Patents Represented by Attorney John J. Piskorski

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  • Plating method
    Patent number: 7582199
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: September 1, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • Electroless gold plating solution
    Patent number: 7534289
    Abstract: An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: May 19, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Koichi Yomogida
  • Electroless copper and redox couples
    Patent number: 7527681
    Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: May 5, 2009
    Assignee: Rohm and Haas Electronic Materials LLP
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Catalyst composition and deposition method
    Patent number: 7510993
    Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: March 31, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Peter R. Levey, Nathaniel E. Brese
  • Leveler compounds
    Patent number: 7510639
    Abstract: Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
    Type: Grant
    Filed: July 16, 2005
    Date of Patent: March 31, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan Wang, Robert D. Mikkola, Chunyi Wu, George G. Barclay
  • Formaldehyde free electroless copper compositions
    Patent number: 7501014
    Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: March 10, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
  • Photoresist composition
    Patent number: 7482107
    Abstract: Photoresist compositions having a resin binder with an acid labile blocking group with an activation energy in excess of 20 Kcal/mol. for deblocking, a photoacid generator capable of generating a halogenated sulfonic acid upon photolysis and optionally, a base.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: January 27, 2009
    Assignee: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, James F. Cameron, Roger F. Sinta
  • Acid electrolytes
    Patent number: 7465384
    Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: December 16, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Peter R. Levey, Neil D. Brown
  • Gold alloy electrolytes
    Patent number: 7465385
    Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: December 16, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: André Egli, Wing Kwong Wong, Raymund W. M. Kwok, Jochen Heber
  • Silicon carbide with high thermal conductivity
    Patent number: 7438884
    Abstract: A chemical vapor deposited, ? phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The silicon carbide is synthesized under specific conditions using hydrogen gas and methyltrichlorosilane gas as reactants. The thermal conductivity of the silicon carbide is sufficiently high such that it can be employed as parts of apparatus and components of electrical devices where a high heat load is generated. Such components may include active thermoelectric coolers, heat sinks and fans.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: October 21, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Nathaniel E. Brese, Jitendra S. Goela, Michael A. Pickering
  • Bath analysis
    Patent number: 7384535
    Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
    Type: Grant
    Filed: April 24, 2004
    Date of Patent: June 10, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Wade Sonnenberg, Leon R. Barstad, Raymond Cruz, Gary Hamm, Mark J. Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
  • Functional polymer
    Patent number: 7364834
    Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: April 29, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, Edgardo Anzures, Daniel E. Lundy
  • Electroplating composite substrates
    Patent number: 7357853
    Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: April 15, 2008
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael P. Toben, Neil D. Brown, Angelo Chirafisi
  • Imaging composition and method
    Patent number: 7270932
    Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: September 18, 2007
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, James T. Fahey, Corey O'Connor, James G. Shelnut, John J. Piskorski
  • Method of producing high aspect ratio domes by vapor deposition
    Patent number: 7238241
    Abstract: An apparatus for the manufacture of chemical vapor deposited domes. The apparatus has a vapor deposition chamber with a plurality of sides, a base and a top where the base has a reactant port for receiving a flow of chemical reactants. A male mandrel is joined to one of a plurality of sides of the deposition chamber such that the flow of chemical reactants in the vapor deposition chamber does not impinge on the mandrel.
    Type: Grant
    Filed: April 24, 2003
    Date of Patent: July 3, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Jitendra S. Goela, Zlatko Salihbegovic
  • Imaging compositions and methods
    Patent number: 7223519
    Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: May 29, 2007
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, Corey O'Connor
  • Tin plating
    Patent number: 7160629
    Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: January 9, 2007
    Assignee: Shipley Company, L.L.C.
    Inventor: Jeffrey N. Crosby
  • Electroplating compositions and methods
    Patent number: 7151049
    Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
    Type: Grant
    Filed: April 2, 2004
    Date of Patent: December 19, 2006
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Rozalia Beica, Neil D. Brown, Kai Wang
  • Functional polymer
    Patent number: 7148265
    Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: December 12, 2006
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Robert K. Barr, Edgardo Anzures, Daniel E. Lundy
  • Tin electrolyte
    Patent number: RE39476
    Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: January 23, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Neil D. Brown, George A. Federman, Angelo B. Chirafisi, Gregory Lai