Abstract: A device for a drain, such as a manhole 10 for access to a sewer, is protected by a seal structure 34 having a bottom bleeding feature such as a bottom thru-bore 42. The seal structure 34 may have a flange 38 for sealingly engaging between a cover 22 and a frame 18 around an accesshole 17 of the manhole 10. The structure 34 has a central portion downwardly depressed to avoid a path of spin of the cover 22. In a bottom portion 40 of structure 34, the thru-bore 42 bleeds (such as by thin trickling streams) into and off the sewer, sufficient fluids such as air to maintain a substantially atmospheric level of pressure in the sewer. Because of its size and shape, the thru-bore 42 advantageously bleeds into the sewer, from water introduced to manhole 10, only quantities of water known to be tolerated by the sewer system. To avoid unsanitary conditions, when water stops entering accesshole 17, the thru-bore 42 substantially completely drains away water remaining in the seal structure 34.

Abstract: A strip (10) of delicate foil is advanced longitudinally along a substantially flat path such as along a platen (104) for printing patterns of lead clusters (12) in photoresist on the foil. A margin (28) of strip (10) is formed into a guiding member such as a standing ridge (98), leaving a residue portion (29) in a desirably flat condition. Ridge (98) has a convenient reference edge (102) and a structural angle is formed by ridge (98) with adjacent foil portions. Such angle is sufficiently strong that advancing strip (10) receives no unacceptable deformation as the reference edge (102) is contacted such as to a reference wall (100) for guidance. Strip (10) is biased so the reference edge (102) maintains contact with guiding apparatus so located that the strip follows the desired path. For example, a flat member (122) is biased downward upon the residue portions (29) of strip (10) and the flat path while a side of member (122) is biased against ridge (98) and the reference wall (100).

Abstract: Components such as lids (9) and electronic chip carriers (10) are assembled by registering respective mating faces of each component. An array of assembly stations (75) are formed on an upwardly extending edge (67) of a base (66) having a special inclination. For example, a lid (9) is supported with its mating face upturned and a carrier (10) is supported with its mating face downturned upon the upturned face of the lid (9) on the base (66). The inclination causes the components to slide relative to each other and the base in a given direction within each station (75). A plate (92) overlies a plate (72), supported on and inclined with the base (66). Plate (72) has an opening (74) and plate (92) has an overlying opening (94) to each station (75). The openings (74) and (94) have respective reference edges for stopping sliding of, and thereby positioning an upturned lid (9) and a downturned carrier ( 10) thereupon with a desired registration.

Abstract: At least one article such as a device (10) is reoriented to achieve uniform orientation of a plurality thereof. The devices (10) typically have a head (12) and a body portion (18) depending therefrom along a plane (26) dividing the head asymmetrically. A portion of head (12) has a fully developed shape typically seen along one side of a disc while another portion of head (12) has at least one segment omitted. A preferably air powered track (30) is utilized to guidably advance the devices (10) in a single file. The body portions (18) are disposed in track (30) with their respective dividing planes (26) lying substantially along a common plane passing through a longitudinal slot (50) in a feed section of track (30). A device (10) is assumed to have a desirable orientation when its flat (24) faces such as to the back of track (30) and an undesirable orientation when flat (24) faces oppositely such as to the front of track (30).

Abstract: Individual ones of articles such as (LED) devices 10 are fed and positioned at one or more stations along a path traversed by the devices. A track 30 guidably advances the devices 10 in single file to and beyond stations 63 and 64 successively located along the path represented by a channel 35 in the track 30. An assembly 50 shuttles, transversely of the channel 35, a plurality of fingers 66-70 simultaneously from a working state to and from a transitory state with respect to devices 10 in channel 35. The fingers may be in the form of thin, upright blades 66-70 which are engaged to assembly 50 and extend substantially normally of and into channel 35 in response to the shuttling. An indexing blade 68 extends from the front of and into channel 35 when shuttling assembly 50 is in the working state to block a waiting file of devices 10.

Abstract: An article such as a semiconductor wafer (12) is contacted for plating on an active surface (16). Disposed adjacent to and around the surface (16), there is a conductor such as an annular ring (58) which is adapted for connection to a current source. A composite member (62) has an outer portion (64) for contacting the conductor ring (58) and an inner portion (63) for contacting peripheral regions of surface (16) of the wafer (12). Each of the portions (64 and 63) have a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends. The first ends of the elements in the outer portion (64) are for contacting the conductor (58) and the first ends of the elements in the inner portion are for contacting the surface (16). A coupling member such as a compliant metal foil (66) is contacted to and interconnects the second ends of the elements in the inner and outer portions (63 and 64).

