Patents Represented by Attorney, Agent or Law Firm John R. Pivnichny
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Patent number: 6759738Abstract: A substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate.Type: GrantFiled: February 16, 1999Date of Patent: July 6, 2004Assignee: International Business Machines CorporationInventors: Kenneth Michael Fallon, Christian Robert Le Coz, Mark Vincent Pierson
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Patent number: 6759597Abstract: Wire bonds are made to palladium coated bonded pads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.Type: GrantFiled: February 2, 1998Date of Patent: July 6, 2004Assignee: International Business Machines CorporationInventors: Lawrence Richard Cutting, John Gerard Gaudiello, Luis Jesus Matienzo, Nikhil Mohan Murdeshwar
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Patent number: 6760771Abstract: A method and system for delivering a datagram across multiple inter-network servers. The datagram is delivered from a source device having a first network level protocol to a destination device having a second network level protocol. The inter-network servers transport the datagram in accordance with a transport level protocol while the datagram has a transport priority defined by the first and second network level protocols. The source device delivers the datagram from a source port that designates the transport priority and the destination device receives the datagram at a destination port that also designates the transport priority. In accordance with the method of the present invention, either the source port or said destination port is first identified. The transport priority of said datagram is identified utilizing the transport priority designation of the identified source port or destination port. A current server capacity of each of the inter-network servers is determined.Type: GrantFiled: October 17, 2000Date of Patent: July 6, 2004Assignee: International Business Machines CorporationInventors: Didier Giroir, Olivier Hericourt
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Patent number: 6735612Abstract: A carry skip adder has a plurality of ripple adders, in which at least one part of the plurality of ripple adders is divided into a plurality of groups, and a carry signal is transferred from one group to one upper group. In addition, a circuit for calculating C=C2+F*C1 is included, in which the C1 denotes a carry signal from the one group to the one upper group, and the F denotes a signal indicating whether or not outputs of all adders in the one upper group are 1s, and the C2 denotes a carry signal associated with the most upper ripple adder in the one upper group.Type: GrantFiled: October 30, 2000Date of Patent: May 11, 2004Assignee: International Business Machines CorporationInventors: Yoshinao Kobayashi, Akashi Satoh, Seiji Munetoh
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Patent number: 6721285Abstract: In a duplex communications system a master station transmits to and receives from a multiplicity of remote terminals over a shared broadcast communications channel. A polling method and system is disclosed which takes advantage of the asymmetrical reliability of the channel preferably broadcasting from the master station thus, forwarding polling commands carrying a status towards the remote terminals due to deliver responses including only the changes in order to use much more efficiently the channel. Also, the scheme allows to carry out most of the error recovery process in each remote terminal thus completely freeing the in master for its chief task, i.e., the management of the network of remote terminals.Type: GrantFiled: March 22, 2000Date of Patent: April 13, 2004Assignee: International Business Machines CorporationInventor: Fernando Incertis Carro
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Patent number: 6690646Abstract: A method and a system of network capacity planning for use in a high speed packet switching network. The network comprises a plurality of switching nodes interconnected through a plurality of communication links, each of the switching nodes comprises means for switching packets from at least one input link to at least one output link. Each of the output links is coupled to at least one buffer in the switching node for queuing packets before they are transmitted over the output link. In each of the switching nodes and for each of the output links, a time distribution of the occupancy of each buffer during a predetermined monitoring time period is measured, and stored in a centralized memory location. Then, the buffer occupancy time distribution data are retrieved from the centralized memory location in all the switching nodes, gathered and stored in a network dedicated server.Type: GrantFiled: June 27, 2000Date of Patent: February 10, 2004Assignee: International Business Machines CorporationInventors: Aline Fichou, Claude Galand, Jean-Francois Le Pennec
