Abstract: A circuit for controlling the base drive of switching transistor in a power supply wherein the switching transistor is coupled to the primary winding of a transformer linking the primary and secondary circuits of the power supply. Optimum operation of the switching transistor implies a desired level of saturation thereof. Base drive for the switching transistor is provided by a second conducting transistor. An excess of current flowing in the switching transistor is sensed, thereby effecting a reduction in the current flow in the second transistor. The latter condition causes a diminution in the base drive of the switching transistor and a return to its desired level of saturation.

Abstract: The present disclosure describes an antenna which may be collapsed and stored in a compact configuration and readily released from storage to assume a deployed operative state. More specifically, the antenna is a wire member comprised of a straight section and an integral transverse helical spring section. The antenna lends itself to storage about the axis of a right circular cylinder while permitting full deployment parallel to the longitudinal axis of the latter. This arrangement permits the storage of potential energies of torsion and bending respectively in the helical spring and straight portions of the antenna, and permits continuous motion in these planes to effect antenna erection and deployment.

Abstract: Workstations may advantageously be interconnected in a cluster arrangement wherein multiple "slave" stations utilize the database which exists in a "master" unit. The cluster interface has been implemented as a wired system but the latter involves significant limitations as to distance between units, electrical noise restricting data transmission rates and the protection of sensitive data from compromise. The fiber optic interface module of the present invention eliminates the foregoing limitations by translating the electrical signals of the wired system into optical signals for transmission and restoring them to electrical signals at a receiving unit.

Abstract: The present disclosure describes an alignment fixture having particular application in surface-mount connector technology. The fixture utilizes a plurality of through-hole connector sections having pins which are retained in holes formed in a plate and which exhibit a predetermined positional tolerance. A plurality of surface-mount connector sections to be mounted adjacently on the edge of a printed circuit board are plugged into mating through-hole connector sections, and positioned with respect to conductive pads on the board surface. In effect, the above-mentioned positional tolerance has been transferred by the fixture to the surface-mount connector sections.

Abstract: The present disclosure describes a system for handling detected error signals, providing the circuit elements for processing fault reports and implementing automatic fault isolation. More specifically, the system develops a fault report for each component based upon error signals derived therefrom. Changes in the fault report are detected and selector circuits are actuated to automatically isolate the fault to the particular component or components, or to reset the system in response to previous fault correction. The present system is advantageous in that it is independent of the equipment technology and applies to all design levels, from the unit itself to the individual components of which it is comprised.

Abstract: The present disclosure describes an insulated electrical contact pin for use in making wiring changes in an interconnection medium such as a printed circuit board or backplane. More specifically, the present pin replaces the original compliant press-fit type pin mounted in a plated-through hole on the board. The pin is formed in two sections--one section having a threaded extremity, and the other, a tapped bore to receive the former. The pin is mounted in a plated-through hole on the printed wiring board by screwing the two sections together. Portions of the pin sections are electrically insulated from the wiring traces situated on or below the board surface. The present contact pin is versatile, easy to install and tolerance-free with respect to the dimensions of the plated-through hole in which it is mounted.

Abstract: The present disclosure describes a latch assembly wherein structural members are coupled to each other by an electric match-type device interposed therebetween. The latter device generally comprises a body portion having electrical connections thereto and a rigid mass of combustible material firmly adhered to an extremity thereof. At least a pair of the structural members are individually coupled to the combustible material. Remote activation of the match by the passage of electric current therethrough results in the firing of the combustible material and the consequent opening of the latch through the elimination of the coupling force between the structural members.

Abstract: The mounting assembly of the present disclosure finds particular application in shielded electrical cable having connectors at opposite extremities thereof and carrying electrical conductors between spaced-apart equipments having respective mating connectors. In accordance with the disclosure, a mounting assembly is provided which may be disposed at either extremity of the cable, or at both extremities, and which permits the cable connectors to rotate through a prescribed arc about the cable axis. This rotation compensates for the torsional inflexibility of the cable, thereby facilitating the orientation of the mating connectors required for attachment, and electrically linking the equipments.

Abstract: The present disclosure describes test coupons having predetermined respective test patterns, formed in a multilayer printed circuit board simultaneously with the fabrication of the latter. The test coupons are probed with conventional electrical instruments to provide information as to the occurrence of a misregistration of any given subsurface printed plane or trace, whether or not the misregistration exceeds a specified limit, and if desired, a measure of the degree of misregistration. The foregoing are readily accomplished in a time and cost efficient manner without the need for cross-sectioning portions of the board and the visual observation of the subsurface printed layers.

Abstract: A device for handling electronic circuit components, such as integrated circuit packages, and for facilitating the insertion of the pins or leads thereof into corresponding apertures of a printed circuit board. More specifically, an integrated circuit package assembly may comprise a mounted integrated circuit chip, a block-like multi-apertured element for protecting the package leads, and a heat sink member. The present tool, under operation control, captivates the entire package assembly, ejects the protective block prior to package insertion, positions the assembly on the printed circuit board, and inserts the package leads into homologous apertures of the board--the foregoing requiring minimal, if any, physical contact with the assembly by the operator.

