Abstract: A high-frequency, high-power, semiconductor device chip is impedance matched to an off-chip impedance by a matching network including a dielectric element located on a substrate ground plane portion adjacent to the device to be matched. A thin film dielectric layer is formed over the dielectric element, the semiconductor device and the surrounding substrate. A patterned metal matching circuit is disposed over the dielectric layer and is in electrical contact with an electrode of the high-frequency, high-power, semiconductor device. An impedance matching network is formed by the patterned metal circuit, the dielectric element, the dielectric layer and the underlying grounded substrate. The matching characteristics of the network can be tailored by selecting suitable dielectric materials for the dielectric element and by altering design of the patterned metal circuit.

Abstract: In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.

Abstract: A double-acting hydraulic cylinder is controlled by a pair of three-way solenoid valves respectively fluid connected to the two ends of the cylinder and energized in parallel with a continuous stream of pulse width modulated (PWM) pulses to create a mean effective fluid pressure balance at the cylinder ends that hold a desired position of a connected load and mean effective fluid pressure imbalances in the cylinder ends that produce variable rate load movement in either of two directions to a desired new position, all determined by the pulse duty cycle.

Abstract: A controller for changing the ratio of a continuously variable hydrostatic transmission, as determined by the angular position of a swashplate, including an actuator having a cylinder slidingly receiving a piston to define a pair of chambers. A pair of solenoid valves, each configured to connect a respective chamber selectively to sump pump pressure or atmospheric pressure, are energized with a stream of pulses to create differential fluid pressures in the chambers, thereby producing movement of the piston; the piston movement being linked to the swashplate to produce a corresponding adjustment of the swashplate angular position. The rate of change of the swashplate angular position is controlled by pulse width modulating the pulse stream.

Abstract: A superconducting single phase alternator is connected by a circuit breaker across the breech ends of a pair of conductive launching rails. At a predetermined point on the alternator voltage wave a projectile establishes a current path between the rails to initiate a transient, sinusoidal current pulse effective in accelerating the projectile along the rails. A switch is actuated in response to the projectile exiting the muzzle ends of the rails to impose a short circuit across the rails. The circuit breaker disconnects the alternator from the rails as the current pulse goes to zero. The system provides higher launcher efficiency and reduced muzzle flash with minimum barrel length penalty.

Abstract: A continuously variable hydrostatic transmission includes an input shaft connected to drive a hydraulic pump unit, a grounded hydraulic motor unit, and an output shaft. A wedge-shaped swashplate is pivotally mounted to the output shaft in driving connection to receive output torque resulting from the exchange of pressurized hydraulic fluid between the pump and motor units through slots in the swashplate. A hydraulically actuated ratio controller shifts the axial positions of spherical bearings mounting a pump portplate in the hydraulic pump unit and a motor portplate in the hydraulic motor unit to adjust the swashplate angle relative to the output shaft axis and thereby change transmission ratio.

Abstract: A hydrostatic transmission includes wedge-shaped swashplate operatively positioned between a hydraulic pump unit driven by an input shaft and a grounded hydraulic motor unit to accommodate pumped exchanges of hydraulic fluid between the units. The swashplate, drivingly coupled to an output shaft, is angularly adjustable about a pivot axis oriented in intersecting, orthogonal relation to the output shaft axis to infinitely variable transmission ratios. Pilot bearings, mounted by the swashplate, support cylinder blocks of the hydraulic pump and motor units for nutating motions centered on the swashplate pivot axis to minimize the resultant moment on the swashplate. Piston rods in the hydraulic pump and motor units are oriented in outwardly flared, acute angles to the output shaft axis to expand the range of permissible angular adjustment of the swashplate by a ratio controller.

Abstract: A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers.

