Patents Represented by Attorney J. F. Spivak
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Patent number: 4870117Abstract: A waterproof cable having a filling material for filling voids in the cable which comprises a styrene-rubber diblock copolymer, a styrene-rubber-styrene triblock copolymer a paraffinic oil, a polybutene oil and a polyethylene wax. The cable is suitable for aerial use as well as underground use.Type: GrantFiled: March 3, 1988Date of Patent: September 26, 1989Assignee: American Telephone and Telegraph Company, AT&T Bell LaboratoriesInventor: Alvin C. Levy
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Patent number: 4866501Abstract: A circuit package comprises at least one IC chip bonded directly in a hole provided in a wafer such that the surface of the chip and the surface of the wafer are in the same plane thereby accommodating TAB bonding of the chip to bonding pads provided on the wafer. The structure can include multilayer circuitry on the wafer.Type: GrantFiled: December 16, 1985Date of Patent: September 12, 1989Assignee: American Telephone and Telegraph Company AT&T Bell LaboratoriesInventor: Daniel J. Shanefield
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Patent number: 4838347Abstract: A compressible thermally conductive member comprises a polymer field with thermally conducting magnetically aligned particles comprising a base portion and a multiplicity of protrusions extending from at least one surface of the base portion.Type: GrantFiled: July 2, 1987Date of Patent: June 13, 1989Assignee: American Telephone and Telegraph Company AT&T Bell LaboratoriesInventors: Mark S. Dentini, Joe A. Fulton, Sungho Jin, John J. Mottine, Jr., Lloyd Shepherd, Richard C. Sherwood
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Patent number: 4718862Abstract: The present invention is a "two-way" handle that accepts an electrical cord in one end and an interchangeable electrical apparatus, e.g., test probe cartridges for nondestructive resistivity measurements in the other end, and wherein the handle can accept said electrical cord or electrical apparatus in either end interchangebly, or when desired, two electrical cords, one at each end of the handle.Type: GrantFiled: April 18, 1986Date of Patent: January 12, 1988Assignee: AT&TInventor: Dean A. Beeman
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Patent number: 4675089Abstract: A high quality Al.sub.2 O.sub.3 film is deposited by means of plasma enhanced chemical vapor deposition by passing a trialkylaluminum vapor over the surface of a substrate and CO.sub.2 gas as the oxidant in a plasma above the substrate surface. The CO.sub.2 is controlled to prevent particle formation due to gas phase reaction in the plasma as opposed to directly on the substrate surface.Type: GrantFiled: November 25, 1985Date of Patent: June 23, 1987Assignee: AT&T Technologies, Inc.Inventors: Earl R. Lory, Leonard J. Olmer
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Patent number: 4665148Abstract: A method for preventing unwanted continued polymerization with aging of a polymer, e.g., a silicone gel, which was catalytically cured comprises treating the cured polymer with a catalytic deactivating agent or stabilization of cured resin.Type: GrantFiled: December 10, 1985Date of Patent: May 12, 1987Assignee: AT&T Technologies, Inc.Inventor: Ching-Ping Wong
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Patent number: 4656091Abstract: A telephone cord employs as an insulator for the conductors therein an extrudable blend of a styrene-ethylenebutylene-styrene copolymer with polypropylene.Type: GrantFiled: January 27, 1986Date of Patent: April 7, 1987Assignees: AT&T Technologies, Inc., Bell Telephone Laboratories Inc.Inventors: Jae H. Choi, William M. Kanotz, William C. Vesperman
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Patent number: 4651011Abstract: A non-destructive method for determining the degree of cure of a polymer, e.g., a polymer film, is based upon measuring the degree of free space rotation of a fluorophore added to the polymer system through fluorescent measurements of the fluorophore. The results can be used to control, on-line, the polymerization of the polymer.Type: GrantFiled: June 3, 1985Date of Patent: March 17, 1987Assignee: AT&T Technologies, Inc.Inventors: Jose A. Ors, Suzanne F. Scarlata
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Patent number: 4638762Abstract: A chemical vapor deposition apparatus particularly useful for forming uniformly thick epitaxial layers of III-V semiconductor compounds on a plurality of substrates comprises a susceptor for supporting the substrates contained within a housing, gas inlet and outlet ports including a plurality of gas inlet ports spaced around the periphery of the housing and wherein the susceptor is provided with a plurality of helical flights extending from top to bottom which control the gas flow pattern.Type: GrantFiled: August 30, 1985Date of Patent: January 27, 1987Assignee: AT&T Technologies, Inc.Inventors: Myung K. Kim, Montri Viriyayuthakorn
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Patent number: 4637989Abstract: A predominantly perovskite phase Pb(Zn.sub.x Mg.sub.1-x Nb.sub.2).sub.1/3 O.sub.3 ceramic is prepared by first forming a columbite precursor having the formula Zn.sub.x Mg.sub.1-x Nb.sub.2 O.sub.6 and reacting this material with PbO at temperatures of from 800.degree. C. to at least 1000.degree. C. as x varies from 0.025 to 0.7.Type: GrantFiled: March 29, 1985Date of Patent: January 20, 1987Assignees: AT&T Technologies, Inc., Bell Telephone LaboratoriesInventors: Hung C. Ling, Warren W. Rhodes, Man F. Yan
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Patent number: 4638401Abstract: A novel low sintering temperature ceramic composition particularly suitable for multilayer ceramic capacitors is disclosed. The composition comprises a mixture represented by the formula(1-x)Bi.sub.2 (ZnNb.sub.2(1+d))yO.sub.3+6y+5dy (x)Bi.sub.3 (Ni.sub.2 Nb)O.sub.9where 0<x<1, 0.6.ltoreq.y.ltoreq.1.1 and -0.05.ltoreq.d.ltoreq.0.05.Type: GrantFiled: January 10, 1986Date of Patent: January 20, 1987Assignees: AT&T Technologies, Inc., Bell Telephone Laboratories, Inc.Inventors: Hung C. Ling, Man F. Yan
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Patent number: 4628022Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.Type: GrantFiled: March 4, 1985Date of Patent: December 9, 1986Assignee: AT&T Technologies, Inc.Inventors: Jose A. Ors, Richard D. Small, Jr.
