Cutting shears
Latest Harris Corporation Patents:
- Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
- Method for making an optical fiber device from a 3D printed preform body and related structures
- Satellite with a thermal switch and associated methods
- Method and system for embedding security in a mobile communications device
- QTIP—quantitative test interferometric plate
Description
FIG. 1 is a perspective view of the cutting shears that are a present invention, looking at the front end, top and right sides;
FIG. 2 is an elevational view of the right side;
FIG. 3 is a top plan view;
FIG. 4 is a bottom plan view;
FIG. 5 is a front end elevational view;
FIG. 6 is a rear end elevational view; and,
FIG. 7 is an elevational view of the left side.
Referenced Cited
Patent History
Patent number: D389714
Type: Grant
Filed: Aug 27, 1996
Date of Patent: Jan 27, 1998
Assignee: Harris Corporation (Melbourne, FL)
Inventors: Mark Snyker (Oakdale, MN), Cory Boudreau (Marshfield, WI)
Primary Examiner: Martie Thompson
Attorney: Harry M. Fleck
Application Number: 0/58,898
Type: Grant
Filed: Aug 27, 1996
Date of Patent: Jan 27, 1998
Assignee: Harris Corporation (Melbourne, FL)
Inventors: Mark Snyker (Oakdale, MN), Cory Boudreau (Marshfield, WI)
Primary Examiner: Martie Thompson
Attorney: Harry M. Fleck
Application Number: 0/58,898
Classifications
Current U.S. Class:
D 8/57
International Classification: 0803;
International Classification: 0803;