Abstract: Systems and methods for using radio frequency identification (“RFID”) technology in display boards such as whiteboards, corkboards, and bulletin boards are disclosed. An RFID tag is affixed to each object that is placed on the display board. Each tag uniquely identifies the object to which it is affixed. RFID readers are placed in proximity to the board so that the position and identity of the tagged objects on the board can be determined. RFID readers can quickly convey this information to a computing device. Optionally, receipt of the position and identity information at the computing device can trigger other events such as the output of notifications.

Abstract: Inbound and outbound traffic on a computer system are intercepted and compared to determine if the presence of malicious code is indicated. Outbound traffic that is sufficiently similar to recently received inbound traffic is indicative of the presence of malicious code. In some embodiments, if the presence of malicious code is indicated, the user, as well as other individuals or systems, are notified of the detection. In some embodiments, if desired, protective actions are initiated to hinder or block the propagation of the malicious code from the host computer system to other computer systems, as well as to remove or inactivate the malicious code on the host computer system.

Abstract: A system uses automatic feedback and control to secure a network infrastructure by iterative convergence of the network's security structure to meet a security policy. Following initialization, a security feedback control system of the security management system makes dynamic adjustments to the system using bi-directional services that are controlled via policy decision components, without user intervention.

Abstract: A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a second semiconductor die and at least one second support that are attached to the active surface of the first semiconductor die and to a coplanar surface of the first support(s). A third level includes a third semiconductor die attached to the active surface of the second semiconductor die and to a coplanar surface of the second support(s). The second and third semiconductor dies do not overlap bond pads of the first and second semiconductor dies, respectively. An adhesive film overlies the entire inactive surface of the second and third semiconductor dies, and attaches the second and third semiconductor dies to the immediately underlying active surface and support(s).

Abstract: A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to the circuit patterns. An encapsulant covers the semiconductor die and the first side surface of the substrate inward of the pads. A layer of a solder is fused to each of the pads. A lateral distance between immediately adjacent pads is selected to be greater than a lateral distance between sidewalls of the encapsulant and immediately adjacent pads, and a height of the solder layers relative to the first side surface is selected to be less than a height of the sidewalls of the encapsulant, so that misalignment of a semiconductor package stacked on the solder layers/pads is self-correcting when juxtaposed ones of the solder layers and respective solder balls of the second semiconductor package are reflowed and fused together.

Abstract: Apparatus and processes, including computer implemented processes, for managing exceptions throwable during execution of methods in one or more classes by a machine. Each method includes an exception handler array defining exception handlers associated with the method. The method includes combining the exception handler arrays for all methods into a single exception handler table.

Abstract: A dynamic prediction is made whether a load instruction will miss a cache. Data is prefetched for the load instruction when a cache miss is predicted. Thus, the prefetch is only performed if a trigger event correlated with a cache miss for that load instruction is detected. This selective execution of the prefetches for a particular load instruction improves processor utilization and performance.

Abstract: Disclosed are a wafer level chip scale package and a method for manufacturing the same. An RDL is formed on a semiconductor die through a sputtering process, and a UBM is formed on the RDL through an electroplating process by using the RDL as a seed layer. Thus, the RDL sputtering, UBM electroplating, RDL etching and leakage descum processes are carried out only one time, thereby simplifying the structure and manufacturing processes of the package. Since a copper layer of the RDL is formed with a relatively large thickness through the sputtering process, current density is uniformly distributed during the electroplating process, so it is possible to uniformly form the thickness of the UBM by using pure nickel.

Abstract: A system links architecture neutral code downloaded to a resource constrained computer. The code may be separated into one or more packages having one or more referenceable items. The system maps the one or more referenceable items into corresponding one or more tokens; orders the tokens to correspond to a run-time mode; downloads the packages to the resource constrained computer; and links the packages into an executable code using the ordered tokens.

Abstract: A Very Long Instruction Word (VLIW) processor having a plurality of functional units includes a multi-ported register file that is divided into a plurality of separate register file segments, each of the register file segments being associated to one of the plurality of functional units. The register file segments are partitioned into local registers and global registers. The global registers are read and written by all functional units. The local registers are read and written only by a functional unit associated with a particular register file segment. The local registers and global registers are addressed using register addresses in an address space that is separately defined for a register file segment/functional unit pair. The global registers are addressed within a selected global register range using the same register addresses for the plurality of register file segment/functional unit pairs.

