Abstract: A method and apparatus are provided for dynamically creating an executable image from an Object File Format (OFF) file stored in a reserved area 175 of one of a plurality of data storage devices 125 in a memory system 100. In the method, a controller 105 having a Programable Read Only Memory (PROM) 160, Random Access Memory (RAM) 155 and a Central Processing Unit (CPU) 150 is coupled to the plurality of data storage devices 125. The memory system 100 is initialized using an initial boot sequence stored in the PROM 160. This initialization can include a hardware discovery sequence to identify all hardware present in the memory system 100. Data relating to the discovered hardware is read from the OFF file and translated from an object format into an executable image that is assembled in RAM 155. Optionally, the PROM 160 is an Electronically Erasable PROM (EEPROM) and the assembled executable image is stored in the EEPROM replacing the initial boot sequence.

Abstract: The effect upon reliability of thickness variation in a printed wiring board at the LGA compression connection site of an electronic module is reduced. Plated through holes formed in a printed wiring board at the mounting site of an electronic module typically result in upper and lower opposing surface depressions in the board at this mounting site. When compressional force is applied for compressional connection of the module to the printed wiring board through an interposer, the board deforms downwardly reducing the lower depression and increasing the upper depression beyond the compliance of the interposer. Filler material, such as, a bonding material is employed to fill the lower depression eliminating the downward deformation of the printed wiring board into the lower depression. A quantity of filler material sufficient to deform the printed wiring board upwardly under pressure into the upper depression thereby reducing or eliminating same may also be used.

Abstract: A system and method for a multi-modal browser/renderer that simultaneously renders content visually and verbally in a synchronized manner are provided without having the server applications change. The system and method receives a document via a computer network, parses the text in the document, provides an audible component associated with the text, simultaneously transmits to output the text and the audible component. The desired behavior for the renderer is that when some section of that content is being heard by the user, that section is visible on the screen and, furthermore, the specific visual content being audibly rendered is somehow highlighted visually. In addition, the invention also reacts to input from either the visual component or the aural component. The invention also allows any application or server to be accessible to someone via audio instead of visual means by having the browser handle the Embedded Browser Markup Language (EBML) disclosed herein so that it is audibly read to the user.

Abstract: An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.

Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.

Abstract: A method for conductively bonding a printed circuit board to a metal back plate is provided. The method includes the steps of providing a dielectric substrate that is metallized on its two faces; providing a metallic back plate; and bonding the metallic back plate to one of the metallized faces of the substrate using an electrically conductive adhesive that includes an adhesive polymer and at least one conductive metal having an electromagnetic force (EMF) that is equal to or less than one volt. The present invention also relates to a printed circuit board assembly which includes printed circuit board which includes a dielectric substrate having a first circuitized metallic layer disposed on one opposing face of the substrate and a second metallic layer disposed on the other opposing face of said substrate; a metal back plate; and an electrically conductive bonding layer disposed between the plate and the second metallic layer of the printed circuit board.

Abstract: A structure comprising a metallic surface, a layer of a polymeric material and a water soluble polymeric material located between the metallic surface and the layer of polymeric material, and process of fabricating such are provided. The structure exhibits enhanced adhesion between the metallic surface and the polymeric material.

Abstract: Embedded flush circuitry features are fabricated by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a later of dielectric material.

Abstract: An organic LED device comprises a substrate, a first driver TFT on the substrate, a second driver TFT on said substrate, and an insulating film on the substrate, the first driver TFT and the second driver TFT. There is a common anode on the insulating film. A first organic LED element is on a first portion of the anode and configured as a top emission struction, and a second organic LED element is on a second portion of the anode and configured as a top emission structure. A first cathode extends into the insulating film and electrically connects the first LED element with the first driver TFT. A second cathode extends into the insulating film and electrically connects the second LED element with the second driver TFT.

Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

Abstract: An approach for allowing a server to act on behalf of an original requestor (originator) which includes an approach for indicating the chain of servers through which the original request came has been defined. This provides a mechanism for a server to act as a “delegate” for a request made by an originator. This approach uses PKI constructs and relies upon public-private key digital signatures for verifying the validity if the “delegation” information. The approach described here allows the originator some control over the extent to which its identity can be used on its behalf by servers that it contacts and servers that are contacted on its behalf. The entire “delegation chain” is contained within the construct, allowing examination of the “path” that a request has taken in getting to a server from which service was requested.

Abstract: Electrical nets are prepared by bonding an electrically conductive element in a deleted plated via. The electrically conductive element has a headed portion that contacts the bottom of the laminate and the other end of the electrically conductive element electrically connects to a BGA pad or surface trace line.

Abstract: A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

Abstract: A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate.

Abstract: A method for forming a dielectric structure. A first layer is formed, wherein the first layer includes a first fully cured photoimageable dielectric (PID) material. A sticker lays is nonadhesively formed on the first layer, wherein the sticker layer includes a partially cured PID material. A second layer is nonadhesively formed on the sticker layer, wherein the second layer includes a second fully cured PID material, wherein the sticker layer is nonadhesively sandwiched between the first layer and the second layer such that the sticker layer is in non-adhesive contact with the first layer and in non-adhesive contact with the second layer, and wherein the sticker layer is capable of remaining in non-adhesive contact with the first layer and the second layer until the sticker layer is subsequently subjected to additional curing.

Abstract: Structure and method for efficient failover and failback techniques in a data storage system utilizing a dual-active controller configuration for minimizing a delay in responding to I/O requests from a host system following a controller failure is described. A stripe lock data structure is defined to maintain reservation status or stripe locks of cache lines within data extents that are part of a logical unit or storage volume. When a controller fails, dirty cache line data of a failed controller is taken over by a survivor controller. The stripe lock data structure is used to process I/O requests from a host system, by the failed controller. The data storage system functions in a single-active configuration until the dirty cache line data is flushed to one or more storage volumes, by the survivor controller. The inventive structure and method provide utilize a storage volume reservation system. The stripe lock data structure is defined in memory within each of the two or more caching controllers.

Abstract: A method and structure for solderably coupling a semiconductor chip to a substrate, with an underfill between the chip and the substrate. In forming the structure, underfill material is dispensed upon a conductive pad on the substrate. The underfill material comprises a resin and a filler. The filler density is less than the resin density. The chip is moved toward the substrate and into the underfill until a solder member coupled to the chip is proximate the conductive pad. The structure is heated, resulting in soldering the solder member to the conductive pad and in curing the underfill. Filler particles move through the resin and toward the chip, resulting in an increased filler concentration near the solder member, and a reduced underfill coefficient of thermal expansion (CTE) near the solder member that is close to the CTE of the solder member.

Abstract: The present invention provides a method of temporarily adhering a stack of sheets together to facilitate drilling a hole through the stack of sheets. The method includes using a temporary adhesive that prevents burring while drilling a hole through the stack.

Abstract: An assembly for mounting elongated electrical contact elements to an integrated circuit package or printed circuit board. The assembly comprises a a base plate having a first surface and a multiplicity of recesses aligned with each other in the first surface. Each of the recesses is sized and configured to receive a respective one of the contact elements. The assembly also comprises first and second spaced apart supports extending from the base plate. The assembly also comprises first and second rods received by the first and second supports and supported parallel to each other. The first and second rods define an intervening slot aligned with the recesses. The assembly also comprises a multiplicity of the contact elements. One end of each of the contact elements is received in a respective one of the recesses. The contact elements are engaged by the first and second rods, whereby the contact elements are held in their respective recesses.

Abstract: An electromagnetic shield device for printed circuit boards (PCBs) which, in one embodiment, is made of conductive material and comprised of two parts. In another embodiment, the device is a singular element. In both examples, press-fit or compliant pins may be used to electrically couple the device to the PCB's ground layer. Alternatively, projecting pins or flat conductive plates can be used to provide this coupling. The device is also adjustable to accommodate PCBs of varying thicknesses. The device provides for added PCB stiffness while assuring prevention of electromagnetic radiation from the PCB's edge.