Abstract: This invention relates to the use of water-based cleaning solutions and their use as environmentally safe replacements of chlorinated hydrocarbon solvents to remove metal-polymer composite paste residue from screening masks and ancillary equipment, such as, used for screening a conductive metal pattern on a ceramic green sheet in the manufacture of multi-layer ceramic products.

Abstract: Disclosed is an automatic container assembler apparatus (800) to assemble the constitutive elements of a COAST container i.e. the wafer (138) that is to be treated in the manufacturing line, the cassette-reservoir (123) and the single wafer holder (130). In essence, the assembler apparatus consists of a cabinet whose interior space cabinet is submitted to a clean filtered gas flow generated by a blower, so that a clean gaseous mini-environment is created therein with a light overpressure with regard to the outside ambient. The cabinet includes a vertical stocker (804) adapted to be manually and safely filled with the adequate number of the elements mentioned above. Generally, the wafers are carried in a multiple wafer holder (130'). These elements are introduced in the cabinet through an input loadlock device (810) and laid down onto a table (806) by an operator. Next, the operator places them in their respective bins (815) of the stocker through manipulation gloves (805).

Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Abstract: The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Abstract: This invention relates generally to a belt type furnace. More specifically, this invention relates to a belt type furnace that sequentially stops the belt at the vicinity of at least one heater, and where the heater comprises at least two heating elements.

Abstract: The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving nickel or alloys thereof, using an Iodide source, preferably an Iodide salt, such as, Copper Iodide.

Abstract: This invention relates generally to a belt type furnace. More specifically, this invention relates to a belt type furnace that sequentially stops the belt at the vicinity of at least one heater, and where the heater comprises at least two heating elements.

Abstract: The present invention relates generally to a new metal/ferrite laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of perforated holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix and electron beam source and methods of manufacture thereof.

Abstract: A Mid-Objective scanner system for correcting astigmatism, bow distortion and field curvature including a tilted lens or a toric lens for producing an opposite amount of astigmatism to correct astigmatism, a scanning mechanism and a concave cylindrical mirror for directing the scanned beam onto to a workpiece wherein the concave cylindrical mirror has a radius of curvature that corrects the field of curvature in the image plane of the workpiece and thereby enables the scanner system to correct astigmatism, bow distortion and field curvature.

Abstract: The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.

Abstract: The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Abstract: A cleaning pad and roller assembly for cleaning semiconductor wafers. The pad may be a felt sheet with a pair of tabs located at opposite ends. The roller may be polyvinylchloride and may have a drive gear at one end and a clamp at each end. Each clamp is a clamping lever mounted on a shelf and may be locked in place by a clamping screw. Each clamping lever may have a pivot at one end and a serrated surface at an opposite end. The clamping screw may pass through the clamping lever into the shelf.

Abstract: This invention is directed to a capacitor having a multilevel interconnection technology. At least one solder ball is reflowed and secured onto the capacitor. The solder ball is in electrical communication with the capacitor through a contact. On this reflowed solder ball a cap of low melting point metal is secured. This can be done in a number of ways. The preferred way is to positioning a mask over the solder ball such that a portion of the solder ball is exposed through openings in the mask. At least one layer of a low melting point metal is deposited on the exposed surface of the solder ball through the mask, and thereby forming a capacitor with a multilevel interconnect cap. The low melting point metal can interact with the surface of the solder ball to form a cap of an eutectic or a liquefied portion. The cap portion can then be joined to the object.

Abstract: The present invention relates generally to a new apparatus and method for use in chip, module, card, etc., burn-in and/or test or electrical interconnection. More particularly, the invention encompasses an apparatus that is used as a temporary media between a chip, module, card, etc., that needs to be tested and/or burned-in and a test or burn-in system. A method for such burn-in and/or test or electrical interconnection is also disclosed.The invention also encompasses an apparatus and a method that can be used as a permanent media between two electrical devices, such as, for example, between a chip and a module or a card, etc., that is to be contained in and part of a system.

Abstract: A sintered structure is formed from a powdered material by the steps of providing a first, green powdered material which can be a ceramic or metallic ceramic material. A second, preformed mold blank material to the green powdered material, wherein the preformed mold blank will not fuse with the first, green powdered material. The mold blank material is different green material having a higher sintering temperature than the first green powdered material. Then the structure is fired at the sintering temperature of the first, green powdered material; and the preformed mold blank material from the fired powdered material is removed. Grooves can be formed by pressing non-sinterable lines into a green sheet prior to firing. A wave guide unit can be formed in the ceramic. A ceramic structure can be formed with fracture markings in the green powdered material.

Abstract: A structure and a method is disclosed for making a laminated circuit carrier card for the purpose of making a Direct Chip Attached Module (DCAM) with low cost and high reliability. The carrier is made using an organic or an inorganic laminated carrier having at least one surface available for direct chip mount. The chip has at least one solder ball with a cap of low melting point metal. The surface of the carrier has electrical features that are directly connected to the low melting point metal on the solder ball of the chip to form the eutectic and this way the chip is directly attached to the carrier.

Abstract: The present invention relates generally to a new apparatus and method for in-situ green sheet slitting. More particularly, the invention encompasses an apparatus and method that uses a modified green sheet slitting machine so that it can provide an in-situ slitting of green sheets that result in a plurality of separate green sheets rolls or strips.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

Abstract: A train of air spaced optical mechanisms capable of taking a raw laser beam and focusing it on a workpiece for a range of cut sizes with varying magnifications and energy densities while controlling divergence and providing optimum uniformity. The lenses are diffraction limited for optimum uniformity and edge definition. The system uses variable down collimators to condense the beam to an aperture plane. The aperture is then imaged to the workpiece with Barlow, zoom transfer, collimator, and objective lenses. The components are color corrected to aid in alignment of an invisible beam and allow the aperture to be imaged to a workpiece in visible light.