Abstract: A method includes hooking a critical operating system function, stalling a call to the critical operating system function originating from a call module, determining a location of the call module in a kernel address space of a memory, and determining whether the location is in a driver area of the kernel address space. Upon a determination that the call module is not in the driver area, the method further includes taking protective action to protect a host computer system. In this event, it is highly likely that the call module is malicious code that has been injected into the kernel stack/heap through a malicious kernel mode buffer overflow attack. By taking protective action, exploitation, damage or destruction of the host computer system is prevented.

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract: Executing an obfuscated application program comprises receiving an application program comprising application program instructions and application program data, determining an application program instruction location permutation to apply to a current instruction counter value, determining an application program data location permutation to apply to a current data location counter value, receiving the current instruction counter value, and applying the application program instruction location permutation to the current instruction counter value to obtain a reference to an application program instruction in an instruction stream to execute. If the application program instruction references application program data, the application program data location permutation is applied to data referenced by the application program instruction to obtain a reference to data to access. The data to access is interleaved with application program instructions in the instruction stream.

Abstract: A method of forming an electronic component package includes: forming electrically conductive traces for connecting first selected bond pads of a plurality of bond pads on a first surface of an electronic component to corresponding bonding locations formed on a second surface of the electronic component; coupling the first surface of the electronic component to a first surface of a lower dielectric strip; coupling the second surface of the electronic component to a first surface of an upper dielectric strip; forming lower via apertures through the lower dielectric strip to expose second selected bond pads of the plurality of bond pads on the first surface of the electronic component; forming upper via apertures through the upper dielectric strip to expose the bonding locations on the second surface of the electronic component; filling the lower and upper via apertures with an electrically conductive material to form lower and upper vias electrically coupled to the first and second selected bond pads of the pl

Abstract: A value that bypasses some of the computations for an arithmetic operation can be supplied for performance of a dependent arithmetic operation without waiting for completion of the computations of the arithmetic operation. During performance of a first arithmetic operation, a value is generated. The value is viable for use in performing a second arithmetic operation that is dependent upon the first arithmetic operation. The value is utilized to continue performance of the first arithmetic operation and commence performance of the second arithmetic operation. As part of the continued performance of the first arithmetic operation, determining whether the value is to be modified for the first arithmetic operation. Compensating for modifications to the value for performance of the second arithmetic operation.

Abstract: A mechanism for determining whether an image is of lossy-origin or lossless origin is used to maximize the compression ratio of any future compressions and avoid wasting the precious resources associated with lossless compression/decompression on any image that has previously been subjected to lossy compression/decompression.

Abstract: Obfuscating an application program comprises reading an application program comprising code, transforming the application program code into transformed application program code that uses one of multiple opcode value encoding schemes of a dispatch table associated with the application program, and sending the transformed application program code. Executing an obfuscated application program comprises receiving an obfuscated application program comprising at least one instruction opcode value encoded using one of multiple instruction set opcode value encoding schemes, determining a dispatch table associated with the application program, and executing the application program using the associated dispatch table. The dispatch table corresponds to the one of multiple instruction set opcode value encoding schemes.

Abstract: A method enables access of a plurality of data sources by a single access operation where each data source in the plurality of data sources requires a different driver to access the data source so that there is a plurality of different drivers. The method includes using an application programming interface (API) for each driver in the plurality of different drivers. The API is substantially identical for each of the drivers in the plurality of different drivers. A merging driver receives the single access operation, and in response to the single access operation, the merging driver accesses the plurality of different drivers through the API.

Abstract: A content provider interfaces a client with a server. The content provider includes a task manager operable to initiate and manage a session for a client and to query the server, when required, for content requested by the client. The content provider also includes session content storage for storing content associated with that session. The content provider further includes a protocol adapter operable to respond to the task manager for interfacing with the server to retrieve content requested by the client. The retrieved content is stored in the session content storage associated with the session for the client.

Abstract: A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is compatible with etched, plated or printed pre-manufactured substrate components. A circuit board or film having a pre-plated, etched or printed circuit, for example a rigid substrate having a Ball Grid Array (BGA) ball-attach pattern, is laser perforated to produce blind vias and/or conductive patterns that provide contact through to conductors of the prefabricated circuit board or film. Existing circuit board and substrate technology is thereby made compatible with laser-embedding technologies, providing the low-cost advantages of existing etching, plating and printing technologies along with a high conductor density associated with laser-embedded circuit technologies.