Patents Represented by Attorney DeLio & Peterson
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Patent number: 7900809Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.Type: GrantFiled: June 26, 2008Date of Patent: March 8, 2011Assignee: International Business Machines CorporationInventors: Glenn G. Daves, David L. Edwards, Mukta G. Farooq, Frank L. Pompeo
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Patent number: 7896367Abstract: A device for transporting and positioning a panel comprising an elongated support member and a base to carry the panel. An upright handle is attached to the support member providing support for the panel. An axle is secured to the support member with at least two wheels rotationally mounted on the axle permitting the support member to pivot about the axle for raising and lowering the support member ends. A lifting lip is attached to one end of the support member and a foot pedal attached to the other end. The panel is carried on the support member base and transported to a desired location. After removing the panel from the base and placing it on the lip, the wheels move the panel toward and away from the desired location. The foot pedal is depressed to pivot the support member about the axle lifting the panel to a desired height.Type: GrantFiled: December 3, 2007Date of Patent: March 1, 2011Inventor: Kurt M. Suprono
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Patent number: 7897059Abstract: A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process.Type: GrantFiled: November 9, 2007Date of Patent: March 1, 2011Assignee: International Business Machines CorporationInventors: Richard F. Indyk, Krystyna W. Semkow
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Patent number: 7891572Abstract: A dual functionality temperature control measurement and low water cutoff measurement system is taught within a single tapping to a boiler. This dual functionality combines a low water cutoff and temperature sensor into one control utilizing a sensing element suitable for use in a single existing tapping for a boiler. Independent of low water functionality, the temperature sensor is also capable of monitoring temperature as a replacement probe in an existing temperature sensor-only well. A conductive member provides a compression fit inside the probe well for thermistors, while simultaneously providing conduction with the well interior for a low water cutoff signal in a two-conductor well.Type: GrantFiled: April 5, 2007Date of Patent: February 22, 2011Assignee: C. Cowles & CompanyInventor: Christopher L. Murray
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Patent number: 7894919Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: October 31, 2007Date of Patent: February 22, 2011Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N Humenik, Mark J LaPlante, David C Long
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Patent number: 7890390Abstract: Methods, systems and apparatus for defining, updating and communicating the current status of parts used by an enterprise to designers and procurement specialists. Allowable values of preferredness of parts are defined based on technology roadmaps, and these values are periodically checked in a current time period against certain criteria, and changes are made in the preferredness values to reflect current conditions in the time period and current estimates for future conditions. Software, including algorithms, is changed as required to implement the changes in the preferredness values, and the updated software is released for use by procurement and design personnel for ensuring consistency of values of preferredness and preferred part codes within an enterprise.Type: GrantFiled: October 12, 2006Date of Patent: February 15, 2011Assignee: International Business Machines CorporationInventors: William H. Cochran, Joel Popelsky, Gary A. Tressler, David R. Whalen
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Patent number: 7887874Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: October 31, 2007Date of Patent: February 15, 2011Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N Humenik, Mark J LaPlante, David C Long
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Patent number: 7883948Abstract: Methods and structures for relieving stresses in stressed semiconductor liners. A stress liner that enhances performance of either an NFET or a PFET is deposited over a semiconductor to cover the NFET and PFET. A disposable layer is deposited to entirely cover the stress liner, NFET and PFET. This disposable layer is selectively recessed to expose only the single stress liner over a gate of the NFET or PFET that is not enhanced by such stress liner, and then this exposed liner is removed to expose a top of such gate. Remaining portions of the disposable layer are removed, thereby enhancing performance of either the NFET or PFET, while avoiding degradation of the NFET or PFET not enhanced by the stress liner. The single stress liner is a tensile stress liner for enhancing performance of the NFET, or it is a compressive stress liner for enhancing performance of the PFET.Type: GrantFiled: May 14, 2009Date of Patent: February 8, 2011Assignee: International Business Machines CorporationInventors: Brian J. Greene, Rajesh Rengarajan
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Patent number: 7883123Abstract: An electronic push retraction exit device includes a support rail, a push rail and a latch mechanism having a latch bolt operably connected to the push rail and movable between latched and unlatched positions. A control circuit in the exit device drives a linear actuator to retract and hold the push rail and the latch bolt in the unlatched position. The linear actuator preferably includes a stepping motor and is connected to the push rail through a lost motion connection allowing the exit device to be mechanically operated without moving the linear actuator. The control circuit preferably includes an electrical adjustment for the retraction distance of the latch bolt and an adjustable relatch timer. The exit device may be operated by a remote switch attached to a control connection, which may be permanently closed to simulate a prior art electrically operated exit device for compatibility with third party control systems.Type: GrantFiled: January 28, 2009Date of Patent: February 8, 2011Assignee: Sargent Manufacturing CompanyInventors: Mark A. Condo, Darren C. Eller, Jon Hulse, Kosta G. Karachristos, Dale D. Martin, Brett E. Tannone
