Abstract: Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.

Abstract: A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

Abstract: In one embodiment, a control system supports an unlimited number of feedback control loops all sharing control of a component. A component performance rate or “speed” is used as a common metric for negotiating control of the component. Each control loop continuously monitors a system parameter it is tasked with regulating, compares it to a setpoint for that system parameter, and “requests” a speed in relation to the deviation of the associated system parameter from the corresponding setpoint. A controller receives the requested speeds as dynamic inputs and selects one of the requested speeds according to predefined selection logic. The controller communicates the selected speed to an actuator, which causes the component to operate at the selected speed. In this manner, the control system in effect negotiates control of the component in a way that ensures that all of the system parameters are being managed within safe limits.

Abstract: An apparatus and method provide supplemental support to an electronic card from above, such as along a longitudinal edge of a PCI card opposite an edge connector on the motherboard. The supplemental support may be provided at any of a plurality of locations along the edge of the card, to avoid interference with certain features on the card and to accommodate cards of a variety of shapes and sizes. One embodiment provides a support apparatus that includes a track secured to the computer chassis over the card, and is generally aligned with a longitudinal edge of the electronic card. A collar is disposed on the track and is moveable to any of a plurality of positions along the track. A plunger is inserted through the collar and is movable with respect to the collar into engagement with the longitudinal edge of the electronic card. A first locking member is activated in response to inserting the plunger into the collar to prevent relative movement of the collar and the plunger with respect to the track.

Abstract: A hard disk drive carrier having a latch apparatus to facilitate leveraged insertion of a hard disk drive into a receiving drive bay to an interfaced position, securing of the hard disk drive carrier in the drive bay when the hard disk drive secured to the carrier interfaces with a host computer, leveraged dislodgement of the hard disk drive from its interfaced position for removal of the hard disk drive from the drive bay, and proper positioning of the latch apparatus upon insertion of the hard disk drive carrier to ensure proper engagement of the latch apparatus with the drive bay for leveraged insertion and removal.

Abstract: A power management scheme is disclosed wherein power limits are imposed on devices of an electronic system using selective airflow reduction. In one embodiment, each server in a rack system includes a throttling system for maximizing processor throughput within a fixed temperature constraint. An airflow system is capable of providing a variable amount of airflow to each server. The power consumption for each server is detected by an external power meter circuit and monitored by a controller operatively connected to the airflow source. The controller selectively reduces the amount of airflow to each server in relation to its power consumption, to induce an amount of throttling of each server sufficient to impose its respective power limit.

Abstract: Systems and methods are provided for managing power in a processing system. In one embodiment, a target system having a plurality of electronic devices is operated within a net power limit. A local controller detects power consumption for each device, and communicates the power consumption to a power management module. The power management module dynamically apportions the net power limit among the devices, and communicates the apportioned power limit for each device back to the associated local controller. Each local controller enforces the apportioned power limit to an associated device on behalf of the power management module.

Abstract: In one embodiment, air is automatically sampled within a zone of interest in response to an event caused by a mammal. The release of material from the mammal may be induced by directing an increased velocity airflow at the mammal or by introducing a sneezing agent into the zone of interest and capturing the air sample after the mammal has sneezed. Materials contained within the sampled air may include organic material such as skin, hair, saliva, or mucus, and gases such as CO2 and methane. The materials may be forensically analyzed to confirm the presence or to determine the identity of the mammal. The organic materials may contain DNA, in which case the forensic analysis may include a DNA analysis to determine the identity of the mammal.

Abstract: A system for ordering on-screen windows for display is disclosed in which an active window partially overlaps an inactive window and hides a portion of the inactive window. The movement of a mouse pointer is monitored to determine its location on the screen. In response to the inactive window being selected with the mouse pointer, the inactive window is given focus to enable the inactive window to receive event signals even though a portion of the inactive window remains hidden, whereby original display depths of the windows is maintained.

Abstract: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: Method and apparatus for blind docking an electronic device or module with an electrical connector, for example within a rack for a computer system. A forwardly-directed power connector is secured to a distal end of at least one rail or shelf bracket for blind docking with a rearwardly-directed power connector on the electronic module. The shelf bracket securing the forwardly-directed electrical connector is included in a pair of longitudinally-extending shelf brackets secured to opposing vertical side walls of a rack at a common elevation to form a module bay. The electronic module may slide along the shelf bracket until a rearwardly-directed power connector of the electronic module blind docks with the forwardly-directed power connector. A boss or alignment stud may be included on the bracket to improve alignment of the connectors. The forwardly-direct electrical connector may also be secured to the bracket with a floating connection to enable minor adjustments in alignment during blind docking.

Abstract: Method and computer program product for recommending cost effective upgrades for a computer system. At least one performance parameter is determined for an existing computer system. Up to date performance specifications for available upgrade components are obtained. A variety of potential systems are modeled utilizing at least one upgrade component, and at least one component from the existing system to create upgrade scenarios. At least one performance parameter is predicted for each upgrade scenario. The performance parameters for the upgrade scenarios are compared to the performance parameters of the existing computer system. The cost-effectiveness is determined for each upgrade scenario, and upgrade recommendations are made when the cost-effectiveness meets or exceeds a target value.

