Patents Represented by Attorney John J. Piskorski
  • Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8277630
    Abstract: A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: October 2, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Patent number: 8252506
    Abstract: Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: August 28, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kevin J. Cheetham, Thomas C. Sutter
  • Patent number: 8202621
    Abstract: An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: June 19, 2012
    Assignee: Rohm and Haas Company
    Inventors: Michael A. Pickering, Jitendra S. Goela
  • Patent number: 8198120
    Abstract: An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: June 12, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jitendra S. Goela, Michael A. Pickering, Neil D. Brown, Angelo Chirafisi, Mark Lefebvre, Jamie L. Triba
  • Patent number: 8142637
    Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.
    Type: Grant
    Filed: August 3, 2011
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andre Egli, Wing Kwong Wong, Raymund W. M. Kwok, Jochen Heber
  • Patent number: 8142639
    Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Masanori Orihashi, Yasushi Takizawa
  • Patent number: 8142913
    Abstract: Polycrystalline monolithic magnesium aluminate spinels are disclosed. The polycrystalline monolithic magnesium aluminate spinels have small grain sizes and may be deposited on substrates as thick one-piece deposits. The polycrystalline monolithic magnesium aluminate spinels may be prepared and deposited by chemical vapor deposition. Articles made with the polycrystalline monolithic magnesium aluminate spinels also are disclosed.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Jitendra S. Goela, Heather A. G. Stern
  • Patent number: 8053160
    Abstract: An imaging composition, article and method of imaging are disclosed. The imaging composition is energy sensitive such that upon application of a sufficient amount of energy to the composition a color or shade change is affected. The imaging composition is coated on an article to form an energy sensitive article, which may be used in marking work pieces.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: November 8, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, James T. Fahey, Corey O'Connor, James G. Shelnut
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8048606
    Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
    Type: Grant
    Filed: March 17, 2006
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, James T. Fahey, Corey O'Connor, James G. Shelnut
  • Patent number: 8043662
    Abstract: To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: October 25, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Masanori Orihashi
  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 7977026
    Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: July 12, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, James T. Fahey, Corey O'Connor, James G. Shelnut
  • Patent number: 7968444
    Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: June 28, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yu Luo, Neil D. Brown, Michael P. Toben
  • Patent number: 7955978
    Abstract: Silicon containing substrates are coated with nickel. The nickel is coated with a protective layer and the combination is heated to a sufficient temperature to form nickel silicide. The nickel silicide formation may be performed in oxygen containing environments.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: June 7, 2011
    Assignee: Rohm and Hass Electronic Materials LLC
    Inventors: John P. Cahalen, Gary Hamm, George R. Allardyce, David L. Jacques
  • Patent number: 7955989
    Abstract: Semiconductors are textured with aqueous solutions containing non-volatile alkoxylated glycols, their ethers and ether acetate derivatives having molecular weights of 170 or greater and flash points of 75° C. or greater. The textured semiconductors can be used in the manufacture of photovoltaic devices.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: June 7, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, Corey O'Connor
  • Patent number: 7955977
    Abstract: Methods of light induced plating of nickel onto semiconductors are disclosed. The methods involve applying light at an initial intensity for a limited amount of time followed by reducing the intensity of the light for the remainder of the plating period to deposit nickel on a semiconductor.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: June 7, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, David L. Jacques
  • Patent number: 7939438
    Abstract: Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: May 10, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, David L. Jacques, Carl J. Colangelo