Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal.
Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an insulative material. The heat spreader includes a base and a ceramic block. The conductive trace provides signal routing between a pad and a terminal. The insulative material extends between the base and the terminal. The ceramic block is embedded in the base. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the heat spreader.
Abstract: A road lamp dimming control device comprises a signal processor, a power supplier, a driver and a light emitting module. The single processor is used for receiving an inputted electric current and a control signal. The control signal is decoded into a dimming control signal that then is transmitted to the power supplier. The power supplier converts the inputted electric current into constant current based upon the dimming control signal. The driver receives the constant current to drive the light emitting module to allow the light emitting module having different brightness based upon the control signal, thereby performing multi-stage variation.
Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.
Abstract: A direct current (DC) power system uses High Concentration Photovoltaic (HCPV) modules and Building-Integrated Photovoltaic (BIPV) module. Power outputs of the HCPV/BIPV modules are mixed to improve utilization of generated power. Thus, solar power is used through best power control and energy conservation.
Type:
Grant
Filed:
January 20, 2010
Date of Patent:
November 20, 2012
Assignee:
Atomic Energy Council—Institute of Nuclear Energy Research
Abstract: Disclosed is an apparatus for measuring temperature coefficients of a concentrator photovoltaic module. The apparatus includes a solar simulator for providing a radiant source, a environment chamber, a concentrator photovoltaic module, a temperature control unit for controlling the temperature of environment chamber, a circuit-voltage curve measurement unit for measuring current-voltage characteristics of a photovoltaic device and a reference cell for measuring the irradiation of the solar simulator.
Type:
Grant
Filed:
February 12, 2010
Date of Patent:
November 13, 2012
Assignee:
Atomic Energy Council-Institute of Nuclear Energy Research
Abstract: The present invention is applied in fields like biological medicine and tissue engineering. A fluid control system in a cell isolation and culture system is used to automatically process sample preparation, circulating tumor cell (CTC) isolation, plate changing and cell culturing. By using the present invention, time and labor are saved; moreover, the present invention has a small size and is easily carried.
Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal.
Abstract: A roll-forming machine formed of a machine base, a guide block unit, pairs of forming roll sets, a first adjustable shape-forming wheel set, a second adjustable shape-forming wheel set, a first lower auxiliary shape-forming wheel set, a second lower auxiliary shape-forming wheel set, an upper auxiliary shape-forming wheel set, a small straightener and a big straightener for the formation of a C-shaped component or a Z-shaped component from a sheet material is disclosed in such a manner that a wide space is provided around each of the adjustable shape-forming wheel assembly, the non-adjustable shape-forming wheel assembly and the adjustable shape-forming wheel set to facilitate maintenance work and, the coupling walls and sidewalls of the non-adjustable shape-forming wheel assembly and the adjustable shape-forming wheel set are mounted with respective pivot shafts and fastening members for quick positioning of the respective shape-forming wheels, assuring high stability and accurate processing.
Abstract: A dual vacuum mount type support device includes a support arm, two vacuum mount assemblies pivotally connected to the two distal ends of the support arm for securing to the flat surface of a support wall and the flat surface of an object to be supported on the support wall, and two pivot locks for locking the vacuum mount assemblies to the support arm in the respective adjusted position.
Abstract: A direct-conversion transmitter with resistance to local oscillator pulling effect comprises a local oscillation circuit, a quadrature modulator connected with the local oscillation circuit, a power amplifier connected with the quadrature modulator, a first variable analog delay device connected with the power amplifier, a variable analog attenuator connected with the first variable analog delay device, an inner self-injection loop, and a power combiner connected with the variable analog attenuator and the inner self-injection loop. The local oscillation circuit comprises a two point voltage-controlled oscillator and a phase locked loop connected with the two point voltage-controlled oscillator. The inner self-injection loop comprises a second variable analog delay device, a phase shifter connected with the second variable analog delay device and a variable gain amplifier connected with the phase shifter.
Abstract: An optoelectronic switch using millimeter wavelength (MMW) is provided. An r voltage pulse is applied to a device under test (DUT) for switching the photo-generated MMW power The DUT is operated under reverse bias. An optical light source with modulated MMW envelop is injected on to DUT for MMW power generation. Thus, based on change of the reverse bias, speed is violently changed and the MMW optoelectronic switch is thus obtained.
Abstract: A method of making a semiconductor chip assembly includes providing a metal plate, providing a ceramic block in the metal plate, providing an insulative material in the metal plate, wherein the metal plate includes a base and a terminal, then providing a conductive layer on the base and the ceramic block, providing a conductive trace that includes a pad, the terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the ceramic block, wherein a heat spreader includes the base and the ceramic block, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Abstract: Disclosed is a controlling apparatus for use in a photovoltaic system. The photovoltaic system includes a solar cell array, an inverter and a solar tracker. The solar tracker includes a solar position sensor, a controller connected to the solar position sensor, a first motor connected to the controller for rotating the solar cell array according to the azimuth of the sun and a second motor connected to the controller for tilting the solar cell array according to the elevation of the sun. The controlling apparatus includes a central unit, a basic unit, a diagnosis unit, a maintenance unit, a security unit and a check unit.
Type:
Grant
Filed:
February 8, 2009
Date of Patent:
October 30, 2012
Assignee:
Atomic Energy Council—Institute of Nuclear Energy Research
Inventors:
Shang-Lee Chyou, I-Tao Lung, Shiu-Ju Yang
Abstract: An elevation adjustable window candle includes a candlestick having axial sliding grooves axially disposed between stop portions and an inside shoulder therein, a candle shaft having springy retaining blocks equiangularly suspending in the bottom side thereof and respectively axially slidably coupled to the sliding grooves in the candlestick to secure the candle shaft to the candlestick at the desired elevation by means of friction resistance, and a lampshell mounted on the top end of the candle shaft and holding a LED lamp module therein.
Abstract: The present invention discloses a conveniently demountable assembled lamp. It is mainly composed of stand columns and clapboards, and multiple clapboards divide the stand columns into up and down multiple layers.
Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Abstract: A magnetic suspension device comprises a magnetic base and a suspension body. The suspension body is suspended above the magnetic base. The suspension body is provided with a receiving coil and at least one luminous body. The magnetic base is provided with a transmitting coil. The transmitting coil transmits an AC signal to the receiving coil. The receiving coil converts the AC signal transmitted by the transmitting coil into electric energy and supplies the electric energy to the luminous body for emitting light. In the magnetic suspension device of the present invention, the transmitting coil is arranged at the magnetic base, and the receiving coil is arranged in the suspension body. Wireless power transmission is realized through the transmitting coil and the receiving coil, so, the luminous body arranged on the suspension body can emit light without any cell and external power supply.
Abstract: A lamp seat structure capable of adjusting light source sensing direction includes a connecting seat and a lampshade, or includes a connecting seat and a light bulb. The connecting base includes a base, a metallic lid, a cylinder, and a circuit modular board which are connected with an outer metallic conducting rod and an inner metallic conducting rod so as to be screwed to a light holder. A blocking board is located between a limit light trough of the cylinder and a light sensor of the circuit modular board. The circuit modular board is disposed under a partition. The circuit modular board is provided with a plurality of light emitting diodes for illumination. Alternatively, the circuit modular board is disposed and located on the partition, and a lower end of the cylinder is formed with an inner metallic threaded section for connecting with the light bulb. The lamp of the present invention is capable of sensing light and dark to turn on/off the lamp automatically.