Patents Represented by Attorney Jackson IPG PLLC
  • Patent number: 8269336
    Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.
    Type: Grant
    Filed: December 19, 2009
    Date of Patent: September 18, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8263852
    Abstract: A heat sink has a number of fixing frames. The fixing frames are soldered with of solar cell devices. And, the fixing frames are defined with insulating ink. Hence, the fixing frames can be used for insulating and locating the of a solar cell devices. Besides, with the insulating ink, solar cells of the solar cell devices are prevented from being contacted with the heat sink. As a result, a good electrical property is obtained on assembling and using the solar cell devices.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: September 11, 2012
    Assignee: Atomic Energy Council—Institute of Nuclear Energy Research
    Inventors: Zun-Hao Shih, Hwen-Fen Hong, Kuo-Hsin Lin
  • Patent number: 8258716
    Abstract: An active type multiple channeled LED power driving system which includes seven regions, wherein power is lead-in through the first region with the EMC circuitry and the PWM circuitry, passing through the second region with the transformer, entering the third region with the CC & CV control circuitry, passing through the fourth region with two multiple channeled outputers, lead-in the fifth region having two intermittent modulating circuitries, outputting to the sixth region with the two LED lighting modules, and setting with environment parameters sensors in the seventh region, thereby raising the electronic typed heat dissipation rate and energy efficiency under the system operation to let the LED lamp be able to achieve its maximum performance.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: September 4, 2012
    Inventor: Jui Chih Yen
  • Patent number: 8251537
    Abstract: A lamp tube coupler is that an insulation terminal seat is respectively disposed to two ends of an expansible outer cylinder. A pair of electrode coupling members is disposed to each insulation terminal seat. The electrode coupling members corresponding to each other at the two ends of the expansible outer cylinder form a conduction mode through respective springs. While using every lamp tube coupler, the coupler is disposed between the two lamp tubes. The electrode coupling members at two ends are respectively inserted into the electrode sockets of the two lamp tubes to achieve the goal of cascading at least two lamp tubes.
    Type: Grant
    Filed: November 27, 2010
    Date of Patent: August 28, 2012
    Assignee: Taiwan Oasis Technology Co., Ltd
    Inventor: Ming-Shun Lee
  • Patent number: 8248258
    Abstract: A resume device is provided. The device detects voltage variation in standby mode. When a big voltage variation is detected, a resume process is run and a sound is played. Volume of the sound is adjustable and power is maintained within a proper range. Thus, power consumption is saved, efficiency is improved and resume process is enhanced.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: August 21, 2012
    Assignee: Tritan Technology Inc.
    Inventor: Ching-Hung Tseng
  • Patent number: 8249840
    Abstract: A simulator system transfers parameters between an enhanced nuclear power plant simulator and a safety control system simulator. Problems concerning software common mode failure, interface interactions errors, software failure complexity, and other failure modes, are evaluated. Thus, diversity and defense-in-depth are analyzed and safety is improved.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: August 21, 2012
    Assignee: Atomic Energy Council—Institute of Nuclear Energy Research
    Inventors: Yuan-Chang Yu, Mao-Sheng Tseng, Hui-Wen Huang, Tsung-Chieh Cheng
  • Patent number: 8244382
    Abstract: An apparatus for monitoring a schedule for testing a fuel cell in a station. Because of the apparatus, the station can test a low-temperature fuel cell or a high-temperature fuel cell. The apparatus enables a user to test the fuel cell through the station manually or enables the station to test the fuel cell automatically.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: August 14, 2012
    Assignee: Atomic Energy Council—Institute of Nuclear Research
    Inventors: Hung-Yu Wang, Wen-Tang Hong, Yu-Ching Tsai, Tzu-Hsiang Yen, Wei-Ping Huang, Cheng-Nan Huang
  • Patent number: 8240695
    Abstract: A baby trailer towing connector formed of a first connector, a second connector, a buffer bar and a spring member for the connection of a baby trailer to a baby bicycle is disclosed. The second connector has a connection frame attached to the top wall and opposing sidewalls of the holder block of the first connector and secured thereto by a pin, assuring connection stability and avoiding breaking of the pin during a towing operation.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: August 14, 2012
    Inventor: Cheh-Kang Liu
  • Patent number: 8242690
    Abstract: The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: August 14, 2012
    Assignee: Evergrand Holdings Limited
    Inventor: Yu-Nung Shen
  • Patent number: 8241962
    Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device to
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: August 14, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang, Sangwhoo Lim
  • Patent number: 8242517
    Abstract: The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: August 14, 2012
    Assignee: Evergrand Holdings Limited
    Inventor: Yu-Nung Shen
  • Patent number: 8234900
    Abstract: A corrugated metal sheet member fabrication system in which the roller ramming unit includes a flange-forming roller set located on the machine base near the rear side for ramming a part of a second lateral corrugated portion of each corrugated metal sheet member processed by a roller ramming unit opposite to a first lateral corrugated portion of the respective corrugated metal sheet member into an inwardly protruding bottom flange, a flange cutting tool located on the machine base behind the flange-forming roller set for cutting the inwardly protruding bottom flange subject to the desired length and shape, a stamping mold located on the machine base between the flange cutting tool and the cut-off unit for stamping the first lateral corrugated portion of each corrugated metal sheet member into a transversely curved profile having a longitudinal groove and simultaneously stamping each corrugated metal sheet member into a stepped configuration.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: August 7, 2012
    Inventor: Tsai-Shen Wang
  • Patent number: 8236075
    Abstract: An abrasive material is fabricated. The material is made of bamboo charcoal. The charcoal has vascular bundles and abrasive particles are uniformly distributed and fixed on inner surfaces of the vascular bundles. Thus, the abrasive material can be used with self-sharpening for grinding, polishing, lubricating, etc.