Abstract: In a method for preserving an air bridge structure on an integrated circuit chip, a protective layer is plasma-deposited over the top and sides of the air bridge. A high density interconnect structure is applied over the chip and protective layer. The protective film provides mechanical strength during the application of the high density interconnect structure to prevent deformation. It also prevents any contamination from intruding under the air bridge. More importantly, the protective film only negligibly impedes the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure.

Abstract: HDI fabrication techniques are employed to form a variety of optical waveguide structures in polymer materials. Adaptive optical connections are formed, taking into account the actual position and orientation of devices which may deviate from the ideal. Structures include solid light-conducting structures, hollow light-conducting structures which are also suitable for conducting cooling fluid, and optical switching devices employing liquid crystal material. A "shrink back" method may be used to form a tunnel in polymer material which is then filled with an uncured polymer material that shrinks upon curing.

Abstract: To control the transmission ratio of a continuously variable hydrostatic transmission including an input shaft, an output shaft, an pump unit driven by the input shaft, a grounded motor unit, and an a wedge-shaped swashplate drivingly and pivotally connected to the output shaft in hydraulic fluid-communicating position between the pump and motor units, a ratio controller is provided having a hydraulically actuated piston incorporated internally of the output shaft. A pilot valve, also incorporated internally of the output shaft, operates to create differential fluid pressures at opposite end faces of the piston, forcing axial motion of the piston and ratio-changing pivotal movement of the swashplate linked to the piston.

Abstract: Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability.

Abstract: A continuously variable hydrostatic transmission includes an input shaft connected to drive a hydraulic pump unit, a grounded hydraulic motor unit, and an output shaft. A wedge-shaped swashplate is pivotally mounted to the output shaft in driving connection to receive output torque resulting from the exchange of pressurized hydraulic fluid between the pump and motor units through specially configured ports in the swashplate. A hydraulically actuated ratio controller is pivotally linked to the swashplate to selectively adjust the swashplate angle relative to the output shaft axis and thereby change transmission ratio.

Abstract: A method for fabricating a multi-chip module substrate comprises providing a carrier having a well. Substrate molding material is poured into the carrier well. A plurality of chips is situated in the substrate molding material. A laminatable dielectric layer is laminated over the substrate molding material at a predetermined temperature and a predetermined pressure so that the substrate molding material flows and encapsulates the chips.

Abstract: To deploy an inflatable member, such as an occupant restraint safety bag in a motor vehicle, a buffer zone is pressurized by the firing of inflation initiator to release liquid propellant into the buffer zone through ruptured frangible seals in a stationary separator disk or in a movable piston for controlled ignition. The ignited liquid propellant generates a large volume of gas that is cooled and pressurize buffered prior to inflating introduction into the safety bag.

Abstract: A continuously variable hydrostatic transmission includes an input shaft connected to drive a hydraulic pump unit, a grounded hydraulic motor unit, and an output shaft. A wedge-shaped swashplate is pivotally mounted to the output shaft in driving connection to receive output torque resulting from the exchange of pressurized hydraulic fluid between the pump and motor units through specially configured ports in the swashplate. A hydraulically actuated ratio controller shifts the axial positions of spherical bearings mounting a pump cylinder block in the hydraulic pump unit and a motor cylinder block in the hydraulic motor unit to adjust the swashplate angle relative to the output shaft axis and thereby change transmission ratio.

Abstract: A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion of the module underlying a ply in the electrical interconnection structure is substantially unimpairable by a process for removing that ply.

Abstract: A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.

Abstract: To distribute power to plural, widely spaced driven sprocket sets of an ammunition magazine chain conveyor, one or more elongated drive shafts, driven by a prime mover, are journalled in closely spaced relation to a magazine sidewall and carry worms in axial positions to mesh with worm gears fixed on the sprocket shafts of the driven sprocket sets. The axial positions of the worms on the drive shafts are conveniently adjustable to coordinate the timings of the driven sprocket sets. One of the driven sprocket sets is also positionally adjustable to tension adjust the ammunition chain conveyor.

Abstract: A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.