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Patent number: 4614399Abstract: A splicing device is disclosed wherein the conductor and steel support cable portions of an aerial drop wire are each spliced utilizing a single device which is electrically insulated and weather-resistant and has a central member and end caps separable therefrom. The ends of the steel support cable are joined together by a wire linking device integrally molded in the central body and the conductors are spliced together by button-blade terminals driven into conductor-receiving cavities within the same body becoming locked in place. The risk of environmental damage is eliminated by the end caps which protect the stripped portions of the conductors, as well as by the unitary body construction of the central member which provides a sealed environment for the splices themselves.Type: GrantFiled: July 23, 1984Date of Patent: September 30, 1986Assignee: AT&T Technologies, Inc.Inventors: Richard J. Gemra, Manuel Martinez
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Patent number: 4610932Abstract: An electrical contact comprises a base metal and an electroplated nickel layer thereover wherein said nickel layer is preferentially oriented in a <111> crystallographic plane along the surface of the nickel.Type: GrantFiled: December 6, 1984Date of Patent: September 9, 1986Assignee: AT&T Technologies, Inc.Inventors: Richard Haynes, Hung C. Ling, Sau-Lan L. Ng
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Patent number: 4604144Abstract: In a method of cleaning a circuit board having a silicone encapsulated hybrid integrated circuit thereon, subsequent to aqueous solder flux residue removal with an ionic detergent, the board is cleaned with a low molecular weight organic acid such as formic, acetic or oxalic acid.Type: GrantFiled: September 11, 1985Date of Patent: August 5, 1986Assignee: AT&T Technologies, Inc.Inventor: Ching-Ping Wong
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Patent number: 4601972Abstract: A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.Type: GrantFiled: July 26, 1985Date of Patent: July 22, 1986Assignee: AT&T Technologies, Inc.Inventor: Richard D. Small, Jr.
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Patent number: 4600522Abstract: A detergent cleaning composition which includes a combination of a furan type alcohol, a substance having an aroma, a non-ionic surfactant and an emulsifier. The cleaner is biodegradable, meets environmental and health standards and is an effective cleaner of graffiti and other filth from the surface of anodized aluminum, stainless steel and glass.Type: GrantFiled: April 26, 1982Date of Patent: July 15, 1986Assignee: AT&T Technologies, Inc.Inventors: John A. Grzeskowiak, Jr., Elliott E. Hershkowitz
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Patent number: 4600967Abstract: A ceramic capacitor with high Q factor and small temperature coefficients is made using a sintered dielectric comprising(1-y)Pb(Zn.sub.x Nb.sub.1-x)O.sub.3.5-1.5x.yPbTiO.sub.3wherein x is from 0.3 to 0.4 and y is from 0 to less than 0.1.Type: GrantFiled: October 21, 1985Date of Patent: July 15, 1986Assignees: AT&T Technologies, Inc., Bell Telephone Laboratories, Inc.Inventors: Hung C. Ling, Man F. Yan
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Patent number: 4592955Abstract: A telephone cord employs as an insulator for the conductors therein an extrudable blend of a styrene-ethylenebutylene-styrene copolymer with polypropylene.Type: GrantFiled: October 31, 1984Date of Patent: June 3, 1986Assignees: AT&T Technologies, Inc., Bell Telephone LaboratoriesInventors: Jae H. Choi, William M. Kanotz, William C. Vesperman
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Patent number: 4592959Abstract: A method of extending the shelf-life of an uncured silicone resin formulation which includes a primary amine therein comprises adding an acid to the formulation in a molar quantity approximately equal to the number of moles of primary amine present in the formulation, said acid being volatile at or below the curing temperature of the resin formulation.Type: GrantFiled: November 19, 1984Date of Patent: June 3, 1986Assignee: AT&T Technologies, Inc.Inventor: Ching-Ping Wong