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Patent number: 6677522Abstract: An electronic component such as a ceramic capacitor is coupled to a dielectric substrate package. Encapsulant material substantially surrounding the sides of the component, develops cracks therein, particularly near the corners of the component where CTE stresses are greatest. The cracks propagate downward into the dielectric substrate material and sever circuit lines in the substrate causing failure. A mounting pad for the component is extended from beneath the component to substantially beyond the outer periphery of the encapsulant material to prevent cracks from propagating into the dielectric material.Type: GrantFiled: September 26, 2002Date of Patent: January 13, 2004Assignee: International Business Machines CorporationInventors: Charles F. Carey, Eric A. Johnson, Alfredo Migliore
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Patent number: 6678699Abstract: A displayable digital document such as a .PDF document is indexed by displaying it on a viewer. A database field is provided in a relational database. A user selects a field in the digital document for indexing using a pointing device and defines a bounding rectangle for this field. Offsets are recorded and compared to other bounding rectangles. Comparisons are recorded in a parameter file for each document. An indexer is run to insert the offsets and other data into the relational database and also store the digital image in the relational database. A query is made of the database and part or all of the digital document is displayed based on the results of the query.Type: GrantFiled: October 9, 2001Date of Patent: January 13, 2004Assignee: International Business Machines CorporationInventors: Mark Andrew Stephens, Debra Kathleen Wagner
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Patent number: 6672955Abstract: An air flow management system for an Internet Data Center with rows of cabinets, the rows being located on an elevated floor and disposed in pairs wherein the front sides of the two rows face each other. Fresh air is supplied through the elevated floor in order to cool the heat generating elements, and collected after passing through the heat generating elements. The tops of the two front sides of the two rows in each pair of rows are joined by a cover so that the front sides and the cover constitute a tunnel. The volume of fresh air supplied through the elevated floor is controlled by openings whereby the static pressure in each tunnel can be controlled depending upon the heat generated.Type: GrantFiled: September 3, 2002Date of Patent: January 6, 2004Assignee: International Business Machines CorporationInventor: Frederic Charron
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Patent number: 6665654Abstract: A method and system for updating and deleting records in a tableset T of a family having M tables (M≧1). A set S of N source files (N≧1) are embodied in fileset SA at time tA and in fileset SB at time tB. S is logically associated with T. The family has a common family key KF across the M tables and across the N source files. A Delta program generates a dataset D having non-redundant family keyvalues embodying KF. Each non-redundant family keyvalue is drawn from selected Update or Delete records of SB relative to SA. For Updates, a Trigger program generates fileset &Dgr;S from records of SB having a family key in D, and a Bridge program generates fileset &Dgr;T that includes &Dgr;S data in a form compatible with T. A Load program updates and deletes records in T based on the non-redundant family keyvalues.Type: GrantFiled: July 3, 2001Date of Patent: December 16, 2003Assignee: International Business Machines CorporationInventors: Theresa W. Broden, Robert W. Guse, Debra A. Parmeter, Jeffrey G. Willets
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Patent number: 6647480Abstract: Data stored in a block of first memory is updated over a LAN. The block is larger than the unused part of a second memory. After compressing the data it is transferred over a LAN to a device where the first and second memory are located. The data is decompressed in increments smaller than the unused part of the second memory and then written to the first memory.Type: GrantFiled: March 31, 2000Date of Patent: November 11, 2003Assignee: International Business Machines CorporationInventors: Joseph E. Bolan, Michael D. Washburn
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Patent number: 6611536Abstract: An Integrated Voice/Data System on a Single RF Channel for broadcast applications such as Mobile Data Terminal (MDT), Automatic Vehicle Location (AVL), and mobile facsimile (fax) in the frequency region range of 450 MHz to 800 MHz on 25 kHz radio frequency (RF) channels. The system utilizes a dynamic multiplexing technique referred to as Packetized Data/Voice Dedicated (PDVD) Burst Switching, and Lookahead (a digital signal process). PDVD allows transmission of data within silence gaps inherent in speech. Lookahead provides data sources with advanced knowledge of channel(s) where the silence gaps will occur The Integrated Voice/Data System may be retrofitted into existing 450 MHz-800 MHz public and private land mobile radio channels to provide users with full data services and triples voice capacity.Type: GrantFiled: August 11, 1999Date of Patent: August 26, 2003Assignee: International Business Machines CorporationInventor: Nadeem Ahmed
