Patents Represented by Attorney, Agent or Law Firm Jacob Eisenberg
  • Patent number: 6637665
    Abstract: The invention relates to a multi-layered carrier element for reducing interference with an antenna comprising at least one coil. In addition to the layer, the antenna comprises a shield which is placed along at least one extension of the antenna and split at a certain point. The shield is electrically connected to a reference point which is located on the carrier element and is preferably electrically connected to the ground layer. The shield reduces interference such as that caused by a hand or by a nearby metallic object.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: October 28, 2003
    Assignee: Siemens Schweiz AG
    Inventor: Gerard Salzgeber
  • Patent number: 6636427
    Abstract: The housing, which is to accommodate a rotary switch arranged on a printed circuit board, is provided with a threaded projection which can be used to fasten it to a wall through which a setting stem, which is assigned to the rotary switch, reaches. The housing is designed in two parts in such a manner that one half (19, 20) of the threaded projection is integrally formed on each housing component (9, 10). The two housing components (9, 10) are joined together by means of latching connection means (11, 12, 13, 14) and hooks (one of which is denoted by 16) engaging in eyelets.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: October 21, 2003
    Assignee: Mannesmann VDO AG
    Inventor: Christian Dörrie
  • Patent number: 6475819
    Abstract: A method for the production and formation of microscopic semiconductor light emitting diodes Is set out. The method comprises the steps of: producing a semiconductor light emitting device (100) including a pn-junction (24) and metallization layers (6, 7); applying an etching mask (9-11) with a preset structure on one side of the semiconductor device (100), whereby the masked areas of the arrangement form and correspond to the diodes to be formed (30); applying a carrier (8, 12) on the other side of the semiconductor device (100); vertically etching the semiconductor material in the openings of the etching mask (9-11) to the carrier (8, 12) and thereby producing a diode arrangement containing a multiple number of diodes (30) below the masked areas.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: November 5, 2002
    Assignee: Osram Opto Semiconductors GmbH & Co. OHG
    Inventor: Gerhard Franz
  • Patent number: 6409545
    Abstract: The invention relates to a power capacitor for use in capacitor banks, which is build into a housing and interconnected by ribbon cables.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: June 25, 2002
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Harald Vetter, Ludwig Berg
  • Patent number: D485518
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: January 20, 2004
    Assignee: Siemens AG
    Inventors: Ulrich Kraus, Gert-Dieter Tuzar