Abstract: The present invention provides variable reflectance automobile mirrors wherein the component of variable transmittance is an electrochromic device wherein the medium of variable transmittance comprises an electrochromic compound in a gel or a thickened solution.

Abstract: A method of forming an optically transparent seal involves the steps of providing an uncured resinous material, adding a spacing media to the resinous material and curing the resinous material. The spacing media can have an index of refraction similar to that of the resinous or an antireflective coating provided thereon. A filler material can also be added to the resinous material.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: The present invention concerns compositions, which comprise an aprotic polar solvent, at least one electrochromic compound, and a compound of the formula I ##STR1## wherein R.sub.1 is, for example, tert-butyl, and R.sub.2 is, for example, --CH.sub.2 --CH.sub.2 --COO--R.sub.7 --, where R.sub.7 is n-butyl or n-pentyl. Among embodiments of the invention are compositions used as media of variable transmittance in electrochromic devices, especially single-compartment, self-erasing, solution-phase electrochromic devices. The compounds of Formula I have increased solubility in aprotic polar solvents used in electrochromic devices and are effective in stabilizing compositions, which comprise at least one electrochromic compound and are useful as media of variable transmittance in electrochromic devices, against degradation due to exposure to UV-radiation.

Abstract: The present invention provides variable reflectance automobile mirrors wherein the component of variable transmittance is a single-compartment, self-erasing, solution-phase electrochromic device.

Abstract: A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Abstract: The present invention provides electrochromic layers, which comprise polymeric matrices with electrochromic solutions interspersed therein. Varying an electrical potential difference across a layer of the invention results in reversible variation in the transmittance of light across the layer because of electrochemical processes in the electrochromic solution of the layer. The invention further provides electrochromic devices, in which the electrochromic layers of the invention provide reversibly variable transmittance to light, and various apparatus in which the devices of the invention provide light-filtering or light-color modulation. Such apparatus include windows, including those for use inside and on the outside walls of buildings and in sunroofs for automobiles, and variable reflectance mirrors, especially rearview mirrors for automobiles.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: An initiator, for use in a gas generator, includes an enclosed volume in communication with apertures for introducing liquid propellant and pre-pressurization gas into a propellant ignition chamber, and an aperture for introducing combusted gasses into a gas generator. A mechanism for controlling when the gases are allowed to enter the gas generator, and a heater/electrode to initiate combustion of the liquid propellant, also communicate with the enclosed volume. The propellant and the pre-pressurization gas may be introduced together or through separate ports. The heater/electrode thermally decomposes and vaporizes the propellant causing pressurization of the ignition chamber until a critical value is reached and the propellant ignites and burns. The burning propellant increases the chamber pressure beyond a predetermined value thereby opening the controlling mechanism and allowing the combusted gases to be introduced into the gas generator combustion chamber.

Abstract: A clamping system is provided for effectively securing at least one power device in a thermally-conductive and electrically-insulative manner to a heatsink with a clamp member having an elongated member portion adapted to bear against a device, and a second member portion having an end adapted to bear against a heatsink. A fastener exerts a force on the member between the device and the second member portion to force an end of the second member portion into contact with the heatsink, and cause the member portion overlying the device to reciprocally exert a pressure on the device against the heatsink.

Abstract: A built-in-test capability is provided for determining the integrity of an optical fiber connecting: (a) an optical firing unit having a primary light source emitting a first wavelength, a test light source emitting a second wavelength different from the first wavelength, a mechanism both for coupling light from the light sources to the optical fiber and also for coupling the return light to a filter/detector; and (b) an optically initiated device which is coupled to a second end of the optical fiber. The apparatus includes a photoluminescent material disposed at a junction of the optically initiated device and the optical-fiber-second-end. This photoluminescence material photoluminesces at a third wavelength (when exposed to the test light source), and the light travels through the optical fiber and, when detected indicates optical fiber continuity.

Abstract: HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Abstract: A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.

Abstract: In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.

Abstract: HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Abstract: Weld filler alloys comprising aluminum, copper, lithium and, optionally, silver are disclosed which possess significantly improved fabricability and weldability. The weld filler alloys are free of magnesium and can be easily drawn into weld wire that is useful for welding aluminum-base alloys. Weldments made with the filler alloys exhibit highly improved mechanical, physical and corrosion resistance properties. The weld filler alloys may be used to weld cryogenic containers for space launch vehicles and the like.

Abstract: Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability.

Abstract: A method for fabricating a multi-chip module substrate comprises providing a carrier having a well. Substrate molding material is poured into the carrier well. A plurality of chips is situated in the substrate molding material. A laminatable dielectric layer is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates the chips.

Abstract: A device for remote sensing utilizing fiber optic techniques is presented. This device makes use of multi-mode optic fibers in conjunction with light polarized in multiple directions. The device presents a platform which is insensitive to phenomena outside of the remote sensing region while capable of detecting and analyzing multiple phenomena within the sensing region. The device is also capable of inspecting multiple remote sensing regions simultaneously.

Abstract: An optical memory material includes a two-photon storage component which can be written from a first to a second state in response to WRITE light, mixed with a signal component which fluoresces by one-photon absorption only at the written locations in response to READ light. The storage material may be a fulgide. The memory material may also include a frequency upconversion material to aid writing. Writing is performed by a spatial light modulator (SLM) with a dynamic focussing system, for concentrating sufficient power at WRITE locations for nonlinear two-photon absorption. Crosstalk is avoided during simultaneous writing in some embodiments, by spacing the individual WRITE beams apart by an integer number of inter-beam spacings, so that non-adjacent datels are written simultaneously in a "paragraph," and the non-written areas are written at a different time with different paragraphs.