Abstract: A semiconductor device that includes transmitter circuits and receiver circuits that share a common data line and method is disclosed. Each transmitter circuit may include a frequency modulator that receives a stream of data and provides a frequency modulated data output at a predetermined carrier frequency. Each receiver may include a band pass filter that allows a corresponding frequency modulated data output from a corresponding transmitter circuit to pass through to a demodulator while essentially excluding the other frequency modulated data. In this way, a plurality of transmitter circuits can simultaneously transmit data with each one of the plurality of transmitter circuits transmitting data to a predetermined receiver circuit.

Abstract: A memory device including a static random access memory (SRAM) cell comprising junction field effect transistors (JFETs) has been disclosed. The memory cell includes a first bipolar junction transistor (BJT) for driving a bit line at logic levels having a potential outside the potential range in which the SRAM cell operates. An amplifier including a level translator circuit provides a level shifting operation on the data provided by the bit line to provide level shifted data having a voltage swing within the potential range in which the SRAM cell operates. The level translator circuit includes a second BJT. In this way, fast read operation of a SRAM cell comprising JFETs may be provided.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A level shifting circuit can include a first input junction field effect transistor (JFET) having a gate coupled to receive an input signal having a first voltage swing that provides a controllable impedance path between a first supply node and a first terminal of a first bias stack including at least one JFET. A driver circuit can be coupled to receive an output from the first bias stack that provides a level shifted output having a second voltage swing that is less than the first voltage swing.

Abstract: A semiconductor device that includes a memory cell having a junction field effect transistor (JFET) used to form a content addressable memory (CAM) cell is disclosed. The JFET may include a data storage region disposed between a first and second insulating region. The data storage region provides a first threshold voltage to the JFET when storing a first data value and provides a second threshold voltage to the JFET when storing a second data value. The memory cell is a dynamic random access memory (DRAM) cell and can be used to form a CAM cell. The CAM cell may be a ternary CAM cell formed with as few as two JFETs.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor device including a bias voltage generator formed from a junction field effect transistor (JFET). The JFET includes a control gate terminal and a first and a second source/drain terminal. The first and second source/drain terminals can form a first terminal of a p-n junction and the control gate terminal can form a second terminal of the p-n junction. The first terminal of the p-n junction can be provided with a first potential. The second terminal can be left essentially floating to provide a bias voltage. A bias receiving circuit can receive the bias voltage. The bias receiving circuit can be in close proximity on the semiconductor device to the bias voltage generator.

Abstract: A current protection apparatus (200) and current protection method (1000) that may include programmable current protection characteristics has been disclosed. A current protection apparatus (200) may include a power distribution unit (230) with power distribution outlets (PDO-1 to PDO-8), each having a corresponding circuit breaker unit (CB1 to CB8). Each circuit breaker unit (CB1 to CB8) may operate in response to a processing unit (236) that can sample current values flowing between a respective power distribution outlet (PDO-1 to PDO-8) and a load device (LD1 to LD8). Processing unit 236 may operate under control of software stored on a memory (238) to control a switching circuit (320). Current protection characteristics for each circuit breaker unit may be independently programmed and/or altered by a user, for example by way of a computer (250).

Abstract: In a multi-chip package having vertically stacked semiconductor integrated circuits (chips), a heat transmitting conductive plate (5) can be interposed between a lower layer semiconductor chip (3) and an upper layer semiconductor chip (4) and connected to a ground wiring of a substrate (2) through a bonding wire (9). A heating transmitting conductive plate (5) at the ground potential can block propagation of noise between the lower layer semiconductor chip (3) and upper layer semiconductor chip (4). Thus, the addition of noise to signals of an analog circuit in the upper layer semiconductor chip (4) can be avoided, reducing noise induced malfunctions. Furthermore, heat generated by the lower layer semiconductor chip (3) and upper layer semiconductor chip (4) can be transmitted through contact points with the heat transmitting conductive plate (5) for dissipation therefrom. This can improve heat dissipating capabilities of the semiconductor device (1) contributing to more stable operation.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor memory device including a dynamic random access memory (DRAM) cell and a ternary content addressable memory (TCAM) cell is disclosed. The DRAM cell may include a data storing portion and a data read portion. The data storing portion and data read portion comprising p-channel junction field effect transistors. The TCAM cell including an x-cell, y-cell, and comparator circuit. The x-cell, y-cell, and comparator circuits comprising p-channel JFETs.

Abstract: A current protection apparatus (200) and current protection method (1000) that may include programmable current protection characteristics has been disclosed. A current protection apparatus (200) may include a power distribution unit (230) with power distribution outlets (PDO-1 to PDO-8), each having a corresponding circuit breaker unit (CB1 to CB8). Each circuit breaker unit (CB1 to CB8) may operate in response to a processing unit (236) that can sample current values flowing between a respective power distribution outlet (PDO-1 to PDO-8) and a load device (LD1 to LD8). Processing unit 236 may operate under control of software stored on a memory (238) to control a switching circuit (320). Current protection characteristics for each circuit breaker unit may be independently programmed and/or altered by a user, for example by way of a computer (250).

Abstract: A data transmission system including a slave device (30) and a master device (10) is disclosed. Slave device (30) may include a slave side clock signal generator section (32) for generating a slave side clock signal (CLKSOUT), a phase adjusting circuit (40) for controlling a phase of a slave side clock signal (CLKSOUT), output sections (33-1 to 33-m) for outputting transmission data signals (SD1 to SDm) in response to slave side clock signal (CLKSOUT), and a timing reference signal generator section (34) for outputting a timing reference signal (SSPH) in response to slave side clock signal (CLKSOUT).

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor device (10) that may have a wire bonding structure having reduced interference between bond wires and a path of a capillary has been disclosed. Semiconductor device (10) may include bond pads (12) arranged in a line along an edge of a semiconductor chip (14) and conductive fingers (16) arranged on a substrate (18). Bond pads (12) may be electrically connected to conductive fingers (16) with bond wires (20). Bond wires (20) may be divided into a first group having a relatively short length and a second group having a relatively long length. The bond wires (20) in the first group may have bonding points on a bonding pad (12) that is closer to an edge of semiconductor chip (14) than bonding points of bond wires (20) in the second group. In this way, spacing between bond wires (20) already formed and a capillary forming an adjacent bond wire may be increased.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor device including memory cells isolated by a trench that may be self aligned with a stacked film pattern (7) has been disclosed. The memory cells may be flash memory cells having an active gate film (2) that may be thinner than a gate oxide film (30). The active gate film (2) may be located in a central portion under of a gate electrode (3). The gate oxide film (30) may be located under end portions of the gate electrode (3). In this way, a distance between a shoulder portion of a trench (11) and a gate electrode (3) may be increased. Thus, an electric field concentration in the shoulder portion of the trench (11) may be decreased and memory cell characteristics may be improved.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.