Abstract: An article such as a semiconductor wafer (10) is cut by splitting along a line (22) in a plane known to facilitate splitting. Wafer (10) is supported in a laterally unrestrained manner in a holder (34) lined with preferred paper (26) and fitted with a reference plate (43). Paper liner (26) is of a type having a surface (25) capable of developing lateral restraint by friction between such surface (25) and a surface (13) of wafer (10). A resilient force is applied normal to and upon a top surface (11) of wafer (10) by a press (60) having members (75 and 76) applied along line (22). Separation stresses develop along line (22) of the splitting plane and friction forces develop along paper surface (25) providing lateral resistance to an expected cutting force. A cutter (80) has an elongate tool (92) which is advanced at a top edge (27) of wafer (10) where it abuts plate (43).

Abstract: A workpiece such as a minute stud (34) is aligned to a small porcelain body (36) to form a guide (40) for processing lightwaves. Such alignment includes registering a target (30) of an avalanche photodiode in a chip (32) on the stud (34) to a fiber receiving bore (44) in the body (36). Radiation, preferably in the form of a beam of light, is directed to a first end of the bore (44). Some portion of the light is redirected sufficiently to pass longitudinally along the surfaces of the bore (44) and thereby project an image from a second end of the body (36). The image is advantageously in the form of a halo which is enlarged and displayed on a video monitor (100). The stud (34) is manipulated about the first end of the bore (44) by operating micropositioning fixtures (66 and 68). The target (30) in chip (32) reflects light sufficiently to cast a preferably dark image of the target ( 30) through the bore (44) and its image onto the video monitor (100).

Abstract: A ring connector (80) is provided for electrically coupling device contacts such as probes (59) on a card (50) to circuit elements such as pads (94) on a performance board (90). The probes (59) are conventionally disposed outwardly of and around an axis 55 normal to card (50) whereat a device (10) being contacted is generally located. The ring connector (80) has first and second major faces, a thickness therebetween sufficient to install preferably insertable type couplers for coupling to contacts and circuit elements and an axis therethrough common to the axis 55 of the probe 59. Couplers such as sockets (84) are installed in the first face of the ring connector (80) for coupling to the probes (59) on card (50) and such sockets (84) are disposed outwardly of and around the common axis (55). Couplers such as pins (82) are installed in the second face of the ring connector (80) for coupling to circuit elements such as the pads (94) on the performance board (90).

Abstract: A workpiece such as a miniature stud (10) supports a chip (20) having a heat and light sensitive device therein. Such stud (10) is thermally bonded to an insulative body (12) to form a guide (14) for converting light to electrical pulses. A positive and a negative electrode (44 and 45), respectively, are each connected to a respective pole of a power supply for providing electrical current adequate for the bonding. A resistance heating element (42) conducts the current from electrode (44) at least partially along a path through the stud (10) to electrode (45). For stud (10), the path is selected preferably by providing a thru hole (90) in element (42) under the position occupied by the heat sensitive device when stud (10) is placed upon the element (42). The current concentrates in stud (10) along an annular ring (29) where heating is required sufficiently to thermally bond at least the ring (29) of the stud (10) to the body (12).

Abstract: Articles such as miniature laser chips (15) are individually removed from an array on an adhesive web (20). A subjacent forming die has a planar, central surface (160) containing a vacuum cavity (120) and peripheral sloping surfaces (162). The web (20) has an adhesive side for holding the chips (15) and a smooth side for conforming to surfaces (160) and (162) of die (116). A leading target chip (15) is located centrally of cavity (120) on a planar portion of web (20) which portion is substantially restrained from movement away from die (116) by vacuum drawn in cavity (120). At the smooth side of web (20), within cavity (120), there is a needle (135) which is movable perpendicularly of and through web (20) along a path containing the target chip (15). At the adhesive side of web (20), opposite needle (135), there is a pickup probe (147) having a vacuum port (166 ) to retain a chip (15). Also, probe (147) is movable relative to and with a target chip (15) and the needle (135).

Abstract: Gas, such as exhaust gas from a silicon epitaxial reactor, is treated with a liquid such as water. A basin (12) holds a solution (20) including the liquid utilized to treat such gas in the manner intended. An inlet chamber (14) and a convenient self-cleaning passageway (46) introduce the gas into and below a first level (36) of solution (20) established within a treatment chamber (16) in the basin (12). Within delivery piping (44), pressure is provided for advancing the gas for treatment. The treatment chamber (16) is provided with sidewalls (28 and 30) having passageways (46 and 48, respectively), which cooperate with the gas pressure to establish multiple levels (36, 38 and 40) of solution (20) in basin (12) to seal chamber (16). Chamber (16) is also provided with heads (60-67) for spraying the liquid into the advancing gas to wet the same for a time sufficient to treat the gas.

