Abstract: A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.

Abstract: A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecules; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

Abstract: An electrically insulating crosslinked thin-film-forming organic resin composition comprising (A) an electrically insulating organic resin having silicon atom-bonded hydrogen atoms or silicon atom-bonded alkenyl groups and (B) a solvent, and a method for forming a crosslinked thin film therefrom.

Abstract: A suspension containing crosslinked silicone particles with a lower mean particle diameter and a better dispersion in certain organic resins is prepared by emulsifying a condensation crosslinkable silicone composition containing (A) an organopolysiloxane having at least two silanol groups per molecule and (B) a crosslinker, but no (C) condensation catalyst, in water using a surfactant. A tin (II) salt of an organic acid with no more than ten carbon atoms is then emulsified in water with a surfactant, and added as the component (C) to the emulsion of condensation crosslinkable silicone composition. This crosslinks the emulsion of condensation crosslinkable silicone composition.

Abstract: An electrically conductive hot-melt silicone adhesive composition, comprising (A) a hot-melt silicone adhesive; (B) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (C) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided that when the composition is curable, the compound does not substantially inhibit cure.

Abstract: A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R13SiO(R12SiO)nSiR13 wherein each R1 is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0.1 to 200 Pa·s at 25° C., and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R23SiO1/2 siloxane units and SiO4/2 siloxane units wherein each R2 is independently alkyl or alkenyl, the mole ratio of R23SiO1/2 units to SiO4/2 units is from 0.65 to 1.

Abstract: A curable organosiloxane composition comprising: (A) an organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a compound having an alkenyl group and a phenol residue of the formula: where R1 is an alkyl group or alkoxy group, a is 1 or 2, and b is an integer from 0 to 3; and (D) a hydrosilylation reaction catalyst.

Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

Abstract: A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.

Abstract: A high-refractive-index optical silicone oil comprising a pentasiloxane having the formula RMe2SiO(Me2SiO)3SiMe2R wherein Me is methyl, each R is independently a C8 to C12 aralkyl, and the silicone oil has a refractive index of from 1.45 to 1.50 at 25° C.; a method of preparing a high-refractive-index optical silicone oil; a high-refractive-index optical silicone oil mixture comprising a pentasiloxane having the formula RMe2SiO(Me2SiO)3SiMe2R wherein Me is methyl, each R is independently a C8 to C12 aralkyl, and a disiloxane having the formula RMe2SiOSiMe2R wherein Me and R as defined above and wherein the mixture has a refractive index of from 1.45 to 1.50 at 25° C.; and a method of preparing a high-refractive-index optical silicone oil mixture.

Abstract: A cured silsesquioxane resin and method for its preparation are disclosed. By using a silyl-terminated hydrocarbon in the hydrosilylation reaction curable composition used to prepare the cured silsesquioxane resin, the cured silsesquioxane resin has improved strength and toughness without significant loss of modulus. A typical silyl-terminated hydrocarbon useful in this invention is silphenylene.

Abstract: The present disclosure describes novel compounds and compositions which are particularly useful for treating hair loss in mammals, including arresting and/or reversing hair loss and promoting hair growth. The present compounds and compositions may also be useful against a variety of disorders including, for example, multi-drug resistance, human immunodeficiency virus (HIV), cardiac injury, and neurological disorders, and may be useful for controlling parasites and invoking immunosuppression.

Abstract: This invention relates to a macromonomer and a method for its preparation. The macromonomer has one or more silicon-bonded hydrogen atoms at one molecular chain terminal, and one or more aliphatically unsaturated silicon-bonded organic groups at the other molecular chain terminal. This invention further relates to a method of forming a hyperbranched polymer by polymerizing the macromonomer with a group VIII metal catalyst. The hyperbranched polymers can be used as surfactants, gelling agents, drug delivery systems, and polymeric absorbents.

Abstract: The present disclosure describes novel compounds and compositions which are particularly useful for treating hair loss in mammals, including arresting and/or reversing hair loss and promoting hair growth. The present compounds and compositions may also be useful against a variety of disorders including, for example, multi-drug resistance, human immunodeficiency virus (HIV), cardiac injury, and neurological disorders, and may be useful for controlling parasites and invoking immunosuppression.

Abstract: A method for changing the dielectric properties of a polymer impregnated and pyrolyzed ceramic matrix composite (polymer impregnated and pyrolyzed ceramic matrix composite) is disclosed. The polymer impregnated and pyrolyzed ceramic matrix composite can be used in aircraft and turbine engines. polymer impregnated and pyrolyzed ceramic matrix composite comprises a ceramic matrix, a reinforcing fiber, and at least 1 additive used to change dielectric properties (dielectric constant and loss factor). The additive can be a low dielectric constant material having a dielectric constant in the range of 1 to 7.5. The low dielectric constant material can be an oxide such as silica or aluminosilicate or a non-oxide such as silicon nitride, boron nitride, or silicon carbide. The low dielectric constant material can be incorporated in the ceramic matrix as a filler.

Abstract: A highly weathering-resistant coating material exhibits an excellent water resistance and water repellency. The coating material contains a vinyl-type polymer that contains a pendant carbosiloxane dendrimer structure. The coating material is used on construction materials, buildings and structures undercoated with an organic coating material, automobiles, railroad rolling stock, ships, aircraft, and bridges, commercial and industrial plants, and electrical and electronic instruments and devices.

Abstract: The present invention concerns a composition and method for separating heavy metals from contaminated substrates with compositions containing active agent selected from the group consisting of [S,S]-ethylene diamine disuccinic acid and [S,S]-di-imine butane dioic acid.

Abstract: To provide a high-purity platinum complex catalyst composition that has an excellent storage stability, is easy to handle, and has a high catalytic activity. Also, to provide a process for the preparation of this platinum complex catalyst composition and provide a microparticulate thermoplastic resin catalyst composition.

Abstract: Rigid substrates containing an adhesive composition on at least one surface are prepared by an injection molding operation. The degree of bonding between the adhesive layer and the substrate is greater than can be achieved using conventional methods for coating substrates with adhesive compositions.

Abstract: A silicone composition curable to a silicone bonding agent that is suitable for use in manufacturing an optical memory element comprises:(A) 100 parts by weight of an organopolysiloxane having an average of at least two silicon-bonded alkoxy groups per molecule and an average of at least two silicon-bonded alkenyl groups per molecule, wherein the alkoxy groups and the alkenyl groups are in the same molecule;(B) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, wherein the molar ratio of silicon-bonded hydrogen atoms in component (B) to silicon-bonded alkenyl groups in component (A) is from 0.3:1 to 20:1;(C) 0.01 to 20 parts by weight of a metal condensation reaction catalyst wherein the metal of said metal condensation reaction catalyst is selected from the group consisting of titanium, zirconium and aluminum; and(D) a catalytic amount of a hydrosilylation reaction catalyst. The composition is cured by an addition reaction and a condensation reaction.