Abstract: A method for testing a printed circuit board to determining the dielectric loss associated with the circuit board material relative to a standard. Dielectric losses in the material generate heat when a high frequency electronic signal, such as a microwave frequency signal, is communicated through a microstrip that is embedded within the printed circuit board. The temperature or spectrum at the surface of printed circuit board is measured and compared against the temperature or spectrum of the standard to determine whether the material under test is acceptable. While various temperature measurement devices may be used, the temperature is preferably measured without contacting the surface, such as using an infrared radiation probe.

Abstract: A system and method are used for electronically detecting the accumulation of dust within a computer system using a capacitive dust sensor. The dust detection system may be implemented on a smaller computer, such as an individual PC, or in a more expansive system, such as a rack-based server system (“rack system”) having multiple servers and other hardware devices. In one embodiment, each server in a rack system includes a capacitive sensor responsive to the accumulation of dust. The capacitive sensor may include one or more capacitive plates integral with a heatsink. As dust collects on the capacitive plates, the capacitance increases. When a capacitance setpoint is reached, indicating the dust has reached a critical level, an alert is generated. The alerts may be received by a management console for the attention of a system administrator. Each alert may contain the identity of the server generating the alert, so that the system administrator knows which server(s) are to be removed for cleaning.

Abstract: Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.

Abstract: Adapter module securable to a socket frame, integrated circuit module assembly and method for securing a heat dissipation device in direct thermal communication with an integrated circuit module. The socket frame is positioned over a substrate having a land grid array and the frame is secured to the substrate. The frame defines a well for selectively receiving the integrated circuit module in electronic communication with the land grid array. The adapter module is secured to the frame and extends outside the perimeter of the frame. The adapter provides a feature outside the perimeter of the frame for fastening the heat dissipation device. Furthermore, the adapter body is secured to the frame without adding holes through the substrate, such as by extending under the frame to be secured between the frame and substrate, or by extending over the frame to be secured between the frame and fasteners.

Abstract: A scalability card for use with a plurality of computer blades. The computer blades are releasably securable in a parallel configuration, wherein each blade includes a circuit board and a processor operatively coupled to the circuit board. Each processor is in electronic communication with a scalability connector on a floating plate that is loosely secured to the computer blade. Furthermore, each scalability connector is preferably disposed in a common plane extending perpendicular to the plurality of parallel computer blades. The scalability card includes a plurality of electronically interconnected scalability connectors arranged for rough alignment with the scalability connectors of each computer blade. In addition, the scalability card preferably includes at least one alignment feature for engaging each floating plate and, therefore, providing fine alignment of the scalability connector on each floating plate to one of the scalability connectors of the scalability card.

Abstract: A system chassis includes multiple chassis bays configured for receiving either of a single, conventional server blade or an adapter blade. The adapter blade can selectively secure a plurality of compact blades, such as a blade PC. The adapter blade includes a blade latch for selectively releasing the adapter blade from the chassis bay, wherein the presence of a compact blade enclosure within any of the plurality of adapter bays of the adapter blade prevents the latch from being operable to release the adapter blade. The compact blade preferably includes a latch disposed along an upper or lower edge of the blade for selectively releasing the compact blade enclosure from the adapter bay. The adapter blade preferably also includes an interposer disposed for electronically communicating each compact blade with a server interface a separate node upon securing a compact blade within any of the adapter bays.

Abstract: A modular electronic system including a mechanism for releasably securing a modular device within a chassis, and for facilitating insertion and removal of the modular device. One embodiment provides a modular device that includes a handle secured to opposing pivotable lever arms. A follower pin secured to one end of the lever arms rides in a slot defined by the chassis. The slot is arranged so that pulling upward on the handle moves the follower pin in one direction along the slot to urge the modular device in a direction further into the device bay, and pushing downward on the handle urges the modular device in a direction out of the device bay, thereby providing a mechanical advantage to the user. When the modular device is fully inserted, retractable locking members provided on the modular device move into windows provided on the chassis, to releasably lock the modular device in the device bay.

Abstract: Systems and methods for detecting and analyzing elevated temperatures at a component rack to identify and characterize air recirculation anomalies. In one embodiment, temperatures are sensed in proximity to an air intake of the component rack. Temperature sensors communicate with a workstation having system management software including a thermal management component for analyzing air intake temperatures. Predefined temperature differentials (PTD) are established, corresponding to expected temperature differentials between the selected locations in the absence of any appreciable recirculation. The PTD provides a threshold for comparing with “actual” temperature differentials (ATD) to identify the presence and/or mode of recirculation. If an ATD exceeds a corresponding PTD for a predefined time interval, a signal is output. The mode of recirculation, such as left-side, right-side, or dual-surface recirculation, may be determined using as few as four temperature sensors positioned at a zone of interest (ZOI).