Abstract: The present disclosure describes a system for substantially eliminating clock signal timing errors occurring between the signal paths of the various cabinets or modules of a large, high speed digital synchronous data processor. Such errors result from the most part because of the long cable lengths needed for coupling the cabinets to a master clock source. The present system provides a measure of the signal delay from the output of the master clock source through the elements of a given cabinet and permits corrective measures to be made at a single location within the cabinet without the necessity of accessing the large number of elements contained therein.

Abstract: The present disclosure describes a heat exchange element for attachment to the external surface of a package containing an integrated circuit chip or die. The element has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present element is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically the element is an integral structure comprised of a generally helical wire form with substantially elliptic turns wrapped around a metallic plate in symmetrical fashion and in intimate contact with opposed edges of the latter. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the element is attached.

Abstract: The present disclosure describes an electronic system for use with low cost audio tape recorders whereby a substantially noise-free wide dynamic range is provided for the recording of analog signals in the DC to 30HZ frequency band. In achieving this result, the system utilizes two FM carrier oscillators having center frequencies displaced from each other and modulated respectively in opposite senses by the signal being recorded. The system also provides an additional utility channel of limited dynamic range for the concurrent recording of time markers, digital signals and the like.

Abstract: The present disclosure describes the fabrication of subminiature electronic devices incorporating conventional integrated circuit (IC) chips or dies. The IC assembly which may be advantageously realized by tape automated bonding processes utilizes an etched double metal clad plastic carrier which allows the chip to be mounted directly to a metallic base formed on one surface of the carrier and to have its signal pads wire bonded to a metallic lead frame disposed on the opposite surface thereof.

Abstract: The present disclosure describes a heat exchange device for attachment to the external surface of a package containing an integrated circuit chip or die. The device has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present device is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically, the device is an integral structure comprised of a generally helical wire form affixed to a metallic frame-like member. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the device is attached.

Abstract: The present disclosure describes a system for detecting very small displacements of an object with respect to a self oscillating piezoelectric crystal by means of acoustic interference at the crystal. Acoustic energy transmitted by the oscillator is reflected by the object, and movement of the latter causes changes in the phase of the reflected energy. Such changes in turn result in variations in the amplitude of the oscillations. An electronic circuit responsive to the last mentioned variations generates output signals indicative of the instantaneous position of the object.

Abstract: The present disclosure describes an electrical connector for use with a printed wiring board. The connector design is characterized by an inner housing of insulative material for supporting a plurality of electrical contacts and an outer insulative structure which encloses the housing and is easily removable therefrom. The latter permits the cleaning of the electrical contacts after a soldering operation and also allows for the replacement of individual defective contacts. Additionally, if required for impedance or electrical interference considerations, the present connector utilizes an integral ground conductor plane which substantially encloses its outer insulative structure and is electrically connected to the ground plane of the printed wiring board.

Abstract: A tool is described for facilitating the cutting of printed circuit board wires necessitated by changes in the circuit design or the occurrence of electrical faults. The tool is particularly useful with circuit boards having high density wiring, where it virtually eliminates damage to printed wires adjacent to those being severed. Comprised of a guide pin centrally disposed with respect to an annular cutting edge, the tool uses the former for registration with the component and via holes in the circuit board, and the latter, to sever the printed wires from the electrically conductive pads surrounding the holes. The depth of the cut is carefully controlled by the tool and may be chosen to eliminate electrical faults lying below the surface in a multilayer board.

Abstract: The present disclose describes a device which has particular utility in clamping printed circuit boards which are exposed to high shock conditions. This device includes a clamping bar which is permanently deformed in its fabrication process such that it assumes a curved or arcuate configuration. Employment of the clamp device involves physical contact between the edge of the printed circuit board and the bar, and the application of forces to the extremities of the latter, by mechanical fasteners to cause it to become substantially planar. The latter condition provides an evenly distributed high clamping force to the board without any high stress points which might cause board fractures. Accordingly, the present device increases the reliability of printed circuit boards as well as the electrical components mounted thereon, by providing exceptional printed circuit board rigidity.

Abstract: The present disclosure describes a connector assembly especially suited for a large scale integration (LSI) package. The assembly includes a housing to accommodate the package and a hold-down lid or cover to insure reliable electrical connections between the package circuit leads and the contact elements disposed within the housing. The assembly is characterized by the ease with which the housing may be attached to the interconnection medium, such as a printed circuit board, and the hold-down cover may be fastened to the connector housing. The latter are accomplished by a plurality of metal pins which protrude from the interconnection medium, penetrate the housing, and engage locking slots in the cover.