Abstract: A method for recharging a crucible with polycrystalline silicon comprises adding flowable chips to a crucible used in a Czochralski-type process. Flowable chips are polycrystalline silicon particles made from polycrystalline silicon prepared by a chemical vapor deposition process, and flowable chips have a controlled particle size distribution, generally nonspherical morphology, low levels of bulk impurities, and low levels of surface impurities. Flowable chips can be added to the crucible using conventional feeder equipment, such as vibration feeder systems and canister feeder systems.

Abstract: A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor.

Abstract: Silicon deposits are suppressed at the wall of a fluidized bed reactor by a process in which an etching gas is fed near the wall of the reactor. The etching gas includes tetrachlorosilane. A Siemens reactor may be integrated into the process such that the vent gas from the Siemens reactor is used to form a feed gas and/or etching gas fed to the fluidized bed reactor.

Abstract: A polymerized product is obtained from a mixture containing (i) a free radical polymerizable monomer, oligomer or polymer; (ii) an organoborane amine complex, (iii) a poor or non-solvent for the polymerized product of (i); and (iv) an amine reactive compound. The mixture may include (v) an active ingredient to be encapsulated by the polymerized product, and (vi) an optional component(s). Polymer particles are obtained by (A) forming a composition containing components (i)-(iv); (B) agitating components (i)-(iv) in the presence of oxygen to initiate polymerization, at a rate and for a time sufficient to provide a uniform dispersion and reaction of the components; (C) allowing the reaction to proceed to completion at room temperature; and (D) recovering the polymer particles by removing component (iii). The composition may include (v) the active ingredient to be encapsulated by the polymer particles.

Abstract: An impact resistant waveguide includes a clad surrounding a core. A reinforcing filler is incorporated in a curable silicone composition used to prepare the core, thereby imparting impact resistance to the core. A method of manufacture of the waveguide includes injecting the curable silicone composition into a clad made of silicone elastomeric tubing and thereafter curing the curable silicone composition.

Abstract: A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.

Abstract: A moisture curable composition capable of cure to an elastomeric body, the composition comprising (a) an organopolysiloxane having not less than two silicon-bonded hydroxyl or hydrolyzable groups; (b) a silane of the general formula G2-Si—R12, wherein each group is reactable with the hydroxyl or hydrolyzable groups in (a), and each R1 group is an alkyl group having from 1 to 10 carbon atoms, an alkenyl group, an alkynyl group an aryl group or a fluorinated alkyl group; (c) one or more fillers and (d) a photocatalyst. Preferably at least one R1 group is unsaturated, but in the absence of this there is provided an additional component in the form of (e) an unsaturated compound selected from the group of an unsaturated short chain siloxane, an unsaturated cyclic siloxane, an unsaturated fatty acid an unsaturated fatty alcohol or an unsaturated fatty acid ester. The cured product is generally used as a sealant, which avoids dirt pick-up after cure and has a protective layer on the sealant interface with air.

Abstract: A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Abstract: This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

Abstract: A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.

Abstract: A method for preparing flat-top pads in electronic components includes the steps of: a) stencil printing a flat-top deposit of a curable silicone composition onto a first electronic substrate, where the first electronic substrate is selected from a semiconductor die or a semiconductor die attachment member, where stencil printing the flat-top deposit is performed by squeegee through a down-step stencil; b) curing the flat-top deposit to form a flat-top pad; optionally c) adhering a second electronic substrate to the top of the flat-top pad, where the second electronic substrate is selected from a semiconductor die or a semiconductor die attachment member; and optionally d) repeating steps a), b) and c).

Abstract: A single roll crusher for comminuting high purity materials includes a roll with teeth spaced around the circumference of the roll. The roll is rotatably mounted inside a housing. The housing has a top with an entrance port, sides, and bottom with an exit port. The roll, teeth, and at least the inside surfaces of the top, sides, and bottom are fabricated from a material of construction that minimizes contamination of silicon. The material of construction may be tungsten carbide with a cobalt binder. The single roll crusher is used for processing polycrystalline silicon.

Abstract: A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process; (2) fracturing the polycrystalline silicon workpiece into a mixture of polycrystalline silicon pieces, where the polycrystalline silicon pieces have varying sizes; and (3) sorting the mixture of polycrystalline silicon pieces into at least two size distributions. Step (2) may be carried out by a thermal shock process. Step (3) may be carried out using a rotary indent classifier.

Abstract: A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.

Abstract: This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two terminally-unsaturated organic groups per molecule, (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, (III) a hydrosilylation catalyst, (IV) a fluoroorganosilicone having at least one functional group reactive with component (I), component (II), or both, (V) an unsaturated ester-functional compound, and (VI) an adhesion promoter. The composition may also include one or more optional components selected from (VII) a void reducing agent, (VIII) a pigment, (IX) a filler, (X) a cure modifier, (XI) a rheology modifier, and (XII) a spacer.

Abstract: A process for preparing polycrystalline silicon comprising the steps of (A) reacting trichlorosilane with hydrogen thereby forming silicon and an effluent mixture comprising tetrachlorosilane and disilane described by formula HnCl6—nSi2 where n is a value of 0 to 6 and (B) co-feeding the effluent mixture and hydrogen to a reactor at a temperature within a range of about 600° C. to 1200° C. thereby effecting hydrogenation of the tetrachlorosilane and conversion of the disilane to monosilanes.

Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 ?m/m° C. between ?40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.

Abstract: A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process; (2) fracturing the polycrystalline silicon workpiece into a mixture of polycrystalline silicon pieces, where the polycrystalline silicon pieces have varying sizes; and (3) sorting the mixture of polycrystalline silicon pieces into at least two size distributions. Step (2) may be carried out by a thermal shock process. Step (3) may be carried out using a rotary indent classifier.

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.