    Type: Grant
    Filed: July 18, 2009
    Date of Patent: August 7, 2012
    Assignee: National Central University
    Inventors: Biing-Hwa Yan, Shin-Min Lee, Jung-Chou Hung
  • Patent number: 8237618
    Abstract: A slot-fed Yagi aerial includes: a cable, a reflector, an active dipole and directors, wherein, the reflector, the active dipole, etc. are provided on a support tube; the feeding section of the Yagi aerial is of a shielded slot structure in which the distance between the ends of the slot is approximately one half of the wavelength of the electromagnetic signal desired to be received; the two pieces of thin metal rods composing the half wavelength dipole are located at two external sides of the slot; the outer conductor of the cable is connected to one side of the slot, and the inner conductor of the cable is connected to the other side of the slot or the inner conductor of the cable isolated by a dielectric layer is wound around at the other side of the slot, so as to realize a direct connection feed or a coupling feed.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: August 7, 2012
    Assignee: Shenzhen Grentech Co., Ltd.
    Inventor: Jinbo Wu
  • Patent number: 8234899
    Abstract: In a roll-forming machine having pairs of forming roll sets and two first and two second auxiliary shape-forming wheel sets for processing C-shaped component or Z-shaped component, each first auxiliary shape-forming wheel set having, in addition to an upper auxiliary shape-forming wheel, a bottom auxiliary wheel for working with a respective lateral shape-forming wheel to ram each of two sides of a C-shaped or Z-shaped component into a 90° contained angle, and each second auxiliary shape-forming wheel set having, in addition to an upper auxiliary shape-forming wheel, a bottom auxiliary wheel for working with a respective lateral shape-forming wheel to ram each of two sides of a C-shaped or Z-shaped component into a 90° contained angle, so that the operator needs not to shut down the machine or to change or calibrate the machine parts when wishing to change the processing from a C-shaped component processing mode to a Z-shaped component processing mode or from a Z-shaped component processing mode to a C-shaped
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: August 7, 2012
    Inventor: Sen-Jung Chuang
  • Patent number: 8236619
    Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
    Type: Grant
    Filed: April 23, 2011
    Date of Patent: August 7, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8236618
    Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: August 7, 2012
    Assignee: Bridge Semiconductor Corporation
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Patent number: 8231109
    Abstract: A reel structure for a marine fabric tape includes a reel device pivoted to an engaging seat. When a handle of a windlass is turned, a flat rod will be driven to rotate a gear shaft which then drives a gear disc to rotate. Because a head portion is positioned in an axle shaft, a fabric tape is rolled up along with the axle shaft to form a circular shape, providing an even applied force for rolling up the fabric tape.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: July 31, 2012
    Inventor: I-Sin Peng
  • Patent number: 8231253
    Abstract: An adjustable window candle includes a candlestick, a positioning member mounted inside the shank body and having retaining flanges extending around the periphery thereof at different elevations, a candle shaft axially slidably sleeved onto the positioning device and having a locating groove extending around the inside wall thereof and selectively engageable with one retaining flange of the positioning member to secure the candle shaft to the positioning member in the candlestick in one of a series of elevational positions, and a lampshell mounted on a top end of the candle shaft and holding a LED lamp module therein.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: July 31, 2012
    Inventor: Ching-Chao Chen
  • Patent number: D664830
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: August 7, 2012
    Assignee: Taiwan Fu Hsing Industrial Co., Ltd.
    Inventors: Rick Yu, Ju-Kuan Yang