Abstract: A method for plasma etching of silicon nitride using a mixture of trifluoromethane and oxygen in a ratio of approximately 8 to 1 to selectively etch silicon nitride in preference to silicon dioxide and photoresist, resulting in critical dimension gain.

Abstract: The invention provides a method and apparatus for gaming. The method includes receiving a betting level; calculating a required score using a list of scores corresponding to the betting level and a house advantage; and using the required score as a score to be attained in a game of at least partial skill. The system includes a central server; at least one casino server connected to the central server via a communications link; and a gaming machine coupled to the casino server. At least one of the central server and the casino server are configured to: receive a betting level; calculate a required score using a list of scores corresponding to the betting level and a house advantage; and use the required score as a score to be attained in a game of at least partial skill.

Abstract: A flexural joint, in particular a flexural thrust joint suitable for precision stages and application requiring vacuum is disclosed herein. A two degree of freedom joint comprises: two joint elements, each with a load bearing surface; two flexures attached between the elements, such that the flexures are under tension when the joint is subject to a compressive load. The flexures are long and thin, such that they can twist and bend, giving the joint two degrees of freedom. A three degree of freedom joint comprises: a first joint element with a load bearing surface; a second joint element with a second load bearing surface; a third joint element; two first flexures attached between the second and third elements; two second flexures attached between the third and first elements, such that both the first and second flexures are under tension when the joint is subject to a compressive load.

Abstract: Briefly, a preferred embodiment of the present invention includes an apparatus for tuning a regulator in a process controller. The digitized output from a standard relay and a parasitic relay are fed through digital to analog converter providing signals at 0.5&ohgr;c, &ohgr;c and 1.5&ohgr;c to the process, where &ohgr;c is the process critical frequency. The apparatus records the digitized relay output u′ and the digitized process output y′ until stationary oscillations are reached. The outputs u′ and y′ are then used to calculate the process frequency response at 0.50&ohgr;c, &ohgr;c and 1.5&ohgr;c. This data is then used to design the regulator, the output of which is converted to analog form and inputted to control the process.

Abstract: A programmable digital camera requiring a programming password to be entered to access the camera's programmability. The camera further includes programming so as to allow the camera to be operated only for a specified time interval, after which the camera becomes inoperable until the programming password is again entered and the camera is programmed to operate for another interval of time. An alternate embodiment of the invention includes a programmable digital camera as above described wherein the camera is programmed to only capture a set number of images, at which point the programming password must again be entered and the camera reset for another quantity of images. A further alternate embodiment includes a camera system with a separate transmitter for radiating a signal designed to cover a designated area, the signal being modulated with a camera operational code. The camera is equipped with a corresponding receiver and demodulator to receive the operational code.

Abstract: A reconfigurable multi-add/drop module for optical communications. The system includes a first network interface GRIN lens collimator connected on one end to an optical fiber of a communications network. An output of the GRIN lens is directed to a series of slidable two-section channel filters. Each filter is mechanically movable to a first position that passes all wavelengths. The second position of each filter reflects a particular wavelength to a corresponding add/drop GRIN lens collimator that receives the reflected light and outputs it into an add/drop fiber. The outputs from the add/drop collimators are directed to a single add/drop fiber through use of a power combiner. Light that passes through all of the filters is directed into a second network interface GRIN lens collimator for the purpose of coupling the light onto a second network optical fiber. A carrier wavelength can also be entered/added at the add/drop port.

Abstract: A method allowing reliable routing of individual optical carriers through an optical network is disclosed. Routing information is impressed on individual carriers by a method known as subband quadrature coding (SQC). The optical carrier is modulated at a first frequency, and at a first intensity to impress application data on the carrier. The carrier is additionally modulated at a second frequency, preferably two orders of magnitude less than the first frequency, and at a second intensity less than the first intensity to impress management data on the carrier for routing the carrier through an optical communications network, from a source to a destination. According to the method, the management data is continuously impressed upon the carrier during transmission of the application data. The optical carrier is multiplexed onto the fiber optic communications line, and upon reaching a first node, the carrier is demultiplexed and an intensity sample of the carrier is detected.

Abstract: A multiwafer chemical vapor deposition (CVD) reactor providing improved material deposition uniformity through use of improved gas injection and exhaust apparatus. The reactor includes a wafer boat for supporting a vertical stack of wafers, spaced apart for passage of a reactant gas. A preferred embodiment of the gas injector is in the form of a vertically oriented body having at a first end a gas inlet, and extending inward from a wall of the reactor towards the wafer boat, terminating in a widened injector outlet. The injector body and outlet extend vertically a distance approximating the height of the wafer boat, and the outlet is widened to provide an improved flow of gas across the wafer. A face of the injector outlet contains a plurality of gas ejecting holes, arranged to provide a uniform supply of reactant gas over each wafer surface.

Abstract: A semiconductor wafer or flat panel display process chamber for thermally driven, chemical vapor deposition, and/or plasma enhanced chemical vapor deposition processes includes a chamber for loading/unloading the substrate to be processed, and another chamber for processing. The substrate is heated with multiple zone radiant heaters arranged around the processing chamber to provide uniform heating. Process gases are injected into and exhausted in a cross flow fashion. The chamber may be used for plasma processing. Shield plates prevent deposition of reactant species on chamber walls, and also serve to diffuse heat uniformly the chamber.

Abstract: A method of generating an album, comprising: providing a plurality of digitally encoded images, automatically arranging at least some of the images to fit a format of an album and printing a photograph album using the determined arrangement. Preferably, each page of the album is a single sheet of photographic paper.