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Patent number: 7879171Abstract: A method for mounting a film, used to fabricate a mask for use in screening an electronic device, to a common carrier frame. The common carrier frame has an outer edge along an outer periphery and an opening in a central portion of the frame. The method includes applying external pressure to the frame outer edge to compress the frame inward and reduce the opening, securing a film to the frame, the film covering the frame opening, and releasing the pressure on the frame to expand the opening and place the film in tension.Type: GrantFiled: May 30, 2007Date of Patent: February 1, 2011Assignee: International Business Machines CorporationInventors: Robert L Baan, Harry D Cox, John P Gauci, John R Lankard, Jr., David C Long, Thong N Nguyen
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Patent number: 7880739Abstract: A system and method for simulating to one or more individual observers a view through a window using a display screen comprising a storage device containing in electronic form one or more images of a scene selected from the group consisting of one or more images of the scene at different angles and one or more images of the scene at different magnifications. A display screen is adapted to display the images to one or more individual observers, and a sensor is adapted to locate observers with respect to the display screen. A controller is adapted to select one or more of the images based on angle or distance of the individual observers with respect to the display screen and display the selected images on the display screen to simulate to the observers a view through a window of the scene.Type: GrantFiled: October 11, 2006Date of Patent: February 1, 2011Assignee: International Business Machines CorporationInventors: David C Long, Jason S Miller
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Patent number: 7880294Abstract: The invention relates to a circuit arrangement with an electronic circuit on a printed circuit board and an electrically screening housing surrounding the circuit board, wherein there are on said circuit board a HF plug-and-socket connector connected to the electronic circuit with an outer conductor part and an inner conductor part, wherein the HF plug-and-socket connector penetrates through an opening in the housing. The outer conductor part of the HF plug-and-socket connector is electrically isolated from the housing, and wherein a tunnel-like screening sleeve surrounds the outer conductor part both axially and circumferentially at least partially, the sleeve being connected electrically to the housing and capacitively to the outer conductor part of the HF plug-and-socket connector.Type: GrantFiled: October 15, 2008Date of Patent: February 1, 2011Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KGInventor: Michael Wollitzer
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Patent number: 7879515Abstract: A method of determining positioning error between lithographically produced integrated circuit patterns on at least two different lithographic levels of a semiconductor wafer comprising. The method includes exposing, developing and etching one or more lithographic levels to create one or more groups of marks comprising a target at one or more wafer locations. The method then includes exposing and developing a subsequent group of marks within the target on a subsequent lithographic level. The method then comprises measuring the position of the marks on each level with respect to a common reference point, and using the measured positions of the groups of marks to determine the relative positioning error between one or more pairs of the developed and etched lithographic levels on which the marks are located.Type: GrantFiled: January 21, 2008Date of Patent: February 1, 2011Assignee: International Business Machines CorporationInventors: Christopher P. Ausschnitt, William A. Muth
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Patent number: 7876439Abstract: A target system for determining positioning error between lithographically produced integrated circuit fields on at least one lithographic level. The target system includes a first target pattern on a lithographic field containing an integrated circuit pattern, with the first target pattern comprising a plurality of sub-patterns symmetric about a first target pattern center and at a same first distance from the first target pattern center. The target system also includes a second target pattern on a different lithographic field, with the second target pattern comprising a plurality of sub-patterns symmetric about a second target pattern center and at a same second distance from the second target pattern center. The second target pattern center is intended to be at the same location as the first target pattern center. The centers of the first and second target patterns may be determined and compared to determine positioning error between the lithographic fields.Type: GrantFiled: June 23, 2008Date of Patent: January 25, 2011Assignee: International Business Machines CorporationInventors: Christopher P. Ausschnitt, Lewis A. Binns, Jaime D. Morillo, Nigel P. Smith