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Patent number: 6608757Abstract: Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.Type: GrantFiled: March 18, 2002Date of Patent: August 19, 2003Assignee: International Business Machines CorporationInventors: Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, John M. Lauffer, Voya R. Markovich, Thomas R. Miller
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Patent number: 6606527Abstract: A method and system for generating a production sequence for the resources of a manufacturing plant. This method comprises the steps of identifying the total amount of each product that the plant has to produce in one period of time, identifying the operation route and productivity for each product on each available resource, and identifying setup constraints. The method includes the further steps of identifying delivery dates already committed, and identifying the minimum and maximum stock levels for each resource. The identified factors are then used to generate a production sequence for each resource of the plant with a granularity of a defined time period.Type: GrantFiled: January 21, 2003Date of Patent: August 12, 2003Assignee: International Business Machines CorporationInventors: Olympio de Andrade, Jr., Syed Wali Haider, Pedro Sergio de Souza
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Patent number: 6576013Abstract: An ocular prosthesis displays an iris and pupil image on a color liquid crystal array display device. A plurality of iris images are stored as data in a memory. Ambient light level is detected by a light sensor device. An image is selected based on light level and sent to the array display device.Type: GrantFiled: January 8, 2002Date of Patent: June 10, 2003Assignee: International Business Machines CorporationInventors: Mark Budman, James R. Stack
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Patent number: 6549575Abstract: Temporal compression of a digital video data stream with hierarchically searching in at least one search unit for pixels in a reference picture to find a best match for the current macroblock. This is followed by constructing a motion vector between the current macroblock and the best match macroblock in the reference picture.Type: GrantFiled: November 7, 1996Date of Patent: April 15, 2003Assignee: International Business Machines Corporation.Inventors: Adrian Stephen Butter, John Mark Kaczmarczyk, Agnes Yee Ngai, Edward Francis Westermann, Robert J. Yagley
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Patent number: 6545229Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.Type: GrantFiled: August 15, 2000Date of Patent: April 8, 2003Assignee: International Business Machines CorporationInventors: Bao-Tong Ma, Amit Kumar Sarkhel, Ping Kwong Seto
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Patent number: 6542162Abstract: An on-screen display (OSD) processor, processing method and article of manufacture are provided having a color mapped mode, direct color mode, and 4:2:2 profile mode. The OSD processor implements both color mapped OSD region processing capability and direct color OSD region processing capability, along with an ability to store quantizer coefficients for the 4:2:2 profile mode of a video decoder coupled to the OSD processor. The capabilities of the OSD processor are implemented using a common embedded memory within the processor. During color mapped OSD region processing, color table data is temporarily stored within the embedded memory, while in direct color OSD region processing, direct color descriptions are stored within the embedded memory. When the video decoder is decoding a 4:2:2 formatted image, the embedded memory of the OSD processor is used to temporarily store inverse quantization data for the decode function.Type: GrantFiled: June 15, 1998Date of Patent: April 1, 2003Assignee: International Business Machines CorporationInventors: David A. Hrusecky, Bryan J. Lloyd
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Patent number: 6524888Abstract: Mixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity containing the semiconductor chip and a second cavity for containing the substrate. The substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.Type: GrantFiled: January 4, 2002Date of Patent: February 25, 2003Assignee: International Business Machines CorporationInventors: David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Miguel A. Jimarez, Li Li, Donald I. Mead
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Patent number: 6519845Abstract: Wire bonds are made to palladium coated bonded lads on organic dielectric substrates at temperatures below 200° C. A layer of palladium thicker than 14 micro-inches is covered with a thin flash of gold. Palladium coated over copper pads is protected from copper diffusion by a thin nickel layer positioned between the two. Subsequent baking for 1 hour at 185° C. drives off hydrogen molecules provided the gold is less than 200 Å thick. A bonding wire, preferably of gold is then successfully bonded to the pad using conventional bonding equipment at temperatures below 200° C.Type: GrantFiled: January 11, 2000Date of Patent: February 18, 2003Assignee: International Business Machines CorporationInventors: Lawrence Richard Cutting, John Gerard Gaudiello, Luis Jesus Matienzo, Nikhil Mohan Murdeshwar