Abstract: A wafer handling apparatus having input and output robotic systems directed by a programmed controller. Each system has components including a robot, a twist and rotate, and a carrier and automated carrier rail. The input system is for removing wafers from their wafer pod, placing them in the carrier and transporting them via the rail to a wafer processing area. The output system performs the reverse operation, taking wafers from a carrier following processing and placing them in a pod. Each robot includes a plurality of interconnected, articulated cantilevered arms. The last one of the arms has a wand on one end and a laser emitter detector on the other end, and operates in cooperation with the controller to provide location detection of system components. The controller also includes circuitry for sensing contact of the wand with an object by measuring the increased robot motor torque occurring upon contact.

Abstract: A plasma enhanced chemical vapor deposition (PECVD) system having an upper chamber for performing a plasma enhanced process, and a lower chamber having an access port for loading and unloading wafers to and from a wafer boat. The system includes apparatus for moving the wafer boat from the upper chamber to the lower chamber. The wafer boat includes susceptors for suspending wafers horizontally, spaced apart in a vertical stack. An RF plate is positioned in the boat above each wafer for generating an enhanced plasma. An RF connection is provided which allows RF energy to be transmitted to the RF plates while the wafer boat is rotated. Apparatus for automatic wafer loading and unloading is provided, including apparatus for lifting each wafer from its supporting susceptor and a robotic arm for unloading and loading the wafers.

Abstract: A detachable, portable SEM column that is easily disconnected from the electron gun assembly and specimen chamber of the system, allowing different column designs to be used in a given SEM system. As an alternate design, the electron gun and column are configured as a single detachable, portable assembly. The column of the present invention contains a condenser lens and an objective lens, both designed employing permanent magnet elements for primary field generation. Relatively small coils are used for scanning and precise adjustment of focus.

Abstract: A tool for attachment to a working end of an excavator arm for use in supporting a pipe section while lowering it into a trench. The tool has a proximal end from which extends an elongated arm, held in an approximately horizontal position when in use. A vertical riser is attached to the arm at the proximal end, and an upper end of the riser is attached to a quick coupling connector for attachment to a corresponding mating quick coupling on the working end of an excavator arm. A lateral support, extending from each side of the tool is included, making the tool self supporting in a vertical position on level ground in a position ready for connection to an excavator arm. A further embodiment includes the combination of the tool as described above with a leveling device attached to an excavator, a combination that provides precision alignment and joining of pipe lengths in a trench.

Abstract: Briefly, a preferred embodiment of the present invention includes a wafer carrier buffer for storage of a plurality of carriers containing wafers either waiting to be taken for processing in an adjacent wafer processing system, or waiting to be taken from the buffer following the processing. The buffer has a sliding carrier first input apparatus for taking a carrier from outside the buffer through a buffer input door and into the buffer interior. A buffer controller is included for directing robotic apparatus to take the carrier from the input apparatus and place it on a selected one of a plurality of carrier storage locations, and from a carrier storage location to a first output for delivery of wafers to processing. The robotic apparatus also delivers an empty carrier to a second input apparatus for receiving wafers from the processing area, and for delivery of a carrier with processed wafers to a second sliding output apparatus for removal from the buffer through a buffer output door.

Abstract: A method for high rate silicon deposition at low pressures, including a method of operating a CVD reactor having a high degree of temperature and gas flow uniformity, the method of operation providing a novel combination of wafer temperature, gas flow and chamber pressure. According to the method, a substrate is placed in a vacuum chamber wherein a reactant gas is provided at a high velocity in parallel with the substrate via a plurality of temperature controlled gas injectors providing a condition wherein the deposition rate is only limited by the rate of delivery of unreacted gas to the substrate surface and the rate of removal of reaction byproducts. The novel combination of process conditions moves the reaction at the wafer surface into the regime where the deposition rate exceeds the crystallization rate, resulting in very small crystal growth and therefore a very smooth polysilicon film with a surface roughness on the order of 5-7 nm for films 2500 angstroms thick.

Abstract: A method of protecting a tunnel dielectric area from subsequent processing steps in EEPROM fabrication after formation of a memory cell poly 1 floating gate on a P-type substrate, including first implanting the substrate to form a buried N+ junction below and beside the floating gate, and then growing a first thin oxide layer over the N+ junction and on sidewalls of the floating gate and a selection device gate. A thin layer of polysilicon is deposited and then a second thin oxide layer is grown over the thin polysilicon layer. A photoresist is applied, and then removed from the top surface and the sidewalls of the gate structures. The second thin oxide layer is removed from the top surface and the vertical sidewalls of the gate structures.

Abstract: An alignment device for use with a robot for manipulating and aligning a series of semiconductor wafers with respect to an edge fiducial and the center of each wafer is disclosed. The device includes a rotary vacuum chuck for holding a wafer, and an edge detector comprising a light source that extends across the wafer edge as it moves and creates a shadow that falls on a charge coupled device (CCD) below. Output data from the CCD relative to the wafer edge position is processed by a programmable logic circuit and converted to quadrature data which is fed to the logic section of a controller. The controller is programmed to calculate the location of the wafer fiducial relative to the chuck axis and further to calculate the angular and distance offset of the wafer center from the longitudinal axis of the robot arm so that the robot arm can be moved to center the wafer with its fiducial at a preselected location before the wafer is removed from the rotary chuck.

Abstract: A composition and method for removing probing ink and negative photoresist from a substrate with reduced metal corrosion, low toxicity and rapid removal rates. The composition includes a mixture of anisole, an alkylarylsulfonic acid, and aliphatic hydrocarbons containing 9 to 13 carbon atoms.