Abstract: Articles such as printed wiring board substrates (10) often having hundreds of tiny through-bores are coated with particles (76) in fluidization apparatus (55). Such apparatus (55) includes a base (56) having a frame (61) to receive reciprocation forces applied to an arm (65) and to transmit the same to a fluid bed assembly (68). Assembly (68) includes a plenum (71) for distributing gas, a holder (75) for a bed of particles made fluid-like by gas diffusing therethrough and columns (69) for supporting a work chamber (85). Connected to the bed assembly (68) is the chamber (85) having sidewalls (86-89) formed sufficiently strong to uniformly distribute horizontal vibratory forces thereover. Vibrators (91 and 92) are mounted to opposing sidewalls (88 and 89), respectively, to apply horizontal forces against such sidewalls and gases therebetween.

Abstract: Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

Abstract: First components such as lids (9) are assembled to second components such as electronic chip carriers (10). Each lid (9) has an external surface opposite a first mating face and each carrier (10) has a second mating face complementary with the first mating face of the lid (9). An assembly station contains a first frame (30) having first walls (31-35) for confining and first ledges (37-38) for supporting a lid (9). Frame (30) has an advantageous peripheral opening (39) suitable for passing therethrough portions of devices for transferring lids (9). Preferably such stations (25) are established in an array suitable for access by an array of lids (9) transferred by a first device (35). A first magazine (70) holds files of lids (9) with external surfaces of leading ones in an array for contact, pickup and transfer.

Abstract: A tool (10) for handling a magnetic article (50) includes a member (12) having a jaw (18) which is movable toward and away from a member (14) having a corresponding jaw (14). A holder (34) is associated with jaw (20) of member (14) for releasably holding an article (50) in cooperation with a magnetic field. A magnet (42) is associated with and removably applied by jaw (18) of member (12) in stages. To pick up an article (50), magnet (42) is moved by member (12) to establish a magnetic field at holder (34). To release an article (50), magnet (42) is withdrawn by member (12) to withdraw the magnetic field from holder (34). The article (50) is restrained at holder (34) until gravitational force overcomes the attraction of the withdrawing field and the article separates from tool (10).

Abstract: An assembly is provided for selecting at least one vertically oriented planate article such as a disc-shaped wafer (10) from an array of such wafers. A carrier (20) holds the wafers (10) in a mutually spaced, substantially parallel relationship along a single horizontal file. Peripheral portions of each wafer (10) are supported in opposing guides (26) formed generally vertically along opposing first and second sidewalls (22) and (24), respectively, of the carrier (20). A frame (42) positions the carrier (20) so the file of wafers (10) extends substantially along a vertical plane (44) passing generally centrally of each wafer and of the frame (32). A rotatable shaft (62) extends parallel to the file and subjacent of the wafers (10). For selecting a singular wafer (10), at least one cam (64) is mounted to and rotates with the shaft (62) for engaging and displacing a randomly selected wafer (10) a desired distance upwardly along the guides (26) of the carrier (20).

Abstract: Articles such as substantially flat, electronic chips (10) are positioned in an array with surfaces (11) to be treated facing upward along a succession of specially selected tiers. Such tiers may preferably be horizontal rows (20-24) of top rims (19) of vertical suction tubes (18). A leading row (20) of such top rims (19) is at a first elevation and each succeeding row is parallel to, elevated above and offset horizontally from a preceding row in stepwise fashion. At least one nozzle (40) is provided for propelling a stream (52) of a treating medium upon and at an angle "H" to the surfaces (11) to be treated. Angle "H" is selected so the medium and any dislodged matter is deflected from the respective surfaces (11) without contacting other such surfaces (11) of chips (10) positioned for treatment in the array.

Abstract: Articles (18) are transferred from a first position, such as a feed track (37) on which they are located closely spaced, to a second position such as a heat seal apparatus. At the heat seal apparatus the spacing of the articles is to coincide with the spacing of frame members (32) to which the articles are to be joined. The change in the spacing occurs during the transfer of the articles from the first to the second positions by means of a transfer mechanism (41). A plurality of pickup members (43) are slideably mounted to an arm (44) of the mechanism (41). The pickup members (42) which are resiliently urged apart with respect to each other are forced together at one end of the travel of the arm (44) to assume the close spacing established by the width of the pickup members. At the other end of the travel of the arm (44) the resilient urging force drives the pickup members (43) against predetermined stop positions.

Abstract: Apparatus is provided for releasably retaining an article such as an optical cable (10) for rotation of the article. A chuck body (31) is provided along with components (24, 26 and 46-48) for rotating the body (31) and the cable (10) about a common central axis (33). A jaw (34) is affixed to the body (31) and disposed generally laterally of the axis (33). A movable jaw (35) is provided having at least mating surfaces which are complementary to the fixed jaw (34) for mounting thereto and grasping therebetween the cable (10) disposed about the axis (33). Magnetic devices are associated with the jaws (34 and 35) for releasably mounting the movable jaw to the fixed jaw for releasably retaining a cable (10) therebetween. For example, first and second magnets (36 and 37), respectively, may be made a part of a jaw such as movable jaw (35) and be disposed astride the central axis (33).