellite air interface link. A paging server is implemented in the network and interfaced with a mobile switching center/visitor location register (MSC/VLR) serving the mobile station. When a SMS service center receives a mobile-terminating SMS message, it sends the message to the paging server. The paging server stores a copy of the message and sends the message from the paging server to the MSC/VLR. The MSC/VLR makes a first attempt to deliver the message to the mobile station via the satellite air interface radio link. If the SMS service center times out before receiving an acknowledgment that the message was delivered, the service center sends the message to the paging server a second time. Upon receipt, the paging server determines whether the message received the second time has already been sent to the MSC/VLR.

Abstract: A method of handling an incoming call to a mobile station (MS) in a radio telecommunications network having a gateway mobile switching center (G-MSC) and a home location register (HLR), and the MS communicates with the network via a satellite link comprising a satellite and a satellite gateway. The method includes storing in the HLR, a plurality of primary gateways and an associated backup gateway for each primary gateway in the network. If the primary gateway serving the MS fails while the satellite is still operational, the incoming call is routed from the G-MSC to the backup gateway. The backup gateway's base station subsystem (BSS) is reconfigured to cover the service area of the primary gateway, and the MS is notified that the backup gateway has replaced the primary gateway as the MS's serving gateway. Subscriber data for the called MS is provided to the backup gateway by the HLR.

Abstract: A packaged semiconductor device and a method for burn-in and testing are disclosed. The package comprises a carrier having a pattern of contact pads for electrical connection, and also a pattern of testing pads for electrical characterization such that their location, size and composition allows a conversion to contact pads after the device has been electrically characterized following burn-in. Furthermore, an adapter and a method for burn-in and testing are disclosed for use in testing a variety of different semiconductor devices. The adapter comprises a carrier having a pattern of testing pads bordering the carrier outline, and routing strips which are structured such that the carrier is adaptable to the package of the device being tested.

Abstract: An apparatus for the fabrication of a semiconductor assembly and a method of underfilling flip-chip devices are disclosed. The apparatus for multiple controlled dispensing of polymeric precursors filled with silica and anhydrides comprises a center feed tube supplying the proecursor; a header connecting the center tube to a plurality of distribution tubes, whereby the distribution tubes acquire predetermined distances from the center tube; a nozzle at the end of each distribution tube; and these nozzles having increasingly larger cross sections, the farther the respective distribution tube is positioned from the center tube, whereby the dispense rate of the precursor remains the same for all distribution tubes.

Abstract: The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die mount pad is exposed through the package backside and serves both as a ground plane and as a heat spreader. The external leads are flat and extend beyond the package edge so that good solder connections to a printed wiring board can be made and inspected. The lead tips exposed beyond the package further provide a position for mold clamping and for test probing the device.

Abstract: A hybrid radio frequency (RF) power device is provided which comprises: a flange (10) and an arrangement of die blocks (30) disposed about the flange (10), where the arrangement of die blocks (30) has die blocks (30a-30d) organized in a plurality of rows and a plurality columns, where the device may further comprise a substrate (15) disposed between the flange (10) and the arrangement of die blocks (30), and a first die block (30a) connected to a second die block (30b) by a conductor (42c) having a length of half a wavelength.

Abstract: A method for assembling electronic devices by moving particles (12) on an adhesive sheet (35) having a plurality of adhesive areas (30), comprising the steps of loading the particles (12) onto the adhesive sheet (35) and transferring kinetic energy from a mechanical device (39) to the particles (12) for moving the particles (12) is disclosed. The adhesive sheet (35) may be composed of an adhesive coating (22) laminated to a film (24). The particles (12) may be composed of a variety of materials, including minerals and compounds such as solder or polymers.

Abstract: A current sharing circuit scheme comprising first and second power modules (36,38) each including an input side (30) and an output side (32), the power modules (36, 38) coupled to each other via respective input sides (30), each of the output sides (32) including a positive terminal and a negative terminal. The circuit scheme also comprises first and second circuit output voltage terminals (47, 46) and first and second set point controls (40, 41) coupled to the negative terminal of each of the output sides (32). First and second initial set point controls (42,45) are included providing current signal paths between corresponding first and second set point controls (40, 41) and the first output voltage terminal (47).

Abstract: A method (40) and device (42) for assigning transmission channels in a wireless communications network (38). The frequencies of the network (38) are discriminated to determine which transmission channels have a predetermined blocking threshold of interference. A transmission channel is preassigned with a channel quality less than the predetermined blocking threshold of interference to an incoming call. The channel quality and interference level of the preassigned transmissions channel are continually monitored, and another transmission channel is assigned to the call when the monitored levels of channel quality and interference levels change beyond a set of predetermined thresholds. Forward and backwards channel reassignments are performed depending on the channel quality and interference levels.

Abstract: A tool for removing a propeller from a drive shaft having a damaged shear pin. The tool has a plurality of fingers for engaging the blades of the propeller and an advancement member for leveraging against the distal end of the shaft. The advancement member leverages against the drive shaft to cause the tool to pull the propeller assembly from the drive shaft to facilitate the replacement of the damaged shear pin. The tool fingers engage and restrict the rotation of the propeller blades with respect to the tool as the advancement member is leveraged against the drive shaft.

Abstract: A method and system for electroplating a metal coating onto a continuous part, such as the leadframe stock used in packaging integrated circuits, whereby the method comprises plating metal from a series of plating baths having the same or compatible chemical composition, supplying a continuous electrical connection between the D.C. power supply via a rotating contact held in intimate contact with the cathode, and cooling the contact by using the plating solution itself.

Abstract: A self-driven synchronous rectifier circuit (50) for a DC—DC power converter. The circuit comprises a primary transformer (16), a first synchronous rectifier (SQ1) coupled to the primary transformer (16), a second synchronous rectifier (SQ2) coupled to the primary transformer (16), an external drive circuit (18). The circuit (50) also comprises a plurality of switches (SQ3, SQ4) controllably coupled to second synchronous rectifier (SQ2). The external drive circuit (18) provides turn-off signaling for both synchronous rectifiers (SQ1, SQ2) Turn-on signaling provided for first synchronous rectifier (SQ1) by the primary transformer (16) turn-on signaling for second synchronous rectifier (SQ2) is provided by the external drive circuit (18).