Abstract: A smart card having a multi-layer substrate; a transponder module disposed in a first layer of the multi-layer substrate; a first antenna disposed in the first layer of the multi-layer substrate; and a second antenna disposed in a second layer of the multi-layer substrate. A switch and a capacitor in series with the second antenna. The first antenna may be tuned to a different frequency than the second antenna. An RFID chip and antenna in a mold mass disposed in a recess in the first layer of a substrate, behind a hologram disposed on the first layer of the substrate. The switch for the second antenna disposed under the RFID chip. A layer of ferrite material disposed between the hologram and the RFID chip. LEDs disposed behind the hologram.

Abstract: A micro-abrasive blasting device comprises a mixing chamber, a delivery conduit extending from external the mixing chamber to the mixing chamber and a discharge conduit extending from the mixing chamber. Abrasive material may selectively be sealed in the chamber by positioning the discharge conduit to abut the inlet port. The chamber may be spherical to deliver consistent powder perturbation at all mixing chamber orientations. Methods of using the device are disclosed. Methods of making the device by blow molding are disclosed.

Abstract: A current-driven load such as LEDs or laser diodes is driven by a current driver having a two stages (or phases), the summed outputs of which have ripple which is forced to be out-of-phase with one another. In analog embodiments, an output (ripple or switching) of a master stage hysteresis controller is phase-shifted and scaled, and modulates the input of a slave stage hysteresis controller so that the slave stage pulls into a ripple-canceling phase. In a digital embodiment, a faster of the two phases is designated “master”, maximum and minimum thresholds are set, and the slave phase's on time is based on a previous cycle's slave phase ON time, the master stage OFF time and an offset. The slave controller preferentially “locks” to the anti-phase of the master stage (or phase) and the ripple current at the summed output substantially cancels.

Abstract: In a pulsed laser diode driver an energy storage capacitor is continuously being charged to a supply voltage Vr. When a pulse is initiated, energy stored in the capacitor is delivered to the laser diode load. The capacitor voltage Vd at the end of a pulse is used to control Vr to ensure that Vd is maintained above a minimum voltage Vm required to ensure operation of a current control device (such as FET) just above saturation. Test pulses (such as with attenuated currents or reduced pulsewidth) may be fired to determine an initial optimum value for Vr. After a test pulse, a slightly high estimate for Vr may be used and may be iterated (incremented) down to an optimum value Vm during a firing burst. A digital processor may be used to calculate and store data to optimize the performance. Various embodiments are disclosed.

Abstract: A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.

Abstract: An antenna wire (210, 260, 310, 410, 510, 610, 710) is mounted to a substrate (204, 254, 304, 404, 504, 604, 704) so that end portions (210a/b, 260a/b, 310a/b, 410a/b, 510a/b, 610a/b, 710a/b) of the wire are spaced far enough apart for a transponder chip (208, 250, 308, 408, 508, 608, 708) to be positioned therebetween, such as into a recess (206, 256, 306, 406, 506, 606, 706) in the substrate. The end portions are left unmounted, as “wire bridges”, “jump loops”, or “flat loops”. The end portions may be re-positioned to be over the terminals (208a/b, 258a/b, 308a/b, 408a/b, 508a/b, 608a/b, 708a/b) of the chip for bonding. Or, the chip (or substrate) may be moved (such as side-to-side, or rotated) so that the chip's terminals are under the end portions of the wire for bonding. Insulation may be removed from the end portions of the wire prior to bonding.

Abstract: A micro-abrasive blasting device and method for perturbation control using a plurality of delivery conduits of various lengths and/or apertures. The user is able to individually open and close bypass conduit pinch valve(s) external to micro-abrasive blasting device to affect the perturbation intensity internal to the mixing chamber. By selectively opening and closing flow through delivery conduits it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber.

Abstract: A portable RFID reader apparatus having a contactless interface and slots or recesses for insertion of contactless smart card fobs, including ID card, and having a wireless interface for communicating with a token plugged into a computer, provides physical and logical access.

Abstract: The present invention is a micro-abrasive blasting device (55) with superior perturbation control via a plurality of delivery conduits (25) of various lengths and apertures. The user is able to individually open and close bypass conduit pinch valve (99) external to micro-abrasive blasting device (55) to affect the perturbation intensity internal to the mixing chamber (23). By selectively opening and closing flow through delivery conduits (25) it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber (23).

Abstract: A retractable USB stick comprises: an elongate housing having an open end, a USB stick disposed within the elongate housing, and means for causing the USB stick to project out of and retract back into the housing. The means for causing the USB stick to project may be patterned after comparable means in a lipstick dispenser mechanism of U.S. Pat. No. 3,941,489. The means for causing the USB stick to project/retract may comprise an outer holder having an elongate housing with an opening at one end, an intermediate sleeve sized disposed between the USB stick and the holder, and means for imparting reverse motion includes a toothed wheel disposed at a back end of the intermediate sleeve, teeth on an inner surface of the outer holder and teeth on an elongate linear track extending from the back end of the USB stick. Optionally, the USB stick may be releasably locked in the open position, and means may be provided for closing the open end of the housing.

