Abstract: A method for depositing a tacking agent (18) onto a circuit-carrying substrate (e.g., a printed circuit board) (22) such that a regulated volume is simultaneously deposited at multiple substrate sites (24). A first input pressure, P1, introduced through a bladder inlet (12), is supplied to a compliant bladder (14) which is in contact with a plurality of transfer pins (16). The compliant bladder imparts a substantially equal force to each of the transfer pins. The pins are then dipped into a thin film of tacking agent and removed. Subsequently, the first input pressure, P1, is adjusted to a second input pressure, P2, sufficient to force the pins to a uniform maximum extension. Finally, the second input pressure, P2, is adjusted to a third input pressure, P3, which imparts a predetermined uniform force on each of the pins, and the pins are brought in contact with the printed circuit substrate deposition sites.