Abstract: A method of provisioning communication devices is provided which preferably includes transferring a customer order to an order database. The transferred customer order preferably includes an order sequence. A due order is then retrieved from the order database responsive to the order sequence. The due order is representative of a next customer order due. The method also includes retrieving at least one provisioning rule from a rule database having a plurality of rules stored therein and responsive to the retrieve due order, executing a provisioning script representative of instructions for provisioning communication devices to provide a customer selected service responsive to the at least one retrieved provisioning rule, and provisioning communication devices responsive to the generated provisioning script.
Abstract: The method of removing an epoxy bonded microelectronic component from a substrate includes the steps of heating a removal tool comprising a blade portion. The heated blade portion engages against the cured epoxy positioned around the edge of the component, and the epoxy is removed. The blade portion is positioned between an edge of the component and an adjacent portion of the substrate to lift the component from the substrate. A screwdriver receiving tip can also be attached to the removal tool. The screwdriver receiving tip includes an orifice that receives a screwdriver shaft that is freely rotatable therein. The removal tool is heated, thereby heating the screwdriver receiving tip and screwdriver shaft so that any screw to be removed is heated and removed. A tool is also disclosed for removing the microelectronic component from a substrate. The tool includes a removal tool comprising a proximal body and a distal heating end.
March 22, 1999
Date of Patent:
April 10, 2001
Terry S. Bryant, Donald J. Beck, James B. Nichols