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Patent number: 7875806Abstract: Methods of forming and assemblies having hybrid interconnection grid arrays composed of a homogenous mixture of Pb-free solder joints and Pb-containing solder paste on corresponding sites of a printed board. The aligned Pb-free solder joints and Pb-containing solders are heated to a temperature above a melting point of the Pb-free solder joint for a sufficient time to allow complete melting of both the Pb-free solder joints and Pb-containing solder paste and the homogenous mixing thereof during assembly. These molten materials mix together such that the Pb from the Pb-containing solder disperses throughout substantially the entire Pb-free solder joint for complete homogenization of the molten materials to form the homogenous hybrid interconnect structures of the invention.Type: GrantFiled: February 16, 2010Date of Patent: January 25, 2011Assignee: International Business Machines CorporationInventors: Muta G. Farooq, Charles C. Goldsmith
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Patent number: 7871221Abstract: An anchoring base for a delineating pole using the reconfiguration of protruding resilient mechanical members to facilitate insertion and resist the subsequent extraction force on the pole. The mechanical members extend outwards relative to the insertion rod longitudinal axis, and bend or configure upon insertion of the anchoring base, into a first position that facilitates insertion while impeding and resisting axial extraction forces, and upon subsequent rotation of the anchoring base, the mechanical members bend or reconfigure into a second position such that the extraction resistance force is significantly reduced. The anchoring base design may be used in conjunction with a spring cartridge having a plurality of interlocking members forming a rigid mechanical structure during rotation.Type: GrantFiled: July 23, 2010Date of Patent: January 18, 2011Assignee: MBW Technologies, LLCInventors: Christoph P. Menzel, Steven Barss
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Patent number: 7866042Abstract: A method of manufacturing serpentine fins for assembly between tubes in a heat exchanger core. The method includes providing a flat metal strip and forming in the strip, multiple rows of split louvers. Each row of split louvers has louvers formed in pairs of adjacent, spaced louver banks extending across the width of the strip. Each row includes ribs formed in the strip parallel to the louver openings and extending across the pair of louver banks. The metal strip has unformed portions extending across the strip width between rows of split louvers for forming folds across the width of the strip. After forming the rows of split louvers, pressure is applied to the strip to cause the flat strip to buckle along the unformed portions forming folds in the strip resulting in the serpentine fin. Preferably, the strip has ribs formed both in the center portion and along the edges.Type: GrantFiled: January 12, 2007Date of Patent: January 11, 2011Assignee: Centrum Equities Acquisition, LLCInventor: John A. Kolb
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Patent number: 7856856Abstract: An independently interactive interconnected lock includes an interconnecting mechanism that retracts a latchbolt and a deadbolt when an inner handle is moved between an up position, an intermediate position and a down position. The deadbolt is retracted by a deadbolt lock mechanism as the inner handle moves from the up position to the intermediate position. The latchbolt is retracted by a latchbolt lock mechanism as the inner handle continues to move from the intermediate position to the down position. When the inner handle is moved to the up position, both the latchbolt and deadbolt are extended and the deadbolt lock mechanism is disconnected from the latchbolt lock mechanism such that manipulation of the latchbolt lock mechanism to retract the latchbolt does not retract the deadbolt. The inner handle operates with low handle torque because the deadbolt and the latchbolt are not retracted simultaneously.Type: GrantFiled: February 20, 2008Date of Patent: December 28, 2010Assignee: Assa Abloy, Inc.Inventor: Vladimir Shvartz
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Patent number: 7858269Abstract: A mask system for use by a lithographic system to project an image of a circuit design. The design includes at least one large feature and at least one nearby small feature. The mask comprises one or more shapes on a mask to project an image of the nearby small feature and, on the same mask or on a different mask, an opaque shape to project an image of the large feature. The opaque shape includes in a field thereof at least one dummy clear shape of size and configuration insufficient to be resolved. Light from the lithographic projection system may be projected through the opaque shape and the dummy clear shape to resolve an image of the large circuit feature on a resist layer of a wafer without resolving the clear shape on the resist layer, while simultaneously increasing optical flare on the resolved large circuit feature image.Type: GrantFiled: March 16, 2007Date of Patent: December 28, 2010Assignee: International Business Machines CorporationInventors: Howard S. Landis, David P. Parker, Jeanne-Tania Sucharitaves
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Patent number: 7860701Abstract: A method for predicting functionality of an integrated circuit segment to be lithographically printed on a wafer. Initially there is provided a two-dimensional design of an integrated circuit, including an integrated circuit segment having critical width, and a two-dimensional printed image of the critical width integrated circuit segment is simulated. The method then includes determining a ratio of perimeters or areas of the designed critical width integrated circuit segment to the simulated printed critical width integrated circuit segment, and predicting functionality of the critical width integrated circuit segment after printing based on the ratio of perimeters or areas.Type: GrantFiled: November 19, 2007Date of Patent: December 28, 2010Assignee: International Business Machines CorporationInventors: Ioana Graur, Kafai Lai, Rama N. Singh