Abstract: The present invention is a micro-abrasive blasting device (75) constructed from a disposable pipette structure (80) comprising a delivery conduit (30) extending from a delivery conduit inlet (35) through a tapered section (33) to form a delivery conduit outlet (37) and a inlet port (27); contiguous pipette structure (80) expands from inlet port (27) to form a hollow bulb mixing chamber (23) and then narrows to form a discharge port (29) section; a discharge conduit (10) is in fluid communications with discharge port (29) and extends from a discharge conduit inlet (12) internal to mixing chamber (23) to a discharge conduit outlet (14) external to mixing chamber (23); a particulate matter (50) is disposed within mixing chamber wall (25); discharge conduit inlet (12) abuts inlet port (27) preventing particulate matter (50) from exiting mixing chamber 23.

Abstract: A pocket-size RFID reader apparatus having a contactless interface and a slot for insertion of a contactless smart card fob, and having a biometric sensor, thereby providing two levels of personalization. The apparatus may have a wireless interface; and a slot for insertion of a wireless SD I/O device. The apparatus may have a slot for insertion of an external memory device. The apparatus may have a mechanical connection (contact) interface. The apparatus may also have an RF interface for reading an electronic immobilizer within the apparatus.

Abstract: Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions spanning the recess. The end portions are spaced wider than the chip, to allow the chip to be inserted into the recess from the same side as the antenna. The end portions may then be repositioned to be over corresponding terminals of the chip, for bonding thereto. The recess may be substantially larger than the chip, so that the chip and/or the substrate may be moved from side-to-side in the recess for positioning the terminals under the end portions, for bonding thereto. Insulation may be removed from the end portions prior to mounting the chip in the recess, to enhance subsequent bonding.

Abstract: Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the antenna wire free-standing, as loops adjacent terminal areas of a site on the substrate for the transponder chip. With the transponder chip installed on the substrate, the free-standing loops are repositioned to be substantially directly over the terminals of the transponder chip, in preparation for interconnection of the loops to the terminals of the transponder chip, then are bonded to the terminals. An embedding tool for mounting the wire on the substrate may embed the wire in or adhesively place a self-bonding wire on a surface of the substrate. The substrate may have two transponder chips, and function as a secure inlay. An anti-skimming feature is included in the inlay.

Abstract: A driver supplying a total current to a load has a plurality (n) of driver stages (ST1 . . . STn). One stage is a master stage. Each driver stage has a switching device (Q) and an inductor (L) connected in series between the switching device and the output of the driver stage. The switching devices are turned ON in sequence with one another, during a cycle time (Tc) which is determined by sensing current through the inductor (L1) in the master stage. When the switching device is turned ON current through the inductor rises, when the inductor current reaches the value of a demanded current the switch is turned OFF, and after the switch is turned OFF the inductor continues to supply (output) current to the load with a current which ramps down. A rectifying device (D) connected between the inductor and the supply line allows current to continue to flow in the inductor and be supplied to the load after the switch is turned OFF.

Abstract: A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

Abstract: A capacitor is connected to the output of a multiphase power converter, and a current-driven device (e.g., LED or laser diode) is also connected to the power converter output. A solid state switch (FET or IGBT) is connected in series with the current-driven device. Means are provided for sensing current through the current-driven device. An error amplifier compares sensed current through the current-driven device with a current level demand signal and controls the output of the power converter. Means are provided for turning the switch on and off and may be (i) a fast comparator receiving a voltage reference signal at one input and the current level demand signal at another input, and outputting the switch on/off signal to the switch or (ii) an externally-generated logic signal provided directly to the switch.

Abstract: A compact personal token apparatus (100,120,140,200,220,300,320,500), resembling a conventional USB memory fob in size, shape, and form which can be plugged into a PC and interfaced with the virtual world of the Internet. The apparatus is capable of loading and storing information from the Internet, via the PC to its flash memory (410) or EEPROM and then using the stored information or value via its contactless interface (108,128,148,508) in the real world. The apparatus is capable of implementing an auto-run application, when inserted into a personal computer. The apparatus is capable of exchanging information with other devices having compatible interfaces. The apparatus can also function as a firewall (400) when plugged between an Internet connection and a PC.

Abstract: The light output intensity of incandescent lamps and LEDs connected to a common lamp power bus are controlled using a composite waveform having two power components: a pulse-width modulated (PWM) component and a direct current DC component. The DC component is maintained below the turn-on voltage for the LEDs. The PWM component controls the light intensity of the LEDs; and the DC component is calculated as a quadrature power series, taking into account that the PWM component contributes to the light intensity of the incandescent lamps. The frequency and slew rate of the PWM component are selected to minimize EMI. A small steady state power component is provided to keep the LEDs slightly turned